KR20070119800A - Apparatus for radiating exothermic element - Google Patents

Abstract

A device for radiating heat from a heating element is provided to prevent short and breakage of an internal circuit of a thermoelectric element, and save maintenance expenses by preventing dew condensation directly occurring in the thermoelectric element when the heating element like an IC is cooled. A thermoelectric element(110) cools the heat generated from the heating element(10), is installed over the heating element and is formed with a heating part(111) generating the heat and a cooling part(112) absorbing the heat to an upper/lower part. A heat exchanger(120) exchanges the heat between the cooling and heating part by being interposed between the cooling part and the heated part, and prevents the dew condensation directly occurring in the thermoelectric element. Insulation(130) blocks heat transfer to the outside by surrounding an outer circumferential surface of the thermoelectric element excluding the heating part and the outer circumferential surface of the heat exchanger. A radiating plate(140) radiates the heat of the heating part at an upper part of the heating part of the thermoelectric element.

Description

Heat dissipation device for heating element {Apparatus for radiating exothermic element}

1 is a schematic diagram of a Peltier device,

2 is a cross-sectional view showing a heat radiation device of a heat generating element according to the present invention;

3 is a cross-sectional view illustrating another embodiment of the heat exchanger illustrated in FIG. 2.

<Explanation of symbols for the main parts of the drawings>

Heat dissipation device for heat generating element

111.Heating section 112 ... Cooling section

113 metal plate 120 heat exchanger

121 ... First Heat Transfer Unit 122 ... Second Heat Transfer Unit

123 ... Space 124 ... Bent

125 Edge 130 Insulation

140 ... heat sink 150 ... temperature sensor

The present invention relates to a heat dissipation device of a heat generating element, and more particularly, to prevent the malfunction of the device due to overheating by cooling the heat generating component of a heat generating element by an endothermic action of a thermoelectric element such as a Peltier element. It relates to a heat dissipation device.

In general, an IC element such as a central processing unit (CPU) configured as an integrated circuit (IC) is degraded as it enters a high temperature state due to heat generation during operation, and a performance decreases, a malfunction occurs, or an allowable threshold value. When entering the above high temperature, the internal circuit may be destroyed.

In order to solve this problem, a method of conventionally providing a thermoelectric element such as a Peltier element in the IC element to offset the heat generating component of the IC element by cooling has been proposed.

Typically, the Peltier element is composed of a cooling unit for absorbing and cooling the heat of the IC element and a heat generating unit for emitting the absorbed heat to the outside. As the Peltier element is installed to be in contact with the surface of the IC element, The high temperature heat generating component generated in the IC element can be cooled.

However, as the cooling unit of the Peltier element has a low temperature characteristic of below zero, and as the IC element has a high temperature characteristic of room temperature or more, condensation may occur on the surface of the IC element due to the sudden temperature difference.

That is, according to the method in which the cooling unit of the Peltier element is directly bonded to the IC element, while the cooling efficiency is excellent, condensation may occur due to the rapid temperature difference as described above, and the internal circuit of the IC element may be shorted or damaged. There is a disadvantage that the maintenance cost according to the replacement of the IC element can be increased.

The present invention has been made to solve the above-mentioned problems, and prevents condensation which occurs directly on the heat generating element when cooling the heat generating element such as an IC element, thereby preventing short circuit and breakage of the internal circuit of the heat generating element, and maintaining accordingly. An object of the present invention is to provide a heat dissipation device of a heating element that can reduce cost.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. Furthermore, the objects and advantages of the present invention can be realized by means and combinations indicated in the claims.

The heat dissipation device of the heat generating element of the present invention for achieving the above object, relates to a heat dissipating device for cooling the heat generating element, the heat generating portion and the cooling portion for absorbing heat is provided up and down, the heat generating element A thermoelectric element installed above and cooling the heat generated by the heat generating element; A heat exchanger interposed between the cooling unit of the thermoelectric element and the heat generating element to perform heat exchange between the cooling heat of the cooling unit and the generated heat of the heat generating element, and to prevent condensation occurring directly in the heat generating element; Insulation material to block the heat transfer to the outside while integrally surrounding the outer peripheral surface of the thermoelectric element and the heat exchanger except the heat generating unit; And a heat sink installed at an upper portion of the heat generating portion of the thermoelectric element, and dissipating heat of the heat generating portion to the outside.

The heat exchange part may include: a first heat transfer part in contact with a cooling part of the thermoelectric element and transferring cooling heat of the cooling part; A second heat transfer part in contact with the heat generating element under the first heat transfer part to transmit generated heat of the heat generating element; Interposed between the first heat transfer part and the second heat transfer part, the cooling heat transferred from the first heat transfer portion and the generated heat transferred from the heat generating element may include a space portion to generate condensation.

In addition, the space portion, at least one bent portion in the longitudinal direction may be formed to increase the contact area between the first heat transfer portion and the second heat transfer portion to facilitate heat transfer.

In addition, the space portion may be filled with one selected from a gas, a liquid, a gel of a solid and a liquid, and a solid material.

In addition, the second heat transfer unit is preferably relatively large in volume compared to the first heat transfer unit in contact with the cooling unit so that the transfer time of the cooling heat transferred to the heating element is delayed.

In addition, the first heat transfer unit and the second heat transfer unit, the thickness of the first heat transfer portion and the second heat transfer portion is gradually reduced while the edge is further extended to the outside compared to the outer periphery of the space interposed between each heat transfer portion. It is preferable that the vertical gap between each edge is increased toward the outside.

The first heat transfer part and the second heat transfer part may be made of metal.

In addition, the heat sink may be installed on the heat generating portion of the thermoelectric element while surrounding the outer peripheral surface of the heat insulating material.

The apparatus may further include a temperature sensor installed in the heat generating element and measuring a temperature of heat generated from the heat generating element.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. It should be interpreted as meanings and concepts corresponding to the technical idea of the present invention based on the principle of definition.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a schematic view of the Peltier element, FIG. 2 is a sectional view showing a heat dissipation device of a heat generating element according to the present invention, and FIG. 3 is a sectional view showing another embodiment of the heat exchanger shown in FIG.

As shown, the heat dissipation device 100 of the heating element according to the present invention includes a thermoelectric element 110, a heat exchanger 120, a heat insulating material 130 and a heat sink 140.

The thermoelectric element 110 is provided with a heat generating portion 111 that generates heat and a cooling portion 112 that absorbs heat up and down, and is installed above the heat generating element 10, and generates a heat generating element 10. Cooling the heat generating components generated in the high temperature to prevent overheating of the heating element 10 and the resulting malfunction.

In the thermoelectric element 110, as shown in FIG. 1, when the P-type semiconductors and the N-type semiconductors alternately arranged are connected in series by the upper and lower metal plates 113, and electricity is applied to the metal plates 113, the upper and lower portions are respectively heated. It refers to a Peltier device that acts as the heat generating unit 111 and the cooling unit 112 to be emitted and absorbed.

Meanwhile, the heat exchange part 120 is interposed between the cooling part 112 of the thermoelectric element 110 and the heat generating element 10, and the heat of cooling of the cooling part 112 and the heat generated by the heat generating element 10. The heat exchange is made between, and prevents condensation that occurs directly in the heat generating element (10).

That is, the heat exchange part 120 is the cooling unit 112 and the heat generating element 10 of the heat generating element 10 so that the heat generating element 10 is indirect contact with the cooling unit 112 of the thermoelectric element 110. The heat exchange between the cooling unit 112 having a low temperature property of below zero and the heat generating element 10 having a high temperature characteristic of room temperature or more occurs, and the cooling heat is transferred to the heat generating element 10.

The heat exchange part 120 may include a first heat transfer part 121, a second heat transfer part 122, and a space part 123.

The first heat transfer part 121 is a part in contact with the cooling part 112 of the thermoelectric element 110 and the cooling heat of the cooling part 112 is transferred as it is, a metal material having excellent thermal conductivity, such as aluminum It is preferred to be prepared.

The second heat transfer part 122 is a portion in which the heat generated by the heat generating element 10 is directly transmitted as it is in direct contact with the heating element 10 under the first heat transfer part 121. It is preferable that the heat transfer part 121 is made of a metal material having excellent thermal conductivity such as aluminum.

On the other hand, the space 123 is interposed between the first heat transfer unit 121 and the second heat transfer unit 122, the cooling heat transferred from the first heat transfer unit 121 and in the heat generating element (10) Condensation is generated when the generated heat is met.

The space 123 may be filled with one selected from a gas, a liquid, a solid and a gel, a solid material, such as compressed air, water, oil, or gel.

Here, since the material filled in the space 123 has a relatively low thermal conductivity compared to the heat transfer parts 121 and 122, in some cases, transfer of cooling heat to the heating element 10 may be reduced.

Therefore, the space 123 is preferably manufactured with a fine thickness of 1 micrometer (μm) to mm (mm) unit so as not to affect the heat exchangeability as described above.

As described above, due to the excellent thermal conductivity of the first heat transfer unit 121 and the second heat transfer unit 122, the cooling heat of the cooling unit 112 is initially transferred to the first heat transfer unit 121 while the temperature is changed. Temperature characteristics below zero are maintained as they are, and the generated heat of the heat generating element 10 is transferred to the second heat transfer part 122, so that high temperature characteristics of room temperature or more can be maintained without temperature change.

As the time continues, the cooling heat transferred to the first heat transfer part 121 and the generated heat transferred to the second heat transfer part 122 are heat exchanged while facing each other in the space 123, and the cooling part is heated by the heat exchange phenomenon. Cooling heat of 112 may be transferred to the heating element 10 to cool the heating element, and the generated heat of the heating element 10 may be transferred to the cooling unit 112.

At this time, as the heat generated by the heat generating element 10 is transferred to the cooling unit 112, the temperature of the cooling unit 112 is increased. The cooling efficiency of the heat generating element 10 is increased by the temperature rise of the cooling unit 112. The thermoelectric element 110 is preferably controlled to control the cooling temperature of the cooling unit through a separate control so as not to deteriorate.

In addition, the space 123 as described above is the heat of cooling of the cooling unit 112 transferred through the first heat transfer unit 121 and the heat generating element 10 transferred through the second heat transfer unit 122. As the generated heat meets directly, the dew condensation is substantially generated due to the rapid temperature difference between the zero point and the image.

When cooling heat is directly transmitted to the heat generating element 10, condensation may occur on the heat generating element 10 due to a sudden temperature difference, which may cause problems such as an internal circuit short circuit and breakage.

However, the temperature difference as described above by the first heat transfer part 121 and the second heat transfer part 122 provided in the heat exchange part 120 is not in the heating element 10 but in the space part 123. As a result, the dew condensation generation point may be converted into the space part 123 instead of the surface of the heating element 10.

In this case, the material filled in the space 123 is fluid, compressed air, water, oil, or gel as described above, and thus, even if the condensation occurs, the deformation or damage of the filled material does not occur. Do not.

That is, as the condensation occurrence point due to the temperature difference between the cooling unit 112 and the heating element 10 is switched to the space portion 123 while the heating element 10 is cooled, the surface of the existing heating element 10 It can be seen that the problem of direct condensation is solved.

On the other hand, the second heat transfer unit 122 has a relatively large volume compared to the first heat transfer unit 121 in contact with the cooling unit 112 so that the transfer time of the cooling heat delivered to the heat generating element 10 is delayed. It is desirable to be large.

That is, when the power of the heating element 10 is switched from the ON (OFF) state to the OFF (OFF) state, the heating element 10 is not consumed by the power is self-cooled, the first heat transfer unit 121 As the cooling heat transmitted to the heat transfer element 10 is rapidly transferred to the heat generating element 10 via the second heat transfer unit 122, rapid cooling of the heat generating element 10 may be caused.

Therefore, the second heat transfer part 122 is manufactured in a relatively large volume compared to the first heat transfer part 121, so that the cooling heat transfer is performed while the heating element 10 is switched off and then cooled. It may be delayed, so that rapid cooling of the heating element 10 and condensation may be prevented.

On the other hand, the first heat transfer portion 121 and the second heat transfer portion 122, the edge 125 may be further extended to the outside compared to the outer periphery of the space portion 123 interposed between each transfer portion. .

The edges 125 of each of the extended heat transfer parts 121 and 122 are gradually reduced in thickness toward the outer portion, and thus, between the extended edges 125 of the first heat transfer part 121 and the second heat transfer part 122. The space between the upper and lower spaces becomes '>' or '<' which increases toward the outside.

According to the configuration of the edge 125, the heat exchange generated in the portion of the edge 125 of the first heat transfer portion 121 and the second heat transfer portion 122 can be gradually offset toward the outer edge 125 The rapid cooling problem of the heat generating element 10 due to the heat exchange in the) can be prevented.

Meanwhile, as shown in FIG. 3, the space part 123 has at least one or more lengthwise directions to smoothly transfer heat while increasing contact areas between the first heat transfer part 121 and the second heat transfer part 122. The bent portion 124 may be formed.

In general, the thermoelectric element 110 may control the temperature, but when the heating element 10 having a high capacity exceeding the control range of the thermoelectric element 110 is cooled, the space portion (b) is formed by the bent portion 124. By extending the range of the first heat transfer part 121 and the second heat transfer part 122 in contact with 123, the cooling efficiency of the heating element 10 may be always maintained.

The shape in which the space portion 123 is bent is not limited to the wave shape illustrated in FIG. 3, and may be modified in various forms in which the bent portion 124 is formed.

According to the heat exchanger 120 as described above, as the rapid cooling of the heat generating device 10 and the occurrence of direct condensation on the heat generating device 10 are prevented, a short circuit or breakage problem in the heat generating device 10 is prevented and the service life is prevented. Maintenance costs due to extension can be reduced.

On the other hand, the heat insulator 130 may block the heat transfer to the outside while integrally wrapping the outer peripheral surface of the thermoelectric element 110 and the outer peripheral surface of the heat exchanger 120 except for the heat generating portion 111.

According to the heat insulating material 130, the heat generated by the cooling unit 112 is prevented from being directly transmitted to the heat generating element 10 through the outside without passing through the heat exchange unit 120, the heat generating element Sudden cooling and condensation of (10) can be prevented.

The heat dissipation plate 140 is installed on the heat generating part 111 of the thermoelectric element 110 and dissipates heat of the heat generating part 111 to the outside, and includes a plurality of protrusions for improving a heat generating effect per unit area ( 141) and may be made of a metal material such as aluminum having high thermal conductivity.

The heat sink 140 may be installed on the heat generating portion 111 of the thermoelectric element 110 while surrounding the outer circumferential surface of the heat insulating material 130.

The heat insulating material 130 may be cooled by the heat of cooling of the cooling part 112 because the heat insulation limit is exceeded in some cases. In this case, the heat generating device 10 may also be rapidly cooled to cause condensation on the surface. have.

Therefore, the heat sink 140 is preferably installed to cover the outer peripheral surface of the heat insulating material 130 to offset the cooling heat of the heat insulating material 130.

On the other hand, the heat dissipation device 100 of the heating element according to the present invention may further include a temperature sensor 150 is installed in the heating element 10, the temperature of the generated heat generated in the heating element 10 is measured. .

When the power of the heat generating device 10 is switched from ON to OFF, self-cooling of the heat generating device 10 is performed. At this time, the heat of cooling transferred to the first heat transfer unit 121 is Rapidly transferred to the heat generating element 10 through the second heat transfer unit 122 may cause rapid cooling of the heat generating element 10 and the condensation.

According to the temperature sensor 150, the endothermic amount of the thermoelectric element 110, that is, the cooling unit 112 by checking the temperature of the heating element 10 in real time to prevent the rapid cooling of the heating element 10 as described above It is possible to flexibly cope with the cooling amount control of the battery.

According to the heat dissipation device 100 of the heating element of the present invention as described above, as the condensation phenomenon directly generated in the heating element 10 during the cooling of the heating element 10 is prevented, the damage of the heating element 10 is prevented As a result, maintenance costs can be reduced.

Meanwhile, the heating element 10 to which the present invention is applied is not limited to an IC element such as a central processing unit (CPU) composed of an integrated circuit (IC), and a motor, an electric motor, and the like, which generate heat. It should be understood that it can be applied to various pyrogenic components.

As described above, the present invention has been described by means of limited embodiments and drawings, but the present invention is not limited thereto and is described below by the person skilled in the art and the following description of the present invention. Various modifications and variations are possible without departing from the scope of the appended claims.

The heat radiating device of the heat generating element of the present invention as described above provides the following effects.

First, as the condensation generation point due to the temperature difference between the cooling unit and the heating element is converted to the space portion of the heat exchanger while the heating element is cooled, the problem of direct condensation occurring on the surface of the existing heating element can be solved.

Second, by installing a separate insulating material to prevent the cooling heat of the thermoelectric element is directly transmitted to the heating element through the outside can be prevented the rapid cooling and condensation of the heating element.

Third, since the temperature of the heating element is monitored in real time by the temperature sensor, it is possible to flexibly cope with the cooling amount control of the thermoelectric element.

Claims (9)

A heat dissipation device for cooling a heating element, A thermoelectric element that is provided above and below a heat generating portion for generating heat and a cooling portion for absorbing heat, and is disposed above the heat generating element to cool the heat generated by the heat generating element; A heat exchanger interposed between the cooling unit of the thermoelectric element and the heat generating element to perform heat exchange between the cooling heat of the cooling unit and the generated heat of the heat generating element, and to prevent condensation occurring directly in the heat generating element; Insulation material to block the heat transfer to the outside while integrally surrounding the outer peripheral surface of the thermoelectric element and the heat exchanger except the heat generating unit; And The heat dissipation device of the heat generating element is provided above the heat generating portion of the thermoelectric element, comprising a heat dissipation plate for dissipating heat to the outside. The method of claim 1, wherein the heat exchange unit, A first heat transfer part in contact with the cooling part of the thermoelectric element and transferring the cooling heat of the cooling part; A second heat transfer part in contact with the heat generating element under the first heat transfer part to transmit generated heat of the heat generating element; Is interposed between the first heat transfer unit and the second heat transfer unit, the heat dissipation of the heat generating element, characterized in that it comprises a space where condensation occurs while the cooling heat transmitted from the first heat transfer unit and the heat generated from the heat generating element meet. Device. The method of claim 2, wherein the space portion, The heat dissipation device of a heat generating element, characterized in that at least one bent portion in the longitudinal direction is formed to increase the contact area between the first heat transfer portion and the second heat transfer portion to facilitate heat transfer. The method of claim 2 or 3, wherein the space portion, Heat dissipation device of a heating element, characterized in that the gas, a liquid, a solid of the medium and the liquid (Gel) of the liquid, a solid material is selected. The method of claim 2, wherein the second heat transfer unit, The heat dissipation device of the heat generating element, characterized in that the relatively large volume compared to the first heat transfer portion in contact with the cooling unit, so that the transfer time of the cooling heat delivered to the heat generating element. The method of claim 2 or 5, wherein the first heat transfer unit and the second heat transfer unit, As the edge extends further to the outside compared to the outer periphery of the space portion interposed between each heat transfer portion, the thickness gradually decreases, so that the vertical gap between the first and second heat transfer portions of each of the extended edges increases toward the outside. A heat radiating device of a heat generating element. The method of claim 6, wherein the first heat transfer unit and the second heat transfer unit, Heat dissipation device of a heating element, characterized in that the metal material. The method of claim 1, wherein the heat sink, A heat dissipating device of a heat generating element, characterized in that installed on the heat generating portion of the thermoelectric element surrounding the outer peripheral surface of the heat insulating material. The method of claim 1, The heat dissipation device of the heat generating element, characterized in that further comprising a temperature sensor installed in the heat generating element, the temperature of the heat generated from the heat generating element is measured.

Images