KR20070105771A - Memory module - Google Patents

Abstract

A memory module is provided to check rapidly a coupling state between each semiconductor package and a heat spreader irrespective of the number of semiconductor packages mounted on a memory module. A semiconductor package(110) includes a semiconductor chip(120), a sealing part(130), and input/output terminals. A plurality of semiconductor packages are mounted on a module printed circuit board(150). A plurality of adhesive members(160) are attached to upper surfaces of the semiconductor packages mounted on the module printed circuit board. A detection unit(200) has a length and a width to cover the semiconductor packages. The detection unit is attached to the semiconductor packages by using the adhesive members. The detection unit includes connective terminals(230) formed on a first surface(113) to connect electrically the adhesive members to each other and insertion holes(240,245) for exposing the connective terminals to the outside. A heat spreader(250) is disposed on a second surface(115) of the detection unit facing the first surface in order to radiate the heat of the semiconductor packages to the outside.

Description

Memory modules {MEMORY MODULE}

1 is a cross-sectional view showing a memory module according to a first embodiment of the present invention.

2 is a plan view of a detection device according to a first embodiment of the present invention.

3 is a view showing an adhesive member attached to a BGA package mounted on a module printed circuit board according to an embodiment of the present invention.

4 is a view for detecting whether the heat spreader is attached according to an embodiment of the present invention.

The present invention relates to a memory module, and more particularly, to a memory module to reduce the time taken to check the bonding state of the heat dissipation portion attached to the upper surface of the semiconductor package.

In general, memory is a general term used to temporarily or permanently store data or instructions used in computers, communication systems, image processing systems, and the like, and is typically a semiconductor, tape, disk, or optical method. Accounted for the majority. There are many kinds of such semiconductor memories, such as DRAM, SRAM, Flash Memory, and ROM, which are classified according to electrical characteristics of a data storage method.

When the various types of memory described above are actually used in a system, a module is manufactured and produced. A module is a set of semiconductor devices having a single function, and a plurality of semiconductor packages are mounted on a printed circuit board (PCB). Form.

On the other hand, the semiconductor package refers to a form in which a semiconductor chip designed with a microcircuit is sealed with a mold resin or a ceramic so as to be used by being mounted on an electronic device. When the semiconductor chip packaged as described above is operated, heat is inevitably generated, and the semiconductor chip is seriously damaged if the generated heat does not quickly escape to the outside of the package.

Therefore, a heat dissipation device, for example, a heat spreader, is attached to the upper surface of the semiconductor package to quickly release heat generated in the semiconductor chip to the outside of the semiconductor package.

In the memory module, a plurality of semiconductor packages are mounted on a module printed circuit board, an adhesive is applied to the upper surface of each semiconductor package, and then a heat spreader is attached. Here, the heights of the semiconductor packages mounted in the memory module may be different because they differ slightly in manufacturing. As a result, in some packages, the heat spreader adheres completely to the top surface of the semiconductor package, and in some packages, the heat spreader is often lifted off the top surface of the semiconductor package.

Therefore, after attaching the heat spreader to the upper surface of each semiconductor package, a process of confirming the attachment state of the heat spreader using ultrasonic waves or infrared rays is involved.

However, when checking the attachment state of the heat spreader using ultrasonic waves or infrared rays as in the related art, it takes a lot of time to check whether the heat spreader is attached because ultrasonic or infrared rays must be irradiated to each semiconductor package mounted in the memory module. Has the problem.

In addition, since it is necessary to separately install an ultrasonic wave generator or an infrared ray generator in order to confirm whether the heat spreader is attached, a facility investment cost increases.

Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a memory module which reduces the time required to check whether or not the heat spreader is completely adhered to each semiconductor package.

In order to achieve the above object, the present invention provides a semiconductor package including a semiconductor chip, a sealing part and an input / output terminal, a module printed circuit board on which a plurality of semiconductor packages are mounted, and upper surfaces of semiconductor packages mounted on a module printed circuit board, respectively. An adhesive member attached to and electrically conductive to the semiconductor package, the connecting member having a length and width covering all of the semiconductor packages and attached to the semiconductor package by the adhesive member and formed on a first surface facing the semiconductor package to electrically connect the adhesive members. A detection device comprising an insertion hole for exposing the connection terminal to the outside so that the terminals and the probe for applying the power are in contact with the connection terminal, and the first surface to dissipate heat generated in the semiconductor packages to be discharged to the outside. The heat soup is disposed on the second surface of the detection device, the portion corresponding to the insertion hole is opened It provides a memory module containing more.

Preferably, adhesive regions are provided at portions of the first surface corresponding to the semiconductor packages, and connection terminals are formed between the adhesive regions to interconnect the adhesive regions in a series connection manner.

In addition, the connecting terminals are formed at the corner portions facing in the diagonal direction in the bonding region, respectively, and connect the bonding regions to each other in a series connection manner.

On the other hand, the insertion hole is formed corresponding to the connecting terminal for connecting the adhesive region located on the first side of the first surface and the connecting terminal for connecting the adhesive region located on the end of the first surface.

Preferably, the connecting terminals are formed of copper.

(Example)

Hereinafter, a method of checking whether the memory module and the heat spreader are attached according to the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a memory module according to a first embodiment of the present invention.

Referring to FIG. 1, the memory module 100 includes a semiconductor package 110, a module printed circuit board 150, an adhesive member 160, a detection device 200, and a heat spreader 250.

The semiconductor package, for example, the BGA package 110, includes a base substrate 111, a semiconductor chip 120, a wire 125, a seal 130, and solder balls 135.

The base substrate 111 has a quadrangular shape and includes a first surface 113, a second surface 115, and side surfaces 117. The conductive pads 114 are printed on the first surface 113, and the semiconductor chip 120 is attached to the center of the first surface 113 via the adhesive 123. Solder pads 116 are printed on the second surface 115, and the solder pads 116 penetrate through the first surface 113 and the second surface 115 and have a conductive material coated on the through surface (not shown). Is electrically connected to the conductive pads 114. Solder balls 135 are bonded to each of the solder pads 114 formed as described above by soldering. In addition, the side surfaces 11 are formed of four and connect the first surface 113 and the second surface 115.

The wire 125 is a medium for electrically connecting the base substrate 111 and the semiconductor chip 120. One end of the wire 125 is connected to the semiconductor chip 120, and the other end of the wire 125 is conductive. Is connected to the pad 114.

The encapsulation part 130 covers the first surface 113 of the base substrate 111 to protect the semiconductor chip 120.

The module printed circuit board 150 is a rigid printed circuit board having at least one layer. The ball lands 155 to which the solder balls 135 are bonded and circuit patterns (not shown) for electrically connecting the ball lands 155 are printed on the surface of the module substrate 150 on which the BGA package 110 is mounted. . In the module printed circuit board 150 formed as described above, a plurality of the above-described BGA packages 110 are mounted to form a memory module 100 mounted on an electronic device. In FIG. 1, four BGA packages 110 are mounted on a module printed circuit board.

The adhesive member 160 has adhesiveness and is attached to each of the upper surfaces of the BGA packages 110 mounted on the module printed circuit board 150. In addition, the adhesive members 160 have electrical conductivity, so that when the detector 200 and the heat spreader 250 are attached to the upper surfaces of the adhesive members 160, the adhesive members 160 may be attached to the adhesive members 160 by the detection apparatus 200. Are electrically connected to each other.

2 is a plan view of a detection apparatus according to a first embodiment of the present invention.

1 and 2, the detection apparatus 200 includes a detector plate 210, adhesive regions 220, connection terminals 230, and probe insertion holes 240 and 245. Since the detection apparatus 200 is an apparatus for electrically connecting the adhesive members 160 to check whether the heat spreader 250 is attached to the BGA package 110 in close contact with the BGA package 110, the detector plate 210 may be used. It should be manufactured to have a length and a width covering at least the BGA packages 110 mounted on the module printed circuit board 150. The detector plate 210 having the size includes a first surface 211 attached to the adhesive member 160, a second surface 213 on which the heat spreader 250 is attached, and a first surface 211 and a second surface. It has a plurality of side surfaces 215 connecting the surfaces 213.

Referring to FIG. 2, adhesive regions 220 and connection terminals 230 are provided on the first surface 211. The adhesive region 220 is an area attached to the top surface of the BGA package 110 by the adhesive member 160, and each of the adhesive regions 220 corresponds to the BGA packages 110 mounted on the module printed circuit board 150. Prepared. As described above, since the four BGA packages 110 are mounted on the module printed circuit board 150, four adhesive regions 220 are also provided on the first surface 211. For convenience of description, the first bonding region 221, the second bonding region 223, the third bonding region 225, and the fourth bonding region 227 are disposed in the longitudinal direction from the left edge of the detector plate 210.

The connection terminals 230 are connected to the adhesive members 160 and the probe 300 (see FIG. 4) for applying power to electrically connect the adhesive members 160 to each other, and to the adhesive members 160 and the probes. (300) is connected in a series chain (Dasiy chain) method. The connection terminals 230 are connected to each of the adhesive regions 220 two by one. In more detail, between the first and second adhesive regions 221 and 223, the second and third adhesive regions 223 and 225, and the third and fourth adhesive regions 225 and 227. Connection terminals 230 are formed one by one to interconnect them. Then, one connection terminal 231 extends from the left edge of the first surface 211 toward the edge of the first adhesive region 221, and the fourth adhesion region 227 at the right edge of the first surface 211. One connecting terminal 233 is extended toward the edge of the). Therefore, when four adhesive regions 220 are present on the first surface 211, five connection terminals 230 are formed.

For example, the five connection terminals 230 may be arranged in a line on the same line of the first surface 211 and overlap the edges of the adhesive regions 220. As another example, as shown in FIG. 2, five connection terminals 230 are arranged in a zigzag shape on the first surface 211 and overlap the corner portions of the respective adhesive regions 220. That is, two connection terminals 230 are formed in each adhesive region 220 near each corner positioned in the diagonal direction. Here, the reason for overlapping the connection terminals 230 near the edge or the edge of the adhesive region 220, when attaching the heat spreader 250 to the upper surface of the BGA package 110 together with the detection device 200 This is because lifting of the heat spreader 250 occurs most frequently at the edge of the BGA package 110. This is because the heat spreader 250 is attached to the upper surface of the BGA package 110 by intensively pressing the center portion of the BGA package 110.

The connection terminals 230 are formed by using copper having excellent electrical conductivity.

Referring to FIG. 1, the probe insertion holes 240 and 245 may include two connection terminals 231 and 233 located at both ends in the longitudinal direction of the first surface 211 among the connection terminals 230 of the detection apparatus 200. Expose to the outside. That is, the first probe insertion hole 240 is formed to correspond to the connection terminal 231 extending from the first adhesive region 221 to the left edge of the first surface 211, and in the fourth adhesive region 227. The second probe insertion hole 245 is formed to correspond to the connection terminal 233 extending to the right edge of the first surface 211.

The heat spreader 250 is fixed to the second surface 213 of the detector plate 210 to quickly release heat generated in each BGA package 110 to the outside. Portions of the heat spreader 250 corresponding to the first probe insertion hole 240 and the second probe insertion hole 245 are opened to connect the connection terminals 230 connected to the probe 300 to the outside of the heat spreader 250. Expose

3 is a view showing an adhesive member attached to a BGA package mounted on a module printed circuit board according to an embodiment of the present invention.

As shown in FIG. 3, when a plurality of, for example, four BGA packages 110 are mounted on the module printed circuit board 150, adhesive members having adhesiveness and conductivity to each of the upper surfaces of the BGA packages 110 are provided. Attach 160.

4 is a diagram for detecting whether a heat spreader is attached according to an embodiment of the present invention.

When the adhesive members 160 are attached to each BGA package 110, as illustrated in FIG. 4, the detection device 200 having the heat spreader 250 fixed thereon is positioned on the adhesive members 160. In this case, the first surface 211 of the detection apparatus 200 should face the adhesive member 160, and the adhesive regions 220 provided on the first surface 211 correspond to the respective BGA packages 110. It must be located in the part. When the detection apparatus 200 is placed on the BGA packages 110 in this state, the five connection terminals 230 connect the respective adhesive members 160 in a series connection method.

When the detection device 200 having the heat spreader 250 fixed thereon is placed on the top surface of the adhesive members 160, the first surface 211 of the detection device 200 is applied by applying pressure from the top surface of the heat spreader 250. To the adhesive member 160.

Thereafter, in order to confirm whether the heat spreader 250 and the detection apparatus 200 are completely attached to the adhesive members 160, the probes 300 electrically connected to the detector 310 are inserted into the first probe. It is inserted into the hole 240 and the second probe insertion hole 245. Then, the probe 300 is connected to the connection terminals 231 and 233 exposed to the outside through the openings of the first and second probe insertion holes 240 and 245 and the heat spreader 250.

In this state, power is applied to each probe 300. Then, the detection device 200 is in the closed loop state by the connection terminals 230 and the adhesive members 160 connecting the probe 300, the adhesive members 160.

If the heat spreader 250 and the detection device 200 are not completely attached to the BGA package 110 in the process of attaching the heat spreader 250 and the detection device 200 to the upper surface of the BGA package 110. In the non-attached portion, the connection terminal 230 is not in contact with the adhesive member 160. Then, the detection apparatus 200 is in an open loop state and the detector 310 determines that the heat spreader 250 is not completely attached to the top surfaces of all the BGA packages 110.

On the contrary, if the heat spreader 250 and the detection device 200 are completely attached to the top surface of the BGA package 110, the respective connection terminals 230 may be in full contact with the adhesive member 160. Therefore, since the power applied through the probe 300 is transferred to each adhesive member 160 through the connection terminals 230, the detection device 200 is in a closed loop state. Accordingly, the detector 310 determines that the heat spreader 250 is completely attached to the top surfaces of all the BGA packages 110.

As described above, the conductive adhesive member 160 is attached to the upper surfaces of the respective BGA packages 110 mounted on the memory module 100, and the heat spreader 250 is fixed on the adhesive members 160. When power is applied to the detection device 200 while the detection device 200 is attached, the heat spreader 250 is connected to all the BGA packages by the adhesive members 160 and the connection terminals 230 electrically connecting them. Whether it is completely attached to the 110 can be easily confirmed in a short time.

Hereinbefore, the present invention has been illustrated and described with reference to specific embodiments, but the present invention is not limited thereto, and the scope of the following claims is not limited to the spirit and scope of the present invention. It will be readily apparent to those skilled in the art that various modifications and variations can be made.

As in the present invention, when a conductive adhesive member is attached to each of the upper surfaces of the semiconductor packages, and power is applied while a detection device having a heat spreader fixed thereto is attached to the adhesive member, a large number of semiconductor packages are attached to the memory module. Even if they are mounted, it is possible to easily check whether or not the heat spreader is completely attached to the upper surfaces of the respective semiconductor packages in a short time, thereby reducing the detection time.

Claims (5)

A semiconductor package having a semiconductor chip, a sealing part, and an input / output terminal; A module printed circuit board having a plurality of semiconductor packages mounted thereon; An adhesive member attached to each of the upper surfaces of the semiconductor packages mounted on the module printed circuit board and electrically conductive; A connection terminal having a length and a width covering all of the semiconductor packages and attached to the semiconductor package by the adhesive member and formed on a first surface facing the semiconductor package to electrically connect the adhesive members; A detection device including an insertion hole for exposing the connection terminal to the outside such that a probe for applying a contact thereof is in contact with the connection terminal; And A memory including a heat spreader disposed on a second surface of the detection device opposite to the first surface to dissipate heat generated in the semiconductor packages to be discharged to the outside, and a portion corresponding to the insertion hole is opened; module. The method of claim 1, wherein adhesive regions are provided at portions of the first surface corresponding to the semiconductor packages, and the connection terminals are formed between the adhesive regions to interconnect the adhesive regions by a series connection method. Memory module, characterized in that. The memory module of claim 2, wherein the connection terminals are formed at edge portions facing in the diagonal direction from the adhesion region to connect the adhesion regions to each other in a series connection manner. According to claim 2 or 3, wherein the insertion hole is formed corresponding to the connecting terminal for connecting the adhesive region located on the first side of the first surface and the connecting terminal for connecting the adhesive region located on the end of the first surface Memory module, characterized in that. The memory module of claim 1, wherein the connection terminal is formed of copper.

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