KR20070103946A - Structure and method for adhiveness of transcription print layer and base layer - Google Patents

Structure and method for adhiveness of transcription print layer and base layer Download PDF

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KR20070103946A
KR20070103946A KR1020060035893A KR20060035893A KR20070103946A KR 20070103946 A KR20070103946 A KR 20070103946A KR 1020060035893 A KR1020060035893 A KR 1020060035893A KR 20060035893 A KR20060035893 A KR 20060035893A KR 20070103946 A KR20070103946 A KR 20070103946A
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layer
printed
adherend
intermediate layer
high frequency
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KR100818308B1 (en
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안병학
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안병학
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Decoration By Transfer Pictures (AREA)

Abstract

A method for reinforcing an adhesiveness of a transcription printed article and an adhered material and a structure produced thereby are provided to attach the transcription printed article firmly to the adhered material via an intermediate layer. A method for reinforcing an adhesiveness of a transcription printed article and an adhered material comprises the steps of: attaching an intermediate layer(15) under a printed layer(13) by high frequency welding; mounting the printed layer and intermediate layer which are adhered to each other, on an adhered material(19) with a hot melt(17) therebetween; and fusing the intermediate layer and the hot melt to each other by hot stamping to adhere the printed layer to the adhered material. In the method, the intermediate layer comprises a thin film resin capable of high frequency welding and thermal adhesion. Upon high frequency welding, a lenticular layer(11) is further attached onto a top surface of the printed layer.

Description

전사인쇄물과 피착재의 접착력강화방법 및 그 접착구조{Structure and Method for adhiveness of transcription print layer and base layer}Adhesion reinforcement method of transfer print and adherend and its adhesive structure

도 1은 종래의 전사인쇄물의 피착제에 대한 접착구조를 나타내는 단면도,1 is a cross-sectional view showing the adhesive structure to the adherend of the conventional transfer printed matter,

도 2는 본 발명에 따른 피착재에 전사인쇄물을 접착하기 전처리단계의 접착구조를 나타내는 단면도,2 is a cross-sectional view showing an adhesive structure of a pretreatment step of adhering a transfer printed material to an adherend according to the present invention;

도 3은 본 발명에 따른 전사인쇄물을 피착제에 접착완료한 상태의 접착구조를 나타내는 단면도이다.3 is a cross-sectional view showing the adhesive structure of the state in which the transfer printed matter adhered to the adherend according to the present invention.

*도면 내 주요부분에 대한 부호설명** Description of Signs for Main Parts in Drawings *

11: 렌티큘러층 13: 인쇄층11: lenticular layer 13: printed layer

15: 매개층 17: 핫멜트15: intermediate layer 17: hot melt

19: 피착재19: Substrate

본 발명은 전사인쇄물과 피착재의 접착력강화방법 및 그 접착구조에 관한 것으로, 특히 섬유로 이루어진 피착재에 전사인쇄물을 견고하게 부착시킬 수 있는 전사인쇄물과 피착재의 접착력강화방법 및 그 접착구조에 관한 것이다.The present invention relates to a method of strengthening the adhesion between the transfer printed material and the adherend, and more particularly, to a method of strengthening the adhesion between the transfer printed matter and the adherend and the adhesive structure thereof capable of firmly attaching the transfer printed material to the adherend made of fibers. .

전사인쇄물은 의류, 옷, 모자 등의 제품에 라벨류 또는 디자인을 위해 부착하는데 적용되었다. 이러한 종래의 전사인쇄물은 입체용 렌티큘러층(1)에 저면에 결합된 인쇄물(3)을 피복이나 가방 등의 피착재(7)에 부착하기 위해 피착재(7)와 인쇄물(3) 사이에 핫멜트(5)를 배치하여 핫스템핑을 통해 상기 전사인쇄물을 피착재(7)에 부착하는 방법을 사용하였다.Transfer prints were applied to label or design items on clothing, clothing, hats, etc. This conventional transfer printed matter is hot melted between the adherend 7 and the printed matter 3 to attach the printed matter 3 bonded to the bottom surface of the three-dimensional lenticular layer 1 to the adherend 7 such as a cloth or a bag. (5) was used to attach the transfer printed matter to the adherend 7 through hot stamping.

그런데, 이러한 종래의 부착방법은 인쇄물(3)이 핫멜트(5)에 의해 핫스템핑 으로 직접 열을 가하여 피착재(7)에 부착됨에 따라 접착력이 저하되어, 손으로 잡아당기거나 세탁을 하게되면 쉽게 떨어지는 문제점이 있었다.However, in the conventional method of attachment, the adhesive force is lowered as the printed matter 3 is directly attached to the adherend 7 by applying heat directly by hot stamping by the hot melt 5, and pulling or washing by hand. There was an issue that easily fell off.

상기와 같은 문제점을 해결하기 위해 본 발명은, 전사인쇄물을 매개층을 통해 전사인쇄물을 피착재에 견고하게 부착시킬 수 있는 전사인쇄물과 피착재의 접착력강화방법 및 그 접착구조를 제공하는데 그 목적이 있다.In order to solve the above problems, an object of the present invention is to provide a method of strengthening the adhesion between the transfer printed material and the adherend and the adhesive structure that can be attached to the transfer printed material through the intermediate layer. .

상기 목적을 달성하기 위해, 본 발명은 고주파용접을 통해 인쇄층 하면에 매개층을 부착하는 단계; 상호 접착된 상기 인쇄층과 매개층을 핫멜트를 사이에 두고 피착재에 안착시키는 단계; 및, 상기 핫스템핑을 통해 상기 매개층과 핫멜트를 상호 융착시켜 상기 인쇄층을 피착재에 접착시키는 단계;를 포함하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화방법을 제공한다.In order to achieve the above object, the present invention comprises the steps of attaching the intermediate layer on the lower surface of the printed layer through high frequency welding; Placing the printed adhesive layer and the interlayer bonded to the adherend with a hot melt interposed therebetween; And fusion bonding the media layer and the hot melt to each other through the hot stamping to adhere the print layer to the adherend. 2.

또한 본 발명의 다른 특징은, 인쇄층; 고주파용접에 의해 상기 인쇄층 하면에 부착되는 매개층; 및, 상기 매개층과 피착재 사이에 배치되어 핫스템핑처리에 의해 상기 매개층과 상호 융착되면서 상기 피착재에 상기 인쇄층을 부착시키기 위한 핫멜트;를 포함하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화구조를 제공한다.In addition, another feature of the present invention, the print layer; An intermediate layer adhered to the lower surface of the printed layer by high frequency welding; And a hot melt disposed between the intermediate layer and the adherend to adhere the print layer to the adherend while being fused with the intermediate layer by hot stamping. Provides an adhesion strengthening structure.

이하, 첨부된 도면을 참고하여 본 발명의 일 실시예에 따른 전사인쇄물의 피착재에 대한 접착구조를 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings will be described the adhesive structure for the adherend of the transfer printing according to an embodiment of the present invention.

첨부된 도 2는 본 발명에 따른 전사인쇄물을 피착제에 접착하기 전처리단계의 접착구조를 나타내는 단면도이고, 도 3은 본 발명에 따른 전사인쇄물을 피착제에 접착완료한 상태의 접착구조를 나타내는 단면도이다.2 is a cross-sectional view showing the adhesive structure of the pretreatment step of adhering the transfer printed matter to the adherend according to the present invention, and FIG. 3 is a cross-sectional view showing the bonded structure of the transfer completed state to the adherend according to the present invention. to be.

본 발명에 따른 전사인쇄물의 피착재에 대한 접착구조는 렌티큘러층(11), 인쇄층(13), 매개층(15), 핫멜트(17)로 이루어진다. 이와 같은 접착구조는 다음과 같은 과정을 거쳐 전사인쇄물을 피착재(섬유재)에 견고하게 부착시킬 수 있다.The adhesive structure for the adherend of the transfer printed matter according to the present invention includes a lenticular layer 11, a print layer 13, an intermediate layer 15, and a hot melt 17. This adhesive structure can be firmly attached to the transfer material (fiber) through the following process.

먼저, 도 2와 같이, 통해 렌티큘러층(11)과, 렌티큘러층(11) 하면에 배치된 인쇄층(13) 및 인쇄층(13)의 하면에 매개층(15)을 순차적으로 배치한 후, 전처리단계로서 고주파용접을 통해 상기 적층된 렌티큘러층(11), 인쇄층(13) 및 매개층(15)의 외곽의 필요부분을 따라 견고하게 상호 접착한다. First, as shown in FIG. 2, the intermediate layer 15 is sequentially disposed on the lenticular layer 11, the printed layer 13 disposed on the lower surface of the lenticular layer 11, and the lower surface of the printed layer 13. As a pretreatment step, it is firmly adhered to each other along the necessary portions of the lenticular layer 11, the printed layer 13, and the intermediate layer 15 through the high frequency welding.

이 경우, 상기 매개층(15)은 고주파융착 및 열접착이 가능한 박막수지로 이루어지는 것이 바람직하다. 즉, PVC, PU, 폴리우레탄 또는 EVA 중 어느 하나로 이루어지는 것이 바람직하다.In this case, the intermediate layer 15 is preferably made of a thin film resin capable of high frequency fusion and thermal bonding. In other words, it is preferably made of any one of PVC, PU, polyurethane or EVA.

그 후, 도 3과 같이, 고주파용접 된 상기 렌티큘러층(11), 인쇄층(13) 및 매개층(15)을 핫멜트(17)를 사이에 두고 피착재(19)에 안착시킨다.Thereafter, as shown in FIG. 3, the lenticular layer 11, the printed layer 13, and the intermediate layer 15 which are high frequency welded are placed on the adherend 19 with the hot melt 17 therebetween.

이 상태에서 130℃∼150℃의 온도에서 10∼20초간 가압하는 핫스템핑을 통해 상기 렌티큘러층(11), 인쇄층(13)을 피착재(19)에 견고하게 접착시킨다.In this state, the lenticular layer 11 and the print layer 13 are firmly adhered to the adherend 19 through hot stamping at a temperature of 130 ° C. to 150 ° C. for 10 to 20 seconds.

상기 핫스템핑 과정에서 매개층(15)과 핫멜트(17)와의 상호 융착에 의해 더욱 견고한 접착력을 기대할 수 있다.In the hot stamping process, a more firm adhesive force can be expected by mutual fusion of the intermediate layer 15 and the hot melt 17.

상기한 바와 같은 본 발명에 있어서는, 열경화성수지로 이루어진 매개층을 통해 전사인쇄물을 피착재에 견고하게 부착시킬 수 있는 이점이 있다.In the present invention as described above, there is an advantage that the transfer print can be firmly attached to the adherend through the intermediate layer made of a thermosetting resin.

이상에서는 본 발명을 특정의 바람직한 실시예를 예를 들어 도시하고 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변경과 수정이 가능할 것이다.In the above, the present invention has been illustrated and described with reference to specific preferred embodiments, but the present invention is not limited to the above-described embodiments, and the present invention is not limited to the spirit of the present invention. Various changes and modifications will be possible by those who have the same.

Claims (8)

고주파용접을 통해 인쇄층 하면에 매개층을 부착하는 단계;Attaching the intermediate layer to the lower surface of the printed layer through high frequency welding; 상호 접착된 상기 인쇄층과 매개층을 핫멜트를 사이에 두고 피착재에 안착시키는 단계; 및Placing the printed adhesive layer and the interlayer bonded to the adherend with a hot melt interposed therebetween; And 상기 핫스템핑을 통해 상기 매개층과 핫멜트를 상호 융착시켜 상기 인쇄층을 피착재에 접착시키는 단계;를 포함하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화방법.Adhering the intermediate layer and the hot melt to each other through the hot stamping, thereby adhering the print layer to the adherend; and a method of enhancing adhesion between the transfer printed material and the adherend. 제1항에 있어서, 상기 매개층은 고주파용착 및 열접착이 가능한 박막수지인 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화방법.The method of claim 1, wherein the intermediate layer is a thin film resin capable of high frequency welding and thermal bonding. 제1항에 있어서, 상기 핫스템핑은 130℃∼150℃의 온도에서 10∼20초간 가압하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화방법.The method of claim 1, wherein the hot stamping is pressed at a temperature of 130 ° C. to 150 ° C. for 10 to 20 seconds. 제1항에 있어서, 상기 고주파용접 시 인쇄층 상면에 부착하는 렌티큘러층을 더 포함하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화방법.The method of claim 1, further comprising a lenticular layer attached to an upper surface of the printed layer during the high frequency welding. 인쇄층;Printed layer; 고주파용접에 의해 상기 인쇄층 하면에 부착되는 매개층;An intermediate layer adhered to the lower surface of the printed layer by high frequency welding; 상기 매개층과 피착재 사이에 배치되어 핫스템핑처리에 의해 상기 매개층과 상호 융착되면서 상기 피착재에 상기 인쇄층을 부착시키기 위한 접착부재;를 포함하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화구조.An adhesive member disposed between the intermediate layer and the adherend to adhere the print layer to the adherend while being fused with the intermediate layer by hot stamping. Reinforced structure. 제5항에 있어서,The method of claim 5, 상기 매개층은 열접착 및 고주파용착 가능한 박막의 PVC, PU, 폴리우레탄, EVA 중 어느하나인 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화구조.The media layer is a thermal adhesion and high-frequency welding thin film of any one of PVC, PU, polyurethane, EVA, characterized in that the adhesion strengthening structure of the transfer printing material and the adherend. 제5항에 있어서,The method of claim 5, 상기 접착부재는 핫멜트, EVA 또는 열경화성수지중 어느 하나 인것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화구조. The adhesive member is hot melt, EVA or thermosetting resin, characterized in that any one of the transfer printing material and the adhesion strengthening structure. 제5항에 있어서, 상기 고주파용접 시 인쇄층 상면에 부착하는 렌티큘러층을 더 포함하는 것을 특징으로 하는 전사인쇄물과 피착재의 접착력강화구조.The structure of claim 5, further comprising a lenticular layer attached to an upper surface of the printed layer during the high frequency welding.
KR1020060035893A 2006-04-20 2006-04-20 Structure and Method for adhiveness of transcription print layer and base layer KR100818308B1 (en)

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JP2016179569A (en) * 2015-03-24 2016-10-13 三菱樹脂株式会社 Medical film and high-frequency welded package

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KR102264589B1 (en) 2019-09-09 2021-06-11 안병학 Product Of Lenticular Transferring Printed Matter Heat-Adhered By Hot-Melt Resin

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KR19990033526U (en) * 1999-04-30 1999-08-05 문형근 Label for Raw-Cloth
KR100588066B1 (en) * 2004-06-24 2006-06-09 주식회사 동성엔에스씨 The adhering method of shoe items using reactive-hotmelt adhesive transfer
KR200373532Y1 (en) 2004-10-19 2005-01-21 박균삼 Textile printing emblem having adhesive property

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JP2016179569A (en) * 2015-03-24 2016-10-13 三菱樹脂株式会社 Medical film and high-frequency welded package

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