KR20070101064A - Radio frequency transmitter/receiver system - Google Patents

Abstract

An RF(Radio Frequency) transceiving system is provided to design packaging of parts, to minimize the size of a product and to mount a communication system in accordance with various signal bands on one terminal product. An RF(Radio Frequency) transceiving system comprises an RF processor(132), a spacer unit, a baseband processor(136) and a storage unit(134). The RF processor, packaged on a surface of a base plate, processes RF signals transmitted or received via an antenna. The spacer unit, positioned around the RF processor, provides a gap area with a certain thickness. The baseband processor, packaged over the RF processor while being combined with the spacer unit, processes conversion of the RF signal into a baseband signal. The storage unit, combined with an upper side of the baseband processor, stores data for signal processing.

Description

RF transmission and reception system {Radio Frequency transmitter / receiver system}

1 is a side cross-sectional view illustrating an exemplary SIP structure according to a first embodiment of a general RF transmission / reception system.

Figure 2 is a side cross-sectional view illustrating an exemplary SIP structure according to a second embodiment of a general RF transmission and reception system.

3 is a block diagram schematically illustrating the components of a DMB receiving system according to an embodiment of the present invention;

Figure 4 is a side cross-sectional view illustrating the structure of each component of the DMB receiving system according to the first embodiment of the present invention when mounted in a SIP structure.

Figure 5 is a side cross-sectional view illustrating the structure of each component of the DMB receiving system according to the second embodiment of the present invention when mounted in a SIP structure.

Figure 6 is a side cross-sectional view illustrating the structure of each component of the DMB receiving system according to the third embodiment of the present invention when mounted in a SIP structure.

<Explanation of symbols for main parts of drawing>

100: DMB receiving system 110: antenna

130: SIPD 132: RF processing unit

134: storage unit 136: baseband processing unit

140: media processing unit 150: video playback unit

160: audio playback unit 170: MSM

182a, 182b, 182c: substrate portion 184a, 184b, 184c: passive element portion

186a, 186b, 186c: bonding portion 188a, 188b, 188c: molding portion

190a, 190b, 190c: BGA 192a, 192b, 192c: spacer

The present invention relates to an RF transmission and reception system having a SIP (System In Package) structure.

The RF transmission / reception system may include a satellite / terrestrial DMB receiving system, a GPS receiving system, a CDMA communication system, and the like, and a representative example of the DMB receiving system is as follows.

DMB (Digital Multimedia Broadcasting) refers to high-end broadcasting that encompasses radio (audio) broadcasting, TV broadcasting and mobile communication data. In 2003, "digital audio broadcasting" and "digital video broadcasting" Incorporation has led to the generic term DMB being commonly used.

Since DMB transmits broadcast signals as digital data using all terrestrial, satellite, and radio frequency bands, DMB has a wide range of applications from mobile broadcasting, portable broadcasting, and personal broadcasting, and the development of contents is extensive.

DMB is classified into terrestrial DMB and satellite DMB according to technical standard and network configuration. Terrestrial DMB is based on Orthogonal Frequency Division Multiplex (OFEM), and satellite DMB is code division multiplex (CDM). It uses the same principle as mobile communication technology.

On the other hand, the microcircuit manufacturing technology of semiconductor devices is increasingly difficult to differentiate and respond according to product types due to the prolonged development period, enormous equipment investment, and rapid increase in process cost due to the complexity of the circuit.

Accordingly, a technology for vertically stacking the same type or various types of semiconductor devices at a chip level or a wafer level, and circuit-connecting wafers or chips stacked in a via pattern into a single package. The system structure to which such technology is applied is called SIP (System In Package) structure.

Elements constituting a general RF transmission and reception system including the above-described DMB reception system are often manufactured using a SIP structure.

1 is a side cross-sectional view illustrating an example of a SIP structure according to a first embodiment of a typical RF transmission and reception system, Figure 2 is a side cross-sectional view illustrating an example of a SIP structure according to a second embodiment of a typical RF transmission and reception system to be.

In general, the RF transmission / reception system includes an RF signal processing unit, a baseband processing unit, a baseband modem, a media processing unit, a memory, a codec, and an input / output unit, among which a baseband processing unit and an RF signal processing unit are provided as individual semiconductor elements. The baseband element is interlocked with the memory.

1 and 2, there is illustrated a mounting structure of a typical RF transmission and reception system having a SIP structure, the signal received through the antenna is converted into an intermediate frequency band signal while passing through the RF signal processing elements (12, 22) The converted intermediate frequency band signal is input to the baseband elements 13 and 23.

The baseband devices 13 and 23 include analog to digital converter (ADC) circuits, digital to analog converter (DAC) circuits, and low pass filters to extract video and audio signals from a received signal. Do this.

In this case, the baseband elements 13 and 23 require interworking with the memory chips 14 and 24 to smoothly process the video signal and the audio signal.

Referring to the first embodiment shown in FIG. 1, a relatively large baseband element 13 is mounted on a substrate 10, and a memory 14 is mounted thereon, respectively, and bonding patterns and wires 15 of the substrate, respectively. ) Is bonded. The RF signal processing element 12 has a structure in which the RF signal processing element 12 is horizontally disposed and mounted and wire bonded.

As described above, when the RF signal processing element 12 and the baseband element 13 have a horizontal structure, the RF signal processing element 12 and the baseband element 13 have advantages in preventing signal coupling, but occupy a large area in terms of layout design.

Referring to the second embodiment shown in Fig. 2, the baseband element 23, the memory 24, and the RF signal processing element 22 are sequentially in turn (depending on the size of the relative element) from the surface of the substrate 20. ) The stacked structure can be seen, but in this case, the mounting space can be reduced, but the parasitic component is generated because the RF signal processing element 22 is positioned at the top and the length of the wire 25 bonding is long. As the distance between the wires 25 is closer to each other, signal coupling may occur. In addition, there is a problem that the effect of radio interference between the RF signal processing element 22, the memory 24, and the baseband element 23 is increased.

In addition, since the passive elements 11 and 21 are disposed around the chip elements 12, 13, 14, 22, 23, and 24, they are one obstacle to minimizing the mounting area.

The present invention provides a relatively essential function in the SIP structure of the RF communication system, such as the satellite / terrestrial DMB receiving system, GPS receiving system, CDMA communication system, the baseband element, RF signal processing element and memory By efficiently arranging and designing the components, such as to minimize the mounting area, and to suppress the effect of mutual signal interference to provide an RF transmission and reception system that can maintain the performance stable.

RF transmission and reception system according to the present invention is an RF processing unit for processing the RF signal transmitted and received through the antenna, the surface mounted on the substrate; A spacer part positioned around the RF processor to provide a gap region having a predetermined thickness; A baseband processor configured to convert the RF signal into a baseband signal and to process the RF signal, the baseband processor coupled to the spacer and mounted on the RF processor; And a storage unit which stores signal processing data and is coupled to an upper side of the baseband processor.

RF transmission and reception system according to the present invention is an RF processing unit for processing the RF signal transmitted and received through the antenna, the surface mounted on the substrate; A spacer part positioned around the RF processor to provide a gap region having a predetermined thickness; A storage unit for storing signal processing data and coupled to the spacer unit and mounted on the RF processing unit; And a baseband processing unit converting the RF signal into a baseband signal and processing the combined RF signal.

In addition, the RF processing unit of the RF transmission and reception system according to the present invention is wire bonded with the substrate in the inner region of the spacer portion, the base band portion and the storage portion is wire bonded with the substrate in the outer region of the spacer portion.

In addition, the RF processing unit, the spacer unit, the baseband processing unit and the storage unit of the RF transmission and reception system according to the present invention is molded on the substrate.

In addition, the RF transmission and reception system according to the present invention includes the baseband processing unit and a passive element unit connected to the RF processing unit, the passive element unit is mounted on at least one substrate region of the outer substrate region and the inner substrate region of the spacer portion do.

Hereinafter, an RF transmission / reception system according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the embodiment of the present invention, a DMB receiving system is used.

3 is a block diagram schematically illustrating the components of the DMB receiving system 100 according to an embodiment of the present invention.

Referring to FIG. 3, the DMB receiving system 100 according to an embodiment of the present invention includes an antenna 110, an RF processor 132, a storage unit 134, a baseband processor 136, a media processor 140, and a video. And a playback unit 150, an audio playback unit 160, and a mobile station modem (MSM) 170. Each of the RF processor 132, the baseband processor 136, and the storage unit 134 are each one. It is provided as a chip element of the package is mounted together and molded by a single package element.

Hereinafter, the single package device will be referred to as "System In Package Device" (SIPD), and the SIPD 130 will be described in detail with reference to FIGS. 4 to 6.

First, the antenna 110 receives a DMB terrestrial signal, converts it into an electrical signal, and transmits the converted electrical signal to the RF processor 132.

When the DMB terrestrial signal is transmitted from the antenna 110, the RF processor 132 selectively selects a signal through a synchronization means and converts the selected signal into an intermediate frequency band signal.

The RF processor 132 is largely composed of an RF unit (not shown) and an IF (Intermediate Frequency) unit (not shown). The RF unit is a duplexer, a power amplifier, a driver amplifier. ), A low noise amplifier, a signal mixer, a frequency synthesizer, a band pass filter (BPF), and the IF unit, an automatic gain controller (AGC), a signal synthesizer, a signal mixer, IF amplifier or the like.

As described above, the baseband processor 136 and the storage unit 134, which are implemented as the SIPD 130 together with the RF processor 132, interoperate to generate an audio signal and a video signal from an intermediate frequency band signal, and store the same. The unit 134 stores the signal processing data of the baseband processing unit 136.

The baseband processor 136 demodulates the signal transmitted from the RF processor 132 into a baseband signal (a low band analog signal state) and converts the low band analog signal into a digital signal.

The baseband processor 136 includes an analog / digital signal converter (ADC, DAC), a fast fourier transform (FFT) circuit, a low pass filter (LPF), a modulator, an error correction circuit, and the like.

The storage unit 134 may be provided as a memory device such as, for example, a synchronous dynamic random access memory (SDRAM).

SDRAM refers to the type of DRAM whose clock speed is synchronized with the main computing device. The use of such SDRAM allows the clock speed synchronization to increase the amount of signal that the processor can perform within a certain amount of time. It is used a lot.

The MSM 170 is a core device of the DMB receiving system 100. The MSM 170 includes a central processing unit (CPU) and a vocoder for coding a voice, and performs an operation / control function to control the operation of each circuit unit. Then, the user interface signal is processed to control input and output of data.

In addition, the MSM 170 is connected to the SIPD 130 composed of the RF processing unit 132, the baseband processing unit 136, and the storage unit 134, and receives a gain amplifier received in the SIPD 130. The control signal is transmitted to adjust the gain voltage according to the electric field.

In the baseband processor 136, the low-band analog signal is processed into an audio signal and a video signal. Since the audio signal is processed by the vocoder of the baseband processor 136, the audio signal output from the baseband processor 136 The audio reproducing unit 160 may be processed in real time.

The audio reproducing unit 160 converts the audio signal output from the baseband processing unit 136 into an analog signal, amplifies it, and outputs it through a speaker.

In addition, the video signal output from the baseband processor 136 passes through the image processor on the media processor 140 and is then transmitted to the video player 150.

That is, the media processor 140 decodes the video signal transmitted from the baseband processor 136 and processes the decoded signal graphic. For example, the media processor 140 outputs a plurality of channels at the same time by providing a picture in picture (PIP) function. The user interface menu may be overlapped and displayed on the broadcast screen.

The video reproducing unit 150 converts and reproduces a video signal corresponding to a channel selected by the user to an analog signal so as to be output on the screen.

4 is a side cross-sectional view illustrating the structure of each component of the DMB receiving system 100a according to the first embodiment of the present invention when it is mounted in a SIP structure.

Referring to FIG. 4, the SIP structure of the DMB receiving system 100a according to the first embodiment of the present invention includes a board unit 182a, a bonding unit 186a, a passive element unit 184a, and an RF processor 132a. And a spacer 192a, a baseband processing unit 136a, a storage unit 134a, and a molding unit 188a.

First, the RF processing unit 132a is surface-mounted on the upper surface of the substrate unit 182a. The RF processing unit 132a is coupled to the surface of the substrate unit 182a through a conductive adhesive member, and formed on the substrate unit 182a. For example, it may be wire bonded with a bonding pattern connected with a routing pattern or a via hole pattern.

When the RF processing unit 132a is coupled to the substrate unit 182a through a conductive adhesive member, when the substrate unit 182a has a multi-layer structure, it is possible to shield transmission of RF radio waves to elements mounted therein. .

The spacer portion 192a is positioned around the wire bonding region of the RF processor 132a, and the spacer portion 192a has a predetermined spaced space above the RF processor 132a and the baseband processor 136a. The gap area is provided so that can be mounted.

The spacer portion 192a may be formed of a silica or a resin material, and may be formed through a process of being manufactured with a predetermined structure and bonded or applied in a particle form.

The spacer 192a is bonded to the chip end of the baseband processor 136a to fix / support the baseband processor 136a, and spatially separates the RF processor 132a from the baseband processor 136a. Signal coupling, radio wave interference effects, etc. can be effectively blocked.

In particular, since the RF processing unit 132a and the baseband processing unit 136a are not only spatially isolated, but also separated by the spacer unit 192a to each bonding unit, the radio wave shielding effect can be maximized, and the RF processing unit 132a Since the bonding wire length can be made as short as possible, it is possible to suppress the occurrence of parasitic components.

In addition, the base band processing unit 136a is coupled to the upper surface through the storage unit 134a and the adhesive member, and wire-bonded with the substrate unit 182a, respectively.

Here, since the baseband processing unit 136a and the storage unit 134a are extremely weak in radio wave interference, and there is little fear of signal coupling, factors such as distance between bonding wires and whether the adhesive member is conductive or non-conductive. There is no need to be affected.

When the baseband processing unit 136a, the RF processing unit 132a, and the storage unit 134a are vertically mounted and wire bonded, the passive element unit 184a is surface mounted outside the entire wire bonding area, and each component is epoxy on a substrate. The molding part 188a is formed by molding a material such as resin and treating the curing process.

5 is a side cross-sectional view illustrating the structure of each component of the DMB receiving system 100b according to the second embodiment of the present invention when it is mounted in a SIP structure.

Referring to FIG. 5, the SIP structure of the DMB receiving system 100b according to the second embodiment of the present invention is the board unit 182b, the bonding unit 186b, and the passive element unit 184b as in the first embodiment. And an RF processing unit 132b, a spacer unit 192b, a baseband processing unit 136b, a storage unit 134b, and a molding unit 186b, which have the same structure and function as those of the first embodiment. The description thereof will be omitted.

The difference between the SIP structure according to the second embodiment of the present invention and the first embodiment is that the spacer unit 192b and the storage unit 134b are coupled, that is, stored with a space above the RF processor 132b. The unit 134b is mounted, and the baseband processing unit 136b is coupled to the upper surface of the storage unit 134b.

Since the SIP structure proposed by the DMB receiving system according to the present invention aims to separate the RF processing unit 132 from the baseband processing unit 134 and the storage unit 136, the baseband processing unit 134 and the storage unit ( The order on the vertical mounting structure of 136 is not critical.

Therefore, when the chip size of the storage unit 136 is larger than the chip size of the baseband processor 134, the mounting order may be changed as in the second embodiment of the present invention.

6 is a side cross-sectional view illustrating the structure of each component of the DMB receiving system 100c according to the third embodiment of the present invention when it is mounted in the SIP structure.

Referring to FIG. 6, the SIP structure of the DMB receiving system 100c according to the third embodiment of the present invention is the board unit 182c, the bonding unit 186c, and the passive element unit 184c as in the first embodiment. And an RF processing unit 132c, a spacer unit 192c, a baseband processing unit 136c, a storage unit 134c, and a molding unit 188c, with the same structure and function as in the first embodiment. The description thereof will be omitted.

The SIP structure according to the third embodiment of the present invention is different from the above-described first and second embodiments in that a part of the passive element part 184c is mounted in the inner region of the spacer part 192c. .

Here, a part of the passive element unit 192c is a group of passive elements related to the RF processor, for example, the RF processor 132c implemented as a chip element needs to be further connected to a passive element externally, in this case, passive The device unit 192c also needs to be divided into a passive device connected to the RF processor 132c and a passive device connected to the baseband processor 136c.

Therefore, in order to shield the radio wave interference effect more completely, in the third embodiment of the present invention, the passive element portion 184c is also divided and spaced apart from the space provided by the spacer portion 192c.

According to FIGS. 4 to 6, since many non-Pb type processing methods are used in the HAL processing (lead processing) method, Ball Grid Array (BGA) 190a, 190b, It can be seen that 190c) is formed.

As described in the above embodiments, the SIP structure of the DMB receiving system 100 according to the present invention stacks chips vertically with a spaced space different from a conventional single chip package, thereby increasing placement density or information. By stacking chips with storage functions and logic operations to manufacture multi-functional packages, the products can be made smaller, lighter and more versatile.

In addition, the SIP structure according to the present invention is to package a combination of the conventionally developed semiconductor chip products, has a short development period, it is possible to reduce the production cost by using the existing equipment as it is.

Although the present invention has been described above with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains may have an abnormality within the scope not departing from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not illustrated. For example, each component specifically shown in the embodiment of the present invention can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

According to the RF transmission and reception system according to the present invention, by improving the conventional SIP mounting structure, it is possible to minimize parasitic components and signal coupling phenomenon generated between wire bonding and between devices while minimizing the mounting area of devices. have.

In addition, according to the present invention, it is easy to design the mounting of the components, to minimize the size of the product, to simplify the production process, and to mount a communication system according to various signal bands on one terminal product It works.

In addition, according to the present invention, it is possible to use the existing chip products, production equipment as it is, it is possible to quickly launch a variety of products in response to customer requirements, there is an effect that can easily create a new market.

Claims (6)

An RF processor which processes an RF signal transmitted and received through an antenna and is surface mounted on a substrate; A spacer part positioned around the RF processor to provide a gap region having a predetermined thickness; A baseband processor configured to convert the RF signal into a baseband signal and to process the RF signal, the baseband processor coupled to the spacer and mounted on the RF processor; And RF transmission and reception system for storing signal processing data, the storage unit coupled to the upper side of the baseband processing unit. An RF processor which processes an RF signal transmitted and received through an antenna and is surface mounted on a substrate; A spacer part positioned around the RF processor to provide a gap region having a predetermined thickness; A storage unit for storing signal processing data and coupled to the spacer unit and mounted on the RF processing unit; And And converting the RF signal into a baseband signal, processing the signal, and including a baseband processor coupled to an upper side of the storage unit. According to claim 1 or claim 2, wherein the RF processing unit RF transmission and reception system, characterized in that coupled to the substrate via a conductive adhesive member. The method according to claim 1 or 2, And the RF processor is wire bonded to the substrate at an inner region of the spacer portion, and the base band portion and the storage portion are wire bonded to the substrate at an outer region of the spacer portion. The method according to claim 1 or 2, And the RF processing unit, the spacer unit, the baseband processing unit and the storage unit are molded on the substrate. The method according to claim 1 or 2, A passive element unit connected to the baseband processor and the RF processor; The passive element unit is RF transmitting and receiving system, characterized in that mounted on at least one substrate region of the outer substrate region and the inner substrate region of the spacer portion.

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