KR20070091982A - Plasma display apparatus - Google Patents

Abstract

A plasma display device is provided to enhance heat-radiating efficiency with lower costs by attaching a carbon-based sheet to one surface of two or more layers of a heat-sink. A plasma display device includes a panel having at least one or more electrodes, a driving board installed at a backside of the panel in order to apply a driving voltage to the electrodes, and a heat-sink(110) installed at a backside of the driving board. The heat-sink includes a first thin layer(111a), a second thin layer(112a) separated from the first thin layer, and an FPC(Flexible Printed Circuit) protection part(110c). The first thin layer is bent to the panel along the FPC for connecting the electrodes and the driving board with each other. A plurality of heat-radiating fins are formed in the second thin layer and are protruded vertically to the backside.

Description

Plasma display apparatus

1 is a cross-sectional view of a typical plasma display device;

2 is a rear view of a typical plasma display device;

3 is a perspective view showing a heat sink applied to a general plasma display device;

4 is a perspective view showing a heat sink of a plasma display device according to the present invention;

5A, 5B, 5C, and 5D are cross-sectional views illustrating heat sinks of the plasma display apparatus according to the first to third embodiments.

<Explanation of symbols on main parts of the drawings>

110, 120, 130, 140: heat sink 111a: first thin plate

112a: second thin plate 110c: FPC protection unit

110b: heat sink fin P: Pamnut

S: screw 113: carbon material sheet

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display apparatus, and more particularly, to a structure of a heat sink coupled to a rear side of an address driver to reduce heat generation in an address driver and an FPC for applying a driving voltage to an address electrode of a panel.

1 is a cross-sectional view showing a plasma display device according to the prior art.

As shown in FIG. 1, the conventional plasma display panel is composed of a front and rear substrates (1) and (2), which are discharged by an applied pulse to generate light, and installed at the rear of the panel. And a drive board 8 for applying a driving voltage to an electrode, and an FPC 9 for connecting the panel and the drive board, and is installed on the rear surface of the panel 3 to be generated in the panel 3. Including a heat dissipation frame 4 for dissipating the heat, and a heat sink 11 for dissipating the heat generated from the FPC (9), and surrounds one side of the panel (3) and the drive board (8) It is composed.

In addition, the filter 3 is installed on the front of the panel 3 to shield electromagnetic interference (hereinafter referred to as 'EMI') and prevents external reflection, and is installed to surround the rear surface of the panel 3. It further comprises a back cover (5), and a cabinet (6) assembled with the back cover (5) while surrounding a portion of the edge of the glass filter (3).

Here, referring to the back of the plasma display device with reference to FIG. 2, a scan / sustain / address and a control drive board 8 are installed on the back of the heat dissipation frame 4, and each drive board is connected by a cable 10. Connected. In addition, the scan / sustain / address drive board is connected to an electrode provided in the panel through a flexible printed circuit 9 (FPC).

Among the driving boards shown in FIG. 1 as an address driving board for applying a driving voltage to the address electrodes of the panel, the driving board 8 is connected through a flexible flexure FPC 9, In the driving board 8 and the FPC 9, heat generation is severe due to a switching operation for generating data pulses during the address period.

In particular, when the number of electrodes increases as the size of the panel increases, when the number of address electrodes connected to one FPC 9 is large, an image pattern in which one line of discharge cells is sequentially turned on and off When input, and when the temperature of the environment in which the plasma display apparatus is driven is high, the heat generation problem is more seriously generated.

As described above with reference to FIG. 3, the heat sink 11 is installed to dissipate heat generated by the driving board 8 and the FPC 9. The heat sink 11 is formed of a metal sheet 11a. And a plurality of heat dissipation fins 11b protruding vertically from the thin plate by a predetermined length, and the FPC protection unit 11c in which the thin plate 11a is bent at right angles to protect the FPC 9. .

That is, in the conventional heat sink 11, since the heat dissipation fins 11b protruding on the thin plate 11a to have a predetermined height are formed at a predetermined height, the unit cost of the heat sink is increased and the thickness of the module is thick. There was a disadvantage of losing.

The present invention has been made to solve the above-mentioned problems of the prior art, the thin plate constituting the heat sink which is mounted to solve the heat generation of the FPC and the address driver to form at least two or more layers, the space between each layer is separated by air convection The present invention provides a plasma display device having high heat generation efficiency.

Plasma display device of the present invention for solving the above problems is a panel formed with at least one electrode; A driving board applying a driving voltage to the electrode from the rear of the panel; And a heat sink installed at the rear of the driving board, wherein the heat sink comprises: a first thin plate; A second thin plate spaced apart from the first thin plate by a predetermined distance; According to the FPC connecting the electrode and the drive board is characterized in that the first thin plate comprises an FPC protection portion bent to the panel side.

In addition, the second thin plate may be formed with a plurality of heat dissipation fins projecting vertically toward the rear by a predetermined length, characterized in that the number and height of the heat dissipation fins are reduced compared to the prior art.

At least one fastening hole is formed in the first thin plate and the second thin plate, and a pampnut is inserted through the fastening hole of the first thin plate, and a screw coupled to the pampnut is inserted through the fastening hole of the second thin plate. Accordingly, the thin plates are spaced apart by a predetermined distance to increase heat dissipation efficiency due to air convection.

The separation distance between the first thin plate and the second thin plate is preferably within 2 mm.

A carbon sheet may be attached to at least one surface of the first thin plate and the second thin plate facing each other, and the heat dissipation efficiency may be further increased by the carbon sheet having high thermal conductivity.

Hereinafter, a plasma display device of the present invention will be described with reference to the accompanying drawings. 4 is a perspective view of a heat sink applied to a plasma display device according to the present invention, and FIGS. 5A to 5D are cross-sectional views showing first to fourth embodiments of the heat sink structure of the present invention.

First, the panel includes a front substrate provided with a scan electrode and a sustain electrode, and a rear substrate disposed behind the front substrate, bonded to the front substrate, and provided with an address electrode. In addition, an inert mixed gas is filled in the front substrate and the rear substrate, and a heat dissipation frame for dissipating heat generated from the panel is installed at the rear of the panel.

In addition, the driving board installed at the rear of the heat radiation frame includes a scan driving board and a sustain driving board for applying a driving voltage to the scan electrode and the sustain electrode, and an address driving board for applying the driving voltage to an address electrode. And a control board for controlling the switching operation timing in the scan / sustain / address drive board.

At this time, the number and type of the plurality of driving boards installed in the rear of the heat radiation frame is not limited by the drawings of the present specification.

The driving board is connected to an electrode formed on the panel through a flexible printed circuit (FPC).

In this case, the FPC is a circuit embedded in a flexible film. In the present embodiment, the FPC is illustrated, but the present invention is not limited thereto. A chip on film type and a tape carrier package type may also be used. State that

Here, the heat sink 110 of the present invention is illustrated as being mounted to dissipate heat of the FPC and the address driving board, as shown in FIG. In addition, at least one heat sink is mounted depending on the panel size.

The heat sink 110 includes a first thin plate 111a and a second thin plate 112a spaced apart from the first thin plate by a predetermined distance, and the first thin plate along an FPC connecting the electrode and the driving board. It consists of the FPC protection part 110c bent to the said panel side.

In this case, the first thin plate 111a is positioned inside the adjoining address driving board and the FPC, and the second thin plate 112a is spaced apart from the first thin plate 111a by a predetermined distance.

In addition, at least one fastening hole is formed in the first thin plate 111a and the second thin plate 112a, and the femnut P is inserted through the fastening hole formed in any one of the first and second thin plates. And, through the fastening hole formed in the other thin plate is inserted into the screw (S) coupled to the pampnut so that the space between the first thin plate (111a) and the second thin plate (112a) by the height of the Pampnut (P). .

At this time, the separation distance between the first thin plate (111a) and the second thin plate (112a) is preferably within 2mm, the reason is contrary to the object of the present invention to achieve a thinning of the module when the separation distance is too large, length Longer peanuts are expensive, and manufacturing costs rise.

That is, since air is caused to convection between the first thin plate 111a and the second thin plate 112a in which the separation distance is maintained by the pampnut P and the screw S, the heat generated from the driving board and the FPC. Is emitted to the rear side via the first thin plate 111a-> air layer-> second thin plate 112a.

The first embodiment configured as described above is illustrated in FIG. 5A, and as a result, the first thin plate 111a and the second thin plate 112a of the heat sink 110 have a structure of at least two layers between the thin plates. By forming an air layer, the heat dissipation efficiency is increased, and thus the heat dissipation fin protruding vertically from the first thin plate is omitted.

The second embodiment is as shown in FIG. 5B, and the fact that the first thin plate 111a and the second thin plate 112a of the heat sink 120 form a structure of at least two layers is similar to that of the first embodiment. One feature is that a plurality of heat dissipation fins 110b are formed on the second thin plate. However, since the heat dissipation efficiency is increased as the air layer between the thin plates is formed in comparison with the conventional, it is possible to form a smaller number than the conventional heat dissipation fins, it can also be formed with a height (H) lower than the conventional heat dissipation fins.

The third embodiment is as shown in FIG. 5C, wherein the first thin plate 111a and the second thin plate 112a of the heat sink 130 form a structure of at least two layers and protrude vertically from the first thin plate. The heat dissipation fin is omitted, similar to the first embodiment, but characterized in that the carbon material sheet 113 is bonded to at least one surface of the first thin plate or the second thin plate.

Looking at the desirable physical properties of such a carbon material sheet 113, having a compression ratio of 30% to 50%, an elastic body having a recovery rate of about 10%, has a tensile strength of 4 to 5 MPa so as not to be damaged by physical contact or heat. . In addition, the heat resistance temperature has a high heat resistance of about -200 to 400 degrees in the atmosphere. To this end, the carbon material sheet of the present invention is preferably composed of only carbon atoms (Graphite) to be close to 100% purity.

In addition, the carbon material sheet of the present invention may be coated on the surface, or a film laminated with PET tape or aluminum (Al) tape to form a carbon dust escape phenomenon.

In addition, the thermal conductivity of the carbonaceous sheet of the present invention is 170 to 350W / m * K level in the plane direction and 5 to 20 W / m * K level in the thickness direction, higher than aluminum of 240 W / m * K level It has a thermal conductivity, and the heat capacity per unit volume is about 1.3 J / cm ³ * K, which is only half the level of 2.4J / cm ³ * K of aluminum.

Therefore, the heat sink 130 according to the third embodiment of the present invention increases heat dissipation efficiency by the carbon material sheet 113 together with the air layer between the thin plates even though a plurality of heat dissipation fins are not formed. In this case, the carbon material sheet is preferably bonded to at least one of the surfaces of the first thin plate 111a or the second thin plate 112a facing each other, so that the heat in the first thin plate is convection in the air layer or It is conducted through the carbonaceous sheet and transferred to the second thin plate.

The fourth embodiment is as shown in FIG. 5D, wherein the first thin plate 111a and the second thin plate 112a of the heat sink 140 form at least two layers, and the first thin plate of the heat sink. Alternatively, the carbon material sheet 113 is adhered to at least one of the second thin plates in a similar manner to the third embodiment, but a plurality of heat dissipation fins 110b are formed on the second thin plates 112a.

However, since the heat dissipation efficiency is increased by the air layer between the thin plate and the carbon sheet as compared with the prior art, it can be formed in a smaller number than the heat dissipation fin of the second embodiment, it can also be formed at a low height (H ').

At this time, the carbon material sheet 113 is preferably bonded to at least one of the surfaces of the first thin plate or the second thin plate facing each other, so that the heat in the first thin plate 111a is convection in the air layer or It is conducted through the carbon material sheet 113 and transferred to the second thin plate 112a, and the heat of the second thin plate is discharged to the outside through the plurality of heat dissipation fins 110b.

As described above, the plasma display device according to the present invention has been described with reference to the illustrated drawings. However, the present invention is not limited to the embodiments and drawings described in the present specification, and is provided by those skilled in the art within the scope of the technical idea of the present invention. Application is possible.

In the plasma display device according to the present invention configured as described above, the thin plate constituting the heat sink mounted for heat dissipation of the FPC and the address driver forms at least two or more layers, and the heat dissipation occurs as the air convection occurs because the layers are spaced apart from each other. There is an effect that the efficiency is increased. In addition, as the carbon material sheet is adhered to at least one surface of the thin plates constituting the two or more layers, the heat dissipation efficiency can be increased at a low cost, and the module can be thinned.

Claims (6)

A panel on which at least one electrode is formed; A driving board applying a driving voltage to the electrode from the rear of the panel; It is configured to include a heat sink installed in the rear of the drive board, The heat sink comprises: a first thin plate; A second thin plate spaced apart from the first thin plate by a predetermined distance; And an FPC protection part in which the first thin plate is bent to the panel side along an FPC connecting the electrode and the driving board. In claim 1, And a plurality of heat dissipation fins protruding vertically toward the rear by a predetermined length in the second thin plate. In claim 1, At least one fastening hole is formed in the first thin plate and the second thin plate, And a pampnut is inserted through a fastening hole of one of the first and second thin plates, and a screw coupled to the pampnut is inserted through the fastening holes of the other thin plates. In claim 1, And a separation distance between the first thin plate and the second thin plate is within 2 mm. In claim 1, And a carbon sheet is attached to at least one of the first thin plates and the second thin plates facing each other. In claim 1, And a carbon sheet is attached to at least one surface of the first thin plate.

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