KR20070081839A - Plastic body covered with copper-electroformed skin - Google Patents

Abstract

A copper-electroformed plastic combination body is provided to increase durability by reinforcing strength of synthetic resin and to improve a radiation effect of communication devices by using copper. A copper-electroformed plastic combination body is produced by attaching a reinforced plastic base(600) on the back side of a copper-electroformed plated article. An adhesive agent is applied between the copper-electroformed plated article and the reinforced plastic base. The copper-electroformed plated article is formed by continuously stacking a copper-plated layer(100) of 0.2~0.3mm, a cobalt-plated layer(200) of 0.6~1.4 micron meters, a platinum-plated layer(300) of 0.08~0.12 micron meters, and a chromium-plated layer(400) of 0.25~0.35 micron meters from the lower side in order. A hologram is attached between the platinum-plated layer and the chromium-plated layer. The copper-plated layer has a Vickers hardness value of 180~220Hv.

Description

Copper pole synthetic resin binder {PLASTIC BODY COVERED WITH COPPER-ELECTROFORMED SKIN}

1 is a process chart showing a method of manufacturing a case of an information communication device by conventional Mg die casting.

Figure 2 is a process chart showing a copper pole synthetic resin conjugate according to the present invention.

3 is a process chart showing a multilayer copper electroplating method according to the present invention.

4 is a process chart showing a multilayer copper electroplating method according to the present invention.

5 is a view showing a schematic configuration of the air stirring in FIG.

6 is a graph showing the impact strength value relative to the metal of the reinforced plastic base according to the present invention.

7 is a graph showing the stiffness of other plastics of the reinforced plastic base of the present invention.

8 is a graph showing the trend of tensile strength at low temperature of the reinforced plastic base of the present invention.

9 is a graph showing the tensile strength of other synthetic resins at a high temperature of the reinforced plastic base of the present invention.

10 is a graph comparing the productivity and strength of the reinforced plastic base of the present invention and other materials.

11 is a view showing a cross-sectional configuration of an information communication device case according to the present invention.

12 is an exploded perspective view of an information communication device case according to the present invention.

?? Description of the main reference numbers

100 ... copper plating layer

200 ... Cobalt Plated Layer

300 ... Platinum Plating Layer

400 ... chrome plated layer

600 ... reinforced plastic base

The present invention relates to a copper pole synthetic resin binder, and more particularly, to a copper pole synthetic resin conjugate to cover the copper pole shell on the body made of a resin to exhibit both excellent effects.

In general, plastic or metal is generally used as a material of a case or part of a small information communication device such as a mobile phone, a PDA, an MP3 player, or a PSP.

In the case of manufacturing the case of the information and communication device made of plastic, a method of injecting and molding the plastic into a mold having a constant shape by applying high temperature heat and then placing various electronic components therein is used.

However, since the mobile phone having such a plastic case does not absorb electromagnetic waves due to the characteristics of the plastic itself, there is a problem that the electromagnetic waves generated from the mobile phone may cause fatal damage to the user's human body.

In order to solve this problem, Korean Patent Laid-Open Publication No. 2002-0078392 discloses that ferrite powder is mixed with plastic resin during the manufacture of a case of a mobile phone body, and then heated to inject the case into a liquid plastic state. The present invention discloses a product in which an electromagnetic wave is absorbed by a user so that the user can use the product safely.

However, these general plastic products still have a problem that the surface of the product itself is rough, the strength and hardness are weak, so that breakage or scratching occurs easily when dropped or hit. In addition, the plastic itself has a limit in showing the luxurious metal effect.

In order to avoid the drawbacks of such plastic cases or parts, recently, metal materials have been used as cases of information and communication devices.

In particular, since the case, which is one of the important components of the small information communication device, is one of the bulkiest parts, magnesium or aluminum, which is a low specific gravity material, is typically used to lighten the final assembled mobile phone.

Metals such as magnesium and aluminum described above are very effective materials for blocking electromagnetic waves, and thus may be useful materials for manufacturing a mobile phone case.

However, aluminum is vulnerable to corrosion and low in strength, so it is used to increase the corrosion resistance and surface hardness by anodizing to form an oxide film on the surface.However, the strength of the material itself is low, so it is easily vulnerable to impact such as dropping. There is a disadvantage.

In addition, magnesium is very susceptible to corrosion, so after anodizing and applying the paint, the paint is vulnerable to scratches have a disadvantage that the surface condition worsens. In addition, there is a problem in that allergy occurs when the coating is coated with nickel, while the light rate is high.

Referring to Figure 1 briefly describes a method for manufacturing a mobile phone case made of magnesium.

As shown, the initial product is first formed through die casting.

Then, a predetermined portion is partially processed through machining.

Next, put in a barrel and finish.

Then, it is added to the chromate to perform chromium coating, and under coating is carried out with nickel, followed by base coating and top coating.

Finally, it is baked in a furnace to produce the final product.

In recent years, a constitution has been developed to solve the problems of products made of pure aluminum and magnesium and to improve the surface condition, and a representative constitution is disclosed in Korean Patent Laid-Open Publication No. 2005-0102018. The manufacturing process is briefly described as follows.

1. Shape the case out of titanium.

2. Make fine unevenness on the surface of the manufactured titanium case.

3. Deposit aluminum on the surface of the titanium case where fine unevenness is formed.

4. Perform heat treatment to improve the adhesion between aluminum and titanium.

5. Anodize the aluminum to form an aluminum oxide film.

Accordingly, a product having high strength, light weight, excellent electromagnetic wave shielding property, and high surface hardness may be made to have high resistance to scratching.

However, since such a conventional product is made entirely of a conductor, there is a fear that a short circuit occurs from an internal electronic component or in some cases.

On the other hand, in recent years, a lot of products are pre-plated on the surface of watches, glasses, fountain pens, toys, and mobile phone cases.

Electroplating is a method of manufacturing or replicating metal products by electrodeposition.

As a representative example, a metal salt is deposited in a model (circular, master) by electrolysis of a metal salt solution, and then the electrodeposition layer is removed from the model. There is something to get.

Although the said conduction is used as it is, the peeling film process may be performed on the surface which was peeled off again, and the same operation may be performed to obtain the product exactly identical with a model.

In some cases, the metal is thickly plated and then commercialized.

To distinguish between ordinary plating and electroplating, the electrodeposited thickness in ordinary plating is 0.001mm to 0.05mm, whereas electroplating is large from 0.025mm to 25mm.

According to the electroplating, it is possible to adjust the type, hardness, etc. of the metal according to the electrolytic conditions to obtain a wide range of physical properties, to produce a product with almost no error in the original, it is possible to accurately reproduce the surface state. In addition, there is almost no restriction on the size or shape of the product, it is possible to obtain a high-purity metal product.

Nickel (Ni) is mentioned as a typical representative metal for electroplating.

However, in the case of nickel, the nickel allergy is induced by the user and is regulated. In particular, when nickel is contaminated and oxidized in salt water, sweat or cosmetics, it tends to be more harmful.

In addition, conventional electroplating with nickel has a disadvantage that the surface of the nickel plating layer is very rough. For this reason, in order to obtain a smooth surface, it is usually necessary to form a thick nickel gloss plating layer. Thus, when the nickel gloss plating layer is formed on the hologram, the reproducibility of the hologram is greatly reduced.

The present invention has been made to solve the above problems, an object of the present invention is to provide a copper pole composite resin composite having the advantages of both a synthetic resin and a metal (copper).

It is a specific object of the present invention to provide a copper pole composite resin composite that can utilize the insulation effect due to plastic and the electromagnetic shielding effect and surface metal effect by copper.

In addition, it is an object of the present invention to provide a copper pole composite resin composite that can increase the durability by strengthening the strength of the base synthetic resin.

It is also an object of the present invention to provide a copper pole synthetic resin conjugate that can increase the heat dissipation effect of the product.

In addition, it is an object of the present invention to provide a copper pole synthetic resin conjugate showing a sufficient hardness value and harmless to the human body.

In addition, another object of the present invention, when applying a hologram to the surface of the product, to provide a copper pole synthetic resin conjugate that can greatly increase the reproducibility.

In order to achieve the above object, the copper pole synthetic resin conjugate according to the present invention,

It is characterized in that the reinforcement plastic base is attached to the back of the electroplated copper pole electroplating products.

In this case, it is preferable that an adhesive agent is interposed between the electroplating copper electroplating article and the reinforced plastic base.

In addition, it is preferable that the electroplating copper electroplating article is made of a multilayer, and has a structure in which a copper plating layer, a cobalt plating layer, and a platinum plating layer are sequentially stacked from the bottom.

In addition, the chromium plating layer may be stacked on the platinum plating layer.

In addition, a hologram may be attached between the platinum plating layer and the chromium plating layer.

The copper plating layer preferably has a Vickers hardness value in the range of 180 Hv to 220 Hv.

In addition, the plating layer has a structure in which a copper plating layer having a thickness of 0.2 to 0.3 mm, a cobalt plating layer having a thickness of 0.6 to 1.4 µm, a platinum plating layer having a thickness of 0.08 to 0.12 µm, and a chromium plating layer having a thickness of 0.25 to 0.35 µm are sequentially stacked from the bottom. It is preferable to become.

On the other hand, the reinforcement plastic base, PPA (Poly Phthal Amide), PPS (Poly Phenylene Sulfide), PA66 (Poly Amide 66), PP (Polypropylene), any one selected from the glass fiber 50 to 60% by weight It is preferable that it consists of the structure which occupied.

Furthermore, it is preferable that a coating agent is applied to the surface of the reinforced plastic base.

In addition, it is preferable that a curing portion is formed in the copper electroplating article, and a groove that fits the curing portion is formed on the surface of the reinforced plastic base.

Here, it is advantageous in appearance that the curry portion is formed at the edge of the display window.

In addition, the adhesive is preferably an epoxy urethane E liquid Primer GR-MP3100.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, Figure 2 is a process showing a copper pole synthetic resin conjugate according to an embodiment of the present invention.

As shown, the electro-synthetic resin composite according to the present embodiment, the step of forming a multi-layer copper electroplating article through the electroplating process, the step of forming the copper electroplating article, and the adhesive on the back of the copper electroplating article And applying the injection-molded reinforced plastic base to the copper pole plated article.

It is preferable that the chromium coating process is further included after molding the copper pole plating product.

As shown in Figure 3 and 4, the step of forming a multi-layer copper electroplating article through the electroplating process, the step of plating the one-dimensional type to obtain a two-dimensional type of the negative sound conducted, and the conductive sound Performing substitute platinum plating (IWP) on the two-dimensional type of; cobalt base plating (CBP) on the substitute platinum plating layer; and pyrophosphate copper plating on the cobalt base plating layer (PCP); and the new plating layer And separating the from the two-dimensional form of the inverted sound. This will be described in more detail as follows.

The one-dimensional type is made of copper (Cu), nickel (Ni), or brass and has a predetermined shape.

When the hologram is included in the surface of the product, the hologram is installed on the surface of the one-dimensional type in advance so that it can be copied to the inner surface of the two-dimensional type. In addition, when the subsequent multi-layer plating on the two-dimensional negative inner surface, the hologram is also copied to the surface of the platinum plating layer, the hologram is accurately generated in the predetermined shape on the surface of the final product.

In addition, the inverted negative two-dimensional type may be made by pre-plating a metal such as copper, nickel or brass in a one-dimensional type in a conventional manner. If a two-dimensional type is made of copper, the following pyrophosphate copper plating (PCP) process can be followed.

In order to easily separate the plating layer from the one-dimensional type or the two-dimensional type, it is preferable to apply a separating coating agent to the circular shape. The separation coating agent may be used by dissolving ammonium dichromate in water about 120 ~ 170g / l, immersed in the separation coating agent 1 or 2 dimensional type for 1 to 3 minutes, then take out the plating operation sequentially until copper plating By doing so, the final pole product can be made.

Hereinafter, a process of plating the respective plating layers on the respective secondary circles will be described in detail.

First, the Imitation White Gold Plating (IWP) substitutes 70 to 90 g / l citric acid (C ₆ H ₈ O ₇ .H ₂ O) and potassium citrate (K ₂ C ₆ H ₅ O ₇ .H ₂ O). 60 to 80 g / l, 5 to 15 g / l of cuprous chloride, 0.05 to 0.15 g / l of indium sulfate, 1 to 1.5 g / l of Plating Gold Chemical (PGC) or temperature 20 ?? 35 ??, pH 3.5 to 4.0, specific gravity of 9 to 13 Be '(bowume), in which the cathode current density of 0.3 to 1 A / dm ² , the anode current density of 1 to 4 A / dm ² , and the voltage of 1.2 to ³ V are applied. Is made by Platinum plated titanium may be used as the anode.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Here, in order to activate the plating more, it is to apply the air stirring as shown in FIG.

And, the plating state can be analyzed through the Hullcell Test. That is, the plating color, the metal component, the consumption per hour, and the precipitation amount per 1 A / dm ² can be determined.

By judging the plating state, the thickness is reached to 0.08 to 0.12 mu m.

Next, the cobalt base plating step (CBP, Cobalt Plating), 200 to 400 g / l cobalt sulfate, 15 to 25 g / l ammonium chloride, 60 to 70 g / l boric acid, 0.1 to 0.2 g / l antifit agent (surfactant), Cobalt is formed by applying a cathode current density of 0.5 to 4.5 A / dm ² , an anode current density of 1 to 4 A / dm ² , and a voltage of 1.5 to 6 V in a plating solution having a temperature of 18 ?? to 27 ?? and a pH of 5.0 to 7.0. Conventional conditions for plating may be used. The positive electrode is made of cobalt slag or carbon electrode plate.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Here, in order to activate the plating more, it is to strongly apply the air stirring as shown in FIG.

By determining the plating state, a plating layer having a thickness of 0.6 to 1.4 mu m is reached.

Pyrophosphate Cupric Plating (PCP, Pyrophosphate Cupric Plating), copper pyrophosphate 75-105g / l, metal copper 22-36g / l, potassium pyrophosphate 280-380g / l, potassium nitrate 10-25g / l, ammonia water It consists of 0.2-3 ml / l, CP-3 (product name) 0.1-0.3 g / l, CPS-2 (product name) 0.3-0.7 g / l, temperature 50 ??-60 ??, pH 8.2-9.0, P In a plating solution having a ratio (P ₂ O ₇ / Cu) of 7.0 to 8.0, a cathode current density of 0.5 to 4.5 A / dm ² , an anode current density of 1 to 4 A / dm ² , and a voltage of 1.5 to 6 V are applied. Here, CP-3 is a wetting agent, and CPS-2 is a product name of auxiliary additives, such as a brightening agent. Pure copper may be used as the anode.

When 0.3-0.5 ml of mercaptothiazole is added with respect to the said copper plating liquid, the hardness of pole copper will improve significantly. As a result of the actual experiment, in the case of ordinary copper plating, 150-160 Hv (based on Vickers hardness) was shown, but when mercaptothiazole was added within the above range, the hardness rose to the range of 180-220 Hv.

Here, the stirring is performed by air stirring or ultrasonic vibration in order to activate the plating more, in the case of increasing the timing of the gaiters (stirring) is possible 4 to 5 times faster electrodeposition. The configuration of the air agitation is as shown in Figure 4, has a structure in which a plurality of air holes perforated in a PVC pipe of 15 to 25mm in diameter. Therefore, agitation is performed by blowing air from the outside of the plating bath and evenly wetting the inside of the plating liquid.

In addition, the plating liquid is treated with activated carbon once a month, and once a week, a carbon filter is used to remove impurities.

When the pH is increased, potassium hydroxide (KOH) is added, and when the pH is lowered, pyrophosphoric acid or tetraphosphoric acid is added.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Through determination of the plating state, the thickness reaches 0.2 to 0.3 mm.

Next, the chromium plating may be performed by general chromium plating, ATOTECH's HI-25-25 high speed hard plating, or general agent bath and mica chromium plating.

As standard plating conditions, in a plating solution having 200 to 300 g / l of chromic acid, 2.0 to 4.5 g / l of sulfuric acid, and a temperature of 55 to 60 °, the cathode current density of 35 to 75 A / dm ² , and the anode current density of 1 of the cathode current density / 2, voltage 9-15V can be applied. As the anode, tin, anchimony, or the like may be used. In addition, the plating rate can be appropriately adjusted by the magnitude of the current density.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

The thickness of 0.25 to 0.35㎛ is determined by determining the plating state.

In the above-described plating examples, the plating bath may be made of a material such as general P.E or P.V.C.

On the other hand, before the chromium plating, the molding operation is performed by pressing or the like in a state where the plated product is separated from the two-dimensional type. At this time, it is preferable that the copper plated article is provided with a curing portion C-1, so as to fit with the groove P-1 formed on the surface of the reinforced plastic base, which will be described later. In this way, the bonding force is further increased during the adhesion between the copper pole plated product and the reinforced plastic base.

In addition, it is advantageous in appearance that the curling portion is formed at the edge of the display window.

By the plating method according to the present invention, it is possible to precisely manufacture the case, parts and various ornaments of various information and communication devices such as mobile phone cases, PDAs.

On the other hand, the step of performing alternative platinum plating (IWP) to the negative shape formed circle, the step of cobalt base plating (CBP) on the substitute platinum plating layer, the step of copper plating pyrophosphate on the cobalt base plating layer (PCP) and the plating layer Separation from the negative prototype, molding, and chromium plating (CRP) on the substitute platinum plating layer (CRP) can also produce products that do not contain holograms.

In this case, the negative shape is formed by gypsum, copper, nickel, or brass.

On the other hand, the production of the reinforced plastic base, supplying a plurality of strands of glass fibers and molten synthetic resin to the drawer so that the glass fiber occupies 50 to 60% by weight, and pulled the glass fiber covered with synthetic resin from the drawer It comprises a step of passing, immersing the glass fiber covered with the synthetic resin in an immersion tank, the step of extracting and pelletizing the synthetic resin and glass fiber, and melting and injecting into the mold.

As the synthetic resin to be supplied, PPA (Poly Phthal Amide), PPS (Poly Phenylene Sulfide), PA66 (Poly Amide 66), PP (Polypropylene), PC / ABS, etc. may be used.

1.Poly Phthal Amide (PPA)

(1) Overview

Polyphthalamide (PPA) is a crystalline resin commonly called aromatic nylon. Since the molecular backbone has an aromatic structure, it is excellent in high strength, high rigidity, high heat resistance, low absorption rate and dimensional stability. In addition, there are many grades, such as glass fiber reinforcement, mineral reinforcement, flame retardant and impact resistance grade, plating possible, etc., and is widely used in the electric and electronic field, automotive field, industrial equipment and aircraft.

(2) Examples of major uses

A description of the main uses of the PPA is as follows.

First, as electric and electronic fields, SMT-compatible parts (connectors, switches, chip parts), irons, insulation of rice cookers, handles of warmers, brush holders of motors, pump housings of ports, humidification units of air conditioners, CDs, Used for CD-ROM bases and bobbins.

Also in the automotive field, electrical components such as cooling water system components (coolant engine outlet nozzles, oil coolers), fuel and air system components (fuel oil, fuel pumps, etc.), motor housings, coils, switches, control boxes, It is used for mechanical parts such as gears, transmission parts and ABS parts.

It is also used for water circulation parts such as pumps and water heaters, and metal replacement parts such as building materials, power tools, and mechanical parts.

(3) Main features

① Excellent heat resistance.

Melting Point (Tm): 300∼325 ??, Load Distortion Temperature: 285 ?? (18.6kg / cm 2), glass transition point (Tg): 95 to 125 ??, continuous use temperature (5000 hours): 185 ?? to be.

The high glass transition point maintains stiffness and strength even at high temperatures and withstands infrared reflow and deep solder temperatures.

② The flexural modulus of base resin is high (36,400kg / ㎠), and the flexural fatigue property is also excellent.

③ It is an amide-based resin, but its water absorption rate is low, and the saturation absorption rate of glass fiber 45% reinforced grade is 3% or less, and the dimensional change rate is up to 0.3%.

④ It can be used for drinking water because it has passed NSF Standard 61.

⑤ It is easy to mold because of excellent melt stability and no burr.

⑥ Excellent electrical characteristics. Glass fiber 45% flame retardant grade, 140 seconds arc resistant, 550V tracking (CTI).

⑦ There is a grade that can be plated in the plating process of ABS.

⑧ It also has excellent mechanical strength and chemical resistance.

2.Poly Phenylene Sulfide

(1) Overview

Polyphenylene sulfide (PPS) is a crystalline engineering plastic having high heat resistance and excellent mechanical properties, chemical resistance, electrical properties, and dimensional stability. Examples of applications include electric and electronic parts, automobile parts, and mechanical parts.

In addition, PPS is roughly divided into three types: linear, crosslinked, and semi-crosslinked.

First, the crosslinking type is a PPS that was prepared at the beginning of production, and made a crosslinked structure in the molecule to increase the degree of polymerization by crosslinking and impart workability. In general, because it is soft, it is reinforced with glass fibers or the like.

In the straight chain, the molecular structure is linear, and the toughness is greatly improved as compared with the crosslinked chain. Since the straight chain resin can be used in a resin alone, a non-charged grade is used for applications such as fibers, films, and piping materials.

In addition, the grade reinforced with glass fibers, etc. also shows excellent toughness, in which case it is significantly improved compared to the crosslinking type.

The semi-crosslinking type can obtain a desired molecular weight with less crosslinking than a conventional crosslinking type by increasing the degree of polymer polymerization before crosslinking, and exhibits intermediate properties between straight chain and crosslinking type.

(2) Main use example

First, in the electric and electronic fields, it is used in various switches and connectors, bobbins, sockets, and motor insulators.

In the automotive field, it is used in alternator parts, fuse cases, various valves, lamp reflectors, impeller connectors of water pumps, and the like.

It is also used in other microwave vessels, humidifiers, iron parts or camera parts and copier parts, and seams and valves in hot water supply parts.

(3) Main features

① It has excellent long-term heat resistance, and UL's temperature index is 200 ~ 240 ??. Moreover, load distortion temperature is 260 degrees or more (18.6 kg / cm <2>), and melting | fusing point is 280-285 degrees.

② Withstands high temperature solder immersion (260 °, 10 seconds) and fully withstands SMT (surface mounting technology) of electronic parts.

③ High crystallinity and very low water absorption. Moreover, since the coefficient of linear expansion is small, it shows excellent dimensional stability even at high temperature and high humidity.

④ Has excellent chemical resistance comparable to fluorine resin, 200 ?? There is no solvent soluble at the following temperature. Moreover, it is also excellent in hot water resistance.

⑤ It is high strength and high rigidity and there is little deterioration of characteristics even at high temperature. Moreover, it is excellent also in fatigue resistance and creep resistance.

⑥ The temporal change of volume resistivity under high temperature and high humidity is small, and the dielectric constant hardly changes with frequency or temperature, so it has excellent characteristics as an insulating material.

⑦ Excellent flame retardancy (limit oxygen index is about 50) even without adding flame retardant, UL94V0 is recognized.

⑧ Injection molding is possible like general engineering plastics.

⑨ Burr is easy to generate and vulnerable to shock.

⑩ When forming, gas or filler may cause corrosion or wear of mold and molding machine.

There are some color restrictions.

3.Po66 (Poly Amide 66)

(1) Overview

Polyamide 66 (PA 66) has a high degree of crystallinity and the best balance of various physical properties among polyamides.

Thus, PA 66 is mainly used for applications requiring heat resistance and mechanical strength.

(2) Main use example

Mainly used for food processing machinery parts, packaging machine parts, bearings, liners, rollers, gears, jig, insulation parts and the like.

(3) Main features

① Maintains the best mechanical strength among various nylon resins.

② It shows excellent resistance to hydrocarbon solvents such as gasoline and oil.

③ It is possible to remarkably improve mechanical strength, rigidity, heat deformation temperature, etc. by filling glass fiber.

④ Suitable for food hygiene law.

⑤ Poor dimensional stability and high water absorption.

⑥ Excellent impact resistance and flow.

⑦ The melting point is 250 ~ 260 ??

4.PP (Polypropylene ABS)

In addition, polypropylene (PP) is contained in petroleum decomposition gas, and is a resin produced by polymerizing propylene gas made purely like polymerization of polyethylene at room temperature and atmospheric pressure with a catalyst of a special organic metal in a solvent.

The density is the lightest among plastics (0.90 ~ 0.91), the mechanical strength is large, it is excellent in heat resistance and relatively transparent.

In addition, the high frequency dielectric properties are good.

When such a synthetic resin is properly mixed in a mixer and supplied to a drawing machine of glass fibers (long fibers), a thin thread wrapped with synthetic resin comes out of the glass fibers.

After passing it through a wet bath, it is pulled out continuously by a puller.

Next, after pelletizing in a pelletizer, it is collected in one place to complete a synthetic resin containing glass fibers. In this case, the glass fiber should be included in an amount of about 50 to 60% by weight to obtain an engineering plastic having desired high strength, impact resistance and long-term fatigue properties.

This can be injected to complete a reinforced plastic base product of a predetermined shape.

Specifically, the copper pole plated product is bonded to an injection mold, and insert injection is performed while an adhesive is applied to the inside of the plated product.

In particular, it is possible to mold to a desired thickness through insert injection.

During the injection, the plastic raw material passes through the cylinder, the plunger, the nozzle, and the like, and softens by the internal temperature thereof, thereby being in a state suitable for injection.

The injection conditions at the time of injection vary somewhat depending on the case, so it is unreasonable to set them uniformly. The injection nozzle temperature is 250 to 350 °, the injection time is 0.1 to 0.3 seconds, the holding time is 0.5 to 1.3 seconds, and the injection pressure is 1500. ~2500kg / cm ^2, holding pressure is 1000~1300kg / cm ^2, the back pressure is 4~6kg / cm ^2, injection speed is 300~450mm / sec, holding pressure rate 80~120mm / sec, the injection distance 15~20mm, mold temperature 100 to 150 ° is possible, and it is sufficient to keep it for 3 to 5 hours at 80 to 120 ° under dry conditions.

When glass fibers are contained in 50 to 60% by weight of various synthetic resins, strength-reinforced plastics (engineering plastics) are formed.

① Excellent impact characteristics regardless of high temperature and low temperature.

② Excellent mechanical properties.

③ Excellent long-term fatigue characteristics.

④ Excellent dimensional stability.

⑤ Excellent surface condition (roughness).

The properties of the aforementioned reinforced plastic base are shown in FIG. 5. As shown, productivity is better than die casting products of magnesium or aluminum, and stiffness is better than PC or PC / ABS products. Moreover, compared with general nylon resin, it is excellent in both productivity and strength.

6 is a graph showing the magnitude of the impact strength against the metal, Figure 7 contrasts the magnitude of the stiffness of the reinforced plastic base (VERTON PDX-R-03579) for other plastics. As shown, the reinforcement plastic base in the present invention is excellent in both impact strength and strength.

In addition, in FIG. 8, the size of the tensile strength according to the temperature of the general glass nylon and the reinforced plastic base is compared. As shown, it can be seen that the tensile strength of the reinforced plastic base is greater up to 200 μF (93 °).

In addition, in FIG. 9, the tensile strength of the general glass nylon and the reinforced plastic base at a high temperature is compared. As shown, it can be seen that the tensile strength of the reinforced plastic base is much greater.

In addition, Figure 10 is a graph comparing the productivity and strength of the reinforced plastic base of the present invention and other materials. As shown, the reinforced plastic base of the present invention is located within the high strength, high productivity region.

This makes it possible to replace metal parts such as a case, shield cover, frame, LCD bracket, or hinge of an information and communication device with a reinforced plastic base according to the present invention. do.

On the other hand, it is also good to simply coat and cure the reinforced plastic base. In this case, the adhesive force with the copper electroplating article mentioned above should not be weakened.

As a result, as shown in Figs. 11 and 12, according to the present invention has a configuration in which a multi-layer copper electroplating article and a reinforced plastic base are joined through a pole casting process. Of course, the reinforcement plastic base should be dimensioned to fit exactly the copper pole plating.

In addition, commercially available adhesives for commercial plastics may be used as the adhesive for bonding the copper-clad plated product with the reinforced plastic base. However, when the epoxy urethane-based E-liquid Primer GR-MP3100 is used, the adhesion strength is maintained more.

According to the present invention of the configuration as described above, it can have the advantages of both the reinforced plastic (engineering plastic) and the metal (copper).

Specifically, according to the present invention, both the insulating effect due to plastic and the electromagnetic shielding effect and surface metal effect by copper can be utilized.

In addition, according to the present invention, it is possible to increase the durability of the synthetic resin as a base to increase the durability.

In addition, according to the present invention, it is possible to increase the heat radiation effect of the information communication device due to the copper.

Moreover, according to this invention, since it is a copper casting product on the surface, there exists also the advantage that it is harmless to a human body, showing sufficient hardness value.

In addition, according to the present invention, when the hologram is applied to the surface of the product, the reproducibility can be greatly increased.

Claims (12)

Copper pole copper composite resin composite, characterized in that the reinforcement plastic base is attached to the back surface of the copper pole plating product. The method of claim 1, Copper pole composite resin composite, characterized in that an adhesive is interposed between the copper pole electroplating product and the reinforced plastic base. The method of claim 2, The copper pole copper-plated product is a multi-layer copper copper composite composite, characterized in that the copper plating layer 100, the cobalt plating layer 200, and the platinum plating layer 300 is sequentially stacked from the bottom. The method of claim 3, Copper alloy composite resin composite, characterized in that the chromium plating layer 400 is laminated on the platinum plating layer (300). The method of claim 4, wherein Copper pole composite resin composite, characterized in that the hologram 500 is attached between the platinum plating layer 300 and the chrome plating layer 400. The method of claim 4, wherein The copper plating layer 100, the hardness of the Vickers hardness copper copper composite synthetic resin, characterized in that in the range of 180Hv ~ 220Hv. The method of claim 4, wherein The plating layer is a copper plating layer 100 having a thickness of 0.2 to 0.3mm from the bottom, a cobalt plating layer 200 having a thickness of 0.6 to 1.4 µm, a platinum plating layer 300 having a thickness of 0.08 to 0.12 µm, and a chromium having a thickness of 0.25 to 0.35 µm. Copper pole synthetic resin assembly, characterized in that the plating layer 400 is a continuous stacked structure. The method according to any one of claims 1 to 7, The reinforced plastic base is composed of 50 to 60% by weight of glass fiber in any one selected from PPA (Poly Phthal Amide), PPS (Poly Phenylene Sulfide), PA66 (Poly Amide 66), PP (Polypropylene), and PC / ABS. Copper pole synthetic resin conjugate, characterized in that consisting of. The method of claim 8, Copper pole composite resin composite, characterized in that the coating is applied to the surface of the reinforced plastic base. The method according to any one of claims 1 to 7, Curing portion is formed on the copper pole plated product, the copper pole synthetic resin assembly, characterized in that the groove is formed on the surface of the reinforced plastic base to fit the portion. The method of claim 10, Copper ring composite resin composite, characterized in that the curling portion is formed on the edge of the display window. The method according to any one of claims 1 to 7, The adhesive is an epoxy urethane-based E-type Primer GR-MP3100 copper pole synthetic resin conjugate.

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