KR100824012B1 - Insert injection molding method for frame of wireless communication equipments - Google Patents

Abstract

A method for ejecting an insert of a frame for a wireless communication device having antenna housing of a synthetic resin material is provided to prevent a frame of electronic devices from being damaged or distorted in a post processing process. A method for ejecting an insert of a frame for a wireless communication device having an antenna housing of a synthetic resin material includes the steps of: heating an aluminum alloy for a die-casting to 700-750.C, and forming an alloyed frame(Fa) by injecting and forming a melted liquid into a mold cavity; arranging the alloyed frame, which is cooled in the alloyed frame forming step, on the mold, and forming an antenna housing(Fi) by injecting a melted synthetic resin into the alloyed frame. The synthetic resin used in the antenna housing forming step has a melting point of at least 170.C.

Description

Insert injection method for a frame for a wireless communication device having a synthetic resin housing part {INSERT INJECTION MOLDING METHOD FOR FRAME OF WIRELESS COMMUNICATION EQUIPMENTS}

The present invention relates to a method for manufacturing a portable electronics frame, which is formed by molding an aluminum alloy, and then integrally molding a plastic material intena receiving portion through insert injection.

More specifically, by mixing a predetermined amount of Si, Fe, Cu, Mn, Mg, Cr, Ni, Zn, Ti, Pb, and Sn in an aluminum alloy known to be excellent in corrosion resistance, strength and elongation as an alloy for multicasting,

Due to the characteristics of each component, it meets the characteristics such as corrosion resistance, abrasion resistance, impact resistance and yield strength, which are essential for portable electronic products, especially mobile phones, and increases the formability and machinability by adding tin and lead.

As a result, warping is prevented after demolding and burrs can be easily and neatly removed when cutting, punching, and post-processing.

Above all, high brittleness can be obtained, which is suitable for protecting the internal parts such as LCD and memory chips of portable electronic products from shocks, thus satisfying product characteristics suitable for parts such as frames and brackets for LCDs.

Furthermore, the present invention relates to an injection method that can provide a non-conductive synthetic resin antenna receiver to prevent communication disturbance (fading phenomenon due to RF noise), which can help improve call or transmission quality.

Aluminum alloys for castings, especially die castings, must meet the requirements of good fluidity when melted, low hot brittleness, good melt spreadability for solidification shrinkage and no sticking to the mold.

The type of conventional aluminum alloy for casting can be summarized as follows.

Alloy class Characteristics and uses Al-Cu system O Cu 8% added O Excellent castability and machinability O High temperature filling and shrinkage crack Al-Si system O Silamine is a typical alloy O Good castability but poor machinability O Improved heat treatment effect and improved properties O Improved treatment O Add special elements to refine the crystals of Si O Metal Na, F (fluorine), P, etc. Addition O Lox alloy O Add Mg to Al-Si O Excellent heat resistance and low thermal expansion O Used for piston of internal combustion engine Al-Mg system O Mg 12% or less O Elongation hardening by heat treatment improves strength elongation O Poor castability but excellent seawater resistance O Parts for marine and chemical industries O Hydronalium O 4-7% Mg, 0.5% Mn added O Castability, poor heat resistance O Corrosion resistance Great Al-Cu-Si System O routeal improves castability by adding O Si Y alloy O 4% Cu, 2% Ni, 1.5% Mg O Excellent high temperature strength (90% at room temperature maintained at 250 ℃) O Low coefficient of thermal expansion O No heat accumulation O Cylinder, piston Die Casting Alloys O Excellent fluidity O Injection into mold using Al-Cu and Al-Si alloys

Meanwhile, a technology related to conventional portable electronic products, in particular, an alloy for a mobile phone includes Patent Registration No. 0741660 (2007.07.16) of Daewon Alloy Co., Ltd., `` Aluminum-Magnesium Alloy for Interior and Exterior of Mobile Phones and Electronic Products ''. Is

By weight% Mg 11-14%, Fe 0.5% or less, Si 0.01-0.5%, Mn 0.1-0.5%, Ti 0.01-0.3%, Co 0.01-0.2%, Be 0.003-0.02%, balance Al and other unavoidable Including the components to be contained, the aluminum alloy has a tensile strength of 250N / ㎡ or more, hardness of 60HBW or more, Charpy absorbed energy of 1.0J or more to propose an alloy excellent in hardness and impact resistance,

In particular, the present invention proposes an alloy composition suitable for die casting of a case of a portable electronic device or a notebook such as a notebook, which tends to become thin and small.

However, the inventor of the present invention, which has been engaged in the die casting industry for portable electronic components for many years,

During the process of cutting the ball through die casting and removing the bur during punching and post-treatment, the bur can not be removed neatly, causing defects, and finding distortion during additional plating, painting, and other post-processing of the frame. It became.

In particular, the disadvantages of the above-mentioned patent is that in the case of heat or physical impact applied in the post-processing process such as plating process or cutting to the thin-thin product in accordance with the tendency of light and short, the productivity and cost competitiveness, even completed The quality of the phone will also be seriously affected.

In addition, it improves brittleness among the characteristics of aluminum alloys used in frames for brackets and LCD mounting brackets for portable electronic products, and protects internal components such as LCD and memory chips of portable electronic products from impact. The need for reinforcement is increasing.

On the other hand, in wireless communication devices, particularly portable wireless communication terminals such as mobile phones, PDAs, navigation, DMBs, GPS, wireless notebook computers, etc.

In order to overcome the limitations of design changes caused by existing external antennas (such as rods or helical antennas) and to reduce the light weight and shortening of wireless communication terminals, the adoption of internal antennas (so-called antennas) has recently become popular.

Such antennas should be diversified in size and shape to suit the shape of the antenna installation space and the volume of the space inside the terminal, and should be produced inexpensively and without problems in quality (especially communication quality).

Currently, the built-in antenna is mainly used with a Planar Inverted F Antenna (PIFA) antenna composed of a radiator and a carrier serving as a support for the radiator.

The radiator of the conductive material in the PIFA-type antenna has two contacts consisting of a contact electrically connected to the RF connector of the terminal main board and a contact grounded to the conductive connection of the main mode,

The carrier made of a non-conductive synthetic resin material is spaced apart from the ground by a certain distance to ensure the radiation characteristics and to reduce the SAR (Spac) Absorption Rate (SAR).

In mobile phones where the built-in antenna is most commonly used, the antenna is usually installed above the main board, so it is arranged above the key button, or in the hinged part of the clamshell terminal in consideration of the weak field radiation problem during a call.

In connection with the introduction of such an antenna, the present invention uses a novel aluminum alloy, but in order to reduce communication failure, the basic frame is manufactured by die casting of aluminum alloy, and then the insert molding method is used to form the intena receiving part using synthetic resin. I thought about it.

As a technology related to mitigation of such communication obstacles, Pantech Co., Ltd. registers No. 0732383 (July 20, 2007) `` Slide type personal mobile terminal ''.

According to the above patent, a fading phenomenon (phenomena in which the intensity of the received radio wave is suddenly changed in accordance with the change of the medium through which the received radio wave is generated) is caused by RF (Radio Frequency) noise generated by the conductive slide hinge device. This can reduce the communication sensitivity,

And a slide part reciprocating between a first position before the slide movement on the main part and a second position after the slide movement by the hinge portion, and adjacent to the antenna at the first position and the second position at the second slide hinge portion. The part suggests a mobile phone made of a non-conductive material.

However, since the registered patent is to use a non-conductive material in the slide phone located on the opposite side of the intenna, it does not suggest a specific manufacturing method or specific material, the insert injection molded synthetic resin material receiving portion of the present invention is another feature of the present invention Is different from the approach direction.

Furthermore, when the metal part of the contact friction occurs due to the folding-unfolding or sliding operation of the wireless communication device, noise and damage to the frame may occur.

Conventional technology for preventing this is Shell-Line Co., Ltd. Patent No. 00606767 (July 21, 2006) `` Slide Phone '',

The registered patent is proposed because the lubrication injection molding portion is formed by insert injection to the contact portion of the hinge part to enable a smooth hinge drive.

In another aspect, the present invention is a frame for folding portable electronic products that can achieve noise reduction and anti-wear effect by die-casting the frame with a new aluminum alloy, and then introducing an inner skin made of synthetic resin into the hinge through insert injection. It is intended to provide a difference.

The present invention has been proposed to assist in protecting portable electronics from impact through die casting aluminum alloys, particularly alloys with improved brittleness.

Accordingly, the present invention introduces Mg for improving brittleness, corrosion resistance and tensile strength, Cr for improving brittleness and wear resistance, Ni for improving brittleness and heat resistance, and Ti for improving brittleness and corrosion resistance, thereby improving brittleness characteristics.

Furthermore, due to the characteristics of casting, finishing, and post-processing, and the characteristics of portable electronic products such as mobile phones, friction and friction can occur during opening and closing (in the case of folder type) or sliding (in the case of slide type). To prevent

Cu is added to reduce the adhesion and strengthen the solid solution, Zn to improve the corrosion resistance and strength, and Sn and Pb to improve the formability and machinability,

Mechanical properties (impact resistance, etc.) as well as increased die casting quality (Cu) and stable post-treatment processes such as burr removal after demolding (Sn and Pb), warping or damage in plating and other post-processing processes It is an object of the present invention to provide a die-casting alloy for a portable electronics frame (Cr) and a method of manufacturing a portable electronics frame using the same, so as not to occur (Ni and Zn), and to maintain strength and shape even in the finished portable electronics (Cr). .

In the present invention, a portable electronic product frame manufactured on the basis of such an alloy is additionally aimed at providing a manufacturing method that undergoes a post-processing process such as plating, diamond cutting, and black plating.

In another aspect, the present invention provides a method for insert injection of a frame for a wireless communication device having a synthetic resin intena receiving portion for minimizing the communication failure problem by using a receiving portion for the intenna as a synthetic resin,

Furthermore, an object of the present invention is to provide a method of insert injection of a frame for a folding portable electronic product having a synthetic resin hinge inner shell.

Insert injection method of a frame for a wireless communication device according to the present invention to achieve the above object is

An alloy frame molding step of injecting a molten melted aluminum alloy at 700 to 750 ° C. into a mold cavity; And

And an intena accommodating molding step of arranging the cooled alloy frame manufactured in the alloy frame forming step in a mold and injecting and molding molten synthetic resin.

In addition, in the insert injection method of the frame for a wireless communication device according to the present invention, the synthetic resin used in the intena receiving molding step preferably has a melting point of 170 ° C. or higher, and in particular, the synthetic resin may be glass fiber reinforced resin.

Further in the insert injection method of the frame for a wireless communication device according to the present invention

The alloy used in the alloy frame forming step is

7.50 to 8.00 wt% Si for improved flowability, reduced shrinkage and improved heat resistance of the melt,

0.40 to 0.60 wt.% Fe for improved demolding performance by reducing tack

1.20 ~ 1.60 wt% Cu for reducing tack and strengthening of solid solution

0.30 to 0.55 wt.% Mn to enhance corrosion resistance and to aid in the effect of Fe addition,

2.20 to 2.60 wt% Mg for improving brittleness, corrosion resistance and tensile strength,

0.01 ~ 0.03% by weight Cr for improving brittleness and abrasion resistance,

0.03 to 0.07 wt.% Ni for improving brittleness and heat resistance,

0.10 to 0.30 wt.% Zn for improved corrosion resistance and strength,

0.01 ~ 0.03 wt% Ti for improving brittleness and corrosion resistance,

0.04 to 0.08 wt% Pb for improved machinability,

0.01% to 0.02% by weight of Sn for improved formability and machinability,

It is characterized by comprising a residual amount of Al and unavoidable impurities.

In addition, the insert injection method of the frame for a wireless communication device according to the present invention

The alloy used in the alloy frame forming step may alternatively

0.100 to 0.200% by weight of Si for improved flowability, reduced shrinkage, and improved heat resistance of the melt,

0.400 ~ 0.460 wt% Fe for improved demolding performance by reducing tack

0.060 ~ 0.100 wt% Cu for reduced tack and strengthen solid solution,

0.400 to 0.460 wt.% Mn to enhance corrosion resistance and to aid in the addition of Fe,

8.940 ~ 9.940 wt% Mg for improving corrosion resistance and tensile strength,

0.008 ~ 0.012 wt% Cr, for improved wear resistance

0.007% to 0.009% by weight of Ni for improved heat resistance

Zn of 0.020 ~ 0.040 wt% for corrosion resistance and strength improvement,

0.008 ~ 0.010 wt% Ti for corrosion resistance and strength improvement

0.005 to 0.007 wt% Pb for improved machinability,

0.008% to 0.010% by weight of Sn for improved formability and machinability,

It is characterized by comprising a residual amount of Al and unavoidable impurities.

In addition, the insert injection method of a frame for a folding portable electronic product having a synthetic resin hinge inner shell using the novel aluminum alloy of the present invention is injected into a mold cavity by heating a molten aluminum alloy at 700 to 750 ° C. Forming a frame comprising a hinge; And a hinge endothelial forming step of arranging the cooled frame prepared in the first step in a mold and injecting the molten synthetic resin to form the synthetic resin. The synthetic resin used in the hinge endothelial forming step also has a melting point of 170 ° C. or higher. It is preferable.

The die-cast aluminum alloy for the present invention, together with Al as the main component, Mg for improving brittleness, corrosion resistance and tensile strength, Cr for improving brittleness and wear resistance, Ni for improving brittleness and heat resistance, Ti for improving brittleness and corrosion resistance, and To improve brittleness,

Furthermore, due to the castability, finishing, and stability of post-processing, and the characteristics of mobile phones such as mobile phones, friction and cracking can be prevented from occurring during the opening and closing (in the case of folder type) or sliding (in the case of slide type). in order to

Cu is added to reduce the adhesion and strengthen the solid solution, Zn to improve the corrosion resistance and strength, and Sn and Pb to improve the formability and machinability,

Mechanical properties (impact resistance, etc.) as well as increased die casting quality (Cu) and stable post-treatment processes such as burr removal after demolding (Sn and Pb), warping or damage in plating and other post-processing processes Is not generated (Ni and Zn), and strength and shape can be maintained even in finished portable electronic products (Cr).

In the present invention, a portable electronic product frame manufactured based on such an alloy additionally provides a manufacturing method that undergoes a post-processing process such as plating, diamond cutting, and black plating, and minimizes communication problems by using an accommodating part for the antenna. To provide an insert injection method of a frame for a wireless communication device having a synthetic resin receiving portion to provide, and furthermore, the present invention can provide an insert injection method of a frame for a portable portable electronic product having a synthetic resin hinge inner shell. .

The die-casting aluminum alloy for the present invention includes Si, Fe, Cu, Mn, Mg, Cr, Ni, Zn, Ti, Pb, Sn, and other unavoidable impurities in addition to Al, which is a main material and occupies the remaining amount in addition to the remaining components.

The Si is to improve the fluidity of the melt, to reduce the shrinkage rate, and to improve the heat resistance, and 7.50 to 8.00 wt% is added.

The Fe is a typical component for improving the demolding performance by reducing the adhesion, 0.40 ~ 0.60% by weight is added.

The Cu is for reducing the adhesion and strengthening the solid solution (particularly for Mg), and is added in an amount of 1.20 to 1.60% by weight, and gives a certain age-hardening to improve hardness and wear resistance, but exceeds the upper limit of corrosion resistance. Cause degradation.

The Mn is to enhance the corrosion resistance and to aid the Fe addition effect, and is added in an amount of 0.30 to 0.55% by weight, and serves to increase softening resistance and improve surface treatment characteristics at a certain temperature.

The Mg is to improve the corrosion resistance and tensile strength, 2.20 ~ 2.60% by weight is added, if less than the hardness is lowered, if exceeded due to excessive hardness, fatigue resistance and layer resistance is lowered.

The Cr is for improving abrasion resistance through refinement of crystal grains, and is added in an amount of 0.01 to 0.03% by weight, and contributes to improvement of heat resistance to a certain degree.

Ni is for improving the heat resistance, the 0.03 ~ 0.07% by weight is added, if less than that the heat resistance is lowered, in the case of excess purlin lowers the productivity.

The Zn is for improving corrosion resistance and strength, and is added in an amount of 0.10 to 0.30% by weight, and exceeds the upper limit to reduce corrosion resistance.

The Ti is to improve the corrosion resistance and strength, 0.01 ~ 0.03% by weight is added.

The Pb and Sn together to improve the formability and machinability, 0.04 to 0.08% by weight and 0.01 to 0.02% by weight are added, respectively, and exceeds the upper limit, hot and cold workability is lowered.

The difference between the components of the alloy described in the above-mentioned patent registration No. 0741660 is Cu for reducing adhesion and strengthening solid solution, Zn for improving corrosion resistance and strength, Cr for improving wear resistance, Sn for improving formability and machinability, and Pb, Ni for improving heat resistance,

Due to the difference in the components, it is possible to prevent breakage and deformation during post-processing such as demoulding, removing burrs, and plating for portable electronic products, and reducing defects even if the thickness is made thinner according to the tendency of thinning and shortening. .

In particular, the Mg, Cr, Ni, and Ti contribute to the improvement of brittleness characteristics by the interaction of the relative amount of compound, which provides properties suitable for protecting the internal parts of LCDs and memory chips of portable electronic products from impact. Appeared.

This aluminum alloy component is molded by a die casting method at a casting temperature of 700 ~ 750 ℃, the die casting method will be omitted herein.

Meanwhile, a method of insert injection of a frame for a wireless communication device using a novel aluminum alloy described in more detail below and having a synthetic resin intena receiving portion, which is another feature of the present invention related to FIG. 1, or the present invention related to FIG. 2. Another feature of the aluminum alloy used in the insert injection method of the frame for clamshell portable electronic products having a synthetic resin hinged inner shell may be Al-Mg alloy series.

More specifically, in the Al-Mg alloy series, Si is used to improve the fluidity of the melt, decrease the shrinkage rate, and improve heat resistance, and 0.100 to 0.200 wt% is added thereto.

The Fe is a typical component for improving the demolding performance by reducing the adhesion, 0.400 ~ 0.460% by weight,

The Cu is for reducing the adhesion and strengthening the solid solution (particularly for Mg), and is added in an amount of 0.060 to 0.100% by weight. Cause degradation,

The Mn is to enhance the corrosion resistance and to support the addition of Fe, 0.400 to 0.460% by weight is added, and increases the softening resistance and improves the surface treatment characteristics at a high temperature to some extent,

The Mg is to improve the corrosion resistance and tensile strength, 8.940 ~ 9.940 weight% is added, if less than that the hardness is lowered, if exceeded due to excessive hardness, fatigue resistance and layer resistance is lowered,

The Cr is for improving abrasion resistance through the refinement of crystal grains, and is added in an amount of 0.008 to 0.012% by weight, and contributes to improvement of heat resistance to a certain degree,

The Ni is to improve the heat resistance, 0.007 ~ 0.009% by weight is added, if less than that the heat resistance is lowered and the excess degree of productivity is lowered,

The Zn is for improving the corrosion resistance and strength, 0.020 ~ 0.040% by weight is added, the corrosion resistance is lowered beyond the upper limit,

The Ti is to improve the corrosion resistance and strength, 0.008 to 0.010% by weight is added,

The Pb and Sn are for improving moldability and machinability, and 0.005 to 0.007% by weight and 0.008 to 0.010% by weight are added, respectively. If the upper limit is exceeded, hot and cold workability is lowered.

This composition is different from those of the alloys described in the above-mentioned Patent Registration No. 0417660 to reduce the adhesion and strengthen the solid solution, Cu for improving the corrosion resistance and strength, Zn for improving the corrosion resistance and strength, Cr for improving the wear resistance, and improve the machinability. Sn and Pb, Ni for improving heat resistance,

Due to the difference in the components, it is possible to prevent breakage and deformation during post-processing such as demoulding, removing burrs, and plating for portable electronic products, and reducing defects even if the thickness is made thinner according to the tendency of thinning and shortening. .

The present invention described above can be understood in more detail through the following examples.

Example: Fabrication of Portable Electronic Frame

<Table 1: Composition ratio (% by weight) of alloy components for improving brittleness characteristics>

Si Fe Cu Mn Mg Cr Ni Zn Ti Pb Sn Al 7.760 0.530 1.420 0.460 2.400 0.220 0.0480 0.200 0.023 0.060 0.016  Remaining amount

<Table 2: Composition ratio (wt%) of Al-Mg alloy component>

Si Fe Cu Mn Mg Cr Ni Zn Ti Pb Sn Al 0.180 0.430 0.080 0.430 9.740 0.010 0.008 0.030 0.009 0.006 0.009  Remaining amount

12 kinds of components having the same ratio as in <Table 1> and <Table 2> and a mixture containing unavoidable impurities were placed in a crucible, melted and poured into a mold according to a known method, and then FIG. 1. 10, each of the mobile phone front frame (F) and the LCD bracket (B) as shown in Figs. 2, 3A and 3B were manufactured.

The resulting frames and brackets had an average breaking strength (press breaking load) of 18 kg · f / cm2 and an average elasticity (shape strength) of 18 kg · f / cm2. There was no failure.

On the other hand, each frame having an alloy ratio according to <Table 1> was found to be 38.4 kg · f / cm 2 as a result of the brittle test, and each frame having an alloy ratio according to <Table 2> was 26.4kg · f / ㎠ It turned out to be much better than it was.

Frame (F) shown in Figure 1 is a frame (F) for a wireless communication device (particularly a mobile phone) having an antenna receiving portion manufactured according to the insert injection method, another feature of the present invention,

Through the alloy frame forming step of injecting the molten molten aluminum alloy at 700 ~ 750 ℃ molten molten metal into the mold cavity,

The alloy frame molding step is manufactured through an intena receiving part (Fi) forming step of arranging in a cooled alloy frame (Fa) mold and injecting and molding molten synthetic resin.

Particularly, the synthetic resin used in the molding process of the intena receptor part (Fi) has a melting point of 170 ° C. or higher so that deformation of the synthetic resin material intena receptor part (Fi) is applied even if a temperature exceeding 180 ° C. is applied during the plating or painting process of the frame. It is preferable because it can prevent.

The synthetic resin may be, for example, glass fiber reinforced resin,

Commercially available glass-reinforced polyamide resins such as DuPont's trade name Zytel,

Polyoxymethylene resins such as the LG Chem brand LUCEL N109WR can be purchased and used.

Interfacial uneven portions Fa1 and Fi1 are formed at the contact portions of the alloy frame Fa and the intena receiving portion Fi so that the mutual bonding force can be increased.

In addition, the frame (F) shown in FIG. 2 is a frame (F) for a foldable wireless communication device (particularly a cellular phone) having a synthetic resin hinged inner shell manufactured according to the insert injection method, which is another feature of the present invention.

Molding a frame (F) including a hinge (H) by injecting a molten melted aluminum alloy for die casting at 700 to 750 ° C. into a mold cavity, and

The frame manufactured in the frame forming step is manufactured through a hinge endothelial (Hi) forming step of arranging a cooled frame in a mold and injecting and molding molten synthetic resin.

As a result, noise reduction and wear protection at the hinge part where contact friction occurs due to the folding-unfolding operation can be obtained.

In addition, the synthetic resin used in the hinge endothelial (Hi) molding step preferably has a melting point of 170 ° C. or higher, and may be a glass fiber reinforced resin, whereby a temperature exceeding 180 ° C. is applied during plating or painting of the frame. It is also preferable to prevent deformation of the synthetic resin hinge endothelial (Hi).

Frames (or LCD brackets) for portable electronic products that have been die-cast and post-processed can improve strength and appearance performance through plating, and can be obtained with a variety of exterior colors by touch.

4 shows various post processing processes associated with plating and painting.

For reference, in describing the present invention with reference to FIG. 4, in a non-strict sense, 'step' (D, NP, CP, CC, DC) means a comprehensive process, and 'process' refers to the details of each step. Process,

The term 'coating' is used when referring to plating and painting without distinction.

The combination of each manufacturing step associated with FIG. 4 is, for example,

Die casting (D) -chrome plating (CP),

Die casting (D) -nickel plating (NP) -chrome plating (CP),

Die casting (D)-chrome plating (CP)-color coating (CC) (especially black coating (BC) for LCD brackets),

Die casting (D)-nickel plating (NP)-chrome plating (CP)-color coating (CC) (especially black coating (BC) for LCD brackets),

Die Casting (D) -Chrome Plating (CP) -Color Coating (CC) -Diamond Cutting (DC),

Die casting (D) -nickel plating (NP) -chrome plating (CP) -color coating (CC) -diamond cutting (DC),

Die casting (D) -nickel plating (NP) -color coating (CC) -chrome plating (CP), and

Die casting (D)-nickel plating (NP)-color coating (CC)-chrome plating (CP)-diamond cutting (DC), etc.

In consideration of the various possible combinations, arrows related to the process sequence are indicated by solid lines, dotted lines, single-dot chain lines, and double-dot chain lines, respectively.

In addition, hereinafter, the description of FIG. 4 will not describe all the combinations of the various manufacturing steps, but only specific combinations. However, the present invention is not limited by the description of the specific combination.

In the plating process to provide a variety of metal texture with the purpose of strength reinforcement, it is preferable to go through the nickel plating step (NP) and then the chrome plating step (CP) in order to reduce the gloss characteristics, strength and above all,

If a variety of patterns or lettering through the masking method, even when the color coating (CC) step is mainly performed for the chromium plating step (CP) for the purpose of improving the wear resistance is preferably carried out after the color coating.

However, in the case of the LCD bracket (B), black coating after the chrome plating is required to prevent diffuse reflection by black coating the inner surface (B1) forming the boundary of the opening (B4) for the viewing window as shown in Figure 3b It is preferable to

The frame or bracket of the portable electronic product, which has undergone the die casting step (D), is transferred to a plating facility and subjected to a receipt test to confirm that there are no defects, followed by a full nickel plating step (NP).

The nickel plating step (NP) first removes foreign substances and oil on the surface by using an alkaline surfactant, and then washed with running water.

Next, a chemical nickel (Ni) plating process is carried out (NP1), which is to improve the plating quality by forming a conductive film on the surface of the frame or bracket, and uses a commercial grade commercial plating solution. Proceed for 5 to 7 minutes by applying resistance values of ~ 33 ° C, pH 8.3 to 9.3, and 15 mW / cm 2 or less, and then rinse with water.

Subsequently, a copper lactic acid plating process is performed (NP2), which is to form a first electroplating layer on the surface of the frame or bracket so that the surface has ductility and adhesiveness, improves conductivity, and reduces shrinkage expansion coefficient of each plating layer. Copper sulfate (CuSO4 · 5H2O) 200-230 g / l, sulfuric acid (H2SO4) 50-60 g / l, chlorine (Cl) 40-60 ppm, 20-28 ° C, current 650-750 A / CB, voltage 3-4 V / Run 40-50 minutes under CB. Subsequently, it is pickled and neutralized with sulfuric acid and washed with water.

Next, a semi-gloss nickel plating process (NP3) is performed, which is to improve the bonding force between the previous plating layer (copper copper plating layer) and the subsequent plating layer (gloss nickel layer) as a kind of primer.

This semi-gloss nickel plating process uses NiSO4 260 ~ 300g / ℓ, NiCl2 30 ~ 40g / ℓ, boric acid 35 ~ 45g / ℓ, 52 ~ 58 ℃, pH 3.9 ~ 4.5, current 650 ~ 750A / CB, voltage Proceed for 15-25 minutes under 5-7V / CB.

Next, the nickel nickel process (NP4) is carried out. Through this process, scratch and corrosion resistance can be improved. NiSO4 250-310g / ℓ, NiCl2 30-40g / ℓ, boric acid 35-45g / ℓ Mix and use, proceed for 13-17 minutes under 52 ~ 58 ℃, pH 3.9 ~ 4.5, current 750 ~ 850A / CB, voltage 5 ~ 7V / CB.

The difference between the semi-gloss nickel layer and the gloss nickel layer is basically based on the strength of the current density and the kind of the varnish used, and after each process, the recovery process is performed, and after the nickel coating process, water washing is performed. Proceed.

Next, after the nickel plating step, it was considered to adopt a masking method in order to allow a specific pattern or lettering by finally performing a color coating step (CC) for a different color or texture from the nickel plated layer.

The color coating step (CC) first prints a pattern, a number, a logo, etc. on the portion where the previous nickel plating (NP) layer is exposed when the final washing process is performed (CC1). The printing of the masking layer (CC1) may be, for example, silk printing using a printing equipment, and then goes through a drying process.

Subsequently, the plating equipment is used to perform a different color plating process (CC2), which is different from the nickel layer such as tin or satin. It is 52 ~ 58 ℃, pH 3.9 ~ 4.5, current 700 ~ 1100A / CB. , 5 ~ 19 minutes under voltage 5 ~ 7V / CB, the treatment solution is mainly a mixture of 470 ~ 520g / L NiSO4, 25 ~ 35g / L NiCl2, 30 ~ 40g / L boric acid and small amount of various metal ions or polishes. Mix.

Next, using a washing facility to remove the masking layer by ultrasonic cleaning (CC3) for 50 to 70 seconds and washed with water.

If the object is an LCD bracket (B) as shown in Figure 3b, the color coating step (CC) is a black coating step performed on the bracket passed through the nickel plating step (NP) or chrome plating step (CP) ( Preferably BP).

The LCD bracket (B) is formed with a receiving portion (B2) of a predetermined width for receiving and fixing the outside of the LCD to the outside of the opening (B4) serving as a display window for the LCD, the frame by a rivet or bolt Coupling portion B3 is provided with a plurality of through holes to be fixed to the.

The main object of the black coating step BC is the inner surface B1 around the opening B4, and if the inner surface is merely nickel plated (NP) or chromium plated (CP), the reflection of the LCD is caused by diffuse reflection. It interferes with the uniform brightness and degrades visibility.

Such a black coating may be formed by spraying a paint containing a black pigment, it is possible to repeat the coating and drying several times to improve the coating quality, it is preferable that the matte.

In addition, it is preferable to form fine concavities and convexities on the surface of the bracket plated with a strong alkaline (or strong acid) solution before the black coating in order to improve the bonding force.

In addition, if necessary, anodizing is used to oxidize the surface by electrolysis instead of coating to form a passivation film made of aluminum oxide on the aluminum surface (e.g. aluminum products are added to a sulfuric acid solution containing an iron compound). Dipping and applying a current to form a colored anodized film on the surface), and by forming a thin film mainly composed of chromium (Cr) on the surface of the aluminum by a chemical reaction caused by immersing an aluminum material in a solution containing chromate. The black coating layer can be formed by chemical conversion coating or chromate coating.

Patent When using the alloy and plating and coating technology according to the present invention can be manufactured to the thickness of the finished bracket up to 0.45mm can greatly contribute to the trend of light and short and short of portable electronic products.

Next, the chromium plating step (CP) can contribute to improved wear resistance.

First, it is desirable to proceed with the corrosion-resistant reinforcement layer plating step (CP1), which is a porous nickel coatings process in which the microporous coating method developed for the semiconductor manufacturing process or the flat panel display manufacturing process is applied to the general plating field. It is preferable.

The process using a mixture of NiSO 4 220 ~ 270g / l, NiCl 2 60 ~ 80g / l, boric acid 35 ~ 45g / l, 55 ~ 61 ℃, pH 3.9 ~ 4.5, current 650 ~ 750A / CB, voltage 6.4 ~ 6.6 After 2-4 minutes under V / CB, it is washed with water.

This is followed by a chromium activation process (CP2). The process can use commercially available ANKOR® NFDS from Enthone, Inc., a subsidiary of Cookson Electronics, UK, using NFDS 2-3 g / l, 20-30 ° C., under voltage 2-4 V / CB. Run for ~ 50 seconds.

Subsequently, the chromium plating process (CP3) uses a mixture of chromium oxide (CrO3) 210-260 g / l and sulfuric acid (H2SO4) 0.7-1.3 g / l, 35-41 ° C., current 1600-2000 A / CB, voltage 4.8- Proceed for 3 to 5 minutes at 5.8 V / CB, followed by recovery, washing and ion washing (CP4).

1, 2, 3a and 3b, even if the frame and bracket pursued in the present invention, such as Bao as shown in the thinnest product, even if the deformation does not occur even in the heat applied in each of the above plating process is that much in the present invention According to the alloy, mechanical properties (impact resistance, etc.) as well as increase the die casting quality (Cu), and post-treatment processes such as removal of burrs after demolding are stable (Sn and Pb), and in the plating and other post-processing processes This prevents warping or damage (Ni and Zn) and maintains strength and shape (Cr) even in finished portable electronics.

In addition, thinning is possible because the molten alloy has excellent fluidity.

Further, as shown in FIGS. 1 and 2, thermal deformation is prevented by introducing a special heat-resistant synthetic resin into the intena receiving portion Fi and the hinge endothelial Hi.

Next, in order to ensure that only a specific part of the painted frame has glossiness, a frame that has undergone plating and color coating may be considered to undergo a diamond cutting step (DC).

As shown in FIG. 3A, the cutting part F1 formed along the front outer edge of the frame enables the appearance of beauty and induction.

If the alloy quality is not satisfactory, not only the defect rate of the die-casting product itself is high, but also the dimensional uniformity is not satisfactory, and the repeating error is large. The yield will drop by that much.

However, due to the alloy performance according to the invention significantly reduced shrinkage difference during the curing process,

To eliminate burr, it is possible to trim by using press at the time of degating rather than to remove burr, which improves the work efficiency.

In addition, even in the cutting of diamonds, even a precise cutting pattern can be formed to significantly reduce defects.In order to cut the diamond of the frame, the jig of the press moves in a cylindrical manner so that the cutting by the diamond cutter while pressing the front of the frame uniformly. Work is possible.

Subsequently, the frame that has undergone the diamond cutting step may achieve perfection of the method and the rust prevention performance of the cutting surface F1 through the transparent protective layer forming step DC1.

For example, the transparent protective layer may use an alkylamine compound system, and may further apply a commercially available lacquer enamel resin to compensate for chemical resistance and weather resistance and to obtain a film maintenance gloss.

In the above description, although conventionally known techniques related to each alloy, die casting, insert injection, each plating step and detail process, and diamond cutting device are omitted, those skilled in the art can easily infer, infer, and reproduce the art.

In addition, in the above description of the present invention, the present invention has been described in accordance with a specific process order with reference to the accompanying drawings. Various modifications, changes, and substitutions may be made by those skilled in the art. Such modifications, changes, and substitutions are within the scope of protection of the present invention. Should be interpreted as belonging to.

1 is a schematic perspective view of a frame for a wireless communication device having a synthetic resin receiving portion manufactured using an aluminum alloy according to the present invention;

2 is a perspective view of a frame for a folding portable electronic product having a synthetic resin hinged inner shell manufactured using an aluminum alloy according to the present invention;

3A and 3B are perspective views of a frame and an LCD bracket for a portable electronic device manufactured according to the present invention, respectively;

4 is a process block diagram of a method for manufacturing a frame for a portable electronic device according to the present invention.

<Description of the symbols for the main parts of the drawings>

F: Frame Fa: Alloy Frame

Fi: Intena receptor Fa1, Fi1: Uneven part

H: Hinge F1: Diamond Cutout

B: Bracket B1: Black coating inner side

B2: receiving portion B3: engaging portion

Claims (5)

An alloy frame molding step of injecting a molten melted aluminum alloy at 700 to 750 ° C. into a mold cavity; And An intena receptive molding step of arranging the cooled alloy frame manufactured in the alloy frame molding step in a mold and injecting the molten synthetic resin to mold the molded alloy frame; Insert injection method of the frame for a wireless communication device comprising a. The method of claim 1, Insert injection method of a frame for a wireless communication device, characterized in that the synthetic resin used in the interna accommodating step has a melting point of 170 ℃ or more. The method of claim 2, Insert injection method of the frame for a wireless communication device, characterized in that the synthetic resin is glass fiber reinforced resin. According to any one of claims 1 to 3, wherein the alloy used in the alloy frame forming step 7.50 to 8.00 wt% Si for improved flowability, reduced shrinkage and improved heat resistance of the melt, 0.40 to 0.60 wt.% Fe for improved demolding performance by reducing tack 1.20 ~ 1.60 wt% Cu for reducing tack and strengthening of solid solution 0.30 to 0.55 wt.% Mn to enhance corrosion resistance and to aid in the effect of Fe addition, 2.20 to 2.60 wt% Mg for improving brittleness, corrosion resistance and tensile strength, 0.01 ~ 0.03% by weight Cr for improving brittleness and abrasion resistance, 0.03 to 0.07 wt.% Ni for improving brittleness and heat resistance, 0.10 to 0.30 wt.% Zn for improved corrosion resistance and strength, 0.01 ~ 0.03 wt% Ti for improving brittleness and corrosion resistance, 0.04 to 0.08 wt% Pb for improved machinability, 0.01% to 0.02% by weight of Sn for improved formability and machinability, Characterized in that it comprises a residual amount of Al Insert injection method of frame for wireless communication device. According to any one of claims 1 to 3, wherein the alloy used in the alloy frame forming step 0.100 to 0.200% by weight of Si for improved flowability, reduced shrinkage, and improved heat resistance of the melt, 0.400 ~ 0.460 wt% Fe for improved demolding performance by reducing tack 0.060 ~ 0.100 wt% Cu for reduced tack and strengthen solid solution, 0.400 to 0.460 wt.% Mn to enhance corrosion resistance and to aid in the addition of Fe, 8.940 ~ 9.940 wt% Mg for improving corrosion resistance and tensile strength, 0.008 ~ 0.012 wt% Cr, for improved wear resistance 0.007% to 0.009% by weight of Ni for improved heat resistance Zn of 0.020 ~ 0.040 wt% for corrosion resistance and strength improvement, 0.008 ~ 0.010 wt% Ti for corrosion resistance and strength improvement 0.005 to 0.007 wt% Pb for improved machinability, 0.008% to 0.010% by weight of Sn for improved formability and machinability, Characterized in that it comprises a residual amount of Al Insert injection method of frame for wireless communication device.

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