KR20070080022A - Back light unit - Google Patents

Abstract

A backlight unit is provided to improve the light efficiency and the power consumption, by refracting a light advancing above a light emitting device package through a lens so as to output a light having a uniform intensity above the light emitting device package. A plurality of packages(801,802) are respectively mounted on a substrate(160), wherein each of the packages has a plurality of light emitting diodes. A plurality of lenses are respectively attached on the packages. Each of the lenses has a curved surface for refracting and outputting a light outputted from each of the packages, and a concaved groove formed an upper portion thereof. A diffusing plate(170) is positioned above the plurality of lenses.

Description

Back light unit {

1 is a view illustrating a path of light in a lens of a side light emitting diode package according to the related art.

FIG. 2 is a schematic perspective view of the side light emitting diode package of FIG. 1.

3 is a light emission distribution diagram of a side light emitting diode package according to the related art

4 is a cross-sectional view of a side light emitting diode package mounted on a printed circuit board according to the related art.

5 is a schematic cross-sectional view using a side light emitting diode according to the prior art as a backlight unit of a liquid crystal display;

6 is a cross-sectional view illustrating a path through which light travels through the lens for a light emitting device according to the present invention.

7 is a cross-sectional view illustrating a path through which light travels through the lens for a light emitting device according to the present invention.

8 is a schematic cross-sectional view of a backlight unit using a light emitting device package according to a first embodiment of the present invention.

9 is a schematic cross-sectional view of a backlight unit using a light emitting device package according to a second embodiment of the present invention.

10A and 10B are schematic plan views of a backlight unit using a light emitting device package according to the present invention.

11A to 11E are schematic plan views for manufacturing a light emitting device package equipped with a lens for a light emitting device according to the present invention.

12 is a schematic cross-sectional view of a light emitting device package manufactured by the method of FIG.

FIG. 13 is a schematic plan view illustrating a state in which three light emitting devices are mounted in the light emitting device package of FIG. 12.

14 is a schematic plan view of a light emitting device package according to the present invention having a rectangular shape

FIG. 15 is a schematic plan view illustrating a state in which a lens is attached to the light emitting device package of FIG.

16A to 16E are schematic plan views for manufacturing another light emitting device package equipped with a light emitting device lens according to the present invention;

17 is a schematic cross-sectional view of another light emitting device package according to the present invention.

18A and 18B are schematic plan views illustrating a state in which a light emitting device is mounted in a light emitting device package according to the present invention.

19 is a schematic plan view for explaining the mounting plate shape of the light emitting device package according to the present invention;

20A and 20B are schematic plan views illustrating a lead shape of a light emitting device package according to the present invention.

<Description of the symbols for the main parts of the drawings>

100 light emitting element lens 101 hollow part

102 groove 110,610 light emitting element

120,170 diffuser 160 substrate

200,300,400,600: mounting plate 190: heat dissipation means

210,301,430,631,632,660: Lead

221,222,223,224,411,412,511,512,513,514: Light emitting element

230,420: Wire 250,451,620: Molding part

260 lens 452 lens shape

801,802,811: Package 820: Lens Film

851: drive unit

The present invention relates to a backlight unit, and more particularly, a plurality of light emitting devices are clustered into one package to facilitate mixing of the light emitted from each light emitting device, and the light mixed by the lens on the package is uniform. It relates to a backlight unit that can be emitted to the top.

The optical form of a conventional general light emitting diode is composed of a dome type lens, and the light emission distribution is also distributed within a predetermined region with respect to the central axis.

When using such a light emitting diode to replace a liquid crystal display backlight unit, which has been studied a lot recently, there are many limitations in obtaining a uniform light characteristic due to the light emitting characteristics of the light emitting diode. Receive.

In other words, in order to uniformly synthesize white light emitted from the light emitting diode, a considerable distance is required.

This, in turn, relates to the thickness of the liquid crystal display system, which is a detrimental advantage on thinner systems.

1 is a view illustrating a path of light in a lens of a side light emitting diode package according to the prior art. First, the light emitting diode 10 is located inside a dome-shaped lens 20, which is a dome-shaped lens. The upper portion 20 has a conical groove 21 formed at an upper portion thereof, and a V-shaped groove 22 is formed at a side surface thereof.

When the light emitted from the light emitting diode 10 comes into contact with the conical groove 21 surface of the lens 20, the conical groove 21 is inclined so that the light is reflected to the side of the lens. Emitted by A 'path.

When light comes into contact with the V-shaped grooves 22 on the side of the lens 20, the light passes through the lens 20 and is emitted to another path 'B' that is the side of the lens.

Therefore, the side light emitting diode according to the related art emits light emitted from the light emitting diode 10 to the side by using a lens.

On the other hand, the lens 20 is formed by injection molding, the area corresponding to the vertex 22a of the V-shaped groove 22 formed on the side of the lens 20 is a fine unit (for example, in advance In a meter or less unit), the light of the light emitting diode 10 is emitted to the upper portion of the lens 10 without being emitted to the side of the lens 10 in this region.

For this reason, in the conventional lens structure, the light emitted to the upper part of the lens exists, and the light quantity will be described in the light emission distribution which will be described later.

FIG. 2 is a schematic perspective view of the side light emitting diode package of FIG. 1, wherein the light emitting diode is bonded to a slug, and leads 31 and 32 are positioned on the side of the slug and electrically bonded to the light emitting diode. have.

In addition, the light emitting diode and the slug are molded by the molding means 40 so that the light emitting surfaces and the leads 31 and 32 of the light emitting diode are exposed to the outside, and the lens as shown in FIG. 1 surrounding the light emitting diode. 20 is bonded to the molding means.

3 is a light emission distribution diagram of a side light emitting diode package according to the prior art, as shown in the 'a' and 'b' of the distribution diagram, 92% to 95% of the light is emitted to the side of the package, 5% as the center of the package ~ 8% of light is emitted.

That is, referring to FIG. 1, most of the light is emitted to the side of the lens, but part of the light is emitted to the upper surface of the lens.

Therefore, such a side light emitting diode package cannot realize perfect side light emission, so that when used as a light source of a display, part of the light emitting diode is emitted from the center of the side light emitting diode package, which makes it difficult to make the flat light source uniform. This happens.

That is, a phenomenon in which light is emitted at the center of the side light emitting diode package may cause a hot spot phenomenon in which spots are generated at the center of the pixel displayed on the display, thereby adversely affecting the image quality of the display. .

4 is a cross-sectional view of a side light emitting diode package according to the related art mounted on a printed circuit board, and a plurality of side light emitting diode packages 50 are mounted on the printed circuit board 60.

FIG. 5 is a schematic cross-sectional view using a side light emitting diode according to the prior art as a backlight unit of a liquid crystal display. In order to solve the problem that light is emitted at the center of the side light emitting diode package described above, a backlight of a liquid crystal display is shown. The unit used a hot spot barrier.

That is, the backlight unit 90 of the liquid crystal display places a hot spot preventing plate 80 on top of each of the plurality of side light emitting diode packages 70 mounted on the printed circuit board 60. The light guide plate 85 is disposed on the hot spot prevention plate 80, and the liquid crystal display 95 is positioned on the upper part spaced apart from the light guide plate 85, thereby forming the backlight unit 90 and the liquid crystal display 95. Is assembled.

The backlight unit 90 configured as described above has to perform an assembly process in which a hot spot prevention plate 80 called a diverter is placed on the plurality of side light emitting diode packages 70. have.

In addition, during the assembling process, when misalignment occurs in the alignment of the hot spot prevention plate 80 on the plurality of side light emitting diode packages 70, spots similar to hot spots are generated on the screen of the final display.

In addition, the thickness of the display panel is increased by the thickness of the hot spot prevention plate 80.

In order to solve the problems as described above, the light traveling to the upper portion of the light emitting device package may be refracted by a lens, so that light having a uniform intensity can be emitted to the upper portion of the light emitting device package. The first object of the present invention is to provide a backlight unit capable of making a large area uniform even and improving the light efficiency and power consumption of the backlight unit.

A second object of the present invention is to cluster a plurality of light emitting devices into one package to facilitate mixing of the light emitted from each light emitting device, and the light mixed by the lens on the package can be uniformly emitted upward. It is to provide a backlight unit.

A third object of the present invention is to apply a lens film formed integrally with the lens-shaped portions capable of uniformly refracting light on the packages on which the plurality of light emitting devices are mounted, thereby attaching the lens to each package unit. It is to provide a backlight unit that can remove the.

The fourth object of the present invention is to increase the space utilization of the substrate by using a package in which a plurality of light emitting devices are mounted, so that the driving units can be positioned between the packages. Therefore, the heat dissipation means is attached to the entire opposite side of the substrate surface on which the packages are mounted. It is possible to provide a backlight unit capable of increasing heat dissipation efficiency.

A first preferred aspect for achieving the above objects of the present invention is

A substrate;

Packages each having a plurality of light emitting devices mounted on the substrate;

A plurality of lenses formed of a refractive surface for refracting the light emitted from the packages to be emitted to the outside, a concave groove formed on the upper surface, and adhered to the upper portions of the packages;

A backlight unit including a diffuser plate positioned on the plurality of lenses is provided.

A second preferred aspect for achieving the above objects of the present invention is

A substrate;

Packages each having a plurality of light emitting devices mounted on the substrate;

It consists of a refractive surface that can be emitted to the outside by refracting the light emitted from each of the packages, a plurality of lens-shaped portions having a concave groove is formed on the upper portion, the upper portion of each of the packages Positioned lens film;

A backlight unit including a diffuser plate positioned on the lens film is provided.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

6 is a cross-sectional view illustrating a path through which light passes through the lens for a light emitting device according to the present invention. First, the light emitting device lens 100 according to the present invention positions the light emitting device 110 through which light is emitted. A hollow portion 101 is formed therein; It consists of a surface that can be emitted to the outside by refracting the light emitted from the light emitting device (110); Concave groove 102 is formed in the upper portion.

Here, the light emitting device lens 100 is made in a convex cap shape; It is preferable that the concave groove 102 is formed in the upper region located on the central axis P of the cap shape.

As shown in FIG. 6, in the light emitting device lens 100, the light emitting device 110 is positioned inside the lens 100, and the light emitted from the light emitting device 110 is applied to the lens 100. It is refracted at) and emitted to the outside.

In this case, the concave groove 102 formed in the upper portion of the lens 100 changes the shape of the upper portion of the lens 100 and refracts the light traveling upward from the light emitting device 110.

On the other hand, in general, since the light emitting device has a large light intensity traveling upwards, the light emitting device has a structure in which light is emitted to the side and thus is utilized in the back light unit, but the present invention proceeds upwards. By refracting the light, the light intensity detected by the upper diffusion plate 120 may be more uniform.

Therefore, as shown in FIG. 6, the light emitted from the light emitting element 110 inside the lens 100 is refracted by the lens 100 and spreads to the side surface, and the light is uniformly incident on the diffusion plate 120. )

7 is a cross-sectional view illustrating a path through which light travels through the lens for a light emitting device according to the present invention, which is on the central axis P of the lens 100 for a light emitting device, When the position at which light is emitted from the inside is referred to as 'O', the light emitted by the path up to 80 degrees from the central axis P is refracted by the light emitting device lens 100 and proceeds upward.

However, the light emitted at an angle between 80 degrees and 90 degrees with respect to the central axis P of the lens for the light emitting device does not proceed upward even when refracted by the lens 100 for the light emitting device. Progress toward the side of the lens 100.

The present invention mounts a plurality of light emitting elements in the light emitting device package to be clustered, and attach or form the above-described lens to the light emitting device package to facilitate the mixing of the light emitted from the plurality of light emitting devices, It is to implement a light emitting device package capable of uniformly emitting the mixed light to the top.

8 is a schematic cross-sectional view of a backlight unit using a light emitting device package according to a first embodiment of the present invention, the backlight unit comprising: a substrate 160; Packages 801 and 802 each having a plurality of light emitting devices mounted on the substrate 160; It consists of a refractive surface that can be emitted to the outside by refracting the light emitted from the packages (801, 802), a concave groove is formed on the top, a plurality of bonded to the top of each of the packages (801, 802) Lenses; It is configured to include a diffusion plate 170 positioned on the plurality of lenses.

The backlight unit may be configured to refracting the light traveling above the light emitting device package with a lens to emit light having a uniform intensity to the top of the light emitting device package. Thus, the backlight unit may uniformly cover a large area even with a small number of light emitting device packages. It can be, there is an advantage that can improve the light efficiency and power consumption of the backlight unit.

9 is a schematic cross-sectional view of a backlight unit using a light emitting device package according to a second embodiment of the present invention, including a substrate 160; Packages (811) each having a plurality of light emitting devices mounted on the substrate (160); A plurality of lens-shaped portions 821, 822, 823, and 824 are formed on a refraction surface capable of refracting light emitted from each of the packages 811 to be emitted to the outside, and having a concave groove formed thereon. A lens film 820 positioned on top of each of the packages 811; It is configured to include a diffusion plate 170 positioned on the lens film 820.

Therefore, the backlight unit according to the second exemplary embodiment of the present invention applies a lens film having integrally formed lens shapes capable of uniformly refracting light on top of packages in which a plurality of light emitting devices are mounted, thereby providing each package unit. As a result, the process of attaching the lens can be eliminated.

10A and 10B are schematic plan views of a backlight unit using a light emitting device package according to the present invention, and packages 811 on which a plurality of light emitting devices are mounted are mounted on the substrate 160.

That is, the plurality of light emitting devices are red (R), green (G), and blue (B) light emitting devices.

In addition, the driving units 851 for driving the packages 811 are mounted between the packages 811.

Since the plurality of light emitting devices are mounted in each of the packages 811, the substrate 160 on which the packages 811 are mounted is superior in terms of space utilization than the substrate on which one light emitting device package is mounted.

Therefore, as shown in FIG. 10A, the driving unit 851 may be positioned between the packages 811 by configuring the backlight unit with the packages 811 in which the plurality of light emitting devices are mounted.

As a result, the heat dissipation means 190 may be attached to the entire surface opposite to the surface of the substrate 160 on which the packages 811 are mounted, thereby increasing heat dissipation efficiency.

That is, when the backlight unit is configured as a package in which one light emitting device is packaged, space utilization is lowered compared to the backlight unit of the present invention, so that the driving unit is positioned on the opposite side of the substrate surface on which the light emitting device package is mounted, and thus the heat radiating means 190 ) Area is reduced.

11A to 11E are schematic plan views for manufacturing a light emitting device package equipped with a lens for a light emitting device according to the present invention. First, as shown in FIG. 11A, a mounting plate 200 and the mounting plate 200 are illustrated. A lead frame including a plurality of leads 210 spaced apart from is prepared.

In this case, the lead frame includes a conventional structure and can be variously changed in design.

However, the plurality of leads 210 must satisfy a condition spaced apart from the mounting plate 200.

In addition, in the present invention, as shown in Figure 11a, the plurality of leads 210 should be located around the mounting plate 200.

Thereafter, a plurality of light emitting elements 221, 222, 223, and 224 are bonded to the mounting plate 200 (FIG. 11B).

The plurality of light emitting devices 221, 222, 223, and 224 preferably have a horizontal structure in which electrodes are formed on the light emitting devices.

Subsequently, the plurality of light emitting elements 221, 222, 223, and 224 and the plurality of leads 210 are electrically connected to each other (FIG. 11C).

Here, the plurality of light emitting elements 221, 222, 223, and 224 and the plurality of leads 210 are electrically connected to each other by a wire 230, as shown in FIG. 11C.

Subsequently, a molding part 250 surrounding the plurality of light emitting elements 221, 222, 223, and 224 and a part of the plurality of leads 210 is formed (FIG. 11D).

Finally, the lens 260 is formed of a surface that can be emitted to the outside by refracting the light emitted from the plurality of light emitting devices (221, 222, 223, 223), the concave groove is formed on the lens 260 It adheres to the upper part of the molding part 250. (FIG. 11E)

Here, the light emitting device package mounted on the backlight unit according to the second embodiment of the present invention performs the process only up to FIG. 11D.

FIG. 12 is a schematic cross-sectional view of a light emitting device package manufactured by the method of FIG. 11, including a mounting plate 200; A plurality of leads 210 spaced apart from the mounting plate 200; A plurality of light emitting elements 221, 222, 223, and 224 bonded to the upper portion of the mounting plate 200; A conductor electrically connecting the plurality of light emitting elements (221, 222, 223, 224) and the plurality of leads (210); A molding part 250 surrounding the plurality of light emitting elements 221, 222, 223 and 224 and a part of the plurality of leads 210; Consists of a surface that can be emitted to the outside by refracting the light emitted from the plurality of light emitting elements (221, 222, 223, 223), a concave groove 261 is formed in the upper portion, the molding portion 250 It is configured to include a lens 260 adhered to the top.

Here, the conductor is a wire.

As a result, the light emitted from the plurality of light emitting devices clustered into one package is mixed and uniformly emitted upward by the lens on the top of the package.

FIG. 13 is a schematic plan view illustrating a state in which three light emitting devices are mounted on the light emitting device package of FIG. 12. The package is formed by molding a structure in which three light emitting devices 221, 222, and 223 are mounted on the mounting plate 200. It is.

FIG. 14 is a schematic plan view of a light emitting device package according to the present invention having a rectangular shape. Seven light emitting devices 221, 222, 223, 224, 225, 226, and 227 are mounted on a mounting plate 200 and spaced apart from each other. The light emitting elements 221, 222, 223, 224, 225, 226, and 227 are wire 230 bonded to the plurality of leads 210 spaced apart from both sides, and the plurality of leads 210 and the mounting plate are formed by the molding part 250. 200 and the light emitting elements 221, 222, 223, 224, 225, 226 and 227 are wrapped.

Such a light emitting device package has a rectangular shape since light emitting devices are mounted in a line.

FIG. 15 is a schematic plan view illustrating a state in which a lens is attached to the light emitting device package of FIG. 14, and center lines P1, P2, P3, and P4 of the plurality of light emitting devices 221, 222, 223, 224, 225, 226, and 227 mounted in a line and spaced apart from each other. Concave grooves 251, 252, 253, 254, 255, 256 and 257 are formed on the lens 260 on the P5, P6 and P7.

That is, the light emitting device package mounted on the backlight unit according to the first embodiment of the present invention attaches the above-described lens to the package, and the light emitting device package mounted on the backlight unit according to the second embodiment is described above in the lens film. The lens shape is formed.

Therefore, the rectangular package may be equipped with a lens having a concave groove formed on the center line of each of the light emitting devices to uniformly emit light emitted from the light emitting devices.

16A to 16E are schematic plan views for manufacturing another light emitting device package equipped with a lens for a light emitting device according to the present invention. First, a plurality of leads spaced apart from the mounting plate 300 and the mounting plate 300 are shown. A lead frame including a plurality of leads 301 extending from the field 210 and the mounting plate 300 is prepared (FIG. 16A).

Next, a plurality of light emitting elements 221, 222, 223, and 224 are flip chip bonded on the mounting plate 300 (FIG. 16B).

The flip chip bonding is bonding in which electrode terminals of a plurality of light emitting elements 221, 222, 223, and 224 are electrically bonded to the mounting plate 300 and bonded to the mounting plate 300.

That is, the light emitting device applied to the light emitting device package according to the manufacturing method of FIGS. 16A to 16E is preferably a vertical light emitting device having electrodes formed on top and bottom of the device.

Subsequently, the plurality of light emitting elements 221, 222, 223 and 224 are electrically connected to the plurality of leads 210 spaced apart from the mounting plate 300 (FIG. 16C).

Subsequently, a molding part 250 surrounding the plurality of light emitting elements 221, 222, 223, and 224 and a part of the plurality of leads 210 is formed (FIG. 16D).

Lastly, the molding unit may include a lens having a structure in which light emitted from the plurality of light emitting elements 221, 222, 223, and 223 is refracted to be emitted to the outside, and having a concave groove formed thereon. 250) Adhesion to the top (Fig. 16e).

At this time, the light emitting device package mounted on the backlight unit according to the second embodiment of the present invention performs the process only up to FIG. 16D.

The light emitting device package manufactured by the above-described method includes a mounting plate 300 having a plurality of leads 301 extending therefrom; A plurality of leads 210 spaced apart from the mounting plate 200; A plurality of light emitting elements 221, 222, 223, and 224 bonded to the upper portion of the mounting plate 200; A conductor electrically connecting the plurality of light emitting elements (221, 222, 223, 224) and the plurality of leads (210) spaced apart from the mounting plate (200); A molding part 250 formed around the plurality of light emitting elements 221, 222, 223 and 224 and a part of the plurality of leads 210 and 301; Consists of a surface that can be emitted to the outside by refracting the light emitted from the plurality of light emitting elements (221, 222, 223, 223), a concave groove 261 is formed in the upper portion, the molding portion 250 It is configured to include a lens 260 adhered to the top.

Since the light emitting device package is electrically connected while the light emitting devices are mounted on the mounting plate, only one wire bonding needs to be performed for each light emitting device.

FIG. 17 is a schematic cross-sectional view of another light emitting device package according to the present invention. In the light emitting device package of the first embodiment described above, the molding part and the lens are integrally formed of the same material as the material of the molding part, as shown in FIG. 17. To form.

That is, one molding process is performed on the molding part 451 and the lens shape part 452 surrounding the mounting plate 400, the light emitting devices 411 and 412, the wires 420 and the leads 430. To form integrally.

18A and 18B are schematic plan views illustrating a state in which a light emitting device is mounted in a light emitting device package according to the present invention. First, as shown in FIG. 18A, four light emitting devices are mounted on an upper portion of the mounting plate 500. The red (R) light emitting device 511 and the green (G) light emitting device 512 are disposed in the first column, and the green (G) light emitting device 513 and the blue (B) light emitting device 514 are arranged in the second column. To place.

As shown in FIG. 18B, three light emitting devices are mounted on the mounting plate 500, a red (R) light emitting device 511 is disposed in a first column, and a green (G) light emitting device is arranged in a second column. 513 and a blue (B) light emitting element 514 are disposed.

The arrangement of four light emitting elements in RGGB and the arrangement of three light emitting elements in RGB may cluster and mount light emitting elements for implementing white light in one package.

On the other hand, the package of the present invention is preferably composed of any one or both of a red light emitting device, a green light emitting device and a blue light emitting device.

As a result, the light emitted from the plurality of light emitting devices is mixed through the lens on the top of the package to be uniformly emitted upward.

FIG. 19 is a schematic plan view illustrating a shape of a mounting plate of a light emitting device package according to the present invention. The mounting plate of the light emitting device package described above may be formed thick and mounted on the molding part 620 as shown in FIG. 19. The lower surface of the plate 600 is exposed to release heat generated by the light emitting devices 610 mounted on the mounting plate 600 to the mounting plate 600.

That is, the mounting plate 600 serves as a heat sink.

20A and 20B are schematic plan views illustrating a lead shape of a light emitting device package according to the present invention. As shown in FIG. 20A, a part of the lead of the light emitting device package is exposed to a lower surface of the molding part 620 to expose the lead shape. Heat generated at 610 is discharged through the leads 631 and 632.

As such, when the leads 631 and 632 are present on the lower surface of the molding part 620, there is an advantage that flip chip bonding may be performed on the printed circuit board through soldering the light emitting device package.

As shown in FIG. 20B, the lead 660 protrudes to the side of the molding part 620 and is bent.

As described above, according to the present invention, since the light traveling to the upper portion of the light emitting device package may be refracted by a lens, the light having a uniform intensity may be emitted to the upper portion of the light emitting device package. Since the area can be made uniform, the light efficiency and power consumption of the backlight unit can be improved.

In addition, the present invention clusters a plurality of light emitting devices into one package to facilitate the mixing of the light emitted from each light emitting device, and the light mixed by the lens on the package can be emitted uniformly to the top. have.

In addition, the present invention is applied to the lens film formed integrally with the lens-shaped portions capable of uniformly refracting the light on the top of the package each of the plurality of light emitting elements are mounted, thereby eliminating the process of attaching the lens in each package unit It can be effective.

In addition, the present invention can increase the space utilization of the substrate by using a package in which a plurality of light emitting devices are mounted, so that the driving units can be positioned between the packages, and thus heat dissipation means can be attached to the entire opposite side of the substrate surface on which the packages are mounted. There is an effect that can increase the heat release efficiency.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (17)

A substrate; Packages each having a plurality of light emitting devices mounted on the substrate; A plurality of lenses formed of a refractive surface for refracting the light emitted from the packages to be emitted to the outside, a concave groove formed on the upper surface, and adhered to the upper portions of the packages; And a diffuser plate positioned on the plurality of lenses. The method of claim 1, Each of the packages, A mounting plate; A plurality of leads spaced apart from the mounting plate; A plurality of light emitting elements bonded to an upper portion of the mounting plate; A conductor electrically connecting the plurality of light emitting elements and the plurality of leads; And a molding unit formed to surround the plurality of light emitting elements and a plurality of leads. The method of claim 1, Each of the packages, A mounting plate having a plurality of leads extending; A plurality of leads spaced apart from the mounting plate; A plurality of light emitting elements bonded to an upper portion of the mounting plate; A conductor electrically connecting the plurality of light emitting elements and the plurality of leads spaced apart from the mounting plate; And a molding unit formed to surround the plurality of light emitting elements and a plurality of leads. The method of claim 2 or 3, The lens, And a backlight unit, wherein the backlight unit is molded and formed integrally with the same material as that of the molding unit. The method according to any one of claims 1 to 3, The backlight unit, characterized in that the driver for driving the packages are further mounted between the packages. The method according to any one of claims 1 to 3, The light emitting device, 4 In the first column, a red light emitting device and a green light emitting device are disposed, And a green light emitting element and a blue light emitting element are arranged in the second column. The method according to any one of claims 1 to 3, The light emitting device, 3, A red light emitting element is arranged in the first column, And a green light emitting element and a blue light emitting element are arranged in the second column. The method of claim 2 or 3, The light emitting device, Spaced in a line and bonded to the mounting plate, And a concave groove is formed in the upper portion of the lens on the center line of each of the light emitting elements. The method of claim 2 or 3, The mounting plate, And a backlight unit exposed on the lower surface of the molding unit. The method of claim 2 or 3, The leads, The backlight unit is protruded and bent to the molding portion side. The method of claim 2 or 3, The leads, And a backlight unit exposed on the lower surface of the molding unit. A substrate; Packages each having a plurality of light emitting devices mounted on the substrate; It consists of a refractive surface that can be emitted to the outside by refracting the light emitted from each of the packages, a plurality of lens-shaped portions having a concave groove is formed on the upper portion, the upper portion of each of the packages Positioned lens film; And a diffuser plate positioned on the lens film. The method of claim 12, Each of the packages, A mounting plate; A plurality of leads spaced apart from the mounting plate; A plurality of light emitting elements bonded to an upper portion of the mounting plate; A conductor electrically connecting the plurality of light emitting elements and the plurality of leads; And a molding unit formed to surround the plurality of light emitting elements and a plurality of leads. The method according to claim 12 or 13, The backlight unit further comprises a driver for driving the packages between the packages. The method according to claim 12 or 13, The light emitting device, 4 In the first column, a red light emitting device and a green light emitting device are disposed, And a green light emitting element and a blue light emitting element are arranged in the second column. The method according to claim 12 or 13, The light emitting device, 3, A red light emitting element is arranged in the first column, And a green light emitting element and a blue light emitting element are arranged in the second column. The method of claim 13, The light emitting device, Spaced in a line and bonded to the mounting plate, And a concave groove is formed in the upper portion of the lens on the center line of each of the light emitting elements.

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