KR20070079093A - Display substrate - Google Patents

Abstract

A display substrate is provided to prevent a metal pattern and a transparent electrode formed on a metal pattern from corroding due to reaction with external moisture by changing the metal pattern of a contact area of a gate driver circuit unit. A base substrate includes a display area(DA) where a plurality of pixels are formed and a peripheral area(PA) that surrounds the display area. A driver circuit is formed in the peripheral area and includes a plurality of switching devices and a plurality of contact units. The switching devices include first and second metal pattern. The contact units electrically connect the first and second metal patterns. A sealing member(310) is disposed in a portion of the peripheral area. A transmissive pattern without a metal layer is formed on at least one metal pattern of the first and second metal patterns of the contact unit formed in the portion of the peripheral area.

Description

Display board {DISPLAY SUBSTRATE}

1 is a plan view of a display panel including a display substrate according to an exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

3 is an enlarged view illustrating a gate driving circuit of the display panel of FIG. 1.

4 is an enlarged view illustrating a metal pattern according to an embodiment of the present invention of FIG. 3.

5 is an enlarged view illustrating a metal pattern according to another embodiment of the present invention of FIG. 3.

<Explanation of symbols for the main parts of the drawings>

100: array substrate 200: color filter substrate

PA: Peripheral Area DA: Display Area

130: gate driving circuit portion 300: liquid crystal layer

310: sealing member 320: cell gap holding member

The present invention relates to a display substrate, and more particularly, to a display substrate for preventing corrosion of an integrated circuit portion.

In general, a liquid crystal display device includes a liquid crystal display panel having a plurality of gate lines and a plurality of source lines, a gate driving circuit portion for outputting a gate signal to the plurality of gate lines, and a source driving circuit portion for outputting data signals to the plurality of source lines Is made of.

The liquid crystal display panel includes a lower substrate including a switching element TFT, an upper substrate including a common electrode, a liquid crystal layer interposed between the lower substrate and the upper substrate, a sealing member, and a spacer. The lower substrate and the upper substrate are coupled by the sealing member, and the cell gap of the liquid crystal layer is kept constant using the spacer. At this time, in the liquid crystal ODF (On Drop Filling) process of the sealing process, the sealing member is generally cured through ultraviolet (UV). Since the lower part of the sealing member does not have a wide range of patterns, the ultraviolet ray is exposed back to harden the sealing member.

On the other hand, in recent years, in order to increase the productivity while reducing the overall size of the liquid crystal display, a structure in which the gate driving circuit unit is integrated into the liquid crystal display panel has been developed. In this case, a product in which the gate driving circuit portion is integrated in the liquid crystal display panel mainly adopts a structure in which the sealing member is positioned on the gate driving circuit portion. When the sealing member is cured by back exposure, the gate driving circuit portion is applied. There is a part that cannot be completely cured by the metal patterns.

In particular, the contact portion connecting the different metal patterns requires a metal pattern having a predetermined area. Accordingly, the ultraviolet rays do not reach the sealing member formed on the upper portion of the metal pattern by the metal pattern, so that incomplete curing of the sealing member may occur. As a result, the components of the uncured sealing member and the moisture introduced from the outside react to generate a problem of corrosion of the metal pattern of the gate driving circuit part.

Accordingly, the technical problem of the present invention was conceived in this respect, and an object of the present invention is to provide a display substrate for preventing corrosion of an integrated circuit part.

A display substrate according to an exemplary embodiment of the present invention may include a base substrate including a display area in which a plurality of pixels are formed and a peripheral area surrounding the display area, the first substrate being formed in the peripheral area, A driving circuit including a plurality of switching elements including a second metal pattern and a plurality of contact parts electrically connecting the first and second metal patterns, and a sealing member disposed in a portion of the peripheral area. . In this case, the at least one of the first and second metal patterns of the contact portion formed in the partial region is characterized in that the transmission pattern from which the metal layer is removed. According to the manufacturing method of such a display substrate, the electrical characteristics of the display substrate can be improved.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention.

1 is a plan view of a display panel according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

1 and 2, a liquid crystal display device according to an embodiment of the present invention includes a liquid crystal display panel displaying an image, a gate driving circuit unit integrated in the liquid crystal display panel and outputting a gate signal to the liquid crystal display panel; A source driving circuit unit mounted on the liquid crystal display panel to output a data signal to the liquid crystal display panel.

The liquid crystal display panel includes a lower substrate 100, an upper substrate 200 facing the lower substrate 100, a liquid crystal layer 300 interposed between the lower substrate 100 and the upper substrate 200, and a lower substrate. And a sealing member 310 and a cell gap holding member 320 that couple the upper surface 100 to the upper substrate 200.

The LCD panel is substantially divided into a region DA in which an image is displayed and a peripheral region PA adjacent to the display area DA and in which the image is not displayed. The peripheral area PA includes a first peripheral area PA1 and a second peripheral area PA2.

The display area DA includes a plurality of data wires (not shown) and a plurality of source wires (not shown). A plurality of pixels are respectively provided in the plurality of pixel areas defined by the plurality of data lines and the plurality of source lines.

Each of the plurality of pixels includes a thin film transistor TFT and a pixel electrode PE electrically connected to the thin film transistor TFT. The thin film transistor TFT includes a gate electrode, a source electrode, and a drain electrode, a gate electrode (not shown) is connected with the corresponding gate wiring, and a source electrode (not shown) is connected with the corresponding source wiring. In addition, the drain electrode (not shown) is connected to the pixel electrode PE. The pixel electrode PE is formed of indium tin oxide (ITO) or indium zinc oxide (IZO), which is a transparent conductive material.

The gate driving circuit unit 130 is provided in the first peripheral area PA1 and is connected to first ends of the plurality of gate lines to output a gate driving signal to the gate lines. The gate driving circuit unit 130 is formed of amorphous silicon (a-Si) by the same process as that of the thin film transistor TFT of the display area DA. The gate driving circuit unit 130 will be described later in detail together with the sealing member 310.

The source driving circuit unit 400 is formed adjacent to the second peripheral area PA2 and includes a source printed circuit board 410. The source printed circuit board 410 is connected to the liquid crystal display panel through the source flexible printed circuit board 420. The source flexible printed circuit board 420 may include a source driving chip 430, and the source flexible printed circuit board 420 may be, for example, a tape carrier package (TCP) or a chip on film. : COF). Meanwhile, the source printed circuit board 410 may be removed by forming a separate signal line on the liquid crystal display panel.

The upper substrate 200 includes a light blocking pattern BM, a color filter CF, and a common electrode CE. The color filter CF includes a red (R) color filter, a green (G) color filter, and a blue (B) color filter, and a light shielding pattern BM is provided between the color filters in the display area DA. By bordering the pixel area, the color reproducibility of the pixels is improved. In addition, the light blocking pattern BM prevents the gate driving circuit from being projected on the screen by facing the gate driving circuit 130 in the peripheral area PA. The common electrode CE is stacked on the light blocking pattern BM and the color filter CF to have a uniform thickness to face the pixel electrode PE.

The sealing member 310 is interposed between the lower substrate 100 and the upper substrate 200 and then combines the lower substrate 100 and the upper substrate 200 through a bonding process in which high temperature and high pressure are applied. In particular, the sealing member 310 is interposed between the common electrode CE and the gate driving circuit unit 130 and is formed to cover a portion of the gate driving circuit unit 130.

The cell gap maintaining member 320 is a spacer interposed between the lower substrate 100 and the upper substrate 200 to maintain a constant thickness of the liquid crystal layer 300. The spacer may be a beads spacer or a column spacer.

3 is an enlarged view illustrating a gate driving circuit of the display panel of FIG. 1. Referring to FIG. 3, the gate driving circuit unit 130 includes a gate signal wiring unit 132 and a gate circuit unit 134.

The gate signal wire part 132 includes a plurality of gate signal wires 132a, 132b, 132c, and 132d. The gate signal wires are connected to the metal patterns of the gate circuit part 134 and drive signals transferred through the source driving circuit part 400 through the gate signal wires 132a, 132b, 132c, and 132d through the gate circuit part 134. To pass on.

The gate circuit part 134 includes a plurality of switching elements TFT and a plurality of contact parts CNT1, CNT2, CNT3, and CNT4, and the plurality of switching elements TFT includes a gate electrode G and a metal pattern. .

The metal pattern of the plurality of switching elements TFT may be formed simultaneously with the source electrode and the drain electrode of the thin film transistor TFT included in the display area DA, and pattern the same metal layer as the source electrode and the drain electrode to form a gate electrode. It is formed on (G). The driving signals that enter the gate circuit unit 134 from the gate signal line 132 are converted through the plurality of switching elements TFT and output to the gate line of the display area DA.

In this case, the gate electrode G of the gate driving circuit unit 130 connected to the gate wiring forms a source electrode S or a drain electrode D and a plurality of contact portions CNT1, CNT2, CNT3, and CNT4. The gate electrode G, the source electrode S, or the drain electrode D are electrically connected to each other through the transparent electrodes TE formed in the contact portions. The transparent electrode TE is made of indium tin oxide (ITO) or indium zinc oxide (IZO), which is a conductive material.

The sealing member 310 is formed along the edge of the lower substrate 100. In this case, the lower substrate 100 and the upper substrate 200 are coupled to the partial area of the gate circuit 134 through the sealing member 310. In this case, the sealing member 310 may be formed on the gate signal wiring part 132.

4 is an enlarged view illustrating a metal pattern according to an embodiment of the present invention of FIG. 3, and FIG. 5 is an enlarged view illustrating a metal pattern according to another embodiment of the present invention of FIG. 3.

4 and 5, the gate electrode G of the gate circuit unit 134 is formed adjacent to the source electrode S or the drain electrode D to form the contact portions CNT1 and CNT2. Transparent electrodes TE1 and TE2 are formed in the contact portions CNT1 and CNT2, and the gate electrode G is electrically connected to the source electrode S or the drain electrode D through the transparent electrodes TE1 and TE2. .

At this time, the sealing member 310 is formed on a part of the gate circuit portion 134 including the gate electrode G, the source electrode S or the drain electrode D, and the transparent electrodes TE1 and TE2, and the sealing member ( 310 is cured by irradiating ultraviolet rays from the back surface of the lower substrate (100).

When the ultraviolet rays are irradiated from the rear surface of the lower substrate 100 toward the lower substrate 100, some of the ultraviolet rays have high energy and thus may pass through the lower substrate 100. Accordingly, the ultraviolet rays may reach the sealing member 310 formed on the lower substrate 100, and the sealing member 310 may be cured by the ultraviolet rays to lower the substrate 100 and the upper substrate 200. To combine.

Referring to FIG. 4, the shape of the transmission pattern included in the metal pattern according to the exemplary embodiment of the present invention may be formed as a groove pattern. The metal pattern is, for example, the gate electrode G or the source electrode S of the contact portion CNT1.

The groove pattern has a shape in which a predetermined shape, for example, a wave shape and an uneven shape are repeatedly arranged. Alternatively, a groove is formed toward the second surface of the gate electrode G in which the first surface of the gate electrode G is formed in parallel with the first surface of the gate electrode G. The groove may be one or plural.

In addition, the groove pattern may be formed in the source electrode S, and certain shapes may be repeatedly arranged, or a groove facing the second surface of the source electrode S formed in parallel with the first surface of the source electrode S may be formed. Can be formed. In this case, one or more grooves may be provided.

That is, the groove pattern may be formed only on the gate electrode G, or the groove pattern may be formed only on the source electrode S. In addition, the gate electrode G and the source electrode S may be formed to include all of the groove patterns. In addition, the plurality of surfaces of the gate electrode G or the source electrode S may include the groove pattern. In this case, not only the source electrode S but also the metal pattern of the contact portion CNT2 formed by the gate electrode G and the drain electrode D may include the groove pattern.

The groove pattern forms a photoresist layer on the entire surface of the base substrate including the metal layer for forming the metal pattern, and pattern the photoresist layer by a mask including the groove pattern. When the photoresist layer is patterned by the mask, an etching solution is used to remove the metal layer in the region where the patterned photoresist layer is not formed, and only the patterned metal layer remains to form a metal pattern including the groove pattern. .

As the metal pattern includes the groove pattern, an area occupied by the metal pattern in the contact portion may be reduced. As a result, the area where the ultraviolet rays which are exposed to the rear surface during the curing of the sealing member 310 is transmitted to the lower substrate 100 can be increased, thereby fully curing the sealing member 310.

Referring to FIG. 5, a shape of a transmission pattern included in a metal pattern according to another exemplary embodiment of the present invention may be formed in a hole shape. The metal pattern is, for example, the gate electrode G or the drain electrode D of the contact portion CNT2.

The holes may be formed in the inner region of the metal pattern, and one or more holes may be formed according to the size. The plurality of holes are uniformly disposed in the gate electrode G or the drain electrode D to increase a region in which the ultraviolet rays, which are exposed to the bottom surface during curing of the sealing member 310, are transmitted to the lower substrate 100, and the ultraviolet rays are increased. This can permeate uniformly.

The hole may be formed in the gate electrode G or the drain electrode D, and may be formed in the gate electrode G and the drain electrode D. The hole may be formed in the source electrode S of the gate circuit 134. Holes may be formed. In this case, the metal pattern including the hole is formed by patterning a metal layer by a mask including the hole.

Since the metal pattern includes the hole, an area occupied by the metal pattern in the contact portion CNT2 may be reduced. As a result, the area where the ultraviolet rays which are exposed to the rear surface during the curing of the sealing member 310 is transmitted to the lower substrate 100 can be increased, thereby fully curing the sealing member 310.

As described above in detail, the metal patterns of the plurality of contact portions of the gate circuit portion include a transmission pattern, thereby enabling complete curing of the sealing member. Accordingly, the transparent electrode formed on the metal pattern reacts with external moisture to prevent corrosion of the metal pattern, thereby improving reliability of the manufacturing process and improving electrical characteristics of the display substrate.

In addition, the metal pattern including the transmission pattern may be applied to a plurality of contact parts of the gate signal wiring part in which the sealing member is formed to prevent corrosion of the metal pattern.

According to the manufacturing method of the display substrate, by deforming the metal pattern of the contact portion of the gate driving circuit portion, the transparent electrode and the metal pattern formed on the upper portion of the metal pattern can be prevented from reacting with the external moisture to corrode, Accordingly, the reliability of the manufacturing process and the electrical characteristics of the display substrate can be improved.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

Claims (4)

A base substrate including a display area in which a plurality of pixel parts are formed and a peripheral area surrounding the display area; A driving circuit formed in the peripheral region and including a plurality of switching elements including a first metal pattern and a second metal pattern and a plurality of contact parts electrically connecting the first and second metal patterns; And A sealing member disposed in a portion of the peripheral region, The display substrate of claim 1, wherein at least one of the first and second metal patterns of the contact portion formed in the partial region is formed with a transmission pattern from which the metal layer is removed. The display substrate of claim 1, wherein a plurality of transmission patterns are formed on the at least one metal pattern. The display substrate of claim 1, wherein the display area further comprises a plurality of gate wires and a plurality of source wires crossing the gate wires. The display substrate of claim 3, wherein the driving circuit is a gate driving circuit formed at one end of the gate lines to sequentially output the gate signals to the gate lines.

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