KR20070075792A - Printed circuit board and semiconductor product - Google Patents

Printed circuit board and semiconductor product Download PDF

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Publication number
KR20070075792A
KR20070075792A KR1020060004441A KR20060004441A KR20070075792A KR 20070075792 A KR20070075792 A KR 20070075792A KR 1020060004441 A KR1020060004441 A KR 1020060004441A KR 20060004441 A KR20060004441 A KR 20060004441A KR 20070075792 A KR20070075792 A KR 20070075792A
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KR
South Korea
Prior art keywords
printed circuit
circuit board
semiconductor
semiconductor device
metal pattern
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KR1020060004441A
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Korean (ko)
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이찬석
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삼성전자주식회사
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Priority to KR1020060004441A priority Critical patent/KR20070075792A/en
Publication of KR20070075792A publication Critical patent/KR20070075792A/en

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    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D1/00—Water flushing devices with cisterns ; Setting up a range of flushing devices or water-closets; Combinations of several flushing devices
    • E03D1/003—Cisterns in combination with wash-basins, urinals, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/001—Processes for the treatment of water whereby the filtration technique is of importance
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03C—DOMESTIC PLUMBING INSTALLATIONS FOR FRESH WATER OR WASTE WATER; SINKS
    • E03C1/00—Domestic plumbing installations for fresh water or waste water; Sinks
    • E03C1/12—Plumbing installations for waste water; Basins or fountains connected thereto; Sinks
    • E03C1/14—Wash-basins connected to the waste-pipe
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D1/00—Water flushing devices with cisterns ; Setting up a range of flushing devices or water-closets; Combinations of several flushing devices
    • E03D1/02—High-level flushing systems
    • E03D1/025—Cisterns with floats actuating the flushing
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D1/00—Water flushing devices with cisterns ; Setting up a range of flushing devices or water-closets; Combinations of several flushing devices
    • E03D1/30—Valves for high or low level cisterns; Their arrangement ; Flushing mechanisms in the cistern, optionally with provisions for a pre-or a post- flushing and for cutting off the flushing mechanism in case of leakage
    • E03D1/302—Valves for high or low level cisterns; Their arrangement ; Flushing mechanisms in the cistern, optionally with provisions for a pre-or a post- flushing and for cutting off the flushing mechanism in case of leakage with valves kept in open position by means of air or water pressure or by vacuum
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D1/00—Water flushing devices with cisterns ; Setting up a range of flushing devices or water-closets; Combinations of several flushing devices
    • E03D1/30—Valves for high or low level cisterns; Their arrangement ; Flushing mechanisms in the cistern, optionally with provisions for a pre-or a post- flushing and for cutting off the flushing mechanism in case of leakage
    • E03D1/32—Arrangement of inlet valves
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D1/00—Water flushing devices with cisterns ; Setting up a range of flushing devices or water-closets; Combinations of several flushing devices
    • E03D1/30—Valves for high or low level cisterns; Their arrangement ; Flushing mechanisms in the cistern, optionally with provisions for a pre-or a post- flushing and for cutting off the flushing mechanism in case of leakage
    • E03D1/33—Adaptations or arrangements of floats
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D1/00—Water flushing devices with cisterns ; Setting up a range of flushing devices or water-closets; Combinations of several flushing devices
    • E03D1/30—Valves for high or low level cisterns; Their arrangement ; Flushing mechanisms in the cistern, optionally with provisions for a pre-or a post- flushing and for cutting off the flushing mechanism in case of leakage
    • E03D1/34—Flushing valves for outlets; Arrangement of outlet valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/32—Details
    • F16K1/34—Cutting-off parts, e.g. valve members, seats
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03C—DOMESTIC PLUMBING INSTALLATIONS FOR FRESH WATER OR WASTE WATER; SINKS
    • E03C2201/00—Details, devices or methods not otherwise provided for
    • E03C2201/40—Arrangement of water treatment devices in domestic plumbing installations

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Water Supply & Treatment (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A printed circuit board and a semiconductor product are provided to obtain a stable thermal characteristic by emitting heat generated from a semiconductor element through a metal pattern. A printed circuit board includes a PCB(Printed Circuit Board)(6), a lead(7), a hole(4), and a metal pattern(5). The lead(7) is formed on the PCB(6) for electrically connecting the PCB(6) to the outside. The hole(4) passes through both sides of the PCB(6) and is formed on a location for a semiconductor element to be mounted. The metal pattern(5) is adhered inside the hole(4) for electrically connecting the semiconductor element and the PCB(6).

Description

인쇄회로기판 및 반도체 제품{Printed circuit board and semiconductor product}Printed circuit board and semiconductor product

도 1은 본 발명이 속하는 분야의 종래의 기술에 따라 제조된 인쇄회로기판 위에 반도체 소자가 실장된 모습을 도시한 단면도이다.1 is a cross-sectional view illustrating a semiconductor device mounted on a printed circuit board manufactured according to the related art in the field of the present invention.

도 2a는 본 발명의 실시예에 따른 관통형 인쇄회로기판의 모습을 도시한 평면도이다.2A is a plan view illustrating a through-type printed circuit board according to an exemplary embodiment of the present invention.

도 2b는 도 2a에 도시된 관통형 인쇄회로기판의 단면도이다.FIG. 2B is a cross-sectional view of the through-type printed circuit board shown in FIG. 2A.

도 2c는 도 2a에 도시된 관통형 인쇄회로기판의 홀에 부착되는 금속 배선을 도시한 평면도이다.FIG. 2C is a plan view illustrating a metal wiring attached to a hole of the through-type printed circuit board shown in FIG. 2A.

도 2d는 본 발명의 변형된 실시예에 따른 관통형 인쇄회로기판의 홀의 측벽 모서리의 형태를 도시한 단면도이다.Figure 2d is a cross-sectional view showing the shape of the side wall edge of the hole of the through-type printed circuit board according to a modified embodiment of the present invention.

도 3a는 본 발명의 실시예에 따른 관통형 인쇄회로기판에 반도체 소자가 실장된 반도체 제품을 도시한 평면도이다.3A is a plan view illustrating a semiconductor product in which a semiconductor device is mounted on a through-type printed circuit board according to an exemplary embodiment of the present invention.

도 3b는 도 3a에 도시된 관통형 인쇄회로기판 위에 반도체 소자가 실장된 반도체 제품의 단면도이다.FIG. 3B is a cross-sectional view of a semiconductor product in which a semiconductor device is mounted on the through-type printed circuit board shown in FIG. 3A.

도 4는 도 3a에 도시된 반도체 제품 위에 반도체 소자 보호용 리드가 부착된 모습을 도시한 평면도이다.FIG. 4 is a plan view illustrating a semiconductor device protection lead attached to the semiconductor product illustrated in FIG. 3A.

본 발명은 반도체 소자를 실장하기 위한 인쇄회로기판 및 인쇄회로기판에 반도체 소자를 실장한 반도체 제품에 관한 것으로서, 보다 구체적으로는 관통형 홀이 형성된 인쇄회로기판 및 인쇄회로기판의 홀에 부착된 금속 패턴에 반도체 소자가 실장된 반도체 제품에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board for mounting a semiconductor device and a semiconductor product in which the semiconductor device is mounted on a printed circuit board. A semiconductor product in which a semiconductor element is mounted on a pattern.

완성된 반도체 제품을 제조하기 위하여 금속 배선이 형성된 인쇄회로기판 위에 반도체 소자를 실장함에 있어서, 종래의 기술에 따르면 도 1에 도시된 바와 같이 금속 패턴(미도시)이 형성된 인쇄회로기판(2)의 양면 위에 반도체 소자(1)가 실장된다. 인쇄회로기판(2)과 반도체 소자(1)는 연결부(3)에 의해 전기적으로 연결된다.In mounting a semiconductor device on a printed circuit board on which metal wiring is formed to manufacture a completed semiconductor product, according to the related art, a printed circuit board 2 having a metal pattern (not shown) is formed as shown in FIG. 1. The semiconductor element 1 is mounted on both surfaces. The printed circuit board 2 and the semiconductor element 1 are electrically connected by the connecting portion 3.

이렇게 제조된 반도체 제품은 예컨대 컴퓨터 등과 같은 전자 기기의 메인 보드(main board)에 부품으로 삽입된다. 그러나 여러 종류의 반도체 제품이 삽입되어야 하는 메인 보드에 있어서, 반도체 제품의 두께로 인한 공간상의 제약때문에 의도한 성능을 낼 수 있을만큼 충분한 수량의 반도체 제품을 삽입하지 못하는 문제가 발생한다.The semiconductor product thus manufactured is inserted as a component on a main board of an electronic device such as a computer. However, in a main board to which various kinds of semiconductor products are to be inserted, there is a problem in that a sufficient quantity of semiconductor products cannot be inserted due to the space constraints due to the thickness of the semiconductor products to achieve the intended performance.

따라서 반도체 제품의 두께를 줄이고자 하는 시도가 존재해왔으며, 종래의 기술의 경우 인쇄회로기판(2)의 두께를 줄이는 데에 한계가 있기때문에, 반도체 소자(1)의 두께를 감소시키는 방법을 채택하여 왔다. 그러나 점점 다층, 고집적화된 구조를 가지는 반도체의 제조 경향을 고려하면 반도체 소자(1) 자체의 두께를 감소시키는 데에도 한계가 있다.Therefore, there have been attempts to reduce the thickness of semiconductor products, and in the prior art, since there is a limit in reducing the thickness of the printed circuit board 2, a method of reducing the thickness of the semiconductor element 1 is adopted. Has come. However, there is a limit to reducing the thickness of the semiconductor element 1 itself in view of the manufacturing trend of semiconductors having a multilayered and highly integrated structure.

본 발명이 이루고자 하는 기술적 과제는 반도체 제품의 두께 감소의 한계로 인한 문제점을 해결하는 것으로서, 반도체 제품의 두께를 종래의 기술보다 현저하게 줄이는 것이다.The technical problem to be achieved by the present invention is to solve the problems caused by the limitation of the thickness reduction of the semiconductor product, it is to significantly reduce the thickness of the semiconductor product than the prior art.

상기 기술적 과제를 달성하기 위한 본 발명의 관통형 인쇄회로기판을 포함하는 반도체 제품은, 반도체 소자가 실장될 위치에 인쇄회로기판을 관통하여 형성된 홀, 홀의 측벽에 접합하여 부착된 금속 패턴, 인쇄회로기판을 외부에 전기적으로 연결하기 위한 리이드 및 금속 패턴과 리이드를 전기적으로 연결하기 위한 금속 배선을 포함한다. The semiconductor product including the through-type printed circuit board of the present invention for achieving the above technical problem, a hole formed through the printed circuit board at the position where the semiconductor element is to be mounted, a metal pattern attached to the side wall of the hole, printed circuit Leads for electrically connecting the substrate to the outside and metal wiring for electrically connecting the lead with the metal pattern.

이하, 본 발명에 따른 바람직한 실시예를 상세히 설명한다. 그러나 본 발명이 하기 실시예에 국한되는 것으로 해석되어져서는 안된다.Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention should not be construed as limited to the following examples.

도 2a는 본 발명의 실시예에 따른 관통형 인쇄회로기판의 모습을 도시한 평면도이다. 도 2a를 참조하면, 인쇄회로기판(6) 위에 인쇄회로기판(6)을 외부에 전기적으로 연결하기 위한 리이드(lead; 7)가 형성되어 있다. 또한 인쇄회로기판(6)의 양면을 관통하는 홀(4)이 형성되어 있다. 홀(4)은 반도체 소자가 실장될 위치에 형성된다. 따라서 바람직하게는 실장될 반도체 소자의 모양 및 크기에 최적화된 형태로 홀(4)이 형성될 수 있다.2A is a plan view illustrating a through-type printed circuit board according to an exemplary embodiment of the present invention. Referring to FIG. 2A, a lead 7 for electrically connecting the printed circuit board 6 to the outside is formed on the printed circuit board 6. Further, holes 4 penetrating both sides of the printed circuit board 6 are formed. The hole 4 is formed at the position where the semiconductor element is to be mounted. Therefore, the holes 4 may be preferably formed in a shape optimized for the shape and size of the semiconductor device to be mounted.

홀(4)의 내부에는 금속 패턴(5)이 부착된다. 금속 패턴(5)은 반도체 소자와 인쇄회로기판(6)을 전기적으로 연결하기 위한 것이다. 도 2c는 금속 패턴(5)의 형태를 도시한 평면도로서, 도 2c를 참조하면 금속 패턴(5) 반도체 소자의 연결부와 연결될 수 있는 형태로 패터닝 되어 있다. 또한 종래 기술에서 인쇄회로기판 위에 반도체 소자가 실장될 금속 패턴이 직접 형성되는 것과 달리, 본 발명에서는 홀(4)이 형성된 후에 금속 패턴(5)이 부착되므로, 바람직하게는 따로 금속판을 패터닝하여 금속 패턴(5)을 형성한 후 홀(4)에 부착될 수 있다. 그리고 금속 패턴(5) 위에 반도체 소자가 실장되므로, 바람직하게는 금속 패턴(5)은 실장된 반도체 소자를 지지할 수 있을 정도의 소정의 두께를 가질 수 있다.The metal pattern 5 is attached to the inside of the hole 4. The metal pattern 5 is for electrically connecting the semiconductor element and the printed circuit board 6. FIG. 2C is a plan view illustrating the shape of the metal pattern 5. Referring to FIG. 2C, the metal pattern 5 is patterned to be connected to the connecting portion of the semiconductor device. In addition, in the prior art, the metal pattern on which the semiconductor device is mounted is directly formed on the printed circuit board. In the present invention, since the metal pattern 5 is attached after the hole 4 is formed, the metal plate is preferably patterned separately. After the pattern 5 is formed, it may be attached to the hole 4. Since the semiconductor device is mounted on the metal pattern 5, the metal pattern 5 may preferably have a predetermined thickness sufficient to support the mounted semiconductor device.

금속 패턴(5)은 홀(4)의 측벽에 접합한 형태로 부착되어 있으며 이는 도 2b에 더욱 명확하게 도시되어 있다.The metal pattern 5 is attached in the form bonded to the side wall of the hole 4, which is shown more clearly in FIG. 2b.

도 2b는 도 2a의 인쇄회로기판의 A-A′선에서 절취한 단면도이다.FIG. 2B is a cross-sectional view taken along the line AA ′ of the printed circuit board of FIG. 2A.

도 2b를 참조하면, 인쇄회로기판(6)에 홀(4)이 형성되어 있고, 홀(4)의 측벽에 금속 패턴(5)이 접합한 형태로 부착되어 있다. 도 2c에는 금속 패턴(5)의 형태를 세밀하게 도시하였으나 도 2b에는 편의상 직사각형 형태로 단순화하여 금색 패턴(5)을 도시하였다. 또한 도 2b에는 도시되어 있지 않으나 금속 패턴(5)과 리이드(7, 도 2a 참조)를 전기적으로 연결하기 위한 금속 배선이 형성되어 있으며, 금속 배선은 인쇄회로기판(6) 내부 또는 표면에 형성될 수 있다.Referring to FIG. 2B, holes 4 are formed in the printed circuit board 6, and the metal patterns 5 are attached to the sidewalls of the holes 4. Although the shape of the metal pattern 5 is shown in detail in FIG. 2C, the gold pattern 5 is illustrated in FIG. 2B in a simplified rectangular shape for convenience. Also, although not shown in FIG. 2B, metal wires are formed to electrically connect the metal pattern 5 and the leads 7 (see FIG. 2A), and the metal wires may be formed inside or on the printed circuit board 6. Can be.

바람직하게는 홀(4)의 측벽 모서리 부분(B)은 도 2d에 도시된 바와 같이 글라이드(glide) 형태로 형성될 수 있다. 측벽 모서리 부분(B)이 글라이드 형태로 형 성될 경우, 반도체 소자를 금속 패턴(5) 위에 슬라이딩(sliding) 또는 드롭(drop) 방식으로 실장할 때, 좀더 용이하게 실장할 수 있다.Preferably, the side wall edge portion B of the hole 4 may be formed in the form of a glide as shown in FIG. 2D. When the sidewall edge portion B is formed in the shape of a glide, when the semiconductor device is mounted on the metal pattern 5 by sliding or drop, it may be more easily mounted.

도 3a는 인쇄회로기판(6) 위에 반도체 소자(8)가 실장된 모습을 도시한 평면도이다. 도 3a를 참조하면, 홀(4, 도 2a 참조)의 측벽에 부착된 금속 패턴(5, 도 2a 참조) 위에 반도체 소자(8)가 실장되어 있으며, 이는 도 3b를 통해 더욱 명확하게 알 수 있다. FIG. 3A is a plan view illustrating a semiconductor device 8 mounted on a printed circuit board 6. Referring to FIG. 3A, the semiconductor device 8 is mounted on the metal pattern 5 (see FIG. 2A) attached to the sidewall of the hole 4 (see FIG. 2A), which can be clearly seen through FIG. 3B. .

도 3b는 도 3a의 인쇄회로기판의 C-C′선에서 절취한 단면도이다. 도 3b를 참조하면, 금속 패턴(5)의 양면에 금속 패턴(5)과의 전기적 연결을 위한 연결부(9)를 포함하는 반도체 소자(8)가 실장되어 있다. 도 3b에는 금속 패턴(5)의 양면에 반도체 소자(8)가 실장된 경우를 도시하고 있으나, 반도체 소자(8)는 금속 패턴(5)의 단면에만 실장될 수도 있다. 또한 반도체 소자(8)는 반도체 칩(chip) 또는 이러한 반도체 칩을 실장하고 있는 반도체 패키지(package)일 수 있다. 따라서 연결부(9)는 반도체 소자(8)가 반도체 패키지인 경우 솔더볼(solder ball)일 수 있고, 반도체 소자(8)가 반도체 칩인 경우 범프(bump)일 수 있다.3B is a cross-sectional view taken along the line CC ′ of the printed circuit board of FIG. 3A. Referring to FIG. 3B, semiconductor devices 8 including connecting portions 9 for electrical connection with the metal patterns 5 are mounted on both surfaces of the metal patterns 5. Although FIG. 3B illustrates a case in which the semiconductor device 8 is mounted on both surfaces of the metal pattern 5, the semiconductor device 8 may be mounted only on the end surface of the metal pattern 5. In addition, the semiconductor device 8 may be a semiconductor chip or a semiconductor package in which the semiconductor chip is mounted. Therefore, the connection part 9 may be a solder ball when the semiconductor device 8 is a semiconductor package, or a bump when the semiconductor device 8 is a semiconductor chip.

이와 같이 반도체 소자(8)가 실장됨으로써 인쇄회로기판(6)의 두께(D1)와 금속 패턴(5)의 두께(D2)의 차이만큼 전체적인 실장 두께가 감소하므로, 종래 기술에 비해 반도체 제품의 두께가 줄어들게 된다. 또한 열 전도성이 좋은 금속의 특성상, 반도체 소자(8)로부터 발생되는 열이 금속 패턴(5)을 통해 용이하게 방출된다. 따라서 주로 열에 약한 에폭시(epoxy) 수지를 포함하는 인쇄회로기판(6) 위에 직접 반도체 소자(8)가 실장되는 경우에 비해 반도체 제품의 열 특성이 안정적이다.Thus, because the semiconductor device 8 is mounted, whereby the overall mounting the thickness by the difference between the thickness (D 2) of the thickness (D 1) and the metal pattern 5 of the printed circuit board (6) decreases, compared to the prior art semiconductor products The thickness of will be reduced. In addition, due to the characteristics of the metal having good thermal conductivity, heat generated from the semiconductor element 8 is easily released through the metal pattern 5. Therefore, the thermal characteristics of the semiconductor product are more stable than the case where the semiconductor device 8 is directly mounted on the printed circuit board 6 including an epoxy resin, which is mainly weak in heat.

바람직하게는 도 4에 도시된 바와 같이 반도체 소자(8, 도 3a 참조) 및 인쇄회로기판(6) 위에 반도체 소자(8, 도 3a 참조)를 보호하기 위한 보호용 리드(lid; 10)를 더 부착할 수 있다. Preferably, as shown in FIG. 4, a protective lid 10 is further attached on the semiconductor element 8 (see FIG. 3A) and the printed circuit board 6 to protect the semiconductor element 8 (see FIG. 3A). can do.

이상 살펴본 바와 같이 본 발명에 따른 인쇄회로기판 및 인쇄회로기판에 반도체 소자가 실장된 반도체 제품은, 인쇄회로기판에 형성된 홀에 부착된 금속 패턴 위에 반도체 소자가 실장된 구조를 가짐으로써, 반도체 제품의 전체적인 두께를 줄이고 열 특성도 향상시킬 수 있다.As described above, a semiconductor product in which a semiconductor device is mounted on a printed circuit board and a printed circuit board according to the present invention has a structure in which the semiconductor device is mounted on a metal pattern attached to a hole formed in the printed circuit board. It can reduce the overall thickness and improve thermal properties.

Claims (8)

반도체 소자가 실장될 위치에 인쇄회로기판의 양면을 관통하여 형성된 홀;Holes formed through both sides of the printed circuit board at positions where the semiconductor device is to be mounted; 상기 홀의 측벽에 접합하여 부착된 금속 패턴;A metal pattern bonded to and attached to the sidewall of the hole; 상기 인쇄회로기판을 외부에 전기적으로 연결하기 위해 상기 인쇄회로기판에 형성된 리이드; 및A lead formed on the printed circuit board to electrically connect the printed circuit board to the outside; And 상기 금속 패턴과 상기 리이드를 전기적으로 연결하기 위한 금속 배선;을 포함하는 것을 특징으로 하는 인쇄회로기판.Printed circuit board comprising a; metal wiring for electrically connecting the metal pattern and the lead. 제1항에 있어서,The method of claim 1, 상기 금속 배선은 상기 인쇄회로기판 내부에 형성되어 있는 것을 특징으로 하는 인쇄회로기판.The metal wire is a printed circuit board, characterized in that formed in the printed circuit board. 제1항에 있어서, 상기 금속 배선은 상기 인쇄회로기판의 표면 위에 형성되어 있는 것을 특징으로 하는 인쇄회로기판.The printed circuit board of claim 1, wherein the metal wiring is formed on a surface of the printed circuit board. 제1항에 있어서,The method of claim 1, 상기 홀의 측벽의 모서리는 글라이드 형태인 것을 특징으로 하는 인쇄회로기판.The edge of the side wall of the hole is a printed circuit board, characterized in that the glide form. 반도체 소자가 실장될 위치에 양면을 관통하여 형성된 홀을 포함하는 인쇄회로기판;A printed circuit board including a hole formed through both surfaces at a position where the semiconductor device is to be mounted; 상기 홀의 측벽에 접합하여 부착된 금속 패턴;A metal pattern bonded to and attached to the sidewall of the hole; 상기 인쇄회로기판을 외부에 전기적으로 연결하기 위해 상기 인쇄회로기판에 형성된 리이드;A lead formed on the printed circuit board to electrically connect the printed circuit board to the outside; 상기 금속 패턴과 상기 리이드를 전기적으로 연결하기 위한 금속 배선; 및A metal wire for electrically connecting the metal pattern and the lead; And 상기 금속 패턴의 양면 또는 단면 위에 실장된 반도체 소자;를 포함하는 것을 특징으로 하는 반도체 제품.And a semiconductor device mounted on both surfaces or one end surface of the metal pattern. 제5항에 있어서,The method of claim 5, 상기 인쇄회로기판 및 상기 반도체 소자 위에 부착된 반도체 소자 보호용 리드;를 더 포함하는 것을 특징으로 하는 반도체 제품.And a semiconductor device protection lead attached to the printed circuit board and the semiconductor device. 제5항에 있어서,The method of claim 5, 상기 반도체 소자는 반도체 패키지인 것을 특징으로 하는 반도체 제품.The semiconductor device is a semiconductor product, characterized in that the semiconductor package. 제5항에 있어서,The method of claim 5, 상기 반도체 소자는 반도체 칩인 것을 특징으로 하는 반도체 제품.The semiconductor device is a semiconductor product, characterized in that the semiconductor chip.
KR1020060004441A 2006-01-16 2006-01-16 Printed circuit board and semiconductor product KR20070075792A (en)

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