KR20070073500A - Apparatus for treating chemical to semiconductor wafer - Google Patents

Abstract

An apparatus for treating chemicals onto a semiconductor wafer is provided to discharge residual chemicals from a back nozzle by connecting a discharging tube to the back nozzle. A chemical treatment process for a wafer is performed by supplying chemicals through a front nozzle(113) and a back nozzle(120) to a front surface and a rear surface of the wafer. A chemical discharging tube(116) is combined with the back nozzle in order to discharge the remaining chemicals of the back nozzle. The back nozzle includes a value for maintaining a normal close state to control a supplying state of the chemicals, and a value for maintaining a normal open state to control a discharging state of the chemicals.

Description

Chemical processing apparatus for semiconductor wafers {APPARATUS FOR TREATING CHEMICAL TO SEMICONDUCTOR WAFER}

1 is a cross-sectional view showing a chemical liquid processing apparatus of a semiconductor wafer according to an embodiment of the present invention.

2 is a block diagram showing a part of a chemical liquid processing apparatus of a semiconductor wafer according to a modified embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100; Chemical liquid processing apparatus 110 for semiconductor wafers; Support

111; Insertion hole 112; Support pin

113; Front nozzle 114; Bag nozzle piping

115; Chemical liquid supply valve 116; Chemical discharge pipe

117; Chemical liquid discharge valve 118; Nozzle cap

119; Rotation axis 120; Bag nozzle

TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a chemical processing apparatus for semiconductor wafers.

In the case of a semiconductor wafer cleaning apparatus model available from SHIBAURA Co., Ltd. among semiconductor manufacturing apparatuses, both surfaces of a wafer are simultaneously cleaned by using a front nozzle and a back nozzle. However, during the step of rotating and drying the wafer after the cleaning process, a vacuum is generated in the back nozzle area, and when the rotation stops, the chemical liquid is buried on the back of the wafer, causing defects, and causing unchucking during subsequent wafer vacuum chucking. Accordingly, there is a need for an apparatus for cleaning semiconductor wafers that can eliminate or minimize the occurrence of defects caused by the back nozzle.

Accordingly, the present invention has been made to meet the requirements and needs of the prior art described above, and an object of the present invention is to provide a chemical liquid processing apparatus for a semiconductor wafer capable of suppressing wafer defects caused by a back nozzle.

The chemical liquid processing apparatus of the semiconductor wafer according to the present invention for achieving the above object is characterized in that a pipe for discharging the chemical liquid remaining in the back nozzle is connected to the bag nozzle.

The chemical liquid processing apparatus of the semiconductor wafer according to the embodiment of the present invention capable of implementing the above characteristics, the chemical liquid processing apparatus of the semiconductor wafer for chemically processing the wafer by supplying the chemical liquid to each of the front and back of the wafer through the front nozzle and the back nozzle The chemical liquid discharge pipe for discharging the chemical liquid remaining in the bag nozzle is combined with the bag nozzle.

In the present embodiment, the bag nozzle includes a valve for maintaining a normal close state for controlling the supply of the chemical liquid, the chemical liquid discharge pipe for controlling whether or not the discharge of the chemical liquid remaining in the back nozzle A valve that maintains a normal open state.

In the present embodiment, the back nozzle includes a back nozzle pipe that provides a flow path of the chemical liquid moved toward the back surface of the wafer, and the chemical liquid discharge pipe is connected in a 'T' shape to the back nozzle pipe.

In the present embodiment, the back nozzle includes a nozzle cap fitted to an upper end of the back nozzle pipe.

In the present embodiment, the back nozzle is inserted into the rotation center of the support for supporting the wafer and rotating the wafer in a horizontal state.

The chemical liquid processing apparatus of a semiconductor wafer according to an embodiment of the present invention capable of realizing the above characteristics includes: a support having a hollow rotating center portion for supporting the wafer and rotating the wafer in a horizontal state; A back nozzle providing a chemical liquid on the back surface of the wafer, a front nozzle provided on the top of the wafer to provide the chemical liquid on the front surface of the wafer, and a chemical liquid remaining in the back nozzle combined with the back nozzle to discharge to the outside. It characterized in that it comprises a chemical liquid discharge pipe.

In the present exemplary embodiment, the back nozzle includes a back nozzle pipe provided in the hollow rotating center and a nozzle cap provided on an upper end of the back nozzle pipe.

In the present embodiment, the bag nozzle includes a valve in a normal close state that controls the flow of the chemical liquid to the back surface of the wafer, and the chemical liquid discharge pipe discharges the chemical liquid remaining in the bag nozzle. It includes a valve in the normal open state to control.

In the present exemplary embodiment, the bag nozzle and the chemical liquid discharge pipe are each plural, and each of the plurality of chemical liquid discharge pipes is connected to each of the plurality of bag nozzles.

In the present exemplary embodiment, each of the plurality of bag nozzles includes a valve in a normal close state for controlling a supply flow of the chemical liquid, and each of the plurality of chemical liquid discharge pipes is connected to each of the plurality of bag nozzles. Each of the valves in a normal open state to control the discharge flow of the remaining chemical liquid.

According to the present invention, when the chemical liquid is processed on the wafer back side, the chemical liquid floats on the back side of the wafer so that defects or unchucking phenomenon are eliminated or minimized. Therefore, the reliability and yield of the chemical liquid processing of the semiconductor wafer are improved.

Hereinafter, a chemical liquid processing apparatus of a semiconductor wafer according to the present invention will be described in detail with reference to the accompanying drawings.

Advantages over the present invention and prior art will become apparent through the description and claims with reference to the accompanying drawings. In particular, a device for manufacturing a semiconductor device according to the present invention is well pointed out and claimed in the claims. However, the apparatus for manufacturing a semiconductor device according to the present invention can be best understood by referring to the following detailed description with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.

(Example)

1 is a cross-sectional view showing a chemical liquid processing apparatus of a semiconductor wafer according to an embodiment of the present invention, Figure 2 is a block diagram showing a part of the chemical liquid processing apparatus of a semiconductor wafer according to an embodiment of the present invention.

Referring to FIG. 1, the chemical liquid processing apparatus 100 of a semiconductor wafer according to an embodiment of the present invention includes a support 110 supporting a wafer W, which is a chemical liquid processing target. The support 110 has a plurality of support pins 112 disposed at the periphery thereof to support and fix the circumference of the wafer W. The support 110 is rotatably installed to rotate the supported wafer W in a horizontal position.

The rotation center of the support 110 forms a rotation shaft 119, the rotation shaft 119 is a hollow shape formed with an insertion hole 111 therein. The back nozzle pipe 114 for ejecting the chemical liquid to the back surface of the wafer W is provided in the insertion hole 111. In order to correspond to the back nozzle piping 114, the front nozzle 113 which ejects the chemical | medical solution in the front surface of the wafer W is provided above the wafer W. As shown in FIG. The back nozzle pipe 114 ejects the chemical liquid from the upper end thereof so that the back surface of the wafer W is chemically treated. The nozzle cap 118 is fitted to the upper end of the bag nozzle pipe 114. It is disposed on the rotation center of the support 110 of the nozzle cap 118. The bag nozzle tubing 114 and the nozzle cap 118 form the bag nozzle 120.

Here, as a characteristic part of the present invention, the chemical liquid discharge pipe 116 for discharging the chemical liquid is connected to the bag nozzle pipe 114. The chemical liquid discharge pipe 116 is a pipe for discharging the chemical liquid remaining in the bag nozzle pipe 114 to the outside and is connected in a 'T' shape to the bag nozzle pipe 114. The bag nozzle pipe 114 is provided with a valve 115 for controlling the supply of the chemical liquid, and the chemical liquid discharge pipe 116 is also provided with a valve 117 for controlling the discharge of the chemical liquid.

The valve 115 is normally closed and is open at the time of chemical liquid supply. The valve 117 is normally open and is closed at the time of chemical liquid supply. Therefore, the valve 115 is opened and the valve 117 is closed during the chemical liquid treatment with respect to the back surface of the wafer W, but after the chemical liquid treatment, the valve 115 is closed and the valve 117 is opened so that the back nozzle pipe ( The chemical liquid remaining in 114 is discharged to the outside through the chemical liquid discharge pipe 116.

The chemical liquid processing apparatus of the semiconductor wafer configured as described above operates as follows.

The cleaning liquid composed of chemicals, for example, chemicals and / or ultrapure water, is formed on the front surface of the wafer W through the front nozzle 113 and the back nozzle 120 on the wafer W that rotates in a horizontal position by the rotation of the support 110. It blows off to the back surface, and the both surfaces of the wafer W are wash | cleaned. When the wafer W is rotated at approximately 1500 revolutions per second (rpm) to dry the wafer W after the cleaning process, the vacuum is around the back nozzle 120. However, even if a vacuum is formed around the back nozzle 120, the chemical liquid remaining in the back nozzle pipe 114 is discharged to the outside through the chemical liquid discharge pipe 116 without being moved toward the rear surface of the wafer W. At this time, the valve 115 is closed and the valve 117 is in an open state.

Meanwhile, referring to FIG. 2, a plurality of back nozzle pipes 114a and 114b may be installed. In this case, the chemical liquid discharge pipes 116a and 116b are respectively connected to the bag nozzle pipes 114a and 114b in a 'T' shape. Each of the bag nozzle pipes 114a and 114b is provided with valves 115a and 115b for controlling the supply of the chemical liquid, and each of the chemical liquid discharge pipes 116a and 116b controls the discharge of the chemical liquid ( 117a and 117b are provided, respectively. Here, too, the valves 115a and 115b are normally closed, and the valves 117a and 117b are normally open. Since other configurations and operations are the same as those described with reference to FIG. 1, detailed descriptions thereof will be omitted.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. And, it is possible to change or modify within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the written description, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described in detail above, according to the present invention, when the chemical liquid is processed on the wafer back surface, the phenomenon of defects or unchucking is eliminated or minimized by floating the chemical liquid on the back surface of the wafer. Therefore, the reliability of the chemical liquid processing of the semiconductor wafer can be improved, and furthermore, the yield can be improved.

Claims (10)

In the chemical liquid processing apparatus of the semiconductor wafer for supplying a chemical liquid to each of the front and rear surfaces of the wafer through the front nozzle and the back nozzle, the chemical liquid processing of the wafer, A chemical liquid processing apparatus for a semiconductor wafer, wherein a chemical liquid discharge pipe for discharging the chemical liquid remaining in the back nozzle is combined with the back nozzle. The method of claim 1, The bag nozzle includes a valve for maintaining a normal close state for controlling the supply of the chemical liquid, and the chemical liquid discharge pipe is normally open for controlling whether the chemical liquid remaining in the back nozzle is discharged. A chemical liquid processing apparatus for a semiconductor wafer, comprising a valve for maintaining a state. The method of claim 2, The back nozzle includes a back nozzle pipe that provides a flow path of the chemical liquid moved toward the back surface of the wafer, and the chemical liquid discharge pipe is chemically processed in the semiconductor wafer, characterized in that connected to the back nozzle pipe in a 'T' shape. Device. The method of claim 3, And the back nozzle comprises a nozzle cap fitted to an upper end of the back nozzle pipe. The method of claim 1, The back nozzle is inserted into the rotation center of the support for supporting the wafer and rotate the wafer in a horizontal state, the chemical liquid processing apparatus of the semiconductor wafer. A support having a hollow rotational center for supporting a wafer and rotating the wafer in a horizontal state; A back nozzle provided at the center of rotation to provide a chemical to the back surface of the wafer; A front nozzle provided at an upper end of the wafer to provide the chemical liquid to the front of the wafer; A chemical liquid discharge pipe combined with the bag nozzle to discharge the chemical liquid remaining in the bag nozzle to the outside; Chemical liquid processing apparatus of a semiconductor wafer comprising a. The method of claim 6, The back nozzle includes a back nozzle pipe provided in the hollow rotating center and a nozzle cap provided on the rotating center and fitted to an upper end of the back nozzle pipe. The method of claim 6, The bag nozzle has a normally closed valve for controlling the flow of the chemical liquid to the back surface of the wafer, and the chemical liquid discharge pipe is a normal opening for controlling the discharge flow of the chemical liquid remaining in the back nozzle. A chemical liquid processing apparatus for a semiconductor wafer, comprising a valve in an open state. The method of claim 8, And a plurality of the back nozzles and the chemical liquid discharge tubes, and each of the plurality of chemical liquid discharge tubes is connected to each of the plurality of back nozzles. The method of claim 9, Each of the plurality of bag nozzles includes a valve in a normal close state that controls the supply flow of the chemical liquid, and each of the plurality of chemical liquid discharge pipes discharges the chemical liquid remaining in each of the plurality of bag nozzles. A chemical liquid processing apparatus for a semiconductor wafer, comprising a valve in a normally open state for controlling each.

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