KR20070069754A - Memory module - Google Patents

Abstract

A memory module is provided to increase the memory capacity by inserting plural pad rearranging chips into guide grooves which are formed on a substrate and have inter connectors. A memory module includes a substrate(100) and plural pad rearranging pads(120). The substrate has a base plate(111) with an RLC circuit, and a pair of guide rails(112) each located on both sides of the base plate. The guide rail are electrically connected to the RLC circuit, and are provided with plural guide grooves. The pad rearranging pads are slid into the guide grooves, and plural inter connectors are provided on the guide groove to electrically connect the pad with the substrate.

Description

Memory module

1 is a plan view showing a conventional memory module,

2 is a perspective view showing a memory module according to an embodiment of the present invention;

3 is a perspective view illustrating a substrate in the memory module of FIG. 2;

4 is a cross-sectional view illustrating a pad rearrangement chip of the memory module of FIG. 2;

5 is a plan view illustrating a pad rearrangement chip coupled to a guide groove of the memory module of FIG. 2;

6 is a cross-sectional view illustrating a package coupled to a guide groove of the memory module of FIG. 2.

<Description of the symbols for the main parts of the drawings>

100 ... Memory Module 110 ... Board

111 ... Base plate 112 ... Guide rail

113 ... Guide groove 114 ... Inter connector

120 ... pad rearranged chip 121 ... pad

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory module, and more particularly, to a memory module in which a structure in which chips are coupled on a substrate is changed.

In general, the memory module is a product that expands the memory capacity by mounting a large number of memory chips in a flat layout structure on a single printed circuit board in order to expand the storage capacity of a personal computer or a large-capacity workstation. line memory modules (DIMMs), dual in-line memory modules (DIMMs), and the recently developed Rambus In-line Memory Modules (RIMMs).

However, in order to mount the memory module 10 having the conventional planar layout structure on the motherboard 40 of the personal computer as shown in FIG. 1, a large surface area as large as the size of the memory module 10 is mounted on the motherboard 40. This is required, eventually increasing the volume of the personal computer, and also after the configuration of the memory module 10, if a failure occurs in some of the memory chip 30, the memory chip 30 is coupled on the substrate 20 In this state, it is difficult to replace only the memory chip 30 in which the failure occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and reduces the surface area of a memory module to facilitate space securing, and provides an improved memory module that can be easily replaced in the event of a failure of some of the memory chips. For that purpose.

The memory module of the present invention for achieving the above object, the base plate is provided with an RLC circuit, a guide rail provided at each end of the base plate, electrically connected to the RLC circuit, the guide rail formed with a plurality of guide grooves A substrate; And a plurality of pad rearrangement chips inserted into each of the plurality of guide grooves.

Here, the guide groove is preferably provided with a plurality of inter connectors in contact with the pad.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view illustrating a memory module according to an exemplary embodiment of the present invention, FIG. 3 is a perspective view illustrating a substrate of the memory module of FIG. 2, and FIG. 4 is a cross-sectional view illustrating a memory chip of the memory module of FIG. 2. 5 is a plan view illustrating a pad rearrangement chip coupled to a guide groove in the memory module of FIG. 2.

Referring to the drawing, the memory module 100 includes a substrate 110 and a plurality of pad rearrangement chips 120.

The substrate 110 includes a base plate 111 on which an RLC circuit is formed, and a pair of guide rails 112 provided on both ends of the base plate 111.

The guide rail 112 is electrically connected to the RLC circuit formed on the base plate 111, and a plurality of guide grooves 113 are formed on surfaces of the pair of guide rails 112 facing each other.

The pad rearrangement chip 120 is slidably inserted into the guide groove 113. The pad rearrangement chip 120 is slidably inserted into the guide groove 113. The pad rearrangement chip 120 is inserted into the guide groove 113 to provide electrical connection between the pad 121 and the substrate 110. A plurality of inter connectors 114 are provided.

Of course, this inter connector 114 is electrically connected to the RLC circuit of the base plate 111.

The pad rearrangement chip 120 is provided with rearranged pads 121 on both side ends thereof, and is vertically inserted into the guide groove 113 to be electrically connected to the substrate 110.

Meanwhile, as illustrated in FIG. 6, a package in which a bonding pad is provided on a flat substrate may be inserted into a guide groove.

In the memory module 100 having such a structure, a plurality of pad rearrangement chips 120 are vertically inserted into the guide grooves 113 of the substrate 110, thereby increasing the memory capacity and increasing the volume of the entire memory module 100. Since it reduces the conventional planar layout method, when mounting the memory module 100 on the motherboard, the occupied space on the motherboard is reduced to meet the miniaturization of the product, and also the plurality of pad rearrangement chip 120 If some of the defects, such as breakage occurs, it can be removed from the guide groove 113 and replaced with a new pad rearrangement chip 120, thereby improving productivity and economy.

As described above, according to the memory module of the present invention, a plurality of pad rearrangement chips are vertically inserted into the guide grooves of the substrate on which the inter connector is provided, while increasing the memory capacity, while the volume of the entire memory module is larger than that of the conventional planar layout method. As it reduces the size of the product, it is possible to meet the miniaturization of the product.In addition, when some of the memory chips are damaged or damaged, they can be removed from the guide grooves and replaced with new memory chips, thereby improving productivity. do.

It is to be understood that the invention is not limited to that described above and illustrated in the drawings, and that more modifications and variations are possible within the scope of the following claims.

Claims (2)

A substrate having a base plate provided with an RLC circuit and guide rails provided at both ends of the base plate and electrically connected to the RLC circuit, and having a plurality of guide grooves; And And a plurality of pad rearrangement chips inserted into each of the plurality of guide grooves. The method of claim 1, And a plurality of inter connectors provided in the guide groove in contact with the pads.

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