KR20070067878A - Backlight device with light emitting diodes and fabricating method thereof - Google Patents

Abstract

A backlight panel including LED(Light Emitting Diode)s and a manufacturing method thereof are provided to receive the complicated wiring for supplying driving signals to the LEDs. Plural LEDs are arranged flatly and mounted on a substrate(10). At least two or more metal pattern layers are arranged on the substrate and form the wiring so that driving signals are applied to the LEDs. At least one or more interfacial layers are arranged among at least two or more metal pattern layers. Plural contacts(18A) penetrate the interfacial layers so that the metal pattern layers are electrically connected with each other. The two or more metal patterns are stacked on the surface of the substrate. The substrate is made of metal and an insulation layer is additionally added between the substrate and the neighbor metal pattern layer.

Description

Backlight panel including light emitting diodes and a method of manufacturing the same {Backlight Device with Light Emitting Diodes and Fabricating Method

In order to better understand the drawings used in the detailed description of the invention, a brief description of each drawing is provided.

1 is a cross-sectional view illustrating a structure of a backlight device according to an exemplary embodiment of the present invention.

2 is a cross-sectional view illustrating a structure of a backlight device according to another embodiment of the present invention.

3 is a view for explaining the layout of the light emitting diode type backlight panel shown in FIGS. 1 and 2.

4 is a view schematically illustrating a backlight device including a light emitting diode type backlight panel according to the present invention.

`` Explanation of symbols for main parts of drawings ''

10,100 substrate 12,102 first insulating film

14,106: first conductive film pattern 16,104: second insulating film

18,108: Second conductive film pattern 18A, 106A: Contact

20,110: Light emitting diode 22,112: Connector

102A: contact insulating film

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight device for irradiating light to a liquid crystal panel in a liquid crystal display device, and more particularly to a backlight panel including a light emitting diode.

Conventional liquid crystal display devices control the light transmittance of the liquid crystal so that an image is displayed. To this end, the liquid crystal display includes a backlight device for irradiating light onto the liquid crystal panel. The liquid crystal panel controls the amount of light to be transmitted from the backlight device toward the visible surface for each pixel region so that an image is displayed.

In order to equalize the luminance of the image displayed on the liquid crystal panel, the backlight device must irradiate light on the liquid crystal panel with a uniform density. For this purpose, the backlight device has tended to use a plurality of planarly arranged light emitting diodes as a light source.

Since a plurality of light emitting diodes must be driven, the backlight device may include wiring for supplying a driving signal to each of the light emitting diodes. The wiring included in the backlight device is complicated when a color image is displayed on the liquid crystal panel. This is due to the fact that the green diodes generating green light, the red diodes generating red light and the blue diodes generating blue light must be driven separately. In addition, when the liquid crystal display device has a function of causing the entire area of the liquid crystal panel to be partially and selectively driven (that is, a function of causing an image to be displayed only in a partial area on the liquid crystal panel), the driving signal is supplied to the light emitting diodes. Wiring of the backlight device becomes more complicated. This is because the planarly arranged light emitting diodes must be driven separately according to the area and the light emitting diodes in the area must be distinguished-driven according to the red, green and blue colors. For this reason, the backlight panel including the light emitting diodes is continuously required to accommodate the complex wiring.

Accordingly, an object of the present invention is to provide a backlight panel suitable for accommodating a complicated wiring for supplying a driving signal to planarly arranged light emitting diodes and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a light emitting diode type backlight panel, including: a substrate for mounting a plurality of light emitting diodes to be planarly disposed; At least two metal pattern films provided on the substrate to form wirings for applying driving signals to the plurality of light emitting diodes; At least one interlayer insulating film provided between at least two metal pattern interlayers; And a plurality of contacts formed through the at least one interlayer insulating film such that at least two or more metal pattern layers are electrically connected.

The at least two metal pattern films may be formed to be stacked on the surface of the substrate. In addition, the substrate may be formed of a metal material. In this case, it is preferable that an insulating film formed between the substrate and the metal pattern film adjacent thereto is further included in the light emitting diode type backlight panel.

The at least two conductive film patterns described above may be formed to be dispersed on the surface and the bottom surface of the substrate. In addition, the substrate may be formed of a metal material. In this case, it is preferable that the light emitting diode type backlight panel further includes insulating films formed on the front and bottom surfaces of the substrate.

In the LED panel backlight panel, a LED driver may be mounted instead of a connector.

According to another aspect of the present invention, a method of manufacturing a light emitting diode type backlight panel includes: preparing a substrate; Forming a first conductive film pattern for wiring purposes on the substrate; Forming an insulating film on top of the conductive film pattern with contact holes exposing the surface of the first conductive film pattern; Forming a second conductive film pattern on the insulating film to be electrically connected to the first conductive film pattern through the contact hole; And installing the connector and the light emitting diodes on the second conductive film pattern in electrical contact with the second conductive film pattern.

The light emitting diode type backlight panel manufacturing method may further include adding at least one conductive film pattern by performing the insulating film forming step and the second conductive film pattern forming step at least one or more times.

In the preparing of the substrate, it is preferable to provide a metal substrate coated with an insulating film on its surface. In this case, the substrate is made of a conductive material to quickly release the heat generated by the light emitting diode.

According to another aspect of the present invention, there is provided a light emitting diode type backlight panel manufacturing method comprising: preparing a substrate; Forming contact holes in the substrate; Forming first and second conductive film patterns for wiring and contacts for connecting the conductive film patterns to each of the contact holes on both sides of the substrate; And installing the connector and the light emitting diodes in electrical contact with either one of the first and second conductive film patterns.

According to another aspect of the present invention, a method of manufacturing a light emitting diode type backlight panel includes: preparing a substrate made of a conductive material; Forming contact holes in the substrate; Forming an insulating film on both sides of the substrate and on a wall of each of the contact holes; Forming first and second conductive film patterns for wiring and contacts for connecting the conductive film patterns in each of the contact holes on both surfaces of the insulating film; And installing the connector and the light emitting diodes in electrical contact with either one of the first and second conductive film patterns.

According to the above configuration, in the LED panel backlight panel according to the present invention, since the wirings connecting the LEDs to the connectors are dispersed in two or more conductive film patterns, the wirings are divided by the area-by-region division and parallax driving. Implementation of. In addition, a metal substrate is used to quickly release heat generated from the light emitting diode. Furthermore, in the backlight panel of the LED type according to the present invention, a driver for driving the LEDs may be mounted on the LED panel to be electrically connected to the conductive film pattern, so that the backlight device can be made thinner and lighter.

In addition to the above objects, other objects, other advantages and other features of the present invention will become apparent from the detailed description of the embodiments associated with the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a structure of a backlight panel including light emitting diodes according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a backlight panel according to an exemplary embodiment of the present invention may include a first insulating layer 12, a first conductive layer pattern 14, a second insulating layer 16, and a first layer 12 sequentially stacked on a substrate 10. 2 conductive film patterns 18 are provided. In addition, the backlight panel according to an exemplary embodiment of the present invention includes light emitting diodes 20 mounted on the second conductive film pattern 18 and a connector 22 for connection. The second conductive film pattern 18 is electrically connected to the first conductive film pattern 16 by the contacts 18A.

As the substrate 10, a metal plate such as copper, iron, chromium or aluminum suitable for dissipating heat from the light emitting diodes 20 generated when the light emitting diodes 20 are driven may be used. Preferably, a light weight aluminum plate is used as the substrate 10. The substrate 10 is connected to an external object, such as a case of a liquid crystal display (preferably, a metal frame), so that heat generated from the light emitting diodes 20 is quickly released.

The first insulating film 12 prevents the substrate 10 from being in electrical contact with the first conductive film pattern 14 such that the first conductive film pattern 14 is not short-circuited. The first insulating layer 12 is formed by applying an insulating material on the substrate 10 through a spin-coating process or by depositing on the substrate 10 through a deposition process.

The first conductive film pattern 14 is used as a wiring for driving a drive signal from the connector 22 to the light emitting diodes 20. In addition, if necessary, wiring for connection between the light emitting diodes 20 may be included. The first conductive film pattern 14 is formed by depositing a conductive material film on the first insulating film 12 by a deposition process and then selectively removing the conductive material film through a patterning process using an etching solution and a barrier film.

The second insulating film 16 prevents the first conductive film pattern 14 and the second conductive film pattern 18 from contacting each other, thereby preventing an unnecessary short circuit of the wiring. Like the first insulating film 12, the second insulating film 16 may include the first conductive film pattern 12 and the first insulating film exposed by the conductive film pattern 12 through a spin coating process or a deposition process. It is formed by applying or depositing an insulating material on the surface of 12).

The second conductive film pattern 18 together with the first conductive film pattern 14 forms wirings for supplying driving signals to the light emitting diodes 20 from the connector 22. In detail, the second conductive film pattern 18 includes contact pads in contact with the light emitting diodes 20 and the connector 22 and terminal wirings connected to the contact pads. The contacts 18A electrically connect the first conductive film pattern 14 to the second conductive film pattern 18. To this end, the contacts 18A are in contact with the first and second conductive film patterns 14 and 18 through the second insulating film.

In order to form the contacts 18A and the second conductive layer pattern 18, the second insulating layer 16 is selectively removed through an etching process using an etching solution or an etching gas and a barrier layer to form the first conductive layer pattern ( The contact holes exposing the 14 are formed on the second insulating film 16. Subsequently, a conductive material is deposited on the contact holes and the second insulating layer 16 by a deposition process to provide the contacts in contact with the first conductive film pattern 14 and the conductive film in contact with these contacts. As in the case where the first conductive film pattern 14 is formed, the conductive film is selectively removed by a patterning process using an etching solution and a barrier film to form the second conductive film pattern 18 in contact with the contacts 18A. . The light emitting diodes 20 and the connector 22 are mounted on the second conductive film pattern 18 to be electrically connected to the second conductive film pattern 18.

Since the wiring connecting the light emitting diodes 20 to the connector 22 is dispersed in two conductive films of the first and second conductive film patterns 14 and 18, the light emitting diode type according to the embodiment of the present invention The backlight panel enables the realization of complicated wiring by division of light emitting diodes and parallax driving. In addition, the LED panel backlight panel according to the embodiment of the present invention uses a metal substrate to quickly release the heat generated from the LED.

Alternatively, one or more metal film patterns may be formed between the first and second metal film patterns 14 and 18 by an insulating film. In this case, the wirings connecting the light emitting diodes 20 to the connector 22 are distributed by three or more layers of metal films, so that more complicated wiring can be accommodated in one backlight panel.

Alternatively, a driver for driving the light emitting diodes 20 instead of the connector 22 may be mounted to be electrically connected to the second conductive film pattern 18. In this case, the backlight device including the backlight panel is made thinner and lighter.

2 is a cross-sectional view illustrating a structure of a backlight panel including a light emitting diode according to another embodiment of the present invention.

In FIG. 2, a backlight panel according to another exemplary embodiment of the present invention is sequentially formed on the first insulating film 102, the first conductive film pattern 106, and the upper surface of the substrate 100 sequentially formed on the bottom surface of the substrate 100. And a second insulating film 104 and a second conductive film pattern 108 formed thereon. In addition, the backlight panel according to another exemplary embodiment of the present invention includes a light emitting diode 110 mounted on the second conductive film pattern 108 and a connector 112 for connection with a driver other than the panel. The second conductive film pattern 108 is electrically connected to the first conductive film pattern 106 by contacts 106A penetrating through the second insulating film 104, the substrate 100, and the first insulating film 102. .

As the substrate 100, a metal plate such as copper, iron, chromium or aluminum suitable for dissipating heat from the light emitting diodes 110 generated when the light emitting diodes 20 are driven may be used. Preferably, a light weight aluminum plate is used as the substrate 100. The substrate 100 is connected to an external object, for example, a case (preferably, a metal frame) of a liquid crystal display, so that heat generated from the light emitting diodes 110 may be quickly released.

The first insulating layer 102 prevents the substrate 100 from being in electrical contact with the first conductive layer pattern 106 so that the first conductive layer pattern 14 is not shorted and the light emitting diodes are connected to the connector 112. The short circuit of the wiring which connects 110 is prevented. Similarly, the second insulating film 104 may not only prevent the substrate 100 from being in electrical contact with the second conductive film pattern 108, but may also be used to electrically connect the light emitting diodes 110 to the connector 112. Prevent short circuits. These first and second insulating films 102 and 104 are connected to each other by annular (ie, cylindrical) contact insulating films 102A penetrating the substrate 100. The contact insulating films 102A may be formed together with the first insulating film 102 or together with the second insulating film 104, but the partial and second insulating films 104 are formed in the process of forming the first insulating film 102. The remainder is formed in the process.

In order to form the first and second insulating films 102 and 104 including the insulating contact 102A, first, a through hole penetrating the substrate 100 through a patterning process using a barrier film and an etching solution is formed in the substrate 100. Is formed. As the insulating material is deposited or coated on the bottom surface of the substrate 100 through a deposition process or a spin-coding process, the first insulating layer 102 is formed on the bottom surface of the substrate 100 on which the through holes are formed. Subsequently, the top surface of the substrate 100 is deposited or coated with an insulating material through a deposition or spin-coating process, such that the second insulating film 104 is formed on the top surface of the substrate 100 having through holes. In the cylindrical contact insulating film 102A, the lower portion of the cylindrical contact insulating film 102 is formed in the forming process of the first insulating film 104 and the remaining upper portion is formed through the forming process of the second insulating film 104. .

The first conductive film pattern 106 is used as a wiring to allow the driving signal from the connector 112 to be transmitted to the light emitting diodes 110. In addition, if necessary, a wiring for connection between the light emitting diodes 110 may be included. The second conductive film pattern 108 together with the first conductive film pattern 104 forms a wiring for supplying a driving signal from the connector 112 to the light emitting diodes 110. In detail, the second conductive film pattern 108 includes contact pads contacting the light emitting diodes 110 and the connector 112, and termination wires connected to the contact pads. The contacts 106A electrically connect the first conductive film pattern 14 with the second conductive film pattern 18. To this end, the contacts 18A penetrate the first insulating film 102, the contact insulating film 102A (ie, the substrate 100), and the second insulating film 104 to form the first and second conductive film patterns 14,. 18).

The first conductive film pattern 106 is formed by depositing a conductive material film on the first insulating film 102 by a deposition process and then selectively removing the conductive material film through a patterning process using an etching solution and a barrier film. Like the first conductive film pattern 106, the second conductive film pattern 18 is also deposited on the second insulating film 104 by a deposition process, and then the conductive material film is formed through a patterning process using an etching solution and a barrier film. Formed by optional removal. The contacts 106A are embedded in the contact insulating layer 106A during the deposition of the conductive material for the first conductive film pattern 106 and during the deposition of the conductive material for the second conductive film pattern 108. Will be formed. The light emitting diodes 110 and the connector 112 are mounted on the second conductive film pattern 108 to be electrically connected to the second conductive film pattern 108.

As such, the wires connecting the light emitting diodes 110 to the connector 112 may be connected to the first conductive film pattern 106 below the substrate 100 and the second conductive film pattern 108 above the substrate 100. Since the light emitting diode type backlight panel according to another embodiment of the present invention is dispersed in two conductive film patterns, it is possible to implement complicated wiring by segmentation and parallax driving of the light emitting diodes. In addition, a light emitting diode type backlight panel according to another embodiment of the present invention uses a metal substrate to quickly release heat generated from the light emitting diode.

Alternatively, instead of the connector 112, a driver for driving the light emitting diodes 110 may be mounted to be electrically connected to the second conductive film pattern 108. In this case, the backlight device including the backlight panel is made thinner and lighter.

3 is a diagram illustrating a layout of the light emitting diode type backlight panel illustrated in FIGS. 1 and 2.

In the backlight panel of the light emitting diode type of FIG. 3, the second conductive film pattern 18 or 108 indicated by a solid line on the second insulating film 16 or 104 is connected to the connector 22 or 112 and the light emitting diodes 20 or 110. Extends from). The first conductive film pattern 14 or 106 indicated by a dotted line forms a wiring connecting the two second conductive film patterns 18 or 108. In addition, the contacts 18A or 106A shown in a circle connect the first conductive film pattern 14 or 106 and the second conductive film pattern 18 or 108.

As such, the wiring connecting the light emitting diodes 20 or 110 to the connectors 22 or 112 is connected to the first conductive film pattern 14 or 106 on the lower side and the second conductive film pattern 18 or 108 on the upper side. Since the light emitting diode type backlight panel according to another embodiment of the present invention is dispersed in two conductive film patterns, it is possible to implement complicated wiring by segmentation and parallax driving of the light emitting diodes.

Alternatively, a driver for driving the light emitting diodes 20 or 110 instead of the connector 22 or 112 in FIG. 3 may be mounted to be electrically connected to the second conductive film pattern 18 or 108. In this case, the backlight device including the backlight panel is made thinner and lighter.

4 is a view schematically illustrating a backlight device including a light emitting diode type backlight panel according to the present invention.

4 includes a light emitting diode driver 210 for driving the plurality of thin film type LED arrays LA11 to LA42 mounted on the light emitting diode panel 200. The LED driver 210 is connected to the LED arrays LA11 to LA42 via the connector 202 on the LED panel 200. In addition, the LED driver 210 may individually drive the LED arrays LA11 to LA42. As shown in FIG. 1 or 2, the LED panel 200 allows the LEDs included in the LED arrays LA11 to LA42 to be connected to the connector 202 by at least two conductive film patterns. 210 can be driven area-by-area and parallax.

As described above, in the LED panel backlight panel according to the present invention, wirings connecting the LEDs 20 to the connector 22 are dispersed in two or more conductive film patterns. Accordingly, the LED panel backlight panel according to the embodiment of the present invention enables the implementation of complicated wiring by segmentation of the LEDs and parallax driving.

In addition, the LED panel backlight panel according to the embodiment of the present invention allows the heat generated from the LED to be quickly released using a metal substrate.

In the LED panel backlight panel according to the present invention, a driver for driving the LEDs may be mounted. In this case, the backlight device can be thinner and lighter.

As described above, the present invention has been described in connection with the embodiments shown in the drawings, which are merely exemplary, and a person of ordinary skill in the art without departing from the spirit and scope of the present invention. It will be apparent that various modifications, changes, and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (9)

A substrate for mounting a plurality of light emitting diodes to be planarly disposed; At least two metal pattern layers provided on the substrate to form a wiring for applying a driving signal to the plurality of light emitting diodes; At least one interlayer insulating film provided between the at least two metal pattern layers; And And a plurality of contacts formed through the at least one interlayer insulating layer such that the at least two metal pattern layers are electrically connected to each other. The method of claim 1, And at least two metal pattern films are stacked on the surface of the substrate. The method of claim 2, wherein the substrate is formed of a metallic material, The LED panel further comprises an insulating film formed between the substrate and the metal pattern film adjacent thereto. The method of claim 1, The at least two conductive film patterns are formed to be dispersed on the surface and the bottom surface of the light emitting diode type backlight panel. The method of claim 4, wherein The substrate is formed of a metallic material, The light emitting diode type backlight panel further comprises insulating films respectively formed on the surface and the bottom surface of the substrate. Preparing a substrate; Forming a first conductive film pattern for wiring on the substrate; Forming an insulating film on the conductive film pattern with a contact hole exposing the surface of the first conductive film pattern; Forming a second conductive film pattern on the insulating film to be electrically connected to the first conductive film pattern through the contact hole; And And installing a connector and light emitting diodes on the second conductive film pattern to be in electrical contact with the second conductive film pattern. The method of claim 6, The preparing of the substrate is a method of manufacturing a light emitting diode type backlight panel, characterized in that to provide a metal substrate coated with an insulating film on the surface. Preparing a substrate; Forming contact holes in the substrate; Forming first and second conductive film patterns for wiring and contacts for connecting the conductive film patterns to each of the contact holes on both sides of the substrate; And installing a connector and light emitting diodes in electrical contact with either one of the first and second conductive film patterns. Providing a substrate made of a conductive material; Forming contact holes in the substrate; Forming an insulating film on both sides of the substrate and on a wall surface of each of the contact holes; Forming first and second conductive film patterns for wiring and contacts for connecting the conductive film patterns to each of the contact holes on the insulating films on both sides; And installing a connector and light emitting diodes in electrical contact with either one of the first and second conductive film patterns.

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