KR20070065539A - Plasma display device - Google Patents

Abstract

A plasma display device is provided to ground stably a plurality of driving circuits by connecting electrically a grounding part to a large-sized chassis base through a sliding structure. A plasma display device includes a plasma display panel, a chassis base(130), and a plurality of driving circuit boards. The chassis base is used for supporting the plasma display panel. The driving circuit boards are installed on a backside of the chassis base. A substrate fixing unit(152) is formed at a rear surface of the chassis base in order to couple the driving circuit boards in a sliding manner. Each of the driving circuit boards includes an upper surface, a lower surface, and a plurality of lateral surfaces.

Description

Plasma display device

1 is a perspective view of a plasma display device according to an embodiment of the present invention;

FIG. 2A is an enlarged perspective view of a scan driving board among the driving circuit boards of FIG. 1.

FIG. 2B is a perspective view showing the operation of FIG. 2A

FIG. 2C is a cross-sectional view taken along the line A-A of FIG. 2A

3 is an enlarged perspective view of a scan driving board of a plasma display device according to another exemplary embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

100-plasma display 111-front panel

112-Panel 113-Rear Panel

117-Double Sided Tape 130, 230-Chassis Base

132-Stiffener 134-TCP

136-Protection Plate 140-SMPS

150, 250-Scan drive board 152, 252-Board fixing means

154-Ground

180, 280, 380-vibration absorbing member 316-heat conductive medium

The present invention relates to a plasma display device, and more particularly, by combining a chassis base and a drive board mounted on the rear of the chassis base by a slide fitting method, it is possible to reinforce the ground of the drive board without using a screw. The present invention relates to a plasma display device.

Plasma display devices are plasma display panels (PDPs), which are formed by forming electrodes on two opposing substrates, overlapping them at regular intervals, injecting discharge gas therein, and sealing them. The flat panel display device used.

Plasma displays can be formed thinner than Cathode ray tube (CRT) displays, which occupy a large volume, and thus are suitable for realizing a large screen with a relatively small volume. In addition, the plasma display device does not need to form an active element such as a transistor as compared to other flat panel display devices such as LCDs, and has a general characteristic of wide viewing angle and high luminance.

The plasma display device is formed by forming a panel and installing elements necessary for screen realization, such as a driving circuit connected to each electrode of the panel.

The driving circuits are formed on a driving circuit board mounted at the rear of the chassis base. The driving circuit boards are provided with holes through which screws can be coupled at predetermined positions at four corners. Similarly, the chassis base is provided with holes through which screws can be coupled. The driving circuit board is mounted to the rear of the chassis base by a screw. Meanwhile, the ground between the driving circuit boards is formed by a hole formed at four corners of the driving circuit board, and a hole formed in a screw and a chassis base.

This screw coupling method is inconvenient because a separate tool such as a driver must be provided. In addition, the screw coupling method is difficult to handle (handling) because it handles a very small size screw. In addition, according to the screw coupling method, the screw may be located between the chassis base and the driving circuit board or in the driving circuit board due to careless management of the screw. As a result, there is a problem that a short may occur between the electronic circuit elements mounted on the driving circuit board and the circuit board may be damaged.

The present invention is to solve the problems of the above-described conventional plasma display device, in particular by the slide-fit method of coupling the chassis base and the drive board mounted on the chassis base back, there is no need to use a screw, the ground of the drive board It is an object of the present invention to provide a plasma display device that can further enhance.

Plasma display device of the present invention for achieving the above object is a plasma display panel; A chassis base supporting the plasma display panel; And a plurality of driving circuit boards mounted to the rear of the chassis base, and a substrate fixing means is formed at a rear surface of the chassis base so that the driving circuit board can be coupled in a sliding manner.

In this case, the driving circuit board includes an upper surface, a lower surface, and a plurality of side surfaces, and the substrate fixing means may be formed to fix at least two side surfaces of the driving circuit board. In addition, the substrate fixing means may have a vertical cross-sectional shape having a U shape.

In addition, the substrate fixing means is preferably made of a metal material, more preferably, the substrate fixing means may be made of any one material of aluminum (Al), iron (Fe), iron alloy.

In addition, the substrate fixing means may be formed in the chassis base by a welding method. In addition, the substrate fixing means may be formed integrally with the chassis base.

In addition, the driving circuit board may have a ground portion for grounding the driving circuit in at least one of the portions in contact with the substrate fixing means.

In addition, some of the substrate fixing means may be formed to surround an upper surface and a lower surface of the driving circuit board and an edge formed of two side surfaces contacting each other. At this time, the some substrate fixing means may be formed in a planar shape of the N-shape.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a plasma display device according to an embodiment of the present invention. FIG. 2A is an enlarged perspective view of the scan driving board in the driving circuit board of FIG. 1, FIG. 2B is a perspective view illustrating the operation of FIG. 2A, and FIG. 2C is a sectional view taken along line A-A of FIG. 2A.

Referring to FIG. 1, a plasma display device 100 according to an embodiment of the present invention includes a plasma display panel 112 and a panel 112 including a front panel 111 and a rear panel 113. And a chassis base 130 supporting the panel 112 at the rear and driving circuit boards 140, 142, 144, 146, 148, and 150 mounted on a rear surface of the chassis base 130 and provided with a driving circuit. . In addition, a plurality of electronic circuit devices are mounted on the driving circuit boards 140, 142, 144, 146, 148, and 150. In this case, the driving circuit boards 140, 142, 144, 146, 148, and 150 are coupled to the substrate fixing means 152 formed on the rear surface of the chassis base 130 in a sliding manner.

The front panel 111 is formed to include display electrodes having a straight line parallel to each other horizontally, and the rear panel 113 is formed to include address electrodes having a straight line parallel to each other vertically. The partition wall is positioned in parallel with the address electrode, and a phosphor layer is disposed above the address electrode.

The chassis base 130 is installed at the rear of the rear panel 113. The chassis base 130 has a reinforcing material 132 is formed on the rear surface to prevent bending or deformation of the chassis base 130. In addition, the chassis base 130 has a substrate fixing means 152 is formed on the back. The chassis base 130 is fixed to the rear of the rear panel 113 with a double-sided tape 117 or the like. In addition, a thermoelectric wholesaler may be interposed between the chassis base 130 and the rear panel 113 together with the double-sided tape 117. However, the heat conductive medium may not be formed here. The chassis base 130 is generally formed of a metal material having excellent thermal conductivity.

A plurality of driving circuit boards 140, 142, 144, 146, 148, and 150 are installed behind the chassis base 130. The driving circuit boards 140, 142, 144, 146, 148, and 150 are provided with driving chips and other electric and electronic element devices required for driving the panel. The driving circuit boards 140, 142, 144, 146, 148, and 150 are mounted to the rear of the chassis base 130 through the substrate fixing means 152.

At the periphery of the panel 112 attached to the front of the chassis base 130, a lead electrode 133 connected to the address electrode and the sustain electrode is positioned. The lead electrodes 133 are connected to circuit terminals of a circuit board by a tape carrier package (TCP) 134.

The TCP 134 may be a kind of signal line, and is a kind of a flexible printed circuit (FPC) having flexible wires formed thereon. The TCP 134 is connected to the driving circuit board and the panel 112 coupled to the chassis at both ends of the TCP 134 with the middle portion extending outward with the margin portion outside the periphery of the panel 112 and the chassis body. Accordingly, the extended middle portion of the TCP 134 may be in contact with or caught by other objects during the process of joining the panel 112 and the chassis or in the process of moving the assembly. To prevent such damage, the end of the panel 112 may be provided with protective plates 136 for protecting the TCP 134 from the outside. The protective plates 136 are coupled to the end of the chassis base 130 or to the reinforcement 132 around the end via a screw-like fixing means.

The driving circuit boards 140, 142, 144, 146, 148, and 150 are mounted on the rear surface of the chassis base 130. The driving circuit boards 140, 142, 144, 146, 148, and 150 are coupled to the chassis base 130 through the substrate fixing means 152, and are a switch mode power supply (SMPS) 140 and a logic board. 142, an address buffer board 144, a sustain drive board 146, a scan buffer board 148, and a scan drive board 150. A plurality of electronic circuit devices may be mounted on the driving circuit boards 140, 142, 144, 146, 148, and 150, and a heat sink (not shown) may be attached to heat the electronic circuit devices. In addition, the driving circuit boards 140, 142, 144, 146, 148, and 150 may have a ground portion 154 formed on at least one of the portions in contact with the substrate fixing means 152 for the ground of the driving circuit. Is formed. Hereinafter, a case in which the ground portion 154 is formed on the scan driving board 150 will be described as an example. Therefore, the ground portion 154 may be formed on the driving circuit boards other than the scan driving board 150.

The SMPS 140 may be located above the logic board 142, but the SMPS 140 is not limited thereto. In addition, the SMPS 48 is connected to the logic board 142, the address buffer board 144, the scan driving board 150, the sustain driving board 146, the flexible circuit board FPC, or the flexible flat cable FFC. Electrically connected. The SMPS 140 is a part for supplying power to the driving circuit and the panel 112, and is mounted with an AC / DC converter for converting an AC voltage from the outside into a DC voltage.

The address buffer board 144 includes an IPM (Intelligence Power Module), a timing controller, and signal input terminals, and a circuit portion for processing data. In this case, one address buffer board 144 may be formed at a lower portion of the chassis base 130 as shown in FIG. 2, and may be formed at an upper portion thereof or may be formed at two upper and lower portions thereof. . However, the number and positions of the address buffer boards 144 are not limited thereto.

The scan buffer board 148 arranges data to be input to the scan electrodes.

The scan driving board 150 has electronic circuit elements mounted thereon, and a ground portion 154 is formed. The scan driving board 150 generates a scan signal in synchronization with a signal of a timing controller and supplies the scan signal to a scan electrode. In this case, the scan driving board 150 may be electrically connected to the SMPS 140, the address buffer board 144, the logic board 142, and the scan buffer board 148 through an FPC or an FFC. Accordingly, the electrical coupling relationship may be formed differently.

The ground portion 154 is formed on at least one of the portions in which the scan driving board 150 and the substrate fixing means 152 are coupled to and in contact with each other. The ground part 154 is formed to be electrically connected to the input / output terminals of the electronic circuit elements mounted on the scan driving board 150. The ground part 154 and the input / output terminal are electrically connected to each other through a wiring pattern formed on the scan driving board 150. In addition, referring to FIG. 2C, the ground portion 154 is electrically connected to the chassis base 130 through the substrate fixing means 152. The ground part 154 may be formed on an upper surface of the scan driving board 150, or may be formed on a lower surface of the scan driving board 150. In addition, the ground portion 154 may be formed on any one of the portions in contact with the substrate fixing means 152, may be formed of two or more of course. Preferably, the ground portion 154 is formed on the lower left or right side of the upper surface of the scan driving board 150. The ground portion 154 is formed on the upper surface of the scan driving board 150, so that the operator can recognize it more easily during the assembly process. However, the forming portion of the ground portion 154 is not limited thereto and may be variously formed according to a design pattern of a circuit. The ground part 154 serves to stably reduce noise by allowing the ground of the electronic circuit elements mounted on the scan driving substrate 150 to use the chassis base 130 having a large area. On the other hand, the ground portion 154 is formed on a driving circuit board other than the scan driving board 150 as described above.

Referring to FIG. 2A, the substrate fixing means 152 is formed in an area of the rear surface of the chassis base 130 on which the driving circuit board is to be mounted. Hereinafter, a case where the scan driving board 150 is mounted to the rear of the chassis base 130 through the substrate fixing means 152 will be described as an example. Therefore, the driving circuit boards other than the scan driving board 150 may be mounted on the rear surface of the chassis base 130 in the same manner. The substrate fixing means 152 is preferably formed of a metal material, more preferably formed of any one material of aluminum, iron, iron alloy. This is because the substrate fixing means 152 requires a certain level or more of strength and should be formed of a material having excellent electrical conductivity and thermal conductivity. The substrate fixing means 152 may have a vertical cross-sectional shape having a U shape so as to support the scan driving board 150, but the vertical fixing shape of the substrate fixing means 152 is not limited thereto. . The substrate fixing means 152 is formed to surround a portion of the upper surface and a portion of the lower surface and a portion of the side surface of the scan driving board 150. The substrate fixing means 152 may be attached to the rear surface of the chassis base 130 by a welding method. In addition, the substrate fixing means 152 may be formed integrally with the chassis base 130. When the substrate fixing means 152 is formed integrally with the chassis base 130, it may be formed by casting or the like. However, the method of attaching the substrate fixing means 152 is not limited thereto.

Referring to FIG. 2B, the scan driving board 150 is inserted into the substrate fixing means 152 in a sliding manner so as to be substantially parallel to the rear surface of the chassis base 130. In FIG. 2B, an arrow indicates a direction in which the scan driving board 150 slides. At this time, when the scan driving board 150 is fitted to the substrate fixing means 152 located at the lowermost, the sliding is completed. When the sliding is completed, the ground portion 154 formed on the scan driving board 150 is electrically connected to each other in combination with the inner surface of the substrate fixing means 152. Since the scan drive board 150 is fitted in a sliding manner, it is easy to replace or repair another scan drive board 150 when a problem occurs after assembly.

Next, a plasma display device according to another embodiment of the present invention will be described.

3 is an enlarged perspective view of a scan driving board of a plasma display device according to another exemplary embodiment of the present invention. 3 is similar to the embodiment of FIG. 2A except that a part of the substrate fixing means 152 is formed to surround the edge of the driving circuit board.

A plasma display device according to another embodiment of the present invention is formed by including a plasma display panel, a chassis base 230 and a driving circuit board. The driving circuit boards are mounted to the rear of the chassis base 230 by the substrate fixing means 252. Since the plasma display panel and the chassis base have been sufficiently described in the embodiment of FIG. 2A, detailed description thereof will be omitted. Also, hereinafter, the scan driving board 250 is coupled to the substrate fixing means 252 among the driving circuit boards.

Referring to FIG. 3, the substrate fixing means 252 is formed to include a first substrate fixing means 252a and a second substrate fixing means 252b. Since the first substrate fixing means 252a has the same shape and function as the substrate fixing means 152 according to the embodiment of FIG. 2A, detailed description thereof will be omitted.

The second substrate fixing means 252b is formed to surround an upper surface and a lower surface of the scan driving board 250 and an edge formed of two side surfaces contacting each other. The second substrate fixing means 252b is formed in a planar shape with a N-shape, but is not limited to the planar shape of the second substrate fixing means 252b. In addition, the vertical cross-sectional shape of the second substrate fixing means 252b is U-shaped like the first substrate fixing means 252a. A ground part (not shown) may be formed on the scan driving board 250 in contact with the second substrate fixing means 252b. The second substrate fixing means 252b not only supports the scan driving board 250 but also serves to stop the sliding of the scan driving board 250. Referring to FIG. 3, the second substrate fixing means 252b is formed to surround the left side, the right side, and the front side so that the scan driving board 250 may be more stably mounted. The second substrate fixing means 252b may also be attached to the chassis base 230 by a welding method or may be integrally formed with the chassis base 230.

Next, the operation of the plasma display device according to the embodiment of the present invention will be described.

Hereinafter, for convenience, the embodiment of FIG. 2B will be described as an example.

The plasma display device 100 according to an exemplary embodiment of the present invention includes driving circuit boards 140, 142, 144, 146, 148, and 150 including a panel 112, a chassis base 130, and a scan driving board 150. It is formed to include. In addition, the driving circuit boards 140, 142, 144, 146, 148, and 150 are mounted to the rear of the chassis base 130 by the substrate fixing means 152.

The scan driving board 150 is inserted to engage the substrate fixing means 152 formed on the chassis base 130. Thereafter, the scan driving board 150 is slid in the direction of the arrow of FIG. 2B, and the sliding is stopped when the scan driving board 150 is fitted to the substrate fixing means 152 located at the foremost. When the sliding of the scan driving board 150 is completed, the ground portion 154 formed on the scan driving board 150 is in electrical contact with the substrate fixing means 152. Therefore, the electronic circuit elements mounted on the scan driving board 150 are electrically connected to the ground part 154 through a plurality of wiring patterns, and the ground part 154 is connected to the substrate fixing means 152. It is electrically connected to the chassis base 130 of a large area. As a result, the electronic circuit devices mounted on the driving circuit board including the scan driving board 150 may perform stable ground through the substrate fixing means 152.

When a problem occurs in the scan drive board 150 and needs to be repaired or replaced by another product, the scan drive board 150 may be separated by going through a process opposite to the insertion process.

The plasma display apparatus 100 is easy to handle and does not use a coupling tool such as a screw when coupling the driving circuit boards 140, 142, 144, 146, 148, and 150 to the chassis base 130. There is no risk of loss of, and it is possible to prevent the risk of short circuit caused by the screw remains in the plasma display device (100).

As described above, the present invention is not limited to the specific preferred embodiments described above, and any person having ordinary skill in the art to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Various modifications are possible, of course, and such changes are within the scope of the claims.

According to the plasma display device according to the present invention, the driving circuit boards are mounted on the chassis base by using a substrate fixing structure, which enables easy handling, and there is no risk of screw loss, and is caused by leaving the screw inside the plasma display device during the assembly process. There is an effect that can prevent the short.

In addition, according to the plasma display device according to the present invention, since the ground portion is electrically connected to the chassis base of the large area through the substrate fixing structure, stable grounding of the driving circuits is possible.

In addition, according to the plasma display device according to the present invention, the driving circuit board is mounted in a sliding manner, so that when a problem occurs in the driving circuit board, the repair and replacement can be performed more easily.

Claims (10)

A plasma display panel; A chassis base supporting the plasma display panel; And It is formed including a plurality of driving circuit boards mounted on the rear of the chassis base, And a substrate fixing means formed on a rear surface of the chassis base so that the driving circuit board can be coupled in a sliding manner. The method of claim 1, The driving circuit board includes an upper surface, a lower surface, and a plurality of side surfaces. And the substrate fixing means is configured to fix at least two side surfaces of the driving circuit board. The method of claim 1, And said substrate fixing means has a vertical cross-section having a U shape. The method of claim 1, And said substrate fixing means is made of a metal material. The method of claim 4, wherein And the substrate fixing means is made of any one material of aluminum (Al), iron (Fe), and iron alloy. The method of claim 1, And the substrate fixing means is formed in the chassis base by a welding method. The method of claim 1, And the substrate fixing means is formed integrally with the chassis base. The method of claim 1, And a ground portion for grounding the driving circuit is formed in at least one of the driving circuit boards in contact with the substrate fixing means. The method of claim 1, And some of the substrate fixing means is formed so as to surround an upper surface and a lower surface of the driving circuit board and an edge formed of two side surfaces contacting each other. The method of claim 9, And the substrate fixing means has a planar shape having a C shape.

Images