KR20070063618A - Notebook computer for cooling device - Google Patents

Abstract

A cooling device for a notebook computer is provided to cool a plurality of heated parts mounted on a main board with one cooling device by connecting a heat pipe for cooling a CPU and various chipsets to a high performance graphic card generating the heat. A cooling fan is embedded in a base unit to discharge the heat generated from the heated parts such as the CPU(14), the chipsets(15a), and the high performance graphic card(15b). The heat pipe is facially contacted to the heated parts and the cooling fan to transfer the heat from the heated part to the cooling fan. The first heat pipe(160) is extended to the CPU mounted on a main board by contacting to cooling fins(180) fixed to a housing and a cover(140) of the cooling fan. The second heat pipe(170) is extended to the chipsets and the high performance graphic card mounted on the main board by contacting to an edge of an air inlet(114) installed to a cover of the cooling fan.

Description

Notebook computer for cooling device

1 is a perspective view showing a conventional notebook computer.

2 is an exploded perspective view showing the structure of a conventional notebook computer.

3 is a perspective view showing a cooling apparatus according to the present invention.

4 is an exploded perspective view of a cooling apparatus according to the present invention.

5 is a cross-sectional view taken along the line A-A of FIG.

6 is a perspective view showing a state in which the cooling apparatus according to the present invention is installed in the base unit.

Explanation of symbols on main parts of drawing

10: base unit 12: lower case

13: Motherboard 14: CPU

15a: various chipset 15b: graphics card

20: display unit 100: cooling device

110 housing 112 exhaust port

114: intake port 120: motor

130: blade 140: cover

140a: CPU contact 150a: chipset contact

150b: graphics card contact 160: first heat pipe

170: second heat pipe 180: heat dissipation fin

The present invention relates to a notebook computer, and more particularly, to maximize the contact area between the cooling device and the heat generating parts to cool the heat generating parts integrated in the main board inside the base unit more effectively. The present invention relates to a cooling device for a notebook computer that quickly discharges high heat generated from major heating parts such as a CPU, a chipset, and a graphics card to the outside.

In general, notebook computers are small, light, and powered by a rechargeable battery, and thus can be used anywhere. Also, with the rapid development of 3D games implemented on displays, high-performance graphic cards are being installed on notebook computers.

As shown in FIGS. 1 and 2, the notebook computer displays a result of processing the data inputted by the input unit and the base unit 10 provided with the input unit such as the keyboard 17 to the liquid crystal display device 21. The display unit 20, which is displayed and recognized by the user, is connected to the folding unit by the hinge unit 40.

In addition, heat generating components such as the CPU 14, the chipset 15a, and the graphics card 15b are mounted and mounted on the motherboard 13 in the base unit 10, and the heat generated mounted on the motherboard 13. A cooling device 50 for cooling the component is installed inside the base unit 10 to discharge the high heat generated from the heat generating component to the outside of the base unit 10. This will be described in detail with reference to FIG. 2.

2 is an exploded perspective view showing the structure of a conventional notebook computer. Referring to the drawings, the display unit 20 includes a liquid crystal display device 21 and a back cover 22 supporting the liquid crystal display device 21 and a front cover 23 coupled to the back cover 22. It consists of. In addition, the base unit 10 is touched with storage devices such as upper and lower cases 11 and 12, the main board 13, the CPU 14, various chipsets 15, and the hard disk 16, and the keyboard 17. Data input means consisting of a pad 18, a secondary battery for supplying power, LAN card (not shown) for supporting wired and wireless data communication and the like.

The CPU 14, the various chipsets 15a, and the graphics card 15b are mounted on the main board 13, and main memory devices such as the hard disk 16, the keyboard 17, the touch pad 18, and the LAN card. The back is installed in such a manner as to be supported by the upper and lower cases 11 and 12 in a state of being connected through the main board 13 and the data line. In addition, a cooling device 50 for dissipating heat generated when the CPU 14 and the various chipsets 15a are driven to the outside of the base unit 10 is installed in the base unit.

The cooling device 50 is provided with a motor (not shown) that rotates at high speed to cool the CPU 14 and the various chipsets 15a by using convection. The blade 54 generates convection according to the rotation of the motor. ) Is delivered to the motor to form a cooling fan. In addition, the rotating blade 54 is provided with a cover 56 that wraps the blade 54 so that interference with other components does not occur.

A heat pipe 59 is fixed to one side of the cover 56 to dissipate heat radiation fins 58, which are heat transfer paths extending to the heat generating component, that is, the CPU 14 and the various chipsets 15a. Is installed in contact with the heat radiating fin (58).

On the other hand, a latch 30 for maintaining the folded state of the display unit 20 and the base unit 10 is provided in the display unit 20, and the display unit and the base unit are bound by the latch 30. The portable unit is kept in a closed state, and in use, the latch 30 is released to spread the display unit 20 at an appropriate angle so that the user meets a desired gaze.

Therefore, when the display unit 20 is unfolded, the user performs a predetermined operation through the data input means of the base unit 10, and the result of the data processing is displayed on the liquid crystal display device 21 of the display unit 20. Will appear on the screen.

Thus, in order to implement the data processing result in the liquid crystal display device 21 of the display unit 20, a command operation is executed by giving a command to the CPU 14 through input means such as the keyboard 17 and the touch pad 18. In particular, in order to implement high-performance graphics such as 3D games on the liquid crystal display 21, a high-performance graphics card 15b is mounted. The high performance graphics card 15b emits higher heat than a conventional graphics card in processing a large amount of data.

Accordingly, in the case of the desktop computer, a separate cooling device is installed on the graphics card to emit high heat. However, in the case of a notebook computer, a separate cooling device is installed on the graphics card because the design specifications and structure are limited. There is a problem in that, even if a separate cooling device is installed for cooling the high performance graphics card, there is a problem in that cost increase and structural change should be carried out according to the additional installation of the cooling device.

The present invention is to solve the above problems, to connect the heat pipe to cool the high heat emitted from the high-performance graphics card to the cooling unit built into the base unit to cool the high temperature of the CPU or various chipset of the notebook computer. The purpose of the present invention is to provide a cooling device for a notebook computer that can cool a plurality of heating parts mounted on the motherboard with a single cooling device.

In addition, it is an object of the present invention to provide a cooling device for a notebook computer that can maximize the contact area between the cooling device and the heat generating parts to perform rapid heat movement to effectively discharge the high heat generated from the heat generating parts to the outside of the notebook computer.

According to the technical idea of the present invention for achieving the above object, the base unit consisting of the upper case and the lower case provided with the input means and the main board, and the processing result of the data input by the input means of the base unit Display unit consisting of a front cover and a back cover to be displayed, a heat generating component such as a CPU and various chipsets and high-performance graphics card mounted on the main board, and built in the base unit to discharge high heat generated from the heat generating component to the outside It is achieved by a cooling device for a notebook computer including a cooling fan and a heat pipe which is in contact with the heating element and the cooling device to be a heat transfer passage of the heating element and the cooling device.

Here, the cooling fan, the housing is fixed to the lower case of the base unit, a motor having a blade that is supported and rotated in the housing, a cover which is fixed to the housing so as not to interfere with the other parts surrounding the blade and It is preferable that the heat dissipation fin provided on one side of the housing and the cover.

In addition, an air inlet provided in the cover surrounding the blade to suck the internal air of the base unit and the housing and the cover in which the heat dissipation fins are fixed are provided in the air of the base unit introduced through the inlet to the outside of the base unit. Preferably, the cooling fan further includes an exhaust port to be discharged.

In addition, the first heat pipe which is in contact with the heat dissipation fins fixed to the housing and the cover of the cooling fan and extends to the CPU mounted on the main board, and the various inlet contacted to the circumference of the intake port provided in the cover of the cooling fan It is preferred to further include a second heat pipe extending to the chipset and the high performance graphics card.

In addition, it is preferable that the cover of the second heat pipe and the cooling fan is integrally formed.

In addition, the cover in contact with the second heat pipe is preferably made of copper.

In addition, the first and second heat pipes extending to the CPU, various chipsets, and high performance graphics cards are preferably provided with a contact portion to be in surface contact with the heating element.

Hereinafter, embodiments according to the present invention will be described in more detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected about the part same as a conventional structure among the content of this invention.

3 is a perspective view showing a cooling apparatus according to the present invention. Referring to the drawings, in the case of the notebook computer equipped with the high-performance graphics card, it is difficult to quickly discharge the high heat generated when the graphics card is driven to the outside of the base unit. Therefore, in order to quickly discharge the high heat generated by the high performance graphics card to the outside of the base unit, the cooling device and the high performance graphics card are provided with heat transfer passages directly connected to each other.

The cooling device 100 is composed of a cooling fan and a heat pipe that serves as a heat transfer path connecting the cooling fan and the heat generating parts mounted on the main board, wherein the heat pipe is the highest heat generating CPU ( 14 is divided into a first heat pipe 160 directly connected to the second heat pipe 160 and a second heat pipe 170 connected to the various chipsets 15a and the high performance graphics card 15b.

The first heat pipe 160 is made of copper having excellent thermal conductivity and is in contact with the heat dissipation fin 180 provided on the side surface of the cooling fan, so that the heat generation amount mounted on the main board 13 has the highest CPU 14. The CPU contact portion 140a having an area enough to cover the top surface of the CPU 14 on the first heat pipe 160 such that the first heat pipe 160 and the CPU 14 are in surface contact with each other. ) Is provided.

In addition, the second heat pipe 170 is provided to connect to the various chipsets 15a and the high performance graphics card 15b of the main board 13, and the second heat pipe 170 covers the cooling fan. And a chipset contact portion having an area enough to cover the upper surfaces of the various chipset 15a and the high performance graphics card 15b so as to be in contact with the chip 140 to be brought into surface contact with the various chipset 15a and the high performance graphics card 15b. 150a) and a graphics card contact 150b. In addition, the first heat pipe 160 is made of copper, which is very excellent in thermal conductivity.

As described above, the structures of the first heat pipe 160 and the second heat pipe 170, which are in contact with the cooling fan and the heat dissipation fin 180 and lead to the heat generating parts of the main board 13, become heat transfer paths, will be described in more detail. This will be described with reference to FIG. 4.

4 is an exploded perspective view of a cooling apparatus according to the present invention. Referring to the drawings, the cooling fan built in the base unit 10 is for dissipating heat generated inside the base unit 10 to the outside, the lower case 12 of the base unit 10 The motor 120 having the blade 130 set to rotate simultaneously with the driving of the notebook computer is installed in the housing 110 to be fixed.

In addition, the cover 140 is fixed to the housing 110 to protect the internal parts of the base unit 10 from interfering with the blade 130. At this time, the boss 116 is provided at all four corners of the housing 110 to form the exhaust port 112 ventilated by the blade 130 by placing the cover 140 at a predetermined height.

In addition, the cover 140 is provided with an inlet 114 for sucking the heated air generated inside the base unit 10, while the cover 140 is fixed to the housing 110. Fastening bolt 118 is fastened to the boss 116 to pass through) is provided to be inserted into the fastening hole 117 of the cover 140.

In addition, the heat dissipation fin 180 is provided in the exhaust port 112 provided for ventilation to one side of the cooling fan. The heat dissipation fin 180 discharges the heated air inside the base unit 10 sucked through the inlet 114 of the cooling fan to the outside of the base unit 10 through the exhaust port 112 and at the same time, the first heat pipe. By collecting the high heat conducted from the CPU 14 through the 160 to discharge the high heat in the accelerated convection ventilated to the exhaust port 112 by the blade 130 of the cooling fan.

In particular, one end of the first heat pipe 160 is in contact with the heat dissipation fin 180 provided in the exhaust port 112 of the cooling fan, while the other end of the first heat pipe 160 is the upper surface of the CPU 14 It extends to the CPU contact portion 140a which is covered by the surface contact. Here, preferably, the first heat pipe 160, the heat dissipation fin 180, and the CPU contact part 140a are integrally formed and made of copper having a very high thermal conductivity.

In addition, one end of the second heat pipe 170 is bent so as to surround the air inlet 114 of the cover 140 of the cooling fan, and the other end of the second heat pipe 170 is connected to various chipsets 15a and a high performance graphics card 15b. It extends to the upper surface of. In particular, the second heat pipe 170 extending from the cover 140 to the high performance graphics card 15b is covered with chipsets 15a and the top surface of the high performance graphics card 15b so as to be in surface contact with each other. And graphics card contacts 150b. Here, preferably, the second heat pipe 170, the cover 140 of the cooling fan, the chipset contact 150a, and the graphic card contact 150b are integrally formed and made of copper having a very high thermal conductivity.

5 is a cross-sectional view taken along the line A-A of FIG. Referring to the drawings, the CPU contact 140a, the chipset contact 150a, and the graphics card contact 150b as described above are in convection with the upper surfaces of the heat generating parts 14, 15a, and 15b that generate high heat. By moving the high heat to the first heat pipe 160 and the second heat pipe 170 and at the same time serves to support to prevent the heat generating components from being separated from the main board (13).

That is, when the heating component is mounted on the main board 13, the contact portions 140a, 150a and 150b of the first heat pipe 160 and the second heat pipe 170 extending from the cooling fan to the upper surface of the heating component. ) Is in close contact with the surface, and at the same time to play a role of the heat transfer passage for cooling and to prevent the heat-generating components are separated from the main board (13). On the contrary, in order to remove the heat generating component from the motherboard 13, the contact portions 140a, 150a, and 150b of the first heat pipe 160 and the second heat pipe 170 extending from the cooling fan must be removed.

Specifically, when the CPU 14 is mounted on the main board 13, a heat transfer passage for cooling the high heat generated by the CPU 14, that is, the first heat pipe 160 is cooled. The heat dissipation fin 180 provided at the exhaust port 112 of the fan and the CPU contact portion 140a which is in surface contact with the upper surface of the CPU 14 are connected. In this case, since the heat dissipation fin 180 and the CPU contact unit 140a are integrally formed with the first heat pipe 160, the heat dissipation fin 180 is adjacent to or closely contacted with the exhaust port 112 of the cooling fan, so that the base unit 10 is closed. It is fixed to the lower case 12 of the).

Therefore, while the CPU 14 is in close contact with the CPU contact portion 140a on the upper surface thereof, thermal conduction is performed, while the CPU contact portion 140a supports the CPU 14 so as not to be detached from the main board 13.

Meanwhile, when the various chipsets 15a and the high performance graphics card 15b are mounted on the main board 13, a heat transfer passage for cooling the high heat generated by the various chipsets 15a and the high performance graphics card 15b; That is, the second heat pipe 170 is connected to the chipset contact 150a and the graphics card contact 150b which are in surface contact with the cover 140 of the cooling fan, the top surface of the various chipsets 15a, and the high performance graphics card 15b. do. In this case, since the cover 140, the chipset contact 150a, and the graphics card contact 150b of the cooling fan are integrally formed with the second heat pipe 170, the boss 140 of the cooling fan may be connected to the cover 140. ) Is fixed using the fastening bolt 118.

Accordingly, the various chipsets 15a and the high performance graphics card 15b are brought into close contact with the chipset contact 150a and the graphics card contacts 150b on the upper surface thereof to achieve thermal conductivity, while the various chipsets 15a and the high performance graphics card 15b are in contact with each other. ) Is supported so as not to be separated from the main board (13).

The operation of the cooling device for a notebook computer according to the present invention having the above configuration will be described with reference to FIG.

6 is a trial showing a state in which the cooling apparatus according to the present invention is installed in the base unit. Referring to the drawings, the lower case 12 forming the lower side of the base unit 10, the CPU 14, various chipset 15a and the high performance graphics card 15b built into the lower case 12 ) Is mounted on the main board 13 and the cooling device 100 is connected to the heat generating component of the main board 13 is installed in the corner of the lower case (12).

The cooling device 100 includes a first heat pipe 160 and a second heat pipe 170 that serve as heat transfer paths connecting the cooling fan and the heat generating parts 14, 15a, and 15b mounted on the main board 13. The first heat pipe 160 and the second heat pipe 170 may be configured to contact the high temperature generated by the heat generating parts 14, 15a, and 15b with the contact parts 140a, 150a, and 150b closely contacting the upper surface of the heat generating parts. Will be moved to.

That is, the high heat generated by the CPU 14 is transmitted to the CPU contact portion 140a in close contact with the upper surface of the CPU 14, and the high heat generated in various chipset 15a is in close contact with the upper surface of the chipset 15a. The high heat generated by the high performance graphic card 15b is transferred to the graphic card contacting part 150b which is in close contact with the upper surface of the high performance graphic card 15b.

The high heat transmitted to the contact portions 140a, 150a, and 150b is transferred to the cooling device 100 through the heat pipes 160 and 170, and the high heat of the CUP contact portion 140a is the first heat pipe. The dust is collected by the heat dissipation fin 180 provided in the exhaust port 112 of the cooling fan through the 160. In addition, the high heat of the chipset contact 150a and the graphics card contact 150b is collected through the second heat pipe 170 to the cover 140 of the cooling fan.

As such, the high heat generated by the heat generating parts 14, 15a, and 15b collected by the heat dissipation fin 180 and the cover 140 of the cooling fan may be rotated inside the base unit 10 as the blade 130 of the cooling fan rotates. Air is sucked through the inlet port 114 and discharged to the outside through the grid 12a provided in the lower case 12 through the exhaust port 112 by centrifugal force.

That is, in the limited structure of the cooling fan, the cover 140 itself performs the same function as the heat radiation fins so as to more efficiently heat the high heat generated by the high performance graphic card 15b.

In particular, the high heat generated in the high-performance graphics card 15b is moved to the cover 140 located on the upper surface of the blade 130 of the cooling fan through the second heat pipe 170, so that the area of the cover 140 As a result, the cooling area can be maximized, and therefore, the cooling area can be rapidly cooled by the air inside the base unit 10 sucked through the inlet 114 of the cover 140.

The cooling device for the notebook computer of the present invention is cooled by a second heat pipe that is a high heat transfer path generated in various chipsets without having to provide a separate cooling fan for cooling the high heat generated by the high-performance graphic card. The heat is collected and cooled by the cover of the fan, so that a plurality of heat generating parts mounted on the motherboard can be simultaneously cooled by one cooling device.

In addition, since the cover of the cooling fan is in contact with or integrally formed with the second heat pipe to collect the high heat generated from the high-performance graphic card, the cover itself functions as a heat sink fin, and maximizes the cooling area by the area of the cover. As a result, it is possible to achieve rapid cooling.

On the other hand, the present invention is not limited only to the above-described embodiment, but can be modified and modified within the scope not departing from the gist of the present invention, the technical idea that such modifications and variations are also included in the claims Should be seen.

Claims (7)

A base unit comprising an upper case and a lower case provided with an input means and a main board; A display unit comprising a front cover and a back cover on which a processing result of data input by the input means of the base unit is displayed; Heating components such as a CPU mounted on the main board, various chipsets, and high performance graphics cards; A cooling fan installed in the base unit to discharge the high heat generated by the heat generating component to the outside; And And a heat pipe which is in surface contact with the heat generating part and the cooling fan so as to become a heat transfer path between the heat generating part and the cooling fan. The method of claim 1, wherein the cooling fan, A housing fixed to the lower case of the base unit; A motor having a blade supported and rotated by the housing; A cover which is fixed to the housing so as not to interfere with the other parts by wrapping the blades; And And a heat dissipation fin provided at one side of the housing and the cover. The method of claim 2, An air inlet provided in a cover surrounding the blate to suck internal air of the base unit; And And an exhaust port provided in the housing and the cover to which the heat dissipation fins are fixed, for discharging the internal air of the base unit introduced through the inlet port to the outside of the base unit. The method of claim 3, wherein A first heat pipe extending into a CPU mounted on the main board in contact with the heat dissipation fins fixed to the housing and the cover of the cooling fan; And And a second heat pipe contacting a circumference of an intake port of the cover of the cooling fan and extending to various chipsets mounted on a main board and a high performance graphics card. The method of claim 4, wherein And a cover of the second heat pipe and the cooling fan are integrally formed. The method according to claim 2 to 4, And the cover in contact with the second heat pipe is made of copper. The method of claim 4, wherein The first heat pipe and the second heat pipe extending to the CPU, various chipsets and high-performance graphics card further comprises a contact portion is provided to the surface contact with the heating element.

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