KR20070050801A - Organic light emitting diode display panel - Google Patents

Abstract

There is provided an LED display panel that can reduce the voltage drop of the driving voltage due to the difference in resistance between lines while reducing the dead space. An LED display panel according to the present invention includes a lower substrate including a light emitting area and a non-light emitting area; A positive electrode layer and a negative electrode layer formed in a direction perpendicular to each other on the light emitting region of the lower substrate; A data line and a scan line formed on the non-light emitting region of the lower substrate to be connected to the positive electrode layer and the negative electrode layer, respectively; An encapsulation cap bonded to the lower substrate to seal a light emitting region of the lower substrate; And an upper substrate formed on the encapsulation cap, the driver IC applying an electrical signal to the data line and the scan line, and an upper substrate including the data line wiring and the scan line wiring connected to the driver IC. The scan line wiring is connected by data line, scan line and FPC, respectively.

OLED, organic light emitting diode, dead space, voltage drop, FPC

Description

Organic light emitting diode display panel

1 is a view illustrating an OID display panel according to the prior art.

2 is an exploded perspective view of an LED display panel according to an embodiment of the present invention.

3 is an assembled perspective view of the LED display panel according to an embodiment of the present invention.

4 is a view illustrating the lower substrate of FIG. 2.

FIG. 5 is a view illustrating the upper substrate of FIG. 2.

<Explanation of symbols for the main parts of the drawings>

100: lower substrate 102: light emitting area

104: non-emitting region 110: positive electrode layer

120: negative electrode layer 130: data line

140: scan line 150: bag cap

200: upper substrate 210: driver IC

220: wiring for data line 230: wiring for scan line

The present invention relates to an LED display panel, and more particularly, to an LED display panel capable of reducing dead space and reducing a voltage drop of a driving voltage due to a difference in resistance between lines.

In general, organic light emitting diodes (OLEDs) can be driven at low voltages and can solve the drawbacks of LCDs such as thinning, wide viewing angles, and fast response speeds. In the following, it is attracting attention as a next-generation display having the advantages of having an image quality equal to or higher than that of a TFT-LCD and having a simple manufacturing process to be advantageous in future price competition.

The OLED is formed of an organic light emitting material in a space between a lower plate having a form in which an ITO transparent electrode pattern is formed as a positive electrode on a transparent glass substrate and an upper plate in which a metal electrode is formed as a negative electrode on a substrate, thereby forming a transparent electrode and a transparent electrode. A display device using a property that emits light while a current flows through an organic light emitting material when a predetermined voltage is applied between metal electrodes.

However, in the conventional LED display panel, as shown in FIG. 1, when the negative electrode layer 20 formed on the light emitting region 10 of the substrate is connected to the driver IC 30, the scan line is in a narrow region. The negative electrode layer 20 and the driver IC 30 are connected to each other using 40. Accordingly, as the width of the scan line 40 is narrowed and the length difference between the scan lines 40 occurs, a voltage drop of the driving voltage due to the resistance difference between the lines occurs, thereby deteriorating the characteristics of the panel. Unexplained reference numeral "50" indicates a data line.

Therefore, there is a need for an LED display panel that can reduce the dead space and reduce the voltage drop of the driving voltage due to the difference in resistance between lines.

An object of the present invention is to provide an LED display panel that can reduce the voltage drop of the driving voltage due to the difference in resistance between lines while reducing the dead space.

Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to one or more embodiments of the present invention, an LED display panel includes: a lower substrate including a light emitting area and a non-light emitting area; A positive electrode layer and a negative electrode layer formed in a direction perpendicular to each other on the light emitting region of the lower substrate; A data line and a scan line formed on the non-light emitting area of the lower substrate to be connected to the positive electrode layer and the negative electrode layer, respectively; An encapsulation cap bonded to the lower substrate to seal a light emitting region of the lower substrate; A driver IC formed on the encapsulation cap, the driver IC applying an electrical signal to the data line and the scan line, and an upper substrate including a data line wire and a scan line wire connected to the driver IC. The line wiring and the scan line wiring are respectively connected by the data line, the scan line and the FPC.

In one embodiment of the present invention, the FPC is preferably bonded to the data line, data line wiring, scan line and scan line wiring by the ACF.

According to another aspect of the present invention, there is provided an LED display panel including: a lower substrate including a light emitting area and a non-light emitting area; A positive electrode layer and a negative electrode layer formed in a direction perpendicular to each other on the light emitting region of the lower substrate; A data line and a scan line formed on the non-light emitting area of the lower substrate to be connected to the positive electrode layer and the negative electrode layer, respectively; A driver IC formed on the lower substrate on which the positive electrode layer, the negative electrode layer, the data line and the scan line are formed, and applying an electrical signal to the data line and the scan line, and a wiring and a scan for the data line connected to the driver IC. And an upper substrate including a line wiring, wherein the data line wiring and the scan line wiring are connected by the data line, the scan line, and the FPC, respectively.

In another embodiment of the present invention, the FPC is preferably bonded to the data line, data line wiring, scan line, and scan line wiring by ACF.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In addition, in the drawings, the size and thickness of layers and films or regions are exaggerated for clarity of description, and when any film or layer is described as being formed "on" of another film or layer, It may be directly on top of the other film or layer, and a third other film or layer may be interposed therebetween.

2 is an exploded perspective view of an LED display panel according to an embodiment of the present invention, Figure 3 is an assembled perspective view of the LED display panel according to an embodiment of the present invention. 4 is a diagram illustrating the lower substrate of FIG. 2, and FIG. 5 is a diagram illustrating the upper substrate of FIG. 2.

2 to 5, the LED display panel according to an embodiment of the present invention includes a lower substrate 100, a positive electrode layer 110, a negative electrode layer 120, a data line 130, and a scan line 140. ), The encapsulation cap 150 and the upper substrate 200.

The lower substrate 100 is a base layer for forming an LED display panel according to an exemplary embodiment of the present invention. The lower substrate 100 is formed of an LED element (not shown) so that the light emitting region 102 emitting light and the wiring are formed. And a light emitting area 104. The lower substrate 100 is mainly formed using a transparent insulating substrate such as a glass substrate. However, it can also be formed using a plastic substrate having excellent transparency.

The positive electrode layer 110 is formed in a stripe shape extending in one direction on the light emitting region 102 of the lower substrate 100. The positive electrode layer 110 is an electrode for hole injection and has a high work function and indium tin oxide (ITO) or indium zinc oxide (IZO) so that emitted light can come out of the device. It can be formed using a transparent metal oxide, such as).

By using the transparent metal oxide having a high work function as the hole injection electrode, it is possible to prevent the reduction of the luminous efficiency due to non-luminescence recombination at the anode.

The negative electrode layer 120 is formed in the direction perpendicular to the positive electrode layer 110 on the light emitting region 102 of the lower substrate 100 on which the positive electrode layer 110 is formed. The negative electrode layer 120 is formed of a metal material having a low work function such as calcium (Ca), magnesium (Mg), and aluminum (Al) as an electrode for electron injection.

The reason why the metal having a low work function is used as the electron injection electrode is that a high current density can be obtained in the electron injection by lowering a barrier formed between the electrode and the EL polymer. to be. This can increase the luminous efficiency of the device.

The data line 130 is formed to be electrically connected to the positive electrode layer 110 on the non-light emitting region 104 of the lower substrate 100. More specifically, the data line 130 is formed on the non-light emitting region 104 of the lower substrate 100, and extends to the positive electrode layer 110 formed on the light emitting region 102 of the lower substrate 100. do. In this case, the data line 130 preferably extends in the same direction as the positive electrode layer 110.

The data line 130 may be formed using the same material as the positive electrode layer 110, that is, transparent metal oxides such as ITO and IZO, and may be simultaneously formed with the positive electrode layer 110.

The scan line 140 is formed to be electrically connected to the negative electrode layer 120 on the non-light emitting region 104 of the lower substrate 100. More specifically, the scan line 140 is formed on the non-light emitting region 104 of the lower substrate 100, and extends to the negative electrode layer 120 formed on the light emitting region 102 of the lower substrate 100. do. In this case, the scan line 140 preferably extends in the same direction as the negative electrode layer 120.

The scan line 140 may be formed using the same material as the negative electrode layer 120, that is, a metal material such as calcium (Ca), magnesium (Mg), aluminum (Al), and the negative electrode layer 120. It can be formed at the same time.

The encapsulation cap 150 is bonded to the lower substrate 100 to seal the light emitting region 102 of the lower substrate 100. In more detail, the encapsulation cap 150 is a sealant (not shown) on the lower substrate 100 on which the positive electrode layer 110, the negative electrode layer 120, the data line 130, and the scan line 140 are formed. And the light emitting area 102 of the lower substrate 100 is sealed.

The encapsulation cap 150 prevents oxidation of the light emitting material and the electrode from moisture introduced into the OLED element from the outside, and is formed to protect the device from external shock, and may be formed using glass or stainless steel. .

The upper substrate 200 is formed on the encapsulation cap 150 formed on the lower substrate 100 and includes a driver IC 210, a data line wiring 220, and a scan line wiring 230.

The driver IC 210 applies an electrical signal to the data line 130 and the scan line 140 formed in the light emitting region 102 of the lower substrate 100. That is, the driver IC 210 applies a data signal to the data line 130 and a scan signal to the scan line 140.

The data line wiring 220 is electrically connected to the driver IC 210 to apply a data signal supplied from the driver IC 210 to the data line 130. In this case, the data line wiring 220 is electrically connected to the data line 130 by a flexible printed circuit (FPC) (not shown), and the FPC is connected to the data line wiring 220 and the data line. An adhesive film 130 is bonded by an anisotropic conductive film (ACF).

ACF is a typical material used in semiconductor mounting, and is mainly used when bonding IC to LCD panel glass, chip on film (COF) or tape carrier package (TCP) on glass.

ACF is a double-coated tape that mixes heat-hardened adhesive and fine conductive balls in it. When high temperature pressure is applied, the conductive balls are destroyed when the conductive balls in the pads of the circuit pattern are destroyed. The pads are energized, and the remaining adhesive is filled / hardened on the uneven surface other than the pad portion to bond to each other.

In the exemplary embodiment of the present invention, the FPC is attached to the data line wiring 220 and the data line 130 by using the ACF to electrically connect the data line wiring 220 and the data line 130.

The scan line wiring 230 is electrically connected to the driver IC 210 to apply a scan signal supplied from the driver IC 210 to the scan line 140. In this case, the scan line wire 230 is electrically connected to the scan line 140 by the FPC, and the FPC is bonded to the scan line wire 230 and the scan line 140 by the ACF.

As described above, the LED display panel according to the embodiment of the present invention has a positive electrode layer 110, a negative electrode layer 120, a data line 130, a scan line 140, and an encapsulation cap on the lower substrate 100. 150, an upper substrate 200 including a driver IC 210, a data line wiring 220, and a scan line wiring 230 is formed thereon to form the data line 130 and the data line wiring. By connecting the scan line 140 and the scan line wire 230 to the FPC, the voltage drop of the driving voltage due to the difference in resistance between the lines can be reduced while reducing the dead space of the panel. Accordingly, the overall panel size can be reduced, and the characteristics of the panel can be improved.

Meanwhile, as another embodiment of the present invention, the encapsulation cap 150 may not be formed on the lower substrate 100. In this case, the upper substrate 200 is bonded with the sealant on the lower substrate 100 to serve as an encapsulation cap 150 for sealing the light emitting region 102 of the lower substrate 100.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings and tables, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and common knowledge in the art to which the present invention pertains. Those skilled in the art can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the LED display panel according to an embodiment of the present invention, it is possible to reduce the voltage drop of the driving voltage due to the difference in resistance between the lines while reducing the dead space. Accordingly, the overall panel size can be reduced, and the characteristics of the panel can be improved.

Claims (4)

A lower substrate including a light emitting area and a non-light emitting area; A positive electrode layer and a negative electrode layer formed in a direction perpendicular to each other on the light emitting region of the lower substrate; A data line and a scan line formed on the non-light emitting area of the lower substrate to be connected to the positive electrode layer and the negative electrode layer, respectively; An encapsulation cap bonded to the lower substrate to seal a light emitting region of the lower substrate; A driver IC formed on the encapsulation cap, the driver IC applying an electrical signal to the data line and the scan line, and an upper substrate including a data line wiring and a scan line wiring connected to the driver IC, And the data line wiring line and the scan line wiring line are connected to the data line, the scan line and the FPC, respectively. The method of claim 1, And the FPC is adhered to the data line, the data line wiring, the scan line, and the scan line wiring by an ACF. A lower substrate including a light emitting area and a non-light emitting area; A positive electrode layer and a negative electrode layer formed in a direction perpendicular to each other on the light emitting region of the lower substrate; A data line and a scan line formed on the non-light emitting area of the lower substrate to be connected to the positive electrode layer and the negative electrode layer, respectively; A driver IC formed on the lower substrate on which the positive electrode layer, the negative electrode layer, the data line and the scan line are formed, and applying an electrical signal to the data line and the scan line, and a wiring and a scan for the data line connected to the driver IC. An upper substrate including wiring for lines, And the data line wiring line and the scan line wiring line are connected to the data line, the scan line and the FPC, respectively. The method of claim 3, And the FPC is adhered to the data line, the data line wiring, the scan line, and the scan line wiring by an ACF.

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