KR20070038727A - Tape mount and peeling apparatus for wafer - Google Patents

Abstract

The present invention relates to a tape attachment and removal device. The present invention provides a mount table for attaching a dicing tape in order to improve handling failure or wafer breakage caused by the attachment of the dicing tape and the removal of the protective tape from different devices. And a tape table for removing the protective tape and a tape attacher, a tape remover, first and second transfer means for transferring the wafer ring or the wafer ring to which the wafer is fixed and reversing the vertical position, and the wafer transfer. A tape attaching and removing device having a wafer transfer robot in charge is provided. According to this, since the attachment of the dicing tape and the removal of the protective tape are continuously performed, the movement path of the wafer is minimized and the movement time is shortened. Accordingly, poor handling or wafer damage during handling can be prevented and productivity and process yield can be improved. In addition, it is not necessary to build an independent facility can reduce the cost of the facility.

Tape Attachment, Tape Removal, Protection Tape, Dicing Tape, Inline

Description

Tape attaching and removing device for wafers {TAPE MOUNT AND PEELING APPARATUS FOR WAFER}

1 is a perspective view showing the structure of a tape attaching and removing device for a wafer according to an embodiment of the present invention;

2 is a schematic configuration diagram of a tape attaching device in a tape attaching and removing device according to the present invention;

3 is a schematic configuration diagram of a tape remover in the tape attaching and removing device according to the present invention;

4 is a schematic cross-sectional view of a cleaning bar of the tape attaching and removing device according to the present invention;

5 is a perspective view showing a coupling structure of a barcode labeler in a tape attaching and removing device for a wafer according to the present invention;

6a and 6b is an operation state diagram showing the coupling operation of the barcode labeler,

7A to 7I are plan views showing the operation of the tape attaching and removing device for a wafer according to the embodiment of the present invention, and

8A and 8B are cross-sectional views schematically showing the dicing tape attaching operation of the tape attaching and removing device according to the present invention.

Explanation of symbols on the main parts of the drawings

10; Wafer 20; Wafer ring

30; Protective tape 40; Dicing tape

41; Liner film 50; cassette

100; Tape attachment and removal device 110; Lower frame part

111; Wafer transfer robot 115; Ultraviolet irradiator

117; Wafer ring loader 119; First transfer means

121; Second conveying means 125; Guide rail

130; Mount table 150; Peeling table

160; Table cleaner 161; Cleaning bar

163; Air nozzle 165; Vacuum inlet

170; Barcode labeler 180; Cassette loader

185; Pusher 190; Joining guide

193; Coupling axis 194; Step groove

195; Axial fixed cylinder unit 196; Fixed block

210; Upper frame portion 230; Tape attacher

231; Tape feed roll 233; Liner film recovery roll

235; Auxiliary roller unit 237; Press roller unit

239; Tape collection roll 241; Cutter

243; Cutting blade

245; Secondary roll 250; Tape remover

251; Tape feed roll 253; Peeling bar

255; Pinch roll 257; Tape collection rolls

261; Heating blow unit 300; Wafer back grinding device

330; Spin table

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a tape attaching and removing device for a wafer for attaching a dicing tape and removing a protective tape.

In recent years, the increase in die yield of wafers has led to an increase in productivity, manufacturing cost reduction, package weight reduction, and miniaturization. In order to satisfy this, it is essential to realize wafer large diameter and thinning. Back grinding is one of the technologies for thinning, and it does not affect the integrated circuit, which is the opposite side of the active surface where the integrated circuit is formed on the wafer where the fabrication process is completed and the integrated circuit is formed. It is a technology to reduce the thickness of the wafer by grinding as much as the thickness.

A protective tape is attached to the active surface on which the integrated circuit of the wafer is formed to prevent damage to the integrated circuit during the back grinding process. When back grinding is complete, the protective tape is removed from the active side of the wafer. A dicing tape is attached to the back surface of the wafer to prevent chip detachment during wafer sawing. In this case, the wafer is attached with a dicing tape together with a wafer ring.

Wafer back grinding allows thinning of large diameter wafers of 8 inches (200 mm), 12 inches (300 mm) or more. However, larger wafer apertures and thinner wafer thicknesses result in severe back grinding and subsequent wafer warpage and sag due to the wafer's own weight.

Accordingly, after the back grinding process, the wafer is loaded into a wafer cassette, the wafer is picked up from the wafer cassette to remove the protective tape, the dicing tape is attached to the wafer back surface, and dicing. During the series of operations, such as labeling to attach a bar code label to the tape to verify the history of the wafer assembly process, handling failure, wafer contamination and breakage may occur. Results in lowering and lowering yield.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for attaching and removing a tape for a wafer which minimizes a movement path of the wafer between devices to prevent the occurrence of poor handling or wafer contamination and breakage during wafer handling.

Another object of the present invention is to provide a tape attachment and removal device for a wafer that can reduce the installation cost by allowing the attachment of the dicing tape and removal of the protective tape to be performed in one device.

In order to achieve the above object, the present invention is a wafer ring stacker (wafer ring stacker) is loaded; A mount table to which the wafer and the wafer ring are seated and fixed; A dicing tape attacher attaching a dicing tape to the back side of the wafer and the wafer ring; An ultraviolet irradiator for irradiating ultraviolet rays to the protective tape attached to the active surface of the wafer; A wafer transfer robot that picks up a wafer at a wafer loading position and supplies the wafer to an ultraviolet irradiator and transfers the tape on which the ultraviolet irradiation is completed to a mount table; First transfer means for transferring the wafer ring from the wafer ring loader to the mounting table; A peeling table to which the wafer with the protection tape is attached and the wafer ring are seated and fixed; Second transfer means for transferring the wafer and the wafer ring up and down from the mounting table to the filling table; A protective tape remover separating the protective tape attached to the active surface of the wafer mounted on the filling table; A cassette stacker on which a wafer and a wafer ring storage cassette are stacked; And third transfer means for accommodating the wafer and the wafer ring to which the dicing tape is attached to the cassette of the cassette stacker.

Tape attaching and removing device for wafers according to the present invention comprises a lower frame portion consisting of a wafer ring loader, a wafer transfer robot, a mounting table, a filling table, a cassette loader, and an upper frame portion composed of a tape attacher and a tape remover, It is preferable that the upper frame has a two-layer structure.

The tape attachment and removal device for a wafer according to the present invention may further include a bar code labeler for reading the ID of the wafer surface and attaching the barcode label on the dicing tape between the wafer and the wafer ring.

In the tape attaching and removing device for a wafer according to the present invention, the wafer transfer robot is preferably configured to pick up the back ground wafer from a neighboring wafer back grinding device and transfer the wafer to the ultraviolet irradiator.

In the tape attaching and removing device for wafers according to the present invention, it is preferable to include a table cleaner which blows air and sucks particles in a vacuum to remove particles on the mounting table and the filling table.

In the tape attaching and removing device for wafers according to the present invention, it is preferable to have a guide for guiding the attachment and detachment of the ultraviolet irradiator, the wafer ring loader and the barcode labeler. More preferably, the shaft fixing cylinder fixing unit for installing the coupling shaft in one portion and fixing the coupling shaft in the other portion is provided.

In the tape attaching and removing device for a wafer according to the present invention, the tape attaching unit is a supply roll for supplying a dicing tape, a collection roll for recovering the dicing tape, and a press roller unit for applying pressure to adhere the tape. unit), and an auxiliary roll for dicing tape transfer. Preferably further comprises a liner film recovery roll for recovering the liner film (liner film). It also includes a peeling bar for pre-cut tape that is rounded at the end.

In the tape attaching and removing device for a wafer according to the present invention, the tape remover may include a supply roll for supplying the tape for removing the tape and a collection roll for collecting the protective tape adhered to and removed from the tape for removing the tape. Here, the tape remover may include at least one of a peeling bar or a removal roll that adheres the tape removing tape to the surface of the protective tape to be removed. The peeling bar is preferably rounded at its ends.

In the tape attaching and removing device for wafers according to the present invention, it is preferable to further include a heating blow unit for injecting heating air to the protective tape before being detached and detached from the tape remover.

In the tape attaching and removing device for a wafer according to the present invention, the third conveying means comprises a guide rail on which a wafer ring with a dicing tape attached and a protective tape is removed and a wafer ring are placed, and a wafer and a wafer ring on the guide rail. It may include a pusher for storing in the cassette.

Hereinafter, embodiments of a tape attaching and removing device for a wafer according to the present invention will be described in detail with reference to the accompanying drawings. However, it demonstrates as an example which consists of a back grinding apparatus and an in-line. However, it should be noted that the apparatus of the present invention does not necessarily need to consist of a back grinding apparatus and an in-line.

Example

1 is a perspective view showing the structure of a tape attaching and removing device for a wafer according to an embodiment of the present invention.

Referring to FIG. 1, the tape attaching and removing device 100 according to the present invention works with the upper frame portion 210 in which main operations such as attaching the dicing tape 40 and removing the protective tape 30 are performed. It includes a lower frame unit 110, the lower frame unit 110 and the auxiliary frame, such as unloading after the movement and waiting for the work is completed, the lower frame unit 110 and the upper frame unit 210 is arranged in two layers.

The lower frame part 110 includes a wafer transfer robot 111, an ultraviolet irradiator 115, a wafer ring loader 117, a mounting table 130, a peeling table 150, a table cleaner 160, and a cassette loader 180. And the like. The upper frame portion 210 includes a tape attacher 230, a tape remover 250, and a barcode labeler 170. The first and second transfer means 119 and 121, the guide rail 125, and the pusher 185, which are responsible for the transfer of the wafer ring 20 or the wafer ring 20 to which the wafer 10 is fixed, are included.

The mount table 130 is provided for attachment of the dicing tape 40 as a unit on which the wafer 10 and the wafer ring 20 are mounted and fixed. The mount table 130 fixes the wafer 10 and the wafer ring 20 by vacuum, and is configured to enable vertical movement by a pneumatic cylinder, a hydraulic cylinder, a motor, and the like.

The peeling table 150 is a unit on which the wafer 10 and the wafer ring 20 on which the dicing tape 40 is attached are mounted and fixed, and are provided for removing the protective tape 30. The peeling table 150 is configured to enable vertical movement by a pneumatic cylinder, a hydraulic cylinder, a motor, and the like as the mount table 130. The filling table 150 may be, for example, a porous table in the form of a disc to fix the wafer 10 and the wafer ring 20 by vacuum. The filling table 150 forms a column with the mounting table 130.

The table cleaner 160 is a unit for removing particles on the mounting table 130 and the peeling table 150, and includes a cleaning bar 161 crossing the tables 130 and 150. At a predetermined height of the mounting table 130 and the filling table 150, the horizontal driving is performed periodically. The table cleaner 160 removes particles by air and vacuum while the cleaning bar 161 moves between the mount table 130 and the peeling table 150.

The wafer ring loader 117 is a unit on which the wafer ring 20 is loaded, and the wafer ring 20 is configured to be liftable. The ultraviolet irradiator 115 irradiates ultraviolet rays to the protective tape 30 attached to the wafer 10 to weaken the adhesive force of the protective tape 30.

The wafer transfer robot 111 is a unit for transferring the wafer 10. The ultraviolet irradiator 115 and the wafer ring loader 117 are disposed on both sides of the wafer transfer robot 111. The wafer transfer robot 111 is adjacent to the spin table 330 of the wafer back grinding device 300. The ultraviolet irradiator 115, the wafer transfer robot 111, and the wafer ring loader 117 are arranged in a line in parallel with the rows formed by the mount table 130 and the peeling table 150.

The barcode labeler 170 is a unit that reads an ID of the surface of the wafer 10 and attaches a barcode label corresponding to the information. The barcode labeler 170 is configured to label the dicing tape 40 installed at the position adjacent to the peeling table 150 and attached to the wafer 10 on which the protection tape 30 has been removed. The barcode labeler 170 is configured as a module so that it can be mounted and used only when necessary.

The tape attacher 230 is a unit attaching the dicing tape 40 to the wafer 10 and the wafer ring 20 placed on the mount table 130, and is installed on the mount table 130. The tape remover 250 is a unit for removing the protective tape 30 of the wafer 10 placed on the peeling table 150 and is positioned above the peeling table 150.

The first transfer means 119 and the second transfer means 121 include an adsorption unit 120 for picking up the wafer ring 20 in a vacuum, and configured to enable vertical movement and rotational movement. The first transfer means 119 picks up the wafer ring 20 loaded on the wafer ring loader 117 and transfers the wafer ring 20 to the mount table 130. In addition, the wafer 10 and the wafer ring 20 to which the dicing tape 40 is attached are temporarily picked up before being transferred from the mounting table 130 to the filling table 150. The second transfer means 121 receives the wafer 10 on which the dicing tape 40 is temporarily picked up from the first transfer means 119 and receives the wafer 10 and inverts the up and down positions to transfer the filling table 150 to the filling table 150. do.

The guide rail 125 is installed around the peeling table 150 and configured to place the wafer 10 and the wafer ring 20 on which the protective tape is removed. The pusher 185 pushes the wafer 10 and the wafer ring 20 placed on the guide rail 125 to accommodate the cassette 50 in the cassette stacker 180 which will be described later.

The cassette stacker 180 is configured such that the cassette 50 for accommodating the wafer 10 and the wafer ring 20 is loaded and liftable.

The main structural unit will be described in more detail below.

2 is a schematic configuration diagram of a tape attaching machine in a tape attaching and removing device according to the present invention.

Referring to FIG. 2, the tape attacher 230 includes a tape feed roll 231, a press roller unit 237, an auxiliary roller unit 235, a peeling bar 249, a cutter 241, and a tape collection roll ( 239), a liner collection roll 233, a pinch roll 255, and the like.

The tape feed roll 231 supplies the dicing tape 40. The tape collection roll 239 is wound with unnecessary residual tape portions after cutting. The tape feed roll 231 and the tape collection roll 239 may be configured to automatically adjust to a preset width using a motor.

The press roller unit 237 compresses the dicing tape 40 to the wafer 10 and the wafer ring 20. A portion of the dicing tape 40 not attached to the wafer 10 is separated by the auxiliary roller unit 235. The press roller unit 237 and the auxiliary roller unit 235 move the upper part of the mount table 130 to perform a job.

The liner film recovery roll 233 serves to wind the liner film 41 separated from the dicing tape 40. Here, the liner film recovery roll 233 is configured to be selectively operated to perform the operation only when necessary. Accordingly, various types of dicing tapes 40 can be used, such as a dicing tape without a liner film, a dicing tape with a liner film, and a precut dicing tape precut to fit the wafer ring.

The pinch roll 255 passes through the remaining tape between the auxiliary roller unit 235 and the collection roll 239. Filling bars 249 for precut tape are provided for tape separation when using precut dicing tape. The peeling bar 249 for precut tape is rounded at the end.

The cutter 241 has a cutting blade 243 and an auxiliary roll 245 in a 180 ° symmetrical position, and is configured such that the cutting blade 243 and the auxiliary roll 245 are rotatable. The dicing tape 40 adhered by the rotation of the cutting blade 243 is cut. The auxiliary roll 245 at the 180 ° symmetrical position with the cutting blade 243 in a circular shape rotates together to prevent the lifting of the dicing tape 40. The cutting edge 243 and the auxiliary roll 245 may be adjusted to correspond to the diameter change of the wafer.

3 is a schematic configuration diagram of a tape remover in the tape attaching and removing device according to the present invention.

Referring to FIG. 3, the tape remover 250 collects a tape supply roll 251 for supplying a tape removal tape 70 and a collection roll 257 for collecting a protective tape adhered to and removed from the tape removal tape 70. ), A pinch roll via a peeling bar 253 for removing the protective tape 30, a tape removing tape 70 having a protective tape 30 attached between the peeling bar 253 and the collection roll 257 ( 275). In this case, the peeling bar 253 may have a smooth rounded peeling bar 253. The peeling bar 253 may be replaced by a miniature mini roller.

The peeling bar 253 presses and attaches the tape removing tape 70 to the protective tape 30 and moves slowly. In this process, the protective tape 30 is wound on the collection roll 257 together with the tape removing tape 70 to remove the protective tape 30 attached to the active surface of the wafer 10.

On the other hand, the heating blow unit 261 which injects heating air adjacent to the tape remover 250 is provided. The adhesion of the protective tape 30 is weakened and the flexibility is increased by the heating air, so that the separation can be easily performed, and the impact transmitted from the protective tape 30 is minimized during the removal of the protective tape 30. Accordingly, the protection tape 30 can be easily removed by using a general replenishment tape without using an expensive dedicated tape as the tape removal tape 70.

4 is a schematic cross-sectional view of a cleaning bar of the tape attaching and removing device according to the present invention.

Referring to FIG. 4, the cleaning bar 161 has an air inlet 163 connected to an air source (not shown) and a vacuum inlet 165 connected to a vacuum pump (not shown). Air is injected into the mount table 130 and the peeling table 150 and sucked under vacuum. As a result, particles on the tables 130 and 150 are removed. Particles are protected from wafer cracking and cracking during dicing and protective tape removal.

5 is a perspective view showing a coupling structure of a barcode labeler in a tape attaching and removing device for a wafer according to the present invention, Figures 6a and 6b is an operating state diagram showing the coupling operation of the barcode labeler.

5, 6A, and 6B, a coupling guide 190a is installed at a portion at which the barcode labeler 170 is installed, and a coupling guide 190b corresponding thereto is installed at the barcode labeler 170. The installation position is guided by the matching of the coupling guides 190a and 190b, and the installation may be easily performed.

The bar code labeler 170 is provided with a coupling shaft 193 having a stepped groove 194 formed therein, and a portion into which the bar code labeler 170 is coupled is formed with an insertion hole 105 into which the coupling shaft 193 is fitted. A shaft fixed cylinder unit 195 having a fixing block 196 into which the groove 194 is fitted is installed. As shown in FIG. 6A, the fixing block 196 of the shaft fixing cylinder unit 195 is fitted into the step groove 194 of the coupling shaft 193, thereby firmly fixing the installation state of the barcode labeler 170. As illustrated in FIG. 6B, the barcode labeler 170 may be separated by releasing the fixed state of the fixing block 196.

On the other hand, the wafer ring loader (111 in FIG. 1) and the ultraviolet irradiator (115 in FIG. 1) are similar to the barcode labeler 170 to facilitate access for maintenance when the back grinding device is configured in-line. It is composed of modules so that it can be detached if necessary. In addition, the coupling guides 190a and 190b are installed to be always attached to the same position during the mounting process.

Hereinafter, the operation of the tape attaching and removing device for wafers according to the present invention will be described.

7A to 7I are plan views showing the operation of the tape attaching and removing device for a wafer according to the embodiment of the present invention.

Referring to FIG. 1, the wafer transfer robot 111 picks up the wafer 10 from the spin table 330 of the wafer back grinding apparatus 300 and transfers the wafer 10 to the ultraviolet irradiator 115. The wafer 10 is transferred from the spin table 330 of the wafer back grinding device 300 to the cassette 55 mounted on the unloading unit 350 of the back grinding device 300. It's not like that.

The ultraviolet irradiator 115 irradiates the protective tape 30 with ultraviolet rays to weaken the adhesive force of the protective tape 30. The wafer 10 on which the ultraviolet irradiation is completed is mounted on the mount table 130 by the wafer transfer robot 111.

1 and 7A, in addition to the wafer transfer operation, the first transfer means 119 transfers the wafer ring 20 loaded on the wafer ring loader 117 to the mount table 130. At this time, the cleaning bar 161 of the table cleaner 160 cleans the filling table 150. The adsorption unit 120 of the first transfer means 119 is moved above the wafer ring loader 117. The adsorption unit 120 descends to pick up the wafer ring 20 and to rise again.

1 and 7B, the adsorption unit 120 of the first transfer means 119 moves forward of the mount table 130 and rotates 180 ° horizontally with respect to the ground. The adsorption unit 120 moves and descends to the upper portion of the mount table 130 to place the wafer ring 20 on the mount table 130. At this time, the mount table 130 is in a state of rising from the initial position to the mounting position of the wafer ring 20 and waiting. Then, the adsorption unit 120 is rotated 180 ° again to be in a state as shown in FIG. 7C.

Here, the operation of transferring the wafer ring 20 to the mount table 130 is preceded by the operation of transferring the wafer 10 to the mount table 130. This is to prevent the wafer from being damaged by falling during the transfer of the wafer ring 20.

1 and 7D, the mount table 130 on which the wafer 10 and the wafer ring 20 are placed is lifted from the standby position to the working position. The dicing tape 40 is attached to the wafer 10 and the wafer ring 20 by the tape attacher 230. When the dicing tape 40 is attached, the mount table 130 is lowered again.

1 and 7E, the first transfer means 119 then picks up the wafer ring 20 on which the wafer 10 on the mount table 130 is fixed with the dicing tape 40. The mount table 130 is lowered to the initial position. The adsorption unit 122 of the second transport means 121 is moved below the adsorption unit 120 of the first transport means 119. As shown in FIG. 7F, the adsorption unit 120 of the first transport means 119 is lowered to place the wafer 10 and the wafer ring 20 on the adsorption unit 122 of the second transport means 121. The suction unit 122 of the second transfer unit 121 rotates 360 ° as shown in FIG. 7G in a state in which the wafer ring 20 on which the wafer 10 is fixed is sucked and fixed, thereby being vertically inverted. Wafer 10 is directed onto the active surface. In this state, as shown in FIG. 7H, the second transfer unit 121 returns the wafer ring 20 on which the wafer 10 is fixed to the top of the filling table 150, and then returns.

Subsequently, in the state where the peeling table 150 is raised and moved to the standby position, the second transfer unit 121 places the wafer ring 20 on which the wafer 10 is fixed on the peeling table 150. The second conveying means 121 is out of the top of the peeling table 150, the peeling table 150 is raised from the standby position to the working position.

Thereafter, the tape remover 250 separates the protective tape 30 whose adhesive strength is lost by ultraviolet irradiation. When the removal of the protective tape 30 is completed, the peeling table 150 descends and moves to the standby position. In the filling table 150 at the standby position, the wafer ring 20 to which the wafer 10 is fixed is transferred to the unloading table 177 by the third transfer means 125. The wafer ring 20 to which the wafer 10 completed until the removal of the protective tape 30 is fixed is received in the cassette 50 in the cassette stacker 180 by the pusher 185 as shown in FIG. 7I.

After the protective tape 30 is removed and before the wafer 10 is stored in the cassette 50, the barcode labeler 170 reads the ID of the wafer 10 placed on the unloading table 177 and reads the barcode label. It adheres to the dicing tape 40 part between 10 and the wafer ring 20.

Meanwhile, the table cleaner 160 periodically moves the mount table 130 and the filling table 150, and removes particles from each of the tables 130 and 150 using air and vacuum.

The dicing tape attaching operation will be described in more detail. It demonstrates dividing into the case of using a precut dicing tape as a dicing tape, and the case of using the dicing tape with a liner film.

8A and 8B are cross-sectional views schematically showing the dicing tape attaching operation of the tape attaching and removing device according to the present invention.

Referring to FIG. 8A, when using the general-purpose dicing tape 40 with the liner film 41 attached thereto, the dicing tape 40 is supplied from the tape supply roll 231 to the tape collection roll 239. The liner film 41 is wound around the liner film recovery roll 233. The auxiliary roller unit 235 and the press roller unit 237 are moved to prepare a predetermined length on the mount table 130. The mount table 130 is raised to be in close contact with the dicing tape 40. The dicing tape 40 is brought into close contact with the auxiliary roller unit 235 of the tape attaching machine 130. At this time, the press roller unit 237 presses the dicing tape 40 in close contact with the movement of the auxiliary roller 235 unit, and the press roller unit 237 moves backward.

Subsequently, the cutter 241 is lowered and the dicing tape 40 is cut by repeating the 360 ° rotation twice. A portion of the cutting blade 243 of the cutter 241 and the auxiliary roll 245 at a 180 ° symmetry position are pressed together to press the cut portion. When the cutting is completed, the cutter 241 is raised, and the auxiliary roller unit 235 returns to separate the remaining portions except the circular ring dicing tape 40 attached to the wafer ring 20 and the wafer 10. When the detachment is completed, the mount table 130 is lowered.

Referring to FIG. 8B, in the case of the precut dicing tape 45 without backing paper, it is removed similarly to the removal of the general-purpose dicing tape 41 described above. However, peeling of the precut dicing tape 45 is performed by the peeling bar 249 in which the tip was rounded finely.

In addition, this invention is not limited to the above-mentioned embodiment. Various modifications may be made without departing from the spirit of the present invention. This can be easily understood by those skilled in the art.

According to the tape attachment and removal device for a wafer according to the present invention as described above, since the wafer back grinding and the tape attachment and removal process can be performed continuously, the movement path and travel time of the wafer are minimized. Furthermore, the wafer's travel path and travel time can be minimized by being installed in-line with the wafer back grinding device to continuously perform wafer back polishing and tape attachment and removal. Therefore, it is possible to prevent the occurrence of wafer warpage and wafer sag during handling, thereby improving productivity and process yield such as poor handling or wafer breakage during the process. Accordingly, it is possible to build an automated facility.

In addition, since tape attachment and removal can be performed in a single facility, no independent facility is required. Therefore, the installation cost can be reduced.

Claims (13)

A wafer ring stacker on which a wafer ring is loaded; A mount table to which the wafer and the wafer ring are seated and fixed; A dicing tape attacher attaching a dicing tape to the back side of the wafer and the wafer ring; An ultraviolet irradiator for irradiating ultraviolet rays to the protective tape attached to the active surface of the wafer; A wafer transfer robot that picks up a wafer at a wafer loading position and supplies the wafer to an ultraviolet irradiator and transfers the tape on which the ultraviolet irradiation is completed to a mount table; First transfer means for transferring the wafer ring from the wafer ring loader to the mounting table; A peeling table to which the wafer with the protection tape is attached and the wafer ring are seated and fixed; Second transfer means for transferring the wafer and the wafer ring up and down from the mounting table to the filling table; A protective tape remover separating the protective tape attached to the active surface of the wafer mounted on the filling table; A cassette stacker on which a wafer and a wafer ring storage cassette are stacked; And third transfer means for receiving the wafer and the wafer ring to which the dicing tape is attached to the cassette of the cassette stacker. According to claim 1, The wafer frame stacker, the wafer transfer robot, the mount table, the peeling table, the cassette stacker comprises a lower frame portion, the tape attacher and the tape remover comprises an upper frame portion, the lower frame and the upper frame Tape mounting and removal apparatus for a wafer, characterized by having a two-layer structure. According to claim 1, And a bar code labeler for reading the ID of the wafer surface and attaching the bar code label on the dicing tape between the wafer and the wafer ring. According to claim 1, The wafer transfer robot is configured to pick up the wafer having completed the back grinding from the wafer back grinding device and transfer the wafer to the ultraviolet irradiator. According to claim 1, And a table cleaner which blows air and sucks particles into the vacuum to remove particles on the mounting table and the peeling table. The method according to claim 1 or 3, And the ultraviolet irradiator, the wafer ring loader, and the barcode labeler are configured to be attached and detached by a cylinder fixing device. The method of claim 6, And a guide for guiding attachment and detachment of the ultraviolet irradiator, the wafer ring loader, and the barcode labeler. The method of claim 6, A device for attaching and removing a tape for wafers, characterized in that a coupling shaft is installed on one of the ultraviolet irradiator, the wafer ring loader, and the barcode labeler, and a mounting portion thereof, and a shaft fixing cylinder fixing unit for fixing the coupling shaft on the other side. According to claim 1, The tape attacher includes a supply roll for supplying a dicing tape, a collection roll for recovering the dicing tape, a press roller unit for applying pressure to adhere the dicing tape, and an auxiliary roller unit for dicing tape transportation. Tape attaching and removing device for wafers. According to claim 1, And said tape attacher further comprises a liner film recovery roll for recovering a liner film. According to claim 1, A tape attaching and removing device for a wafer, characterized in that it comprises a peeling bar for precut tape rounded at its ends. According to claim 1, And a heating blow unit for injecting heating air to the protective tape before the tape remover is installed adjacent to the tape remover. According to claim 1, The third transfer means includes a guide rail on which a wafer ring and a wafer ring on which a dicing tape is attached and a protective tape is removed, and a pusher for receiving the wafer and the wafer ring on the guide rail into a cassette. Tape attachment and removal device for wafer.

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