KR20070013813A - Solder ball non destructive inspection device and thereof method - Google Patents

Solder ball non destructive inspection device and thereof method Download PDF

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KR20070013813A
KR20070013813A KR1020050068441A KR20050068441A KR20070013813A KR 20070013813 A KR20070013813 A KR 20070013813A KR 1020050068441 A KR1020050068441 A KR 1020050068441A KR 20050068441 A KR20050068441 A KR 20050068441A KR 20070013813 A KR20070013813 A KR 20070013813A
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bga package
ultrasonic
laser
solder ball
ultrasonic wave
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KR1020050068441A
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Korean (ko)
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이종걸
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주식회사 현대오토넷
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/348—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with frequency characteristics, e.g. single frequency signals, chirp signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4463—Signal correction, e.g. distance amplitude correction [DAC], distance gain size [DGS], noise filtering

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  • Health & Medical Sciences (AREA)
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  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

An apparatus and a method for non-destructively examining a solder ball are provided to perform a reliable examination by precisely analyzing soldering of the solder ball and a minute solder joint crack. An apparatus for non-destructively examining a solder ball includes a pulse laser oscillation section(110), an ultrasonic detection section(120), an optical interferometer(125), and an analyzing section(130). The analyzing section receives an ultrasonic wave and analyzes the reception strength and the reception delaying time of the ultrasonic wave. The analyzing section examines a mounting defect of a BGA package with respect to a mounting board by representing a vibration trend of a surface of the BGA package.

Description

솔더볼 비파괴 검사장치 및 그 방법{SOLDER BALL NON DESTRUCTIVE INSPECTION DEVICE AND THEREOF METHOD}Solder ball nondestructive testing device and its method {SOLDER BALL NON DESTRUCTIVE INSPECTION DEVICE AND THEREOF METHOD}

도 1은 본 발명의 일실시예에 따른 솔더볼 비파괴 검사장치의 구성도이다.1 is a block diagram of a solder ball non-destructive inspection device according to an embodiment of the present invention.

< 도면의 주요부분에 대한 부호의 설명 ><Description of Symbols for Major Parts of Drawings>

100: BGA 패키지 110: 펄스 레이저 발진부100: BGA package 110: pulse laser oscillation unit

120: 초음파 탐지부 125: 광간섭계120: ultrasonic detection unit 125: optical interferometer

130: 분석부130: analysis unit

본 발명은 솔더볼 비파괴 검사장치에 관한 것으로, 보다 상세하게는 검사 대상체에 레이저(일반적으로 pulsed ND:YAG laser)를 조사하여 열탄성(thermoelastic) 및 용발(ablation)현상에 의한 초음파를 발생시킨 후 대상체를 투과한 초음파신호와 대상체 표면 진동에 의해 산란된 레이저 신호를 수신하여 이 데이터를 분석 및 가공함으로써 결함을 평가하는 솔더볼 비파괴 검사장치이다.The present invention relates to a solder ball non-destructive testing device, and more particularly, by irradiating a laser (generally pulsed ND: YAG laser) to the test object to generate ultrasonic waves by thermoelastic and ablation phenomenon It is a solder ball non-destructive inspection device that receives the ultrasonic signal transmitted through and the laser signal scattered by the surface vibration of the object and analyzes and processes this data to evaluate the defect.

최근에는 핀 방식의 패키지를 대신해 공간 효율성이 높은 BGA, 플립칩 방식의 패키지가 전자부품 실장기술의 주류를 이루고 있다. 그리고, BGA나 플립칩은 실 장한 후 솔더볼이 육안으로 보이지 않는 위치에 있기 때문에 보통은 주로 엑스레이(X-ray)를 제품에 투과한 이미지를 분석하는 방법으로 솔더볼 내의 보이드(Void) 등의 결함을 검사하는 것이 일반적인 방식이다.In recent years, space-efficient BGA and flip-chip packages have become mainstream in electronic component packaging instead of pin-type packages. In addition, since BGA or flip chip is mounted in a position where the solder ball is not visible to the naked eye, it is usually a method of analyzing defects such as voids in the solder ball by analyzing an image transmitted through the X-ray through the product. Checking is the usual way.

그래서, 엑스레이로 솔더볼을 정밀히 검사하기 위해서는 최근에 도입된 고가의 3D CT X-ray장비가 필수적이다. 하지만 이 장치는 내부 보이드의 검사 등에는 유용하나 리플로우 공정불량인 솔더볼 냉땜이나, 온도 사이클 시험시 발생한 미세한 솔더 조인트 크랙 등은 정밀히 분석해 내기 어려웠다.Therefore, the expensive 3D CT X-ray equipment recently introduced is essential to inspect the solder balls with X-rays. However, this device is useful for inspection of internal voids, but it was difficult to precisely analyze the solder ball cold solder, which is a poor reflow process, and the fine solder joint crack generated during the temperature cycle test.

그리고 3D CT X-ray장비는 인체에 유해한 엑스레이 선 발생장치를 밀폐해 놓아야 하기 때문에 생산현장에 인라인(in-line)으로 구성할 수 없었다.In addition, 3D CT X-ray equipment could not be configured in-line at the production site because the X-ray generation device harmful to the human body should be sealed.

이에 본 발명은 상기와 같은 문제점들을 해소하기 위해 안출된 것으로서, 솔더볼, 범프(Bump)내의 보이드 불량뿐만 아니라 솔더볼에 대한 냉땜, 미세 솔더 조인트 크랙 등도 정밀히 분석해 낼 수 있어 보다 신뢰성 있는 검사작업을 수행할 수 있으며, 엑스레이 투시 장비와 달리 생산현장에 인라인 검사 장치로도 활용할 수 있는 이점을 제공한다.Accordingly, the present invention has been devised to solve the above problems, and can accurately analyze not only defects of solder balls and voids in bumps, but also cold soldering and fine solder joint cracks on solder balls, thereby performing more reliable inspection work. Unlike x-ray fluoroscopy equipment, it provides the advantage of being used as an inline inspection device on the production site.

상기와 같은 목적을 달성하기 위한 본 발명에 따른 솔더볼 비파괴 검사장치의 구성은 실장보드에 장착되는 BGA 패키지에 레이저를 투사하여 초음파를 발생시키는 펄스 레이저 발진부; 상기 펄스 레이저 발진부의 레이저 조사로 BGA 패키지에서 발생하는 초음파를 상기 레이저가 부딪히는 면과 반대쪽 면에서 일정 거리를 두 고 수신하는 초음파 탐지부; 상기 펄스 레이저 발진부의 레이저가 조사됨으로써, 상기 BGA 패키지의 표면진동으로 발생하는 광간섭을 시간에 따라 측정하는 광간섭계; 및 상기 초음파 탐지부로 수신된 초음파가 입력되어 입력신호 대비 초음파의 수신강도와 수신 지연시간을 분석하고, 상기 광간섭계에서 측정된 광간섭이 신호가 입력되어 BGA 패키지 표면의 진동양상을 나타냄으로써, 상기 실장보드에 대한 상기 BGA 패키지의 장착결함을 검사하는 분석부를 포함한다.The configuration of the solder ball non-destructive inspection device according to the present invention for achieving the above object is a pulse laser oscillator for generating an ultrasonic wave by projecting a laser to the BGA package mounted on the mounting board; Ultrasonic detection unit for receiving the ultrasonic wave generated in the BGA package by a laser irradiation of the pulse laser oscillator at a predetermined distance from the surface opposite the surface hitting the laser; An optical interferometer for measuring optical interference caused by surface vibration of the BGA package with time by irradiating a laser of the pulse laser oscillator; And an ultrasonic wave received by the ultrasonic detection unit to analyze the reception intensity and the reception delay time of the ultrasonic wave relative to the input signal, and the optical interference signal measured by the optical interferometer is input to indicate the vibration pattern of the surface of the BGA package. It includes an analysis unit for inspecting the mounting defect of the BGA package to the mounting board.

그리고, 상기 초음파 탐지부 의해 수신된 상기 초음파를 분석하는 분석부는 상기 초음파 탐지부에 의해 수신된 상기 초음파를 증폭하는 증폭기; 상기 증폭기에 의해 상기 증폭된 초음파를 전송받아 파형을 출력하는 오실로 스코프; 및상기 오실로스코프에 의해 출력된 상기 초음파의 파형을 전송받아 데이터화하고 가공함으로써 상기 초음파의 특성을 나타내는 컴퓨터를 포함할 수 있다.The analyzer for analyzing the ultrasonic wave received by the ultrasonic detector includes an amplifier for amplifying the ultrasonic wave received by the ultrasonic detector. An oscilloscope receiving the amplified ultrasound wave by the amplifier and outputting a waveform; And a computer displaying the characteristics of the ultrasonic waves by receiving the waveform of the ultrasonic waves output by the oscilloscope and converting the data into data.

여기서, 상기 초음파 탐지부는 음향 마이크로폰(acoustic microphone)이거나, 에어 탐촉자(air transducer)가 될 수도 있으며, 전자기 음향 탐촉자(electromagnetic acoustic transducer)인 것이 바람직하다.Herein, the ultrasonic detector may be an acoustic microphone, an air transducer, or an electromagnetic acoustic transducer.

본 발명의 솔더볼 비파괴 검사방법의 구성은 실장보드에 장착되는 BGA 패키지에 레이저를 투사하여 초음파를 발생시키는 단계; 상기 단계 이후 상기 BGA 패키지로 상기 레이저를 주사하는 반대쪽 면에서 일정 거리를 두고 설치된 초음파 탐지부에 의해 상기 BGA 패키지에서 발생하는 초음파를 수신하는 단계; 및 상기 단계 이후 상기 초음파 탐지부로 수신된 초음파 신호를 데이터화하고 가공, 분석함으로써 실장보드에 대한 BGA 패키지의 장착결함을 검사하는 단계를 포함한다.The configuration of the solder ball non-destructive inspection method of the present invention comprises the steps of generating an ultrasonic wave by projecting a laser to the BGA package mounted on the mounting board; Receiving an ultrasonic wave generated in the BGA package by an ultrasonic detector installed at a predetermined distance from an opposite side of scanning the laser into the BGA package after the step; And inspecting the mounting defect of the BGA package on the mounting board by data processing, analyzing, and analyzing the ultrasonic signal received by the ultrasonic detector after the step.

그리고, 상기 레이저를 투사하여 초음파를 발생시키는 단계 이후에는 레이저 조사로 인해 BGA 패키지의 표면진동으로 발생하는 레이저 산란의 광간섭을 광간섭계에 의해 시간에 따라 측정하고, 컴퓨터로 전송하여 데이터화함으로써, 실장보드에 대한 BGA 패키지의 장착결함을 검사하는 단계를 포함할 수 있다.After the step of generating the ultrasonic wave by projecting the laser, the optical interference of laser scattering generated by the surface vibration of the BGA package due to the laser irradiation is measured by an optical interferometer over time, and transmitted to a computer to make data. The method may include checking a mounting defect of a BGA package on a board.

이하, 본 발명의 바람직한 일실시예를 첨부된 도면을 참조하여 설명한다.Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

또한, 본 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 단지 예시로 제시된 것이며, 본 기술사상을 통해 구현되는 다양한 실시예가 있을 수 있다.In addition, the present embodiment is not intended to limit the scope of the present invention but is merely presented as an example, and there may be various embodiments implemented through the technical idea.

도 1은 본 발명의 일실시예에 따른 솔더볼 비파괴 검사장치의 구성도이다.1 is a block diagram of a solder ball non-destructive inspection device according to an embodiment of the present invention.

일실시예에 의한 솔더볼 비파괴 검사장치는 실장보드에 장착되는 BGA 패키지(100)에 레이저를 투사하여 초음파를 발생시키는 펄스 레이저 발진부(110); 상기 펄스 레이저 발진부(110)의 레이저 조사로 BGA 패키지(100)에서 발생하는 초음파를 상기 레이저가 부딪히는 면과 반대쪽 면에서 일정 거리를 두고 수신하는 초음파 탐지부(120); 상기 펄스 레이저 발진부(110)의 레이저가 조사됨으로써, 상기 BGA 패키지(100)의 표면진동으로 발생하는 광간섭을 시간에 따라 측정하는 광간섭계(125); 및 상기 초음파 탐지부(120)로 수신된 초음파가 입력되어 입력신호 대비 초음파의 수신강도와 수신 지연시간을 분석하고, 상기 광간섭계에서 측정된 광간섭 신호가 입력되어 BGA 패키지(100) 표면의 진동양상을 나타냄으로써, 상기 실장보드에 대한 상기 BGA 패키지(100)의 장착결함을 검사하는 분석부(130)를 포함한다.Solder ball non-destructive testing device according to an embodiment is a pulse laser oscillator 110 for generating an ultrasonic wave by projecting a laser to the BGA package 100 mounted on the mounting board; Ultrasonic detection unit 120 for receiving the ultrasonic wave generated in the BGA package 100 by a laser irradiation of the pulse laser oscillator 110 at a predetermined distance from the surface opposite to the surface hitting the laser; An optical interferometer (125) for measuring the optical interference generated by surface vibration of the BGA package (100) with time by irradiating the laser of the pulse laser oscillator (110); And an ultrasonic wave received by the ultrasonic detector 120 to analyze the reception intensity and the reception delay time of the ultrasonic wave relative to the input signal, and the optical interference signal measured by the optical interferometer is input to vibrate the surface of the BGA package 100. By showing an aspect, it includes an analysis unit 130 for inspecting the mounting defect of the BGA package 100 to the mounting board.

여기서, 상기 펄스 레이저 발진부(110)가 BGA 패키지(100)에 대해 레이저(일반적으로 pulsed ND:YAG laser)를 조사하면, 열탄성(thermoelastic) 및 용발 (ablation)현상에 의한 초음파가 발생하고, BGA 패키지(100)를 투과한 초음파 신호는 초음파 탐지부(120)로 수신되며, 초음파 탐지부(120)는 분석부(130)로 초음파를 전달하고, 초음파 신호는 분석부(130)에서 데이터화되어 BGA 패키지(100)의 결합을 평가하기 위해 가공된다.Here, when the pulse laser oscillator 110 irradiates a laser (generally pulsed ND: YAG laser) to the BGA package 100, ultrasonic waves are generated by thermoelastic and ablation phenomenon, and the BGA is generated. The ultrasonic signal transmitted through the package 100 is received by the ultrasonic detector 120, the ultrasonic detector 120 transmits ultrasonic waves to the analyzer 130, and the ultrasonic signal is data from the analyzer 130 to be BGA. It is processed to evaluate the engagement of the package 100.

즉, 분석부(130)는 초음파 탐지부(120)로 수신되는 초음파의 수신강도와 수신 지연시간을 분석함으로써 BGA 패키지(100)의 결함정도를 그래프로 보여준다.That is, the analysis unit 130 shows the degree of defects of the BGA package 100 by analyzing the reception intensity and the reception delay time of the ultrasonic wave received by the ultrasonic detection unit 120.

여기서, 상기 펄스 레이저 발진부(110)가 BGA 패키지(100)에 대해 레이저(일반적으로 pulsed ND:YAG laser)를 조사하면, 열탄성(thermoelastic) 및 용발(ablation)현상에 의한 초음파가 발생하고, BGA 패키지(100)를 투과한 초음파 신호는 초음파 탐지부(120)로 수신되며, 초음파 탐지부(120)는 분석부(130)로 초음파 신호를 전달하고, 초음파 신호는 분석부(130)에서 데이터화되어 BGA 패키지(100)의 결함을 평가하기 위해 가공된다.Here, when the pulse laser oscillator 110 irradiates a laser (generally pulsed ND: YAG laser) to the BGA package 100, ultrasonic waves are generated by thermoelastic and ablation phenomenon, and the BGA is generated. The ultrasonic signal transmitted through the package 100 is received by the ultrasonic detector 120, the ultrasonic detector 120 transmits the ultrasonic signal to the analyzer 130, and the ultrasonic signal is dataized by the analyzer 130. It is processed to evaluate the defect of the BGA package 100.

그리고, 광간섭계(125)는 레이저 조사로 인해 BGA 패키지(100)의 표면진동으로 발생하는 레이저 산란의 광간섭을 시간에 따라 측정하여 분석부(130)로 전송하고, 분석부(130)는 이를 데이터화함으로써, 실장보드에 대한 BGA 패키지(100)의 장착결함을 검사한다.In addition, the optical interferometer 125 measures the optical interference of the laser scattering generated by the surface vibration of the BGA package 100 due to the laser irradiation over time and transmits the optical interference to the analysis unit 130, and the analysis unit 130 does this. By data, the mounting defect of the BGA package 100 on the mounting board is checked.

즉, 상기 BGA 패키지(100)의 솔더볼이 규칙적으로 배열되어 있는 양품인 경우 BGA 패키지(100)의 표면에 나타난 진동양상이 주로 대칭양상으로 규칙적으로 관찰되고, 불량품인 경우 비대칭적이고 불규칙적으로 관찰된다.That is, in the case of a good product in which the solder balls of the BGA package 100 are regularly arranged, vibration patterns appearing on the surface of the BGA package 100 are mainly observed in symmetrical patterns, and in the case of defective products, asymmetrical and irregularities are observed.

여기서, 상기 초음파 탐지부(120)는 음향 마이크로폰(acoustic microphone) 이거나, 에어 탐촉자(air transducer)가 될 수도 있으며, 전자기 음향 탐촉자(electromagnetic acoustic transducer)가 될 수 있다.Here, the ultrasonic detector 120 may be an acoustic microphone, an air transducer, or an electromagnetic acoustic transducer.

일실시예에 의한 솔더볼 비파괴 검사방법은 실장보드에 장착되는 BGA 패키지(100)에 레이저를 투사하여 초음파를 발생시키는 단계; 상기 단계 이후 상기 BGA 패키지(100)로 상기 레이저를 주사하는 반대쪽 면에서 일정 거리를 두고 설치된 초음파 탐지부(120)에 의해 상기 BGA 패키지(100)에서 발생하는 초음파를 수신하는 단계; 및 상기 단계 이후 상기 초음파 탐지부(120)로 수신된 초음파 신호를 데이터화하고 가공, 분석함으로써 실장보드에 대한 BGA 패키지(100)의 장착결함을 검사하는 단계를 포함한다.Solder ball non-destructive testing method according to an embodiment comprises the steps of generating an ultrasonic wave by projecting a laser on the BGA package 100 mounted on the mounting board; Receiving the ultrasonic wave generated in the BGA package 100 by the ultrasonic detector 120 installed at a predetermined distance from the opposite side for scanning the laser to the BGA package 100 after the step; And inspecting the mounting defect of the BGA package 100 on the mounting board by data processing, processing, and analyzing the ultrasonic signal received by the ultrasonic detector 120 after the step.

그리고, 상기 레이저를 투사하여 초음파를 발생시키는 단계 이후에는 레이저 조사로 인해 BGA 패키지(100)의 표면진동으로 발생하는 레이저 산란의 광간섭을 광간섭계(125)에 의해 시간에 따라 측정하고, 컴퓨터로 전송하여 데이터화함으로써, 실장보드에 대한 BGA 패키지(100)의 장착결함을 검사하는 단계를 포함한다.After the step of generating the ultrasonic wave by projecting the laser, the optical interference of laser scattering generated by the surface vibration of the BGA package 100 due to the laser irradiation is measured over time by the optical interferometer 125, and then Including the transmission and data, and checking the mounting defect of the BGA package 100 to the mounting board.

상기한 바와 같이, 본 발명은 솔더볼, 범프(Bump)내의 보이드 불량뿐만 아니라 솔더볼에 대한 냉땜, 미세 솔더 조인트 크랙 등도 정밀히 분석해 낼 수 있어 보다 신뢰성 있는 검사작업을 수행할 수 있으며, 엑스레이 투시장비와 달리 생산현장에 인라인 검사장치로도 활용할 수 있는 효과를 얻을 수 있다.As described above, the present invention can accurately analyze not only defects in solder balls and bumps, but also cold solders and fine solder joint cracks on solder balls, so that more reliable inspection work can be performed. It can be used as an in-line inspection device at the production site.

Claims (6)

실장보드에 장착되는 BGA 패키지에 레이저를 투사하여 초음파를 발생시키는 펄스 레이저 발진부;A pulse laser oscillator for generating ultrasonic waves by projecting a laser onto a BGA package mounted on a mounting board; 상기 펄스 레이저 발진부의 레이저 조사로 BGA 패키지에서 발생하는 초음파를 상기 레이저가 부딪히는 면과 반대쪽 면에서 일정 거리를 두고 수신하는 초음파 탐지부;Ultrasonic detection unit for receiving the ultrasonic wave generated in the BGA package by a laser irradiation of the pulse laser oscillator at a predetermined distance from the surface opposite the surface hitting the laser; 상기 펄스 레이저 발진부의 레이저가 조사됨으로써, 상기 BGA 패키지의 표면진동으로 발생하는 광간섭을 시간에 따라 측정하는 광간섭계; 및An optical interferometer for measuring optical interference caused by surface vibration of the BGA package with time by irradiating a laser of the pulse laser oscillator; And 상기 초음파 탐지부로 수신된 초음파가 입력되어 입력신호 대비 초음파의 수신강도와 수신 지연시간을 분석하고, 상기 광간섭계에서 측정된 광간섭이 신호가 입력되어 BGA 패키지 표면의 진동양상을 나타냄으로써, 상기 실장보드에 대한 상기 BGA 패키지의 장착결함을 검사하는 분석부를 포함하는 것을 특징으로 하는 솔더볼 비파괴 검사장치.The ultrasonic wave received by the ultrasonic detection unit is input to analyze the reception intensity and the reception delay time of the ultrasonic wave relative to the input signal, and the optical interference signal measured by the optical interferometer is input to represent the vibration pattern of the surface of the BGA package, Solder ball non-destructive testing device comprising an analysis unit for inspecting the mounting defects of the BGA package on the board. 제 1 항에 있어서,The method of claim 1, 상기 초음파 탐지부는 음향 마이크로폰(acoustic microphone)인 것을 특징으로 하는 솔더볼 비파괴 검사장치.And the ultrasonic detector is an acoustic microphone. 제 1 항에 있어서,The method of claim 1, 상기 초음파 탐지부는 에어 탐촉자(air transducer)인 것을 특징으로 하는 솔더볼 비파괴 검사장치. The ultrasonic detection unit is a solder ball non-destructive inspection device, characterized in that the air transducer (air transducer). 제 1 항에 있어서,The method of claim 1, 상기 초음파 탐지부는 전자기 음향 탐촉자(electromagnetic acoustic transducer)인 것을 특징으로 하는 솔더볼 비파괴 검사장치.And the ultrasonic detection unit is an electromagnetic acoustic transducer. 실장보드에 장착되는 BGA 패키지에 레이저를 투사하여 초음파를 발생시키는 단계;Projecting a laser onto a BGA package mounted on a mounting board to generate ultrasonic waves; 상기 단계 이후 상기 BGA 패키지로 상기 레이저를 주사하는 반대쪽 면에서 일정 거리를 두고 설치된 초음파 탐지부에 의해 상기 BGA 패키지에서 발생하는 초음파를 수신하는 단계; 및Receiving an ultrasonic wave generated in the BGA package by an ultrasonic detector installed at a predetermined distance from an opposite side of scanning the laser into the BGA package after the step; And 상기 단계 이후 상기 초음파 탐지부로 수신된 초음파 신호를 데이터화하고 가공, 분석함으로써 실장보드에 대한 BGA 패키지의 장착결함을 검사하는 단계를 포함하는 것을 특징으로 하는 솔더볼 비파괴 검사방법.And inspecting the mounting defect of the BGA package on the mounting board by data processing, processing, and analyzing the ultrasonic signal received by the ultrasonic detector after the step. 제 5 항에 있어서,The method of claim 5, 상기 레이저를 투사하여 초음파를 발생시키는 단계 이후에는 레이저 조사로 인해 BGA 패키지의 표면진동으로 발생하는 레이저 산란의 광간섭을 광간섭계에 의해 시간에 따라 측정하고, 컴퓨터로 전송하여 데이터화함으로써, 실장보드에 대한 BGA 패키지의 장착결함을 검사하는 단계를 포함하는 것을 특징으로 하는 솔더볼 비파괴 검사방법.After the step of generating the ultrasonic wave by projecting the laser, the optical interference of the laser scattering generated by the surface vibration of the BGA package due to the laser irradiation is measured by the optical interferometer over time and transmitted to a computer to make data, Solder ball non-destructive testing method comprising the step of inspecting the mounting defects of the BGA package.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098921A2 (en) * 2009-02-27 2010-09-02 Georgia Tech Research Corporation High speed autofocus interferometric inspection systems & methods
KR101140422B1 (en) * 2011-11-16 2012-05-03 한국기계연구원 Method for making standard defect sample
KR101702507B1 (en) * 2015-09-30 2017-02-22 울산과학기술원 Device and method for dectecting damage of electronic product using digital signal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098921A2 (en) * 2009-02-27 2010-09-02 Georgia Tech Research Corporation High speed autofocus interferometric inspection systems & methods
WO2010098921A3 (en) * 2009-02-27 2010-12-02 Georgia Tech Research Corporation High speed autofocus interferometric inspection systems & methods
KR101140422B1 (en) * 2011-11-16 2012-05-03 한국기계연구원 Method for making standard defect sample
KR101702507B1 (en) * 2015-09-30 2017-02-22 울산과학기술원 Device and method for dectecting damage of electronic product using digital signal
WO2017057815A1 (en) * 2015-09-30 2017-04-06 울산과학기술원 Electronics damage detection device using digital signal and electronics damage detection method using same
US10386404B2 (en) 2015-09-30 2019-08-20 Unist(Ulsan National Institute Of Science And Technology) Device and method for detecting damage of electric product using digital signal

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