KR20070007587A - Printed circuit board having embedded electric element and fabricating method therefor - Google Patents

Abstract

A printed circuit board embedded with electric elements and a method of manufacturing the same are provided to form a pad to be connected to the electric elements when through-holes are filled with a paste. An interlayer circuit and through-holes are formed in a copper film stacked plate(S10). A mask with a pad-shaped opening is positioned on the copper film stacked plate(S20). Then, The through-holes is filled with a paste to form a pad, while interposing the mask(S30). An electric element is mounted on the pad, and then is cured(S40). An insulation layer and the interlayer circuit are sequentially stacked(S50). In the step S10, after the through-holes are perforated in the copper film stacked plate, the interlayer circuit is formed.

Description

Printed Circuit Board Having Embedded Electric Element and Fabricating Method therefor}

Figure 1 (a) is a cross-sectional view showing a state in which a paste is filled in the insulating layer in a conventional printed circuit board manufacturing method.

Figure 1 (b) is a cross-sectional view showing a state in which the pad is formed on the film in the conventional printed circuit board manufacturing method.

Figure 1 (c) is a cross-sectional view showing a state in which the electric element is mounted on the pad in the conventional printed circuit board manufacturing method.

Figure 1 (d) is a cross-sectional view showing a state where the film is placed on the insulating layer in a conventional printed circuit board manufacturing method.

Figure 1 (e) is a cross-sectional view showing a state in which the film is removed after laminating the pad in the conventional method of manufacturing a printed circuit board.

1 (f) is a cross-sectional view showing a state in which an insulating layer and a conductor circuit are sequentially formed in a conventional printed circuit board manufacturing method.

2 is a flowchart illustrating a method of manufacturing a printed circuit board incorporating an electric element in the method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

3 is a cross-sectional view showing a state in which a through hole is drilled in a copper-clad laminate in which an inner layer circuit is formed in a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

4 is a cross-sectional view illustrating a state in which a mask having an opening is positioned on a copper clad laminate in a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a printed circuit board manufacturing method according to an exemplary embodiment of the present invention, in which a through hole is filled and a pad is formed through a mask; FIG.

6 is a cross-sectional view showing a state in which an electric element is mounted on a pad in the method of manufacturing a printed circuit board according to the exemplary embodiment of the present invention.

7 is a cross-sectional view illustrating a state in which an insulating layer and a conductor circuit are sequentially positioned on a copper clad laminate in a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

8 is a cross-sectional view illustrating a state in which an insulating layer and a conductor circuit are sequentially stacked on a copper clad laminate in a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

* Description of the drawing symbols *

10: copper clad laminate 11: inner circuit 13: through hole

20: mask 21: opening 30: film

40: paste 41: pad 50: electric element

51: terminal 60; Unclad 61: Joint

70: prepreg

The present invention relates to a printed circuit board and a method of manufacturing the same, and more particularly, to a printed circuit board having an electric element capable of filling a through hole of a copper-clad laminate and forming a pad connected to the electric element. It relates to a manufacturing method.

Recently, according to the miniaturization, thinness, and lightening of electronic devices, printed circuit boards (PCBs) used therein are also required to be compact and lightweight. In a conventional printed circuit board for packaging, not only active devices such as ICs but also passive devices such as capacitors are mounted on the surface of the printed circuit board. However, in electronic devices that are becoming smaller and denser, the surface area of the printed circuit board itself decreases, and as the number of electronic components mounted on the surface increases, many difficulties arise in the surface mounting of the capacitor. Embedding (embedding) process embedded in the printed circuit board is widely used.

1 (a) to 1 (f) are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board incorporating a conventional electric device.

As shown in FIG. 1A, a cavity for accommodating an electric element is formed in the insulating layer 1, and then, the through hole is drilled to fill the paste 2.

As shown in FIG. 1B, after the pad 4 is formed on the film 6, the electric element 5 is mounted on the pad 4 as shown in FIG. 1C. Thereafter, as shown in Fig. 1 (d), the film 6 to which the electric element 5 is attached is placed on the insulating layer 1.

As shown in FIG. 1E, after the pad 4 and the paste 2 are electrically connected, the film 6 is removed. In addition, as shown in FIG. 1 (f), the insulating layers 7 and 8 and the conductor circuits 9 and 10 are sequentially stacked on both surfaces of the insulating layer 1 to form a via hole 11. Fabricate the substrate.

However, the conventional method of manufacturing a printed circuit board requires a separate pad 4 for connecting the electric element 5 and a paste 2 for connecting with the pad 4, which is not only cumbersome but also requires a lot of processing time. There is a problem that this takes.

The present invention is derived to solve the problems of the prior art as described above,

SUMMARY OF THE INVENTION The present invention provides a printed circuit board having a simple electric process and a method of manufacturing the same, since a pad for connecting paste with a paste is filled in the through-hole of the copper-clad laminate and at the same time can be formed with a pad.

The present invention is implemented by the embodiment having the following configuration in order to achieve the above object.

In accordance with another aspect of the present invention, there is provided a method of manufacturing a printed circuit board incorporating an electric device, the method including: forming an inner circuit and a through hole in a copper clad laminate; Filling the through-holes with a paste through a mask and simultaneously forming a pad, mounting and curing the electric element on the pad, and insulating layer and inner layer circuit for accommodating the electric element. Laminating sequentially.

The printed circuit board manufacturing method having such a configuration can simultaneously form the pad connected to the electric element and fill the through hole drilled in the copper-clad laminate, thereby simplifying the manufacturing process and reducing the working time. have.

In the forming of the inner layer circuit and the through-hole in the copper-clad laminate, the through-hole may be formed in the copper-laminated laminate first, and then the inner-layer circuit may be formed, and the process may be performed in the reverse order.

The insulating layer is preferably provided with a cavity for accommodating the electric element to prevent damage to the electric element during the lamination process. In addition, it is preferable to protect the electric element by forming the insulating layer into an unclad, which is a prepreg in a hardened state. In addition, a prepreg can also be used as an insulating layer, and an unclad and a prepreg can also be used simultaneously.

A printed circuit board incorporating an electric element according to an exemplary embodiment of the present invention includes a copper laminate board having an inner layer circuit and having a perforated hole, and a paste forming a pad on the copper laminate board and filling the through hole. The insulating layer having a cavity for accommodating the electric element and the conductor circuit electrically connected to the electric element are alternately laminated on the copper clad laminate. The insulating layer may be unclad and / or prepreg.

Hereinafter, a printed circuit board incorporating an electric device and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a flowchart illustrating a method of manufacturing a printed circuit board incorporating an electric device according to an embodiment of the present invention.

As shown in Figure 2, the method of manufacturing a printed circuit board of the present invention, the step of forming the inner layer circuit and the through-hole in the copper-clad laminate (S10), the step of placing a mask having an opening on the copper-clad laminate ( S20), through-hole filling and pad formation using a paste (S30), mounting and curing after mounting the electric device (S40) and laminating an insulating layer and a conductor circuit (S50) do.

Hereinafter, the steps S10 to S50 according to an embodiment of the present invention will be described with reference to FIGS. 3 to 7.

3 is a cross-sectional view showing a state in which the inner circuit 11 and the through hole 13 are formed in the copper-clad laminate 10.

A plurality of through holes 13 are formed at predetermined positions of the copper clad laminate 10. The through hole 13 may be drilled before or after the inner layer circuit 11 is formed. The through hole 13 is filled with a conductive paste, and the paste is electrically connected to the conductor circuit by a via hole in the conductor circuit laminated in step S50.

The copper clad laminate 10 in general may be used. For example, thermosetting resin copper clad laminates such as epoxy resin copper clad laminates, bismarimide copper clad laminates, cyanate ester resin copper clad laminates, polyimide copper clad laminates, and organic fiber cloth copper clad laminates using these resins, polyimide film copper clad plates, and the like. Heat resistant organic film printed circuit board can be used.

The through hole 13 is also formed by a general method. For example, a carbon dioxide laser, an UV-based excimer laser, a UV-YAG laser, a UV-vanadate laser, or the like may be used.

4 is a cross-sectional view illustrating a state in which the mask 20 having the opening 21 is positioned on the copper foil laminated plate 10 after the copper foil laminated plate 10 is fixed using the film 30.

 The copper-clad laminate 10 is fixed using a film 30 such as a double-sided tape, and then the mask 20 having the opening 21 is positioned thereon. The opening 21 has a shape of a pad to be formed on the copper clad laminate 10. The opening 21 is located on the through hole 13. Therefore, when the conductive paste is applied or printed on the mask 20, the paste is drawn out through the opening 21 to fill the through hole 13 to form a pad.

5 is a cross-sectional view illustrating a state in which the through hole 13 is filled and the pad 41 is formed through the mask 20.

The paste 40 is composed of a conductive powder to impart conductivity and a binder component to hold the powder. As the conductive metal, precious metal particles such as gold, palladium and platinum are used. In addition, various kinds of binder components are used. Examples of typical components include ester resins, urethane resins, acrylic resins, epoxy resins, and phenol resins. In addition, the solvent type paste includes a solvent as a component in addition to the above two components, and in the case of an infrared curable paste, the solvent paste includes only the two components without a solvent.

The paste 40 is printed or coated on the mask 20 by an inkjet printer, and since the plurality of openings 21 are formed in the mask 20, the paste 40 may cover the opening 21. Through it, the through hole 13 is filled and the pad 41 is formed. As described above, the present invention can simplify the process since the pad can be formed at the same time as the through hole is filled. Then, the mask 20 and the film 30 are removed.

6 is a cross-sectional view showing a state in which the electric element 50 is mounted on the pad 41.

The electric element 50 is mounted such that the electrode 51 of the electric element 50 is in contact with the pad 41. The electric device 50 is mounted by a general surface mounting technology (SMT). Thereafter, the paste 40 is cured to fix the electric element 50.

When the electrode 51 is formed on one side or both sides of the electric element 50, as shown in Figure 6, the pad 41 is formed on one surface of the copper-clad laminate 10, respectively. In addition, when the electrodes 51 are formed on both upper and lower surfaces of the electric element 50, one pad 41 is formed on the copper-clad laminate 10 to be in contact with the electrode 51, and the remaining electrodes are formed in the via hole. Can be connected by.

FIG. 7 is a cross-sectional view illustrating a state in which an insulating layer and a conductor circuit are sequentially stacked on the copper-clad laminate 10, and FIG. 8 is a cross-sectional view illustrating a conductor circuit and a via hole formed after stacking them.

On the upper surface of the copper-clad laminate 10 shown in Fig. 6, prepregs 73 and 75, unclad 60 and copper foil 83, and on the lower surface, prepreg 71 and copper foil 81 are sequentially Are stacked. The prepreg 73 and the unclad 60 are formed with cavities 73 'and 61 for accommodating electric elements.

The prepreg 71, 73, 75 may be a general thermosetting resin used as an insulating layer. For example, well-known resins, such as an epoxy resin, a cyanic acid ester resin, a maleimide resin, a polyimide resin, and a polyphenylene ether resin containing a functional group, can be used individually or in mixture of 2 or more types. Further, in order to prevent warping or warping of the substrate by heat, the resin may be formed by impregnating a resin into a reinforcing base such as glass fiber woven fabric.

In the prepreg 73 stacked on the upper surface of the copper-clad laminate 10, a cavity 73 'capable of accommodating the electric element 50 is formed. The prepregs 73 and 75 respectively stacked on the upper and lower surfaces of the unclad 60 are charged between the cavity 61 of the unclad 60 and the electric element 50 during the lamination process. It serves to fix 50. In addition, the prepregs 71 and 73 stacked on the upper and lower surfaces of the copper-clad laminate 10 are charged between the inner layer circuits 11 to prevent migration of the inner layer circuits 11.

In order to prevent damage to the electrical device 50 due to the pressure due to the lamination process, the unclad 60 may be used. The unclad 60 is formed with an opening 61 for accommodating the electric element 50. After the via hole 91 is drilled on the copper foils 81 and 83, a conductor circuit 93 is formed through a general circuit forming process.

Hereinafter, a printed circuit board incorporating an electric device according to an embodiment of the present invention will be described in more detail with reference to FIG. 8.

A printed circuit board incorporating an electric device according to an embodiment of the present invention includes an inner circuit 11 and a copper laminated board 10 having a through hole 13 formed therein, and a pad on the copper laminated board 10. An insulating layer including a paste 40 for forming a 41 and filling the through hole 13, and having a cavity 61 and 73 ′ for accommodating the electric element 50. Conductor circuits 93 connected to each other are alternately stacked on the copper-clad laminate.

As shown in FIG. 7, inner layer circuits 11 and through holes 13 are formed on both surfaces of the copper-clad laminate 10. The through hole 13 is filled with a conductive paste 40 and a pad 41 is formed. The pad 41 is electrically connected to the electrode 51 of the electric element 50.

The insulating layer having the cavity formed therein is a prepreg 73 and an unclad 60 which are stacked on the copper foil laminate 10 to accommodate the electric element 50. Cavities 73 ′ and 61 are formed in the insulating layer to accommodate the electrical device 50 in the lamination process. In addition, the prepregs 73 and 75 stacked on the upper and lower surfaces of the unclad 60 are charged in the space formed between the cavity 61 and the electric element 50 by the heat applied in the lamination process to form an electric element. Fix it.

After the copper foils 81 and 83 are laminated on the insulating layer, the via holes 91 and the conductor circuits 93 are formed, respectively, to produce a printed circuit board. And the multilayer process is repeated to fabricate a multilayer printed circuit board.

Although the technical spirit of the present invention has been described in detail according to the above-described embodiments, the above-described embodiments are for the purpose of description and not of limitation, and a person of ordinary skill in the art will appreciate It will be understood that various embodiments are possible within the scope.

The present invention can provide a printed circuit board and a method of manufacturing the same, in which a simple process is incorporated because the pad can be connected to an electrical device while filling a paste in the through-hole of the copper-clad laminate. Have

Claims (11)

(A) forming an inner circuit and a through hole in the copper-clad laminate; (B) placing a mask having a pad-shaped opening on the copper-clad laminate; (C) filling the through hole using a paste while the mask is interposed therebetween and forming a pad at the same time; (D) hardening after mounting the electric element on the pad; A method of manufacturing a printed circuit board incorporating an electric device comprising the step of sequentially stacking an insulating layer and an inner layer circuit accommodating the electric device. The method of claim 1, The step (a) is a method of manufacturing a printed circuit board containing an electric element for forming an inner layer circuit after the through hole in the copper-clad laminate. The method of claim 1, In the step (a), the inner circuit is formed on the copper-clad laminate, and then the printed circuit board manufacturing method includes an electric element for drilling through holes. The method of claim 1, The insulating layer is a printed circuit board manufacturing method incorporating an electric element having a cavity for receiving the electric element. The method of claim 4, wherein The insulating layer is a manufacturing method of a printed circuit board containing an electric device that is unclad (unclad). The method of claim 4, wherein The insulating layer is a printed circuit board manufacturing method containing a pre-preg electric element. The method of claim 4, wherein The insulating layer is a printed circuit board manufacturing method incorporating an electric element including an unclad and prepreg. A copper foil laminated plate having an inner layer circuit and perforated therethrough; A paste forming a pad on the copper-clad laminate and filling the through hole, A printed circuit board having an insulating layer having a cavity for accommodating an electric element, and an electric element in which conductor circuits electrically connected to the electric element are alternately stacked on the copper-clad laminate. The method of claim 8, The insulating layer is a printed circuit board containing an electric element of unclad (unclad). The method of claim 8, The insulating layer is a printed circuit board containing a pre-preg electric element. The method of claim 8, The insulating layer is a printed circuit board containing an electric element including an unclad and prepreg.

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