KR20070005314A - Apparatus for depositing the organic thin film - Google Patents

Abstract

An apparatus for depositing an organic thin film is provided to improve yield by performing a continuous deposition process of supplying an organic thin film deposition material of solid powder and evaporating the material and injecting the material to a substrate. A substrate(120) and a mask(130) are arranged in a chamber(100). A supply unit(200) is arranged outside the chamber, and supplies an organic thin film deposition material of solid powder. An injection unit(140) evaporates the organic thin film deposition material supplied from the supply unit and then injects the organic thin film deposition material to the substrate. The injection unit includes a heating unit for heating the organic thin film material of solid powder, and an injection unit for injecting the evaporated organic thin film material to the substrate.

Description

Organic thin film deposition apparatus {Apparatus for depositing the organic thin film}

1 is a conceptual diagram of a conventional thin film deposition apparatus.

2 is a conceptual diagram of a thin film manufacturing apparatus according to an embodiment of the present invention.

3 is a conceptual view showing a first modification of the deposition source supply unit according to the embodiment of the present invention.

4A and 4B are graphs for explaining the operation of the deposition source supply unit.

5 is a conceptual view showing another modified example of the deposition source supply unit according to the embodiment of the present invention.

6 and 7 are views for explaining the metering unit.

8 is a conceptual view showing a third modification of the evaporation source supply unit.

9 is a conceptual view showing a fourth modification of the evaporation source supply unit.

<Explanation of symbols for main parts of the drawings>

10, 100: chamber 20, 120: substrate

40 crucible 140 injection unit

200: deposition source supply unit

The present invention relates to an organic thin film deposition apparatus, and more particularly, to a source supply apparatus of an organic thin film manufacturing apparatus used in the organic thin film deposition process.

In general, the organic material used in the organic thin film deposition process does not have a high vapor pressure, unlike the inorganic material, it is easy to decompose and denature at high temperatures.

Due to the characteristics of these materials, the conventional organic thin film was deposited using a low resistance heating evaporation source equipped with a crucible made of tungsten or tantalum.

1 is a conceptual diagram of a conventional organic thin film deposition apparatus.

Referring to FIG. 1, a conventional thin film deposition apparatus includes a reaction chamber 10, a substrate 20 disposed on the reaction chamber 10, a mask 30 disposed on a lower surface of the substrate 20, and a reaction chamber. 10 includes a crucible 40 in which a predetermined deposition raw material 50 is stored below.

Here, in order to deposit a predetermined thin film according to a mask pattern disposed under the substrate 20, the crucible 40 is heated to evaporate the deposition raw material 50 inside the crucible, and the vaporized deposition raw material is deposited on the substrate. .

However, when depositing through a conventional thin film deposition apparatus, the amount of deposition raw materials that can be stored in the crucible is limited so that a new deposition raw material is put into the crucible for each deposition process, or after several to several tens of deposition processes, There is a problem of newly injecting the deposition material. In order to newly inject the deposition material into the crucible, the deposition process should be stopped and then the deposition material should be injected into the crucible in the chamber. Therefore, there is a problem that the continuous thin film deposition process is not performed, the yield of the process is lowered, and the uniformity of the entire device is lowered. In addition, since the width of the opening of the crucible is narrow, there is a problem that it is difficult to deposit a uniform thin film on the substrate.

Therefore, the present invention is to supply the organic thin film deposition material in the form of a solid powder to the chamber in order to solve the above problems, the organic thin film deposition material is vaporized, the substrate is sprayed by a continuous deposition process can be made a process yield It is an object of the present invention to provide an organic thin film deposition apparatus capable of improving and depositing a thin film having improved uniformity.

A substrate having a substrate and a mask disposed therein, a supply unit disposed outside the chamber to supply organic thin film deposition raw materials in the form of a solid powder, and vaporized by receiving the organic thin film deposition raw materials from the supply unit. An organic thin film manufacturing apparatus including a spraying unit spraying onto a substrate is provided.

Here, the spraying unit preferably includes heating means for heating the organic thin film raw material in the form of solid powder and spraying means for spraying the organic thin film raw material vaporized by heating onto the substrate.

The supply unit includes a tank in which the organic thin film deposition raw material in the form of a solid powder is stored, first and second pipes having one end connected to an inlet and an outlet of the tank, respectively, and the other ends of the first and second pipes being intermediate. A third pipe connected to the transport gas supply source, one end connected to the transport gas supply source, the other end connected to the chamber, and a first valve provided at an intermediate portion of the first pipe to control transport gas inflow into the tank; A first pressure regulating unit for adjusting a pressure in the tank, a second valve disposed in the middle of the second pipe to control the discharge of the organic thin film deposition raw material in the form of a solid powder, and the first and second pipes being the third A third valve positioned between two points in communication with the pipe to control the flow of the transport gas, and a second pressure regulating part to control the pressure at the other end of the third pipe. It is effective. At this time, it is effective to open and close the second valve at predetermined time intervals.

The supply unit preferably includes a tank in which the organic thin film deposition raw material in the form of a solid powder is stored, and a fixed-quantity supply unit connected to a lower portion of the tank to discharge the organic thin film deposition raw material in the form of a solid powder in a uniform amount. At this time, it is effective to use a screw type pump or a uniaxial eccentric screw type pump.

The above-mentioned supply unit uses a dispenser including a tank in which an organic thin film deposition raw material in the form of a solid powder is stored, a nozzle provided at the bottom of the tank, a valve for opening and closing the nozzle, and a pneumatic control unit for controlling the pressure in the tank. Alternatively, the supply unit may use a tank in which an organic thin film deposition raw material in the form of a solid powder is stored, and a plunger pump mounted between the tank and the chamber.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like numbers refer to like elements in the figures.

2 is a conceptual diagram of an organic thin film manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 2, the organic thin film manufacturing apparatus according to the present exemplary embodiment includes a chamber 100 in which a substrate 120 is disposed, a mask 130 disposed on the substrate 120, and an outside of the chamber 100. And a supply unit 200 supplying the organic thin film raw material in the form of a solid powder, and an injection unit 140 that receives the organic thin film raw material from the supply unit 200 and vaporizes the organic thin film raw material to spray the substrate 120. do. The apparatus may further include pressure means (not shown) for adjusting the pressure inside the chamber 100 and exhaust means (not shown) for discharging the by-products inside the chamber 100.

In this embodiment, as shown in FIG. 2, the substrate 120 is disposed below the chamber 100, and the mask 130 is disposed above the substrate 120. To this end, a predetermined mounting unit (not shown) may be formed in the lower portion of the chamber 100, and an alignment unit (not shown) for aligning the substrate 120 and the mask 130 may be provided. This may be formed. In addition, a separate fixing unit (not shown) for fixing the mask 130 and the substrate 120 may be formed.

It is preferable to use a glass substrate as the substrate 120. In addition, the mask 130 may be manufactured in a shape in which an area to be patterned is opened on the substrate 120, or may be manufactured in a shape in which a central area of the substrate 120 is opened.

In the upper part of the chamber 100, an injection unit 140 is disposed to receive an organic thin film raw material in the form of a solid powder from the supply unit 200 and vaporize it to spray the lower substrate. Therefore, the spraying unit 140 includes a separate heating means (not shown) for heating the organic thin film raw material in the form of a solid powder and predetermined spraying means (not shown) for spraying the organic thin film raw material vaporized by heating. Comprise. Here, the heating means and the injection means may be disposed separately or may be arranged integrally.

Here, the injection unit 140 may be formed in the same shape as the substrate 120 to apply the organic thin film raw material uniformly vaporized on the substrate 120. In addition, the spraying unit 140 is not fixed, and may be rotated or left and right / forward / backward movement so that the vaporized organic thin film material is uniformly sprayed.

In addition, a predetermined heating means may be provided in an area between the supply unit 200 and the injection unit 140 to preheat the organic thin film material in the form of a solid powder. Through this, the vaporization rate of the organic thin film raw material in the injection unit 140 may be improved to improve the thin film deposition rate.

As mentioned above, the present invention is organic in the exterior of the chamber 100 through a separate supply unit 200 which is located outside the chamber 100 to supply the solid powder, that is, the deposition material in the form of powder into the chamber 100. The thin film deposition raw material can be supplied automatically.

In this case, a supply unit having various structures and shapes may be provided according to a supply method of the organic thin film deposition material in the form of a solid powder.

Hereinafter, a modification of the supply unit according to the present embodiment will be described with reference to the drawings.

3 is a conceptual diagram showing a first modification of the supply unit according to the embodiment of the present invention.

Referring to FIG. 3, a tank 201 in which the deposition material for organic thin film is stored, first and second pipes A1 and A2 connected at one end to an inlet and an outlet of the tank 201, and the first and The other ends of the second pipes A1 and A2 communicate with each other, one end is connected to the transport gas supply CG, and the other end is connected to the injection unit 140 of the chamber 100 shown in FIG. A third valve A3, a first valve V1 provided at an intermediate portion of the first pipe A1 for controlling the inflow of the transport gas into the tank 201, and a pressure inside the tank 201 for adjusting the pressure; The first pressure regulator 203, the second valve (V2) provided in the middle of the second pipe (A2) for controlling the discharge of the deposition material in the form of a solid powder, and the first and second pipes (A1, The pressure at the other end of the third valve V3 and the third pipe A3 is positioned between the two points where A2 is in communication with the third pipe A3. The control includes a second pressure regulator 205. In order to remove the deposition material in the form of a solid powder remaining in the third pipe A3, the third valve V3 is opened in a state in which the first valve V1 and the second valve V2 are closed. open) and introduce a carrier gas, where the flow of carrier gas enters a vent line (not shown). That is, the transport gas flow is connected to the vent line without entering the chamber 100.

 Further comprising a transport gas supply means (not shown) for supplying a predetermined transport gas to the transport gas inlet (CG). The apparatus further includes a block portion 207 disposed inside the tank 201 to prevent backflow of the organic thin film deposition material in the form of a solid powder.

Briefly describing the operation of the supply unit according to a modification of the present invention having the above-described configuration is as follows.

The supply unit 200 according to the present modification transmits the deposition raw material in the tank 201 to the injection unit 140 inside the chamber 100 in the form of a solid powder using a transport gas. Hereinafter, this will be described in more detail.

First, the deposition material in the form of a solid powder is injected into the chamber 100 according to a laminar flow method and a turbulence flow method according to the state of the tank.

First, the laminar flow method will be described. The pressures of the first and second pressure regulators 203 and 205 are constantly maintained, the first to second valves V1 and V2 are opened, and the third valve V3 is used. As shown in FIG. 4A, the pressure P1 inside the tank 201 and the pressure P2 of the deposition raw material outlet SP are kept constant. Due to the constant pressure, the organic thin film deposition raw material in the form of solid powder is supplied to the injection unit 140 inside the chamber 100 through the raw material outlet SP in the tank 201 by the transport gas. do.

Next, the turbulent flow method will be described. The pressures of the first and second pressure regulators 203 and 205 are kept constant, the first valve V1 is opened, and the second valve V2 is opened and closed at predetermined time intervals. When the third valve V3 is closed, the pressure P1 inside the tank 201 and the pressure P2 of the deposition raw material outlet SP are changed instantaneously as shown in FIG. 4B. Vortex occurs at That is, in the state in which the second valve V2 is locked, the pressure inside the tank 201 maintains a high pressure state, and the deposition source discharge port SP maintains a low pressure state. At this time, when the second valve V2 is opened, the pressure in the tank 201 drops, and conversely, the pressure in the deposition raw material outlet SP increases. When the second valve V2 is closed again, the pressure inside the tank 201 rises again, and the pressure of the deposition raw material outlet SP drops. As such, vortices are generated in the tank 201 due to the pressure change inside the tank 201, and the organic thin film deposition material in the form of a solid powder is formed inside the chamber 100 through the raw material outlet SP due to the vortex phenomenon. Is supplied to the injection unit 140.

In addition, in the second modified example of the deposition source supply unit including a quantitative supply unit for injecting a certain amount of solid powder form deposition material into the chamber between the end of the tank in which the organic thin film deposition material is stored and the deposition source outlet. Explain.

Hereinafter, a second modification of the deposition source supply unit will be described with reference to the drawings.

5 is a conceptual diagram illustrating a second modified example of the deposition source supply unit according to the embodiment of the present invention, and FIGS. 6 and 7 are views for explaining the metering unit.

Referring to FIG. 5, the deposition source supply unit 200 according to the present modification is connected to a tank 210 in which deposition raw materials are stored and is connected to a lower portion of the tank 210 to discharge the deposition raw materials in the form of a solid powder in a uniform amount. It includes a fixed amount supply unit 220. At this time, the tank 210 may further include a separate auxiliary tank 211 for supplying the deposition material to the tank 210, a valve for supplying the deposition material in the form of a solid powder between the tank 210 and the auxiliary tank 211. 212 is disposed.

The input end of the above-mentioned fixed quantity supply part 220 is connected to the lower part of the tank 210, and the output end is connected to the injection unit 140 inside the chamber 100 to deposit a uniform amount of solid powder in the chamber 100. Raw materials can be discharged.

Here, at least one of the first to third valve structures of the first modification may be applied to the second modification. There may be a separate check valve to open and close the output stage depending on the flow of the transport gas.

The fixed-quantity supply unit 220 is configured to periodically discharge a predetermined amount of solid powder deposition material, in the present modification, the screw type pump 220 shown in FIG. 6 and the uniaxial eccentric screw type shown in FIG. 7. It is preferable to use a pump 220 '. These pumps are commonly known configurations and will be briefly introduced in the following.

The screw type pump 220 has an input end and an output end as shown in FIG. 6, a housing 221 having an empty inside, a rotating shaft 223 penetrating through the housing 221, and a screw thread is formed between the input end and the output end. It includes a motor 225 for rotating the rotary shaft 223. The output end is formed in one edge area of the lower portion of the housing 221, and the input end is formed in a central area of the upper portion of the housing 221. Looking briefly at the operation of the screw type quantitative supply unit 220 having the above-described configuration and the deposition source supply unit 200 including the same. First, when the motor 225 of the fixed-quantity supply unit 220 is driven to rotate the rotating shaft 223 in which the screw thread is formed, the screw thread rotates. Thus, the deposition material in the form of a solid powder injected through the input end is pushed toward the output end by the rotational movement of the screw line, and finally the organic thin film deposition material in the form of a solid powder is discharged to the output end. At this time, by controlling the rotational speed of the screw thread, the volume of the thread, and the volume of the input and output terminals, it is possible to uniformly inject the organic thin film deposition material in the form of a target solid powder into the chamber 100.

Next, the uniaxial eccentric screw type pump 220 'includes a stator 231 connected to an output end, a rotor 233 disposed in the stator 231, and a rotor 233 and a drive as shown in FIG. A coupling rod 234 connecting the shaft 237, the loader 233, and the drive shaft 237 through the universal joint 235, and the universal joint 235, the coupling rod 234, and the drive. The shaft 237 is disposed therein and includes a housing 239 having an input end and a motor 225 for driving the drive shaft 237.

The operation of the uniaxial eccentric screw type pump 220 'having the above-described configuration and the deposition source supply unit 200 including the same will be briefly described as follows. First, the deposition raw material is supplied through the input terminal, and the rotor 233 fitted to the drive shaft 237 and the universal joint 235 is rotated at the eccentric shaft center. The rotor 233 rotates inside the stator 231 and moves a predetermined space in the direction of travel so that the deposition material in the form of solid powder filling the space moves to the output stage, and the deposition material in the form of a solid powder form through the output stage. Can be discharged.

In addition, a deposition source supply unit using a separate dispenser can be used. Hereinafter, a third modification of the deposition source supply unit will be described with reference to the drawings.

8 is a conceptual diagram illustrating a third modification of the deposition source supply unit.

Referring to FIG. 8, the deposition source supply unit 200 according to the present modification includes a tank 241 in which deposition raw materials are stored, a nozzle 245 provided under the tank 241, and a valve 243 for opening and closing the nozzle. And a pneumatic control unit 247 for controlling the air pressure inside the tank 241.

The nozzle 245 described above may be connected to the injection unit 140 inside the chamber 100 to supply an organic thin film deposition material in the form of a solid powder in a uniform amount inside the chamber 100. That is, when the pressure inside the tank 241 is increased by the pneumatic control unit 247, and the valve 243 is opened, the organic thin film deposition raw material in the form of a solid powder is injected through the nozzle 245. In addition, by installing a vibrator or screw (not shown) in the nozzle unit 245, the nozzle unit 245 may be closed or narrowed when the next process is performed due to the remaining of the deposition material. Here, at least one of the first to third valve structures of the first modification may be applied to the third modification.

In addition, a deposition source supply unit using a plunger can be used. Hereinafter, a fourth modification of the deposition source supply unit will be described with reference to the drawings.

9 is a conceptual diagram illustrating a fourth modification of the deposition source supply unit.

Referring to FIG. 9, the deposition source supply unit 200 according to the present modification is configured to uniformly discharge the organic thin film deposition raw material in the form of a solid powder of the tank 251 in which the deposition raw material is stored and the tank 251 to the outside. Plunger pump 252. The plunger pump 252 may include a housing 253 having a through space having an input end and an output end formed therein, and an input (having one direction from top to bottom) positioned at an input end and an output end of the through space. Output check valves 254 and 255 and a plunger 257 disposed in the pressurizing space in a pressurizing space communicating with the through space in a direction orthogonal to each other to perform the forward and backward movement.

In the deposition source supply unit 200 having the above-described configuration, the opening and closing of the check valves 254 and 255 are controlled according to the forward and backward movement of the plunger 257 in the plunger pump 252, so that the organic matter in the form of a solid powder of the tank 251 is controlled. The thin film deposition raw material is output to the output stage. The organic thin film deposition material in the form of a solid powder is vaporized by the injection unit 140 inside the chamber 100 connected to the output terminal and uniformly sprayed into the chamber 100. That is, when the plunger 257 moves to the right with reference to the drawing and the pressure in the through space is reduced, the output check valve 255 is closed and the input check valve 254 is opened to solid powder in the tank 251. Organic thin film deposition material in the form is introduced into the through space. Subsequently, when the plunger 257 moves to the left side based on the drawing, the pressure in the through space increases, and the input check valve 254 is blocked, and the output check valve 255 is opened to introduce the solid powder introduced into the through space. The organic thin film deposition raw material in the form is discharged to the output stage. Therefore, according to the left and right forward and backward movements of the plunger 257, the degree of discharge and the discharge amount of the organic thin film deposition material in the form of a solid powder can be controlled. In this case, at least one of the first to third valve structures of the first modification may be applied to the fourth modification.

In addition, the present invention may be free to arrange the substrate inside the chamber because the deposition source for depositing the organic thin film in the form of a solid powder is supplied from the outside of the chamber through the deposition source supply unit. That is, as shown in FIG. 2, the substrate may be disposed under the chamber, the substrate may be disposed in the upper region of the chamber, or the substrate may be disposed in both sidewall regions of the chamber. Accordingly, the arrangement of the injection unit can also be changed freely.

As described above, the present invention may supply a deposition material for depositing an organic thin film in the form of a solid powder from the outside of the chamber to perform a continuous organic thin film deposition process without interrupting the process.

In addition, an organic thin film having improved uniformity may be deposited by receiving a deposition raw material in the form of a uniform amount of solid powder, vaporizing it and uniformly spraying the same in a chamber.

Claims (8)

A chamber having a substrate and a mask disposed therein; A supply unit disposed outside the chamber to supply an organic thin film deposition material in the form of a solid powder; And And a spraying unit which receives the organic thin film deposition raw material from the supply unit and vaporizes the sprayed material onto the substrate. The method of claim 1, wherein the injection unit, Heating means for heating the organic thin film raw material in the form of a solid powder; And An organic thin film manufacturing apparatus including the spray means which injects the organic thin film raw material vaporized by heating to the said board | substrate. The method according to claim 1, wherein the supply unit, A tank in which the organic thin film deposition raw material in the form of a solid powder is stored; First and second pipes one end of which is respectively connected to an inlet and an outlet of the tank; Third pipes connected at opposite ends of the first and second pipes to each other, at one end connected to a transport gas supply source, and at the other end connected to the chamber; A first valve provided at an intermediate portion of the first pipe to control inflow of transport gas into the tank; A first pressure control unit controlling a pressure in the tank; A second valve disposed in the middle of the second pipe to control discharge of the organic thin film deposition raw material in the form of a solid powder; A third valve positioned between the two points at which the first and second pipes communicate with the third pipe to control the flow of the transport gas; And Organic thin film deposition apparatus comprising a second pressure control unit for controlling the pressure of the other end of the third pipe. The method according to claim 3, Organic thin film deposition apparatus for opening and closing the second valve at a predetermined time interval. The method according to claim 1, wherein the supply unit, A tank in which the organic thin film deposition raw material in the form of a solid powder is stored; And And a fixed-quantity supply unit connected to a lower portion of the tank to discharge the organic thin film deposition material in the form of a solid powder in a uniform amount. The method according to claim 5, The fixed quantity supply unit is an organic thin film deposition apparatus using a screw type pump or a uniaxial eccentric screw type pump. The method according to claim 1, The supply unit uses a dispenser including a tank in which an organic thin film deposition raw material in the form of a solid powder is stored, a nozzle provided at the bottom of the tank, a valve for opening and closing the nozzle, and a pneumatic control unit for controlling the pressure in the tank. Organic thin film deposition apparatus. The method according to claim 1, The supply unit is an organic thin film deposition apparatus using a tank in which the organic thin film deposition raw material in the form of a solid powder, and a plunger pump mounted between the tank and the chamber.

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