KR20070000716A - Apparatus of rotatable heat sink - Google Patents

Abstract

A rotatable heat sink apparatus is provided to reduce an installation space by having hinge-coupled upper and lower cooling plates. In a rotatable heat sink apparatus, a lower cooling plate(110) is mounted at one side of a semiconductor DRAM module(130). An upper cooling plate(120) is hinge-coupled with a rotation axis(140) installed at one end portion of the lower cooling plate(110). The rotation axis(140) is a heat pipe.

Description

Rotatable heat sink {Apparatus of rotatable heat sink}

1 is a front view showing a conventional heat dissipation device,

2 is a front view showing a heat dissipation device according to an embodiment of the present invention;

3 is a side view showing the heat dissipation device of FIG.

4 is a cross-sectional view illustrating a heat dissipation device taken along a line IV-IV of FIG. 3.

<Description of the symbols for the main parts of the drawings>

110 ... lower heat sink 120 ... upper heat sink

130 ... semiconductor DRAM module 140 ... axis of rotation

150 ... Thermal Grease

The present invention relates to a heat dissipation device, and more particularly to a rotatable heat dissipation device used in a memory semiconductor module.

In general, the heat radiating device radiates high-temperature heat generated by driving of electronic components to the outside to prevent malfunction of electronic components and the like due to high temperatures.

Recently, in the case of an electronic component such as a memory semiconductor, the power consumption is increased due to the reduction in size and speed, and thus heat generation in the memory semiconductor itself is increasing.

However, as illustrated in FIG. 1, the conventional heat sink 20 installed in the semiconductor DRAM module 10 may not properly radiate heat, which is increased in accordance with an increase in power consumption of the semiconductor DRAM module, to the outside.

In addition, there is a problem in that the heat dissipation area of the heat sink is not easy to increase due to the miniaturization of the memory semiconductor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide an improved heat dissipation device that can reduce the space occupied area of a heat dissipation device while expanding the heat dissipation area of the heat dissipation device.

The heat dissipation device of the present invention for achieving the above object, the lower heat sink mounted on one side of the semiconductor DRAM module; And an upper heat sink hinged to a rotation shaft provided at one end of the lower heat sink.

Here, the rotating shaft is preferably a heat pipe.

Moreover, it is preferable that thermal grease is apply | coated to the said rotating shaft.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a front view showing a heat dissipation device according to an embodiment of the present invention.

Referring to the drawings, the heat dissipation device includes a lower heat sink 110 and an upper heat sink 120.

The lower heat sink 110 is mounted on one side of the semiconductor DRAM module 130 to radiate heat generated when the semiconductor DRAM module 130 is driven to the outside.

The upper heat sink 120 may be hinged to the rotation shaft 140 provided at one end of the lower heat sink 110 to rotate in both directions about the lower heat sink 110.

Meanwhile, the rotating shaft 140 provided at one end of the lower heat sink 110 is a heat pipe. The reason for employing the heat pipe is that the heat transfer rate from the lower heat sink 110 to the upper heat sink 120 is increased. It is to improve.

And thermal grease (150) is applied to the surface of the rotating shaft 140 to improve the heat transfer rate as described above, and to facilitate the rotation of the upper heat sink 120 with respect to the lower heat sink 110, the upper heat sink When the rotation of the 120, the rotation shaft 140 and the lower heat sink 110 and the upper heat sink 120 which are in contact with each other to prevent wear.

According to the heat dissipation device having such a configuration, the heat radiation area is further increased while minimizing the space occupancy in compact systems such as a memory semiconductor module, a notebook computer, and a 1U server, which are becoming smaller and smaller. You can radiate more to the outside.

According to the heat dissipation device of the present invention as described above, it is possible to provide the effect of radiating a greater amount of heat to the outside, while reducing the occupied area of the space to be installed by having a hinged coupled rotatable upper and lower heat dissipation plate have.

It is to be understood that the invention is not limited to that described above and illustrated in the drawings, and that more modifications and variations are possible within the scope of the following claims.

Claims (3)

A lower heat sink mounted on one side of the semiconductor DRAM module; And And an upper heat sink hinged to a rotating shaft provided at one end of the lower heat sink. The method of claim 1, The rotating shaft is a heat pipe, characterized in that the heat pipe. The method of claim 1, And a thermal grease is applied to the rotating shaft.

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