KR20060126009A - All-precipitation roller plating apparatus - Google Patents

Abstract

A fully immersed roller rotating type plating equipment that improves plating quality uniformly and also reduces plating time by preventing the surface of a treatment object from being exposed to the atmosphere during plating is provided. In a plating equipment(100) capable of performing rotary plating by dipping a roller(10) which is axially connected to a shaft(12) longitudinally and has rotary supporting shafts(14) at both sides into a plating solution contained plating vat, a fully immersed roller rotating type plating equipment comprises: a plating vat(110) having openings(112) at both sidewalls thereof; a pair of vertically symmetrical finished wall bodies(120) having shaft supporting holes for closely supporting the rotary supporting shafts; O-ring packings(130,130') for closely packing between inner portions of the finished wall bodies and the rotary supporting shafts; plate-shaped packings(140) for closely packing between the finished wall bodies and the edges of the openings of the plating vat; an electrode rod(160) which is contained in the plating vat, and to which a basket(150) having a receiving part(152) therein is connected to receive a positive electric potential; a carbon electrode(170) connected to one side of the shaft of the roller to receive a negative electric potential; an overflow storage tank(180) connected to an outer surface of the finished wall bodies to receive a plating solution overflown; a power supply unit(190) for applying positive and negative voltages to first and second power supply lines(192,194); a plating solution supply means(200) for supplying a plating solution contained in the overflow storage tank into the plating vat; and a rotation supporting drive part for supporting the shaft of the roller and transmitting rotary power to the shaft.

Description

All-precipitation roller plating apparatus

1 is a perspective view showing a combined sedimentation roller rotating plating apparatus according to the present invention,

Figure 2 is an exploded perspective view showing a fully settled roller rotating plating apparatus according to the present invention,

Figure 3 is a combined cross-sectional view showing a fully settled roller plating rotating apparatus according to the present invention.

<Description of Symbols for Major Parts of Drawings>

100: plating device

110: plating bath

112: opening 114: coupling bolt

116: nut

120, 120 ': finishing wall

122a, 122a ': bolt hole 122b, 122b': shaft hole

130, 130 ': O-ring packing 140: Plate packing

150: basket

152: storage

160: electrode 170: carbon electrode

180: overflow reservoir

182a: Bolt Ball

190: power supply

192: first power supply line 194: second power supply line

200: plating solution supply means

210: drainage pipe 220: plating solution storage tank

230: pump 240: filter

250: heat exchanger

300 supply pipe

302: discharge port

410; Motor 412: Drive Roller

422: idle roller

The present invention relates to a fully settled roller rotary plating apparatus which can improve plating quality with a uniform plating thickness and can also shorten plating time.

In general, plating refers to an operation of coating a thin layer of a metal or an alloy on the surface of an object to be treated.

Such plating may be classified in various ways depending on the method and purpose, but the central method is electroplating, and in most cases, plating refers to electroplating.

Briefly explaining the principle of electroplating, the object to be plated is a cathode, the metal to be electrodeposited is an anode, and these are put in an electrolyte solution containing metal ions to be electrodeposited and the two electrodes are energized. The phenomenon in which the desired metal ions are electrolytically precipitated on the surface of the object to be treated by electrolysis is used.

Conventionally, after partially depositing an object to be treated in a plating bath containing a sufficient amount of electrolyte, a cathode electrode is provided on the object to be treated, and a cathode electrode is provided at a position opposite to the cathode electrode.

Therefore, when a cathode voltage is applied to the cathode electrode and an anode voltage is applied to the anode electrode, a reduction reaction occurs at the cathode electrode, and an oxidation reaction occurs at the anode electrode, thereby depositing metal ions on the surface of the object. You will get

The conventional plating apparatus having such a configuration has a problem in that the plating quality is degraded as the plating surface is exposed to the air during rotational non-rotational plating due to partial precipitation rather than full settling so that continuous plating is not performed and plating is interrupted. In addition, there is a problem in that if the plating at the same current density it becomes longer by the rate of exposure to the atmosphere.

The present invention has been made in order to solve the problems of the prior art as described above, because the surface of the object to be treated during plating is not exposed to the atmosphere, it is possible to improve the homogeneous plating quality and to reduce the plating time, the complete settling roller rotation The purpose is to provide a plating apparatus.

In order to achieve the above object, the present invention is a plating apparatus capable of rotating plating by plating a roller having a supporting rotary shaft axially coupled in the longitudinal direction of the shaft in a plating bath containing a plating solution, the plating tank having openings on both side walls and ; A pair of finishing walls coupled to the opening portion and having a vertically symmetrical shape for tightly supporting the support shaft of the roller; An O-ring packing for tightly connecting the interior of the finishing wall and the support shaft of the roller; A plate-shaped packing intimately between the finishing wall and the edge of the opening of the plating bath; An electrode rod accommodated in the plating bath and having a basket having an accommodating portion therein to receive a positive potential; A carbon electrode coupled to one side of the shaft of the roller to allow a negative potential to flow therethrough; An overflow storage tank coupled to an outer surface of the finishing wall to accommodate a plating liquid that overflows; A power supply device for supplying power to the first and second power supply lines respectively connected to the carbon electrode and the electrode; Plating solution supply means for circulating the plating solution contained in the overflow storage tank into the plating tank; It characterized in that it comprises a rotary support drive for transmitting a rotational force to the shaft shaft while supporting the shaft shaft of the roller.

The plating solution supply means may include: a plating solution storage tank connected to a drain pipe formed under the overflow storage tank to store the plating solution accommodated in the overflow storage tank; A pump for pumping the plating liquid collected in the plating liquid storage tank into the plating tank; A filter for removing impurities in the plating liquid that is pumped by the pump; A heat exchanger for cooling the pure plating liquid caught by the filter; And a supply pipe connected to the heat exchanger and disposed on a bottom surface of the plating bath and having a plurality of discharge ports.

In addition, the rotary support driving unit and the two support rollers spaced apart to support the one side shaft of the roller and transmitting the rotational force of the motor to the shaft; It characterized in that it comprises two idle rollers that are freely rotated while supporting the other shaft of the roller.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a combined perspective view showing a fully settled roller rotating plating apparatus according to the present invention, Figure 2 is an exploded perspective view showing a fully settled roller rotating plating apparatus according to the present invention, Figure 3 is a fully settled type according to the present invention Joined cross-sectional view showing a roller rotating plating apparatus.

As shown in Figures 1 to 3, the fully-precipitated roller plating apparatus according to the present invention is axially coupled in the longitudinal direction of the shaft 12, the plating liquid 1 is accommodated in the roller 10 having the support shaft 14 In the plating apparatus 100 that can be plated in the plating bath 110,

Plating tank 110 having an opening 112 on both side walls is provided, a plurality of coupling bolts 114 are formed in the edge portion of the opening 112 of the plating tank 110.

A bolt hole 122a is formed to correspond to the coupling bolt 114, and a finishing wall 120 having a bearing hole 122b is formed therein so as to be closely supported with the support rotation shaft 14 of the roller 10. .

In addition, the finishing wall 120 is coupled to the lower portion of the finishing wall 120 is made of a symmetrical shape, a bolt hole (122a ') is formed to correspond to the coupling bolt 114, the roller ( 10 is provided with a finishing wall 120 'having a shaft hole 122b' for tightly supporting the rotating shaft 14 of the support shaft 14 inserted therein.

Therefore, the bolt bolt 122a is fitted into the coupling bolt 114 to be fastened and fixed with the nut 116.

At this time, the O-ring packing (130, 130 ') is tightly coupled between the interior of the finishing wall (120, 120') and the support shaft 14 of the roller (10).

In addition, the closing wall (120, 120 ') and the plate-shaped packing 140 is coupled so that the edge of the opening 112 of the plating bath 110 is tightly coupled.

The electrode rod 160 is accommodated in the plating bath 110 and the basket 150 having the accommodating part 152 therein is coupled to receive both potentials.

The accommodating part 152 of the basket 150 accommodates the metal of the plating material.

The carbon electrode 170 is provided in contact with the shaft 12 of the roller 10 to receive a negative potential and flow therethrough.

An overflow storage tank 180 is provided to accommodate the plating liquid 1 that is coupled to the outer surface of the finishing wall 120 'and overflows, and the overflow storage tank 180 has a plating tank 110 at an edge portion thereof. The bolt hole 182a is formed to correspond to the coupling bolt 114 of the fastening and fixed to the finishing wall (120 ').

In addition, the drain pipe 210 is coupled to the lower portion of the overflow storage tank 180.

A power supply device 190 is provided to apply plating power to the first and second power supply lines 192 and 194 respectively connected to the carbon electrode 170 and the electrode rod 160.

Plating liquid supply means 200 for supplying and circulating the plating liquid 1 accommodated in the overflow storage tank 180 into the plating tank 110 is provided.

In addition, a rotation support driving unit for transmitting a rotational force while supporting the shaft 12 of the roller 10 is provided. The rotation support driving unit receives the rotational power of the motor 410 by the sprocket and the chain coupling means two drive rollers 412 for rotating the one shaft 12 of the roller 10, and the roller 10 It is provided with two idle rollers 422 that are free to rotate and support the other side of the shaft. The driving roller 412 and the idle roller 422 are made of metal and are fixed by a structure, not shown, so that the roller 10 can be rotated by the frictional force in contact with the roller 10.

The plating liquid supplying means 200 is connected to a drain pipe 210 formed at the bottom of the overflow storage tank 180 to store the plating liquid 1 accommodated in the overflow storage tank 180. Is provided, the pump 230 for pumping the plating liquid 1 collected in the plating liquid storage tank 220 into the plating tank 110 is provided, the of the plating liquid (1) that is pumped by the pump 230 A filter 240 is provided to remove impurities. A heat exchanger 250 is provided to heat or cool the pure plating solution 1 caught by the filter 240 to a temperature suitable for plating. Is connected to the machine 250 is disposed on the bottom surface of the plating bath 110 is provided with a supply pipe 300 having a plurality of discharge ports 302 is provided.

Looking at the process by the apparatus of the present invention having the configuration as described above, by applying a negative potential to the carbon electrode 170 connected to the shaft of the roller 10 completely settled in the plating bath 110, the electrode rod Positive potential is applied to 160.

As the carbon electrode 170 causes an oxidation reaction and the electrode rod 160 generates a reduction reaction, the metal film is plated by depositing metal ions on the surface of the roller 10.

When the plating solution 1 stored in the plating bath 110 overflows, the plating solution 1 is contained in the overflow storage tank 180 and collected in the plating solution storage tank 220 provided outside.

The collected plating liquid 1 is pumped by the pump 230 to remove impurities by the filter 240, and the pure plating liquid 1 from which the impurities are removed is heated to a temperature suitable for plating by the heat exchanger 250. Heat exchange.

The cooled plating liquid 1 is discharged through the plurality of discharge ports 302 of the supply pipe 300 disposed on the bottom surface of the plating tank 110.

The discharged plating solution 1 is circulated in the plating bath 110 to be stirred.

Therefore, the plating quality accommodated in the fully-precipitated roller 10 and the receiving portion 152 of the basket 150 can be improved in plating quality with homogeneous plating properties and the plating time can be shortened.

The above description is only an example of the present invention, and some mechanical modifications may be freely. Therefore, the greatest feature of the present invention is a plating apparatus capable of rotating plating by completely settling a roller, which is one of the plating objects in the plating process, in the plating process, and all structural modifications satisfying this will be described as an embodiment of the present invention. .

As described above, the fully-precipitated roller rotary plating apparatus according to the present invention can provide homogeneous plating quality and shorten the plating process time, thereby enabling mass production.

Claims (4)

A plating apparatus capable of rotating plating by immersing a roller having a supporting rotary shaft on both sides in a shaft longitudinal direction in a plating bath containing a plating solution, A plating bath having openings on both side walls; A pair of top and bottom symmetrical finishing walls coupled to the opening and having a shaft hole for tightly supporting the support shaft of the roller; An O-ring packing for tightly connecting the interior of the finishing wall and the support shaft of the roller; A plate-shaped packing intimately between the finishing wall and the edge of the opening of the plating bath; An electrode rod accommodated in the plating bath and having a basket having an accommodating portion therein to receive a positive potential; A carbon electrode coupled to one side of the shaft of the roller to allow a negative potential to flow therethrough; An overflow storage tank coupled to an outer surface of the finishing wall to accommodate a plating liquid that overflows; A power supply device applying positive and negative voltages to the first and second power supply lines respectively connected to the carbon electrode and the electrode; Plating solution supply means for supplying and circulating the plating solution contained in the overflow storage tank into the plating bath; A rotation support driving unit configured to transmit a rotational force to the shaft shaft while supporting the shaft shaft of the roller downward; Fully settled roller rotation plating apparatus comprising a. The method of claim 1, The plating liquid supply means, A plating solution storage tank connected to a drain pipe formed under the overflow storage tank and storing the plating solution accommodated in the overflow storage tank; A pump for pumping the plating liquid collected in the plating liquid storage tank into the plating tank; A filter for removing impurities in the plating liquid that is pumped by the pump; A heat exchanger for heat-exchanging the pure plating liquid applied by the filter; And a supply pipe connected to the heat exchanger and disposed on the bottom surface of the plating bath and having a plurality of discharge ports. According to claim 1, The rotary support driving unit and the lower support two shafts for driving the roller and spaced apart to transmit the rotational force of the motor to the shaft; Fully-precipitated roller rotary plating apparatus characterized in that it comprises two idle rollers that are freely rotated while supporting the other shaft of the roller. A conventional plating apparatus for electroplating by depositing a roller having a shaft in a plating bath containing a plating solution, The openings are provided at both front and rear sides of the plating bath, and the openings are side-sealed with a finishing wall having a hole into which the shafts of the rollers are inserted. Fully-precipitated roller rotary plating apparatus characterized in that to enable to transmit the rotational force to the shaft.

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