KR20060125371A - Isolation valve for semiconductor manufacturing equipment - Google Patents

Isolation valve for semiconductor manufacturing equipment Download PDF

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Publication number
KR20060125371A
KR20060125371A KR1020050047384A KR20050047384A KR20060125371A KR 20060125371 A KR20060125371 A KR 20060125371A KR 1020050047384 A KR1020050047384 A KR 1020050047384A KR 20050047384 A KR20050047384 A KR 20050047384A KR 20060125371 A KR20060125371 A KR 20060125371A
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South Korea
Prior art keywords
housing
cover
sealing
sealing member
fixing groove
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KR1020050047384A
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Korean (ko)
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김정기
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삼성전자주식회사
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Priority to KR1020050047384A priority Critical patent/KR20060125371A/en
Publication of KR20060125371A publication Critical patent/KR20060125371A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
    • F16K17/003—Safety valves; Equalising valves, e.g. pressure relief valves reacting to pressure and temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/0092—Removing solid or liquid contaminants from the gas under pumping, e.g. by filtering or deposition; Purging; Scrubbing; Cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
  • Details Of Valves (AREA)

Abstract

An isolation valve for semiconductor manufacturing equipment is provided to prevent separation of a sealing member due to vibration of a turbo pump by forming a housing sealing fixing slit. A housing has a chamber port(121) connected to a side of a process chamber(210) and a pump port(123) connected to a side of a turbo pump(220). A cover(130) is prepared on an upper portion of the housing to cover it. A sealing member is mounted between the housing and the cover to seal up. A housing sealing fixing slit is formed on an upper surface to fix a side of the sealing member. A cover sealing fixing slit is formed on a lower surface of the cover to fix the other side of the sealing member. The housing sealing fixing slit is arranged to be opposite to the cover sealing fixing slit.

Description

반도체소자 제조설비용 아이솔레이션밸브{Isolation valve for semiconductor manufacturing equipment}Isolation valve for semiconductor manufacturing equipment

도 1은 본 발명에 따른 반도체소자 제조설비용 아이솔레이션을 도시한 구성도이다.1 is a block diagram showing an isolation for a semiconductor device manufacturing equipment according to the present invention.

도 2는 도 1의 A부분을 도시한 발췌도이다.FIG. 2 is an excerpt view showing a portion A of FIG. 1.

**도면의 주요 부분에 대한 부호의 설명**** Description of the symbols for the main parts of the drawings **

110 : 하우징110: housing

119 : 하우징실링고정홈119: housing sealing fixing groove

121 : 챔버포트121: chamber port

123 : 펌프포트123: pump port

130 : 커버130: cover

139 : 커버실링고정홈139: Cover Seal Fixing Groove

140 : 벨로우즈140: bellows

143 : 구동축143: drive shaft

151 : 스프링151: spring

160 : 실링부재160: sealing member

210 : 공정챔버210: process chamber

220 : 터보펌프220: turbo pump

본 발명은 반도체소자를 제조하기 위한 설비에 관한 것으로, 더욱 상세하게는 공정챔버와 터보펌프의 사이에 설치되어 소정 공정이 수행되는 공정챔버의 내부를 진공분위기로 형성하기 위한 반도체소자 제조설비용 아이솔레이션밸브에 관한 것이다.The present invention relates to a device for manufacturing a semiconductor device, and more particularly, isolating for a semiconductor device manufacturing equipment for forming a vacuum atmosphere inside the process chamber is installed between the process chamber and the turbo pump to perform a predetermined process It is about a valve.

일반적으로, 반도체소자를 생산하기 위한 반도체소자 제조공정은 순수 실리콘 웨이퍼(Silicon wafer) 상에 빛과 화학 반응하여 제거되는 포토레지스트(Photoresist)막을 형성한 후 포토레지스트막 중 원하는 소정 회로 패턴(Pattern)을 형성할 부분에 빛을 주사하여 포토레지스트막 중 원하는 부분만을 선택적으로 오픈(Open)시키는 사진공정과, 오픈된 부분을 소정 깊이로 식각(etching)하는 식각공정과, 원하는 불순물을 주입(Implantation)하는 이온주입공정 및, 오픈된 부분에 또다른 특성을 갖는 박막을 증착(Deposition)하는 증착공정 등으로 구성된다. In general, a semiconductor device manufacturing process for manufacturing a semiconductor device forms a photoresist film which is removed by chemical reaction with light on a pure silicon wafer, and then a desired predetermined circuit pattern of the photoresist film is formed. A photo process for selectively opening only a desired portion of the photoresist film by scanning light to a portion to be formed, an etching process for etching the opened portion to a predetermined depth, and implanting desired impurities Ion implantation process, and a deposition process for depositing a thin film having another property on the open portion.

상술한 반도체 소자 제조공정 중 식각, 애싱, 확산, 화학기상증착, 금속증착 등의 공정은 웨이퍼가 놓이는 공정챔버 내부에 공정가스를 공급하고, 이들 공정가스를 플라즈마 상태로 변환시키거나 고온 분위기에 있도록 하여 웨이퍼 상에 원하는 반응이 이루어지도록 하는 것이다.In the semiconductor device manufacturing process described above, processes such as etching, ashing, diffusion, chemical vapor deposition, and metal deposition may supply process gases into a process chamber in which a wafer is placed, and convert these process gases into a plasma state or in a high temperature atmosphere. To achieve the desired reaction on the wafer.

한편, 공정챔버의 내부로 공급되어 소정 공정이 수행되고 남은 미반응가스는 이 공정챔버의 일측에 마련된 진공 배기장치를 통해 외부로 배출된다. 이때의 배기장치에는 공정챔버와 연통되는 터보펌프와 이 터보펌프와 연결되는 배기라인 및 이 배기라인 상에 설치되는 드라이펌프와 스크러버 및 배기덕트가 순차적으로 마련된다. 따라서, 공정챔버 내부의 미반응가스는 배기장치를 통해 터보펌프와 드라이펌프 및 스크러버를 통해 배기덕트로 배기되는 것이다.Meanwhile, the remaining unreacted gas is supplied to the inside of the process chamber and the remaining unreacted gas is discharged to the outside through the vacuum exhaust device provided at one side of the process chamber. At this time, the exhaust device is provided with a turbo pump communicating with the process chamber, an exhaust line connected with the turbo pump, and a dry pump, a scrubber and an exhaust duct installed on the exhaust line. Therefore, the unreacted gas inside the process chamber is exhausted to the exhaust duct through the turbo pump, the dry pump and the scrubber through the exhaust device.

또한, 공정챔버와 터보펌프의 사이에는 아이솔레이션밸브가 설치된다. 이때, 아이솔레이션밸브는 터보펌프에 의하여 배기되는 미반응가스의 흐름을 개폐하는 역할을 한다.In addition, an isolation valve is provided between the process chamber and the turbo pump. At this time, the isolation valve serves to open and close the flow of unreacted gas exhausted by the turbo pump.

구체적으로, 아이솔레이션밸브는 그 작동이 외부 공기압 주입에 의한 압력으로 작동하는 스프링의 신축에 의하여 구동축이 작동함으로써 터보펌프에 의해 배기되는 미반응가스의 흐름을 개폐한다. 여기서, 스프링과 구동축은 하우징과 이 하우징의 상부를 덮는 커버로 구성된 몸체의 내부에 마련된다.Specifically, the isolation valve opens and closes the flow of unreacted gas exhausted by the turbo pump by operating the drive shaft by the expansion and contraction of the spring, the operation of which is operated by the pressure of external air pressure injection. Here, the spring and the drive shaft are provided inside the body consisting of a housing and a cover covering the upper portion of the housing.

이때, 하우징과 커버의 사이에는 실링부재가 마련되어 하우징과 커버의 사이를 밀폐하는 역할을 한다. 하지만, 종래의 아이솔레이션밸브에 마련되는 실링부재에 대한 고정수단이 별도로 존재하지 않는다.At this time, a sealing member is provided between the housing and the cover to serve to seal between the housing and the cover. However, there is no separate fixing means for the sealing member provided in the conventional isolation valve.

따라서, 아이솔레이션의 하우징과 커버를 장착하는 과정 중에서 실링부재의 유동이 발생되기 쉬우며, 이로 인해 정확한 실링이 되지 않는 문제점이 있다.Therefore, the flow of the sealing member easily occurs during the mounting of the housing and the cover of the isolation, and thus there is a problem in that the accurate sealing is not performed.

또한, 공정챔버의 내부에 잔존하는 미반응가스를 배기하기 위하여 터보펌프의 구동 중에 발생되는 진동 등에 의하여 실링부재가 제 위치를 이탈할 수 있으므로 미반응가스의 누설이 발생되는 문제점이 있다.In addition, in order to exhaust the unreacted gas remaining in the process chamber, the sealing member may be out of position due to vibration generated during the operation of the turbopump, and thus there is a problem that leakage of the unreacted gas occurs.

따라서, 본 발명은 상기에 상술한 문제점을 해결하기 위해서 안출된 것으로써, 본 발명의 목적은 아이솔레이션밸브를 통해 흐르는 미반응가스가 누설되지 않도록 마련되는 실링부재를 고정할 수 있는 반도체소자 제조설비용 아이솔레이션밸브를 제공하는데 있다.Therefore, the present invention has been made in order to solve the above-described problems, the object of the present invention is for a semiconductor device manufacturing equipment that can fix the sealing member is provided so that the unreacted gas flowing through the isolation valve is not leaked To provide an isolation valve.

이와 같은 목적을 구현하기 위한 본 발명에 따른 반도체소자 제조설비용 아이솔레이션밸브는 공정챔버와 터보펌프의 사이에 마련되어 상기 공정챔버의 내부를 진공시키기 위한 펌핑력의 유통이 가능하도록 공정챔버와 연결되는 챔버포트와 터보펌프와 연결되는 터보펌프를 구비한 하우징과, 하우징의 상부에 마련되어 하우징을 덮는 커버와, 하우징과 커버의 사이에 장착되어 하우징과 커버의 사이를 밀폐하는 실링부재와, 하우징의 상면에 형성되어 실링부재의 일측을 고정하도록 하는 하우징실링고정홈 및 커버의 하면에 형성되어 실링부재의 타측을 고정하도록 하는 커버실링고정홈을 포함 포함한다.An isolation valve for a semiconductor device manufacturing apparatus according to the present invention for realizing the above object is provided between a process chamber and a turbopump and is connected to a process chamber to enable distribution of pumping force for vacuuming the inside of the process chamber. A housing having a turbo pump connected to the port and the turbo pump, a cover provided on the housing to cover the housing, a sealing member mounted between the housing and the cover to seal the housing and the cover, and an upper surface of the housing. It is formed to include a housing sealing fixing groove for fixing one side of the sealing member and the cover sealing fixing groove for fixing the other side of the sealing member formed on the lower surface of the cover.

바람직하게, 상기 하우징실링고정홈과 커버실링고정홈은 반구형상으로 형성되어 실링부재와 밀착된다.Preferably, the housing sealing fixing groove and the cover sealing fixing groove are formed in a hemispherical shape to be in close contact with the sealing member.

그리고, 상기 하우징실링고정홈과 상기 커버실링고정홈은 서로 대향되게 배치되는 것이 바람직하다.The housing sealing fixing groove and the cover sealing fixing groove are preferably disposed to face each other.

이하, 도면을 참조하여 본 발명에 따른 반도체소자 제조설비용 아이솔레이션밸브에 대해 살펴보면 다음과 같다.Hereinafter, an isolation valve for a semiconductor device manufacturing facility according to the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명에 따른 반도체소자 제조설비용 아이솔레션밸브를 도시한 구성도이고, 도 2는 도1의 A부분을 도시한 발췌도이다.1 is a block diagram showing an isolation valve for a semiconductor device manufacturing equipment according to the present invention, Figure 2 is an excerpt view showing a portion A of FIG.

도 1 및 도 2를 참조하면, 본 발명에 따른 반도체소자 제조설비용 아이솔레이션밸브는 공정챔버(210)와 터보펌프(220)의 사이에 마련되어 공정챔버(210)의 내부를 진공시키기 위한 진공펌핑력의 유통이 가능하도록 한다. 이때의 아이솔레이션밸브는 전체적으로 원통형상으로 된 하우징(110)과 이 하우징(110)의 상부에 결합되는 커버(130)가 마련된다.1 and 2, the isolation valve for a semiconductor device manufacturing facility according to the present invention is provided between the process chamber 210 and the turbo pump 220 to provide a vacuum pumping force for vacuuming the inside of the process chamber 210. Enable distribution of In this case, the isolation valve is provided with a housing 110 having a cylindrical shape as a whole and a cover 130 coupled to the upper portion of the housing 110.

구체적으로, 하우징(110)은 상, 하단이 모두 개구된 형태로 구현되며, 상면 의 외주에는 하우징리브(113)가 형성되어 상술한 커버(130)와 결합된다. 이때, 하우징리브(113)에는 하우징결합홀(116)이 형성된다. 그리고, 하우징(110)의 측면에는 소정 공정이 수행되는 공정챔버(210)와 연결되는 챔버포트(121)가 형성되고, 하우징의 하면에는 터보펌프(220)와 연결되는 펌프포트(123)가 형성된다. 즉, 챔버포트(121)와 펌프포트(123)는 상호 연통된 구조를 가진다. Specifically, the housing 110 is implemented in the form of the upper, lower ends are opened, the housing rib 113 is formed on the outer periphery of the upper surface is coupled to the cover 130 described above. In this case, the housing rib 113 is formed with a housing coupling hole 116. In addition, a chamber port 121 connected to a process chamber 210 in which a predetermined process is performed is formed at a side surface of the housing 110, and a pump port 123 connected to a turbo pump 220 is formed at a lower surface of the housing 110. do. That is, the chamber port 121 and the pump port 123 has a structure in communication with each other.

그리고, 하우징의 내부에는 하우징(110)의 내경을 따라 상하 신축 동작하여 챔버포트(121)와 펌프포트(123)의 상호 연통과 폐쇄가 수행되도록 하는 벨로우즈(140)가 설치된다. In addition, a bellows 140 is installed inside the housing to vertically expand and contract along the inner diameter of the housing 110 so that communication and closing of the chamber port 121 and the pump port 123 is performed.

그리고, 이 벨로우즈(140)의 내부에는 하단에 벨로우즈(140)의 단부가 결합되어 있는 결합플레이트(141)가 장착된 구동축(143)이 마련된다. 여기서, 이 구동축(143)은 벨로우즈(140)를 신축동작 시키는 역할을 하며, 소정 부분 하우징(110)의 외부로 돌출된다.The bellows 140 is provided with a drive shaft 143 on which a coupling plate 141 to which an end of the bellows 140 is coupled is mounted at a lower end thereof. Here, the drive shaft 143 serves to expand and contract the bellows 140, and protrudes out of the predetermined portion housing 110.

한편, 하우징(110)의 상부에는 상술한 커버(130)가 마련되어 하우징(110)의 상부를 덮는 역할을 한다. 이때, 커버(130)의 내부에는 스프링(151)이 마련되며, 이 스프링(151)의 하부에는 스프링(151)의 신축 동작 시 스프링(151)의 마찰 및 충돌부분에 대한 완충지지를 위한 완충부재(153)가 마련된다. 그리고, 완충부재(153)의 하부에는 하우징(110)의 외부로 소정 부분 돌출된 구동축(143)과 결합되는 패드(146)가 마련된다.On the other hand, the cover 130 is provided on the upper portion of the housing 110 serves to cover the upper portion of the housing 110. In this case, a spring 151 is provided inside the cover 130, and a lower portion of the spring 151 is provided at the lower portion of the spring 151 for cushioning and supporting the frictional and collision parts of the spring 151 when the spring 151 is stretched. 153 is provided. In addition, a pad 146 coupled to the drive shaft 143 protruding a predetermined portion to the outside of the housing 110 is provided under the buffer member 153.

그리고, 커버(130)의 하면 외주에는 커버리브(133)가 형성되어 하우징(110))의 상면 외주에 형성된 하우징리브(113)와 결합된다. 여기서, 이 커버리브(133)에는 커버결합홀(136)이 형성되어 하우징결합홀(116)과 접하게 된다. In addition, a cover rib 133 is formed on the outer circumference of the lower surface of the cover 130 and coupled to the housing rib 113 formed on the outer circumference of the upper surface of the housing 110. Here, the cover rib 133 has a cover coupling hole 136 is in contact with the housing coupling hole 116.

따라서, 하우징(110)과 커버(130)는 이들에 각각 형성된 결합홀(116,136)에 체결부재(129)가 결합됨으로써 상호 결합이 이루어진다.Accordingly, the housing 110 and the cover 130 are coupled to each other by coupling the fastening members 129 to the coupling holes 116 and 136 formed therein, respectively.

한편, 하우징(110)과 커버(130)의 사이에는 실링부재(160)가 마련되어, 하우징(110)과 커버(130)의 사이를 밀폐하게된다. 여기서, 하우징(110)의 상면에는 실링부재(160)의 일측을 고정하기 위한 하우징실링고정홈(119)이 형성되고, 커버(130)의 하면에는 실링부재(160)의 타측을 고정하기 위한 커버실링고정홈(139)이 형성된다. 이때의 하우징실링고정홈(119)과 커버실링고정홈(139)의 형상은 반구형상의 홈으로 이루어지며, 하우징실링고정홈(119)과 커버실링고정홈(139)은 서로 대향되게 배치된다. 이로 인해 각 실링고정홈들(119,139) 내부에 실링부재(160)가 밀착되어 고정되어 실링부재(160)의 유동을 방지하게 된다.Meanwhile, a sealing member 160 is provided between the housing 110 and the cover 130 to seal the space between the housing 110 and the cover 130. Here, the housing sealing fixing groove 119 for fixing one side of the sealing member 160 is formed on the upper surface of the housing 110, the cover for fixing the other side of the sealing member 160 on the lower surface of the cover 130 Sealing fixing groove 139 is formed. At this time, the shape of the housing sealing fixing groove 119 and the cover sealing fixing groove 139 is made of a hemispherical groove, the housing sealing fixing groove 119 and the cover sealing fixing groove 139 are disposed to face each other. As a result, the sealing members 160 are tightly fixed to the inside of each of the sealing fixing grooves 119 and 139 to prevent the flow of the sealing members 160.

따라서, 상술한 하우징실링고정홈(119)과 커버실링고정홈(139)에 실링부재 (160)를 고정하는 것은 하우징(110)과 커버(130)의 결합 시 실링부재(160)가 유동되는 것을 방지하여 하우징(110)과 커버(130)의 사이에서 실링부재(160)를 용이하게 장착하게 한다. 그리고, 하우징실링고정홈(119)과 커버실링고정홈(130)에 고정된 실링부재(160)가 터보펌프(220)의 작동 시에 발생되는 진동에 의해 제 위치를 이탈하는 것을 방지할 수 있게 된다.Therefore, fixing the sealing member 160 to the housing sealing fixing groove 119 and the cover sealing fixing groove 139 described above means that the sealing member 160 flows when the housing 110 and the cover 130 are coupled to each other. It is prevented to facilitate mounting of the sealing member 160 between the housing 110 and the cover 130. In addition, the sealing member 160 fixed to the housing sealing fixing groove 119 and the cover sealing fixing groove 130 may be prevented from being released from its position by vibration generated when the turbo pump 220 is operated. do.

한편, 본 발명은 도시한 도면을 참고로 설명하였으나, 이는 예시적인 것에 불과하며, 본 기술 분야의 통상적 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 그러므로 본 발명의 범위는 첨부된 특허청구의 범위와 이와 균등한 것들에 의해 정해져야 한다.On the other hand, the present invention has been described with reference to the drawings shown, but this is only exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

이상에서 설명한 바와 같이 본 발명에 따른 반도체소자 제조설비용 아이솔레이션밸브는 하우징과 커버의 사이를 밀폐하는 실링부재를 고정할 수 있도록 실링부재고정홈이 형성됨으로써 실링부재의 장착 시 용이하게 장착할 수 있으며, 아이솔레이션밸브의 일측에 연결된 터보펌프의 작동 시 이 터보펌프의 진동에 의하여 실링부재가 제 위치에서 이탈하는 것을 방지할 수 있게 한다.As described above, the isolation valve for a semiconductor device manufacturing facility according to the present invention is easily formed when the sealing member is mounted by forming a sealing member fixing groove to fix the sealing member sealing between the housing and the cover. When the turbopump connected to one side of the isolation valve is operated, the sealing member can be prevented from being released from its position due to the vibration of the turbopump.

Claims (3)

공정챔버와 터보펌프의 사이에 마련되어 상기 공정챔버의 내부를 진공시키기 위하여 펌핑력의 유통이 가능하도록 하는 반도체소자 제조설비용 아이솔레이션밸브에 있어서,In the isolation valve for a semiconductor device manufacturing equipment provided between the process chamber and the turbo pump to enable the distribution of pumping force to vacuum the inside of the process chamber, 상기 공정챔버의 일측에 연결되는 챔버포트와 상기 터보펌프의 일측에 연결되는 펌프포트를 구비한 하우징;A housing having a chamber port connected to one side of the process chamber and a pump port connected to one side of the turbo pump; 상기 하우징의 상부에 마련되어 상기 하우징을 덮는 커버;A cover provided on an upper portion of the housing to cover the housing; 상기 하우징과 상기 커버의 사이에 장착되어 상기 하우징과 상기 커버의 사이를 밀폐하는 실링부재;A sealing member mounted between the housing and the cover to seal between the housing and the cover; 상기 하우징의 상면에 형성되어 상기 실링부재의 일측을 고정하도록 하는 하우징실링고정홈; 및A housing sealing fixing groove formed on an upper surface of the housing to fix one side of the sealing member; And 상기 커버의 하면에 형성되어 상기 실링부재의 타측을 고정하도록 하는 커버실링고정홈을 포함하는 반도체소자 제조설비용 아이솔레이션밸브.Isolating valve formed in the lower surface of the cover including a sealing sealing fixing groove for fixing the other side of the sealing member. 제 1항에 있어서,The method of claim 1, 상기 하우징실링고정홈과 상기 커버실링고정홈은 반구형상으로 형성되어 상기 실링부재와 밀착되는 것을 특징으로 하는 반도체소자 제조설비용 아이솔레이션밸브.And the housing sealing fixing groove and the cover sealing fixing groove are formed in a hemispherical shape to be in close contact with the sealing member. 제 2항에 있어서,The method of claim 2, 상기 하우징실링고정홈과 상기 커버실링고정홈은 서로 대향되게 배치된 것을 특징으로 하는 반도체소자 제조설비용 아이솔레이션밸브.And the housing sealing fixing groove and the cover sealing fixing groove are disposed to face each other.
KR1020050047384A 2005-06-02 2005-06-02 Isolation valve for semiconductor manufacturing equipment KR20060125371A (en)

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