KR20060118280A - Grinding apparatus of plasma display panel - Google Patents

Abstract

A grinding apparatus of a plasma display panel is provided to transfer a grinder to a corresponding position prior to a grinding process of a substrate, thereby reducing a time required to align the substrate with the grinder. A grinding apparatus includes a position detecting unit(46) detecting a position of a substrate, a grinder(50) grinding the substrate corresponding to the position detected by the position detecting unit, and a grinder transferring unit(48) transferring the grinder to the position detected by the position detecting unit. The substrate is supported by a substrate supporting part(42). A transfer unit(40) transfers the substrate to the substrate support part and transfers the substrate support part to the detected position.

Description

Grinding apparatus for plasma display panel {Grinding Apparatus of Plasma Display Panel}

1 is a perspective view showing the structure of a typical plasma display panel.

2 is a plan view showing a mother glass substrate for explaining the three chamfering method of the multi-faceted method of the conventional plasma display panel.

3A and 3B are exemplary views showing an example in which the mother glass substrate and the grinder of the conventional plasma display panel are not aligned.

4 is a plan view showing a grinding apparatus of a plasma display panel according to an embodiment of the present invention.

5A and 5B are exemplary views illustrating an example in which a pressure cylinder senses a substrate as an example of a position sensor.

6 is a side view showing that the grinding unit is moved to the position of the substrate detected by the position sensor.

<Description of the symbols for the main parts of the drawings>

40 transfer part 42 substrate support part

46: position detection unit 46a: sensor unit

46b: calculator 46b 48: grinder moving unit

50: grinder part

The present invention relates to a plasma display panel, and more particularly, to a grinding apparatus of a plasma display panel for grinding a cut substrate.

In general, a plasma display panel is a partition wall formed between a front panel and a rear panel to form a unit cell, and each cell includes neon (Ne), helium (He), or a mixture of neon and helium (Ne + He) and An inert gas containing the same main discharge gas and a small amount of xenon is filled. When discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Looking at the general structure of such a plasma display as shown in FIG.

1 is a perspective view showing the structure of a general plasma display panel.

As shown in FIG. 1, a plasma display panel includes a front substrate in which a plurality of sustain electrode pairs formed by pairing a scan electrode 102 and a sustain electrode 103 are formed on a front glass 101, which is a display surface on which an image is displayed. The rear substrate 110 having the plurality of address electrodes 113 arranged to intersect the plurality of sustain electrode pairs on the back glass 111 forming the back surface 100 and the rear surface is coupled in parallel with a predetermined distance therebetween. .

The front substrate 100 is made of a scan electrode 102 and a sustain electrode 103, that is, a transparent electrode (a) formed of a transparent ITO material and a metal material to mutually discharge and maintain light emission of the cells in one discharge cell. The scan electrode 102 and the sustain electrode 103 provided as the bus electrode b are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by one or more upper dielectric layers 104 that limit the discharge current and insulate the electrode pairs, and to facilitate the discharge conditions on the upper dielectric layer 104 top surface. A protective layer 105 on which magnesium oxide (MgO) is deposited is formed.

The rear substrate 110 is arranged in such a manner that a plurality of discharge spaces, that is, barrier ribs 112 of a stripe type (or well type) for forming discharge cells are maintained in parallel. In addition, a plurality of address electrodes 113 which perform address discharge to generate vacuum ultraviolet rays are arranged in parallel with the partition wall 112. On the upper side of the rear substrate 110, R, G, and B phosphors 114 which emit visible light for image display during address discharge are coated. A lower dielectric layer 115 is formed between the address electrode 113 and the phosphor 114 to protect the address electrode 113.

A plasma display panel having such a structure is manufactured by a predetermined method. First, a mother, which is a base material of a unit panel, is used to take a unit panel that is a substrate of a front substrate 100 and a rear substrate 110. The glass substrate is cut and ground to a certain size to take a plurality of unit panels.

In this way, a method of taking a plurality of unit panels from a single mother glass substrate is called a multi-sided chamfering method, and is divided into three chamfering and four chamfering methods according to the number of unit panels to be taken. .

FIG. 2 is a plan view illustrating a mother glass substrate for explaining three chamfering methods among the multi-faceted etching methods of a conventional plasma display panel.

As shown in FIG. 2, the three-chamfering method of the conventional plasma display panel sets the large mother glass substrate 20 to three zones, that is, three unit panels P, and sets each of the three unit panels. After patterning and forming an electrode, a dielectric layer, and the like, the mother glass substrate 20 is cut along a cut surface A for dividing each unit panel P to take three unit panels P.

Thereafter, a cutting step of cutting and separating the mother glass substrate 20 along a cutting surface A for each unit panel and a grinding step of grinding the cross section of the cut surface cut in the cutting step are essential.

For example, the grinding step is necessary because the cutting surface portion cut in the cutting step is very sharp and rough, which may cause injury to the worker during work. Looking at the cutting step and the grinding step in more detail as follows.

First, in a cutting step, a mother glass substrate is cut to a unit panel size by a predetermined cutting device while moving and aligning a multi-sided mother glass substrate on a predetermined moving means, for example, a conveyor line.

In the grinding step, the cut unit is cut by grinding the cut surface of the unit panel with a predetermined grinding device while aligning and moving the unit panel in order to accurately grind the cut surface of the unit panel formed by cutting from the mother glass substrate in the cutting step. The cut surface of the panel is processed relatively smoothly, so that the operator can work smoothly.

As such, it is important to accurately align the mother glass substrate with the grinder during grinding. However, since the size of the mother glass substrate generally used is large, there is a case in which the alignment between the mother glass substrate and the grinder is not precisely performed.

3A and 3B are exemplary views showing an example in which the mother glass substrate and the grinder of the conventional plasma display panel are not aligned.

In general, since the alignment of the mother glass substrate and the grinder is determined by the naked eye of the manager, as shown in FIG. 3A, the mother glass substrate 34 may not be correctly aligned with the wheel 32 of the grinder 30.

In addition, since the mother glass substrate is generally large in size, bending occurs. In this case, as shown in FIG. 3B, the mother glass substrate 34 is not accurately aligned with the wheel 32 of the grinder 30. .

As such, the setting and alignment for the grinding is performed by the manager, which is cumbersome, and the time for the alignment is not accurate because the grinding of the grinder 30 and the mother glass substrate 34 is not accurately performed. There is a problem of increasing the manufacturing cost.

Accordingly, an object of the present invention is to provide a grinding apparatus of a plasma display panel by sensing a position of a mother glass substrate and accurately aligning it with a grinder to reduce time for alignment.

The present invention for achieving the object of the present invention is a position detection unit for detecting the position of the substrate, a grinder unit for grinding the substrate corresponding to the position detected by the position detection unit, the grinder unit to the position detected by the position detection unit And a grinder moving unit for moving.

In addition, the substrate support for supporting the substrate; The substrate may further include a transfer unit which moves the substrate to the substrate support and moves the substrate support to the position sensed by the position sensing unit.

Hereinafter, a grinding apparatus of a plasma display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4 is a plan view illustrating a grinding apparatus of a plasma display panel according to an exemplary embodiment of the present invention.

As shown in FIG. 4, the grinding apparatus of the plasma display panel includes a substrate transfer part 40, a substrate support part 42, a position sensing part 46, a grinder moving part 48, and a grinder part 50. It is made, including.

First, the substrate transfer part 40 moves the substrate 44 to the substrate support part 42.

The substrate support 44 supports the substrate 42 moved from the substrate transfer part 40.

The position detector 46 is provided with a predetermined sensor to detect the position of the substrate 42 that is moved to the substrate support 44. The position detecting unit 46 includes a sensor unit 46a for detecting the position of the substrate 44, and an operation unit 46b for calculating the position of the substrate 44 using the value sensed by the sensor 46a. Is done.

 At this time, the position detection unit 46 is characterized in that for detecting the edge position of the substrate 44. In addition, the horizontal position and the vertical position of the substrate 44 is characterized by detecting.

The grinder moving unit 48 moves the grinder unit 50 to a position detected by the position detecting unit 46.

The grinder unit 50 is provided with predetermined grinder means to grind the edge portion of the substrate 44.

Looking at the operation of the present invention configured as described above are as follows.

First, a predetermined pattern is formed on the substrate transfer part 40, and the substrate 44 cut from the mother glass substrate is moved to the substrate support part 42. As such, when the substrate 44 is moved to the substrate support 42, the sensor unit 46a of the position detector 46 detects the position of the substrate 44, and outputs the sensing value to the calculator 46b. In this case, the sensor unit 46a may be a pressure cylinder (not shown) for sensing the position of the substrate 44 by applying pressure to the substrate 44.

Here, an example in which the pressure cylinder (not shown) detects the position of the substrate 44 is as follows.

5A and 5B are exemplary views illustrating an example in which a pressure cylinder senses a substrate as an example of a position sensor.

First, as shown in FIG. 5A, when the substrate 44 is moved to the substrate support 42, the pressure cylinder 52 exerts a predetermined pressure on the substrate 44. At this time, when the substrate 44 is not accurately aligned with the substrate support 42 and protrudes upward, the substrate 44 does not apply pressure to the first pressure cylinder 52a and the second pressure cylinder 52b. However, pressure cannot be applied to the third pressure cylinder 52c.

Accordingly, the pressure cylinder 52 may detect that the substrate 44 protrudes upward.

In addition, as shown in FIG. 5B, when the substrate 44 is broken, the pressure value applied to the first pressure cylinder 52a, the second pressure cylinder 52b, and the third pressure cylinder 52c of the pressure cylinder 52. Since the pressure cylinder 52 is different from each other, the pressure cylinder 52 can detect the horizontal position and the vertical position of the edge of the substrate 44.

As described above, after the pressure cylinder 52 of the position detecting unit 46 detects the position of the substrate 44 and outputs the corresponding sensing value to the calculating unit 46b, the calculating unit 46b performs a predetermined calculation process. The position of the substrate 44 is calculated and transmitted to the grinder moving unit 48.

After that, the grinder moving unit 48 moves the grinder unit 50 to the position of the substrate 44 received from the calculating unit 46b, and the grinder unit 50 grinds the substrate 44.

At this time, look at an example in which the grinder moving unit 48 moves the grinder unit 50 as shown in FIG.

First, when the grinder moving unit 48 receives the position of the thin substrate 44 from the position detecting unit 46, the grinder moving unit 48 moves the grinder unit 50 to a position where the edge of the thin substrate 44 can be grounded. Allow grinding process to be performed.

Herein, only the position detecting unit 46 is located on one side of the grinder moving unit 48, but the present invention is not limited thereto, and the position detecting unit 46 is located at one or more positions corresponding to the substrate 44 on the grinder moving unit 48. It is preferred to be provided.

In addition, although it demonstrated here that the sensor part 46a of the position detection part 46 is a pressure cylinder, it is possible to use the optical sensor which senses the position of the board | substrate 44 by a predetermined optical means.

In addition, although the grinder moving part 48 described the movement of the grinder part 50 to the place where the board | substrate 44 is located here, the board | substrate conveyance part 40 is a board | substrate support part to the position which the position detection part 46 sensed. It is possible to move 42.

Accordingly, by sensing the position of the substrate and moving the grinder to the corresponding position or by moving the substrate to the position of the grinder to grind the substrate, the substrate and the grinder portion are accurately aligned, thereby reducing the time for alignment.

Therefore, the manufacturing time of the plasma display panel is reduced, thereby reducing the manufacturing cost.

As described in detail above, the present invention detects the position of the substrate, moves the grinder to the corresponding position, and then grinds the substrate and the grinder part by grinding the substrate, thereby manufacturing the plasma display panel by reducing the time for alignment. There is an effect of reducing the manufacturing cost by reducing the time.

Claims (2)

A position detecting unit detecting a position of the substrate; A grinder unit for grinding the substrate in response to a position detected by the position sensor; A grinder moving unit for moving the grinder unit to a position detected by the position detecting unit; Grinding apparatus of the plasma display panel comprising a. The method of claim 1, A substrate support for supporting the substrate; A transfer unit which moves the substrate to the substrate support and moves the substrate support to a position detected by the position sensing unit Grinding apparatus of the plasma display panel further comprising.

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