KR101544471B1 - Display Panel and Substrate Processing Apparatus - Google Patents

Abstract

The present invention relates to a display panel and a substrate processing apparatus. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate processing apparatus for grinding a glass substrate and a display panel including the glass substrate produced therefrom.
A substrate processing apparatus according to the present invention includes a first grinder including at least one wheel and a second grinder including at least one wheel, Wherein the first grinder grinds a first area on one side of a substrate while the first grinder grinds the first area of the substrate, The second area adjacent to the first area can be ground.

Description

[0001] Display Panel and Substrate Processing Apparatus [

The present invention relates to a display panel and a substrate processing apparatus. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate processing apparatus for grinding a glass substrate and a display panel including the glass substrate produced therefrom.

A glass substrate used for a display device or the like is likely to cause cracks due to the characteristics of the glass.

Cracks can deteriorate the structural properties of the glass substrate.

In order to reduce the occurrence of cracks in the glass substrate, the side surface of the glass substrate can be grinded.

As the process of grinding the side surface of the organic substrate is added, there is a problem that the whole process time is increased.

Published Patent Application No. 10-2010-0033503

An object of the present invention is to provide a substrate processing apparatus for reducing the time required for manufacturing a glass substrate.

It is another object of the present invention to provide a display panel including a glass substrate manufactured from the substrate processing apparatus.

A display panel according to the present invention includes a front substrate, a rear substrate disposed to face the front substrate, and a plurality of pixels positioned between the front substrate and the rear substrate, The side surface of at least one of the front substrate and the rear substrate may include a portion having a difference in height.

The height difference may be 1 탆 to 20 탆.

Further, the surface roughness of the portion having the height step can be larger than the surface roughness of the other portion around the height.

A substrate processing apparatus according to the present invention includes a first grinder including at least one wheel and a second grinder including at least one wheel, Wherein the first grinder grinds a first area on one side of a substrate while the first grinder grinds the first area of the substrate, The second area adjacent to the first area can be ground.

In addition, the first area and the second area may partially overlap each other.

Also, the number of the wheels included in the first grinder may be the same as the number of the wheels included in the second grinder.

In addition, the substrate can grind one side of the substrate while the first grinder and the second grinder move in a fixed state.

The apparatus may further include a first transportation part for transferring the substrate such that one side of the substrate is grinded by the first grinder and the second grinder while the substrate is being transported.

The apparatus may further include a rotation part that rotates the substrate after the grinding of the substrate by the first and second grinders is completed.

The apparatus also includes a third grinder including at least one wheel and a fourth grinder including at least one wheel, wherein the third grinder includes a first grinder on the other side of the substrate, And the fourth grinder may grind a second region adjacent to the first region of the other side of the substrate while the third grinder grinds the first region of the substrate.

The display panel and substrate processing apparatus according to the present invention can form a portion having a height step that can be used as an alignment mark on the side surface of the panel during the grinding process so that an additional process for forming an alignment mark is omitted Therefore, it is possible to reduce the time required for the manufacturing process.

In addition, the display panel and substrate processing apparatus according to the present invention have the effect of reducing the time spent for grinding and fixing by grinding one side of the glass substrate together using a plurality of grinders.

1 is a view for explaining a structure of a plasma display panel;
FIGS. 2 to 4 are views for explaining a substrate in detail; FIG.
5 to 16 are views for explaining a substrate processing apparatus and a substrate processing method according to the present invention; And
17 to 18 are views for explaining an apparatus and a method for rotating a substrate and processing a substrate in a rotated state.

Hereinafter, a display panel and a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, the terms first, second, etc. may be used to describe various components, but the components may not be limited by the terms. The terms may only be used for the purpose of distinguishing one element from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The term " and / or " may include any combination of a plurality of related listed items or any of a plurality of related listed items.

When an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may be present in between Can be understood. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it can be understood that no other element exists in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used interchangeably to designate one or more of the features, numbers, steps, operations, elements, components, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

In addition, the following embodiments are provided to explain more fully to the average person skilled in the art. The shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

Hereinafter, a plasma display panel (PDP) will be described as an example of a display panel. However, the display panel applicable to the present invention is not limited to a plasma display panel, and an organic display panel (OLED), a liquid crystal display device (LCD), or a field emission display (FED).

1 is a view for explaining a structure of a plasma display panel.

1, the plasma display panel may include a rear substrate 211 on which a plurality of second electrodes 213, X intersecting a plurality of first electrodes 202 (Y), 203 (Z) are formed. have.

Here, the first electrodes 202 and 203 may include the scan electrodes 202 and Y and the sustain electrodes 203 and Z, and the second electrode 211 may be referred to as an address electrode.

The discharge currents of the scan electrodes 202 and the sustain electrodes 203 and the sustain electrodes 203 are applied to the front substrate 201 on which the scan electrodes 202 and the sustain electrodes 203 and the sustain electrodes Z are formed. ) And the sustain electrodes 203, Z may be disposed on the lower dielectric layer 204. In this case,

The front substrate 201 on which the upper dielectric layer 204 is formed may be provided with a protective layer 205 for facilitating discharge conditions. The protective layer 205 may include a material having a high secondary electron emission coefficient, for example, a magnesium oxide (MgO) material.

Address electrodes 213 and X are formed on the rear substrate 211 and address electrodes 213 and X are formed on the rear substrate 211 on which the address electrodes 213 and X are formed. The lower dielectric layer 215 may be formed.

Barrier ribs 212 such as a stripe type, a well type, a delta type, and a honeycomb type for partitioning a discharge space, that is, a discharge cell, are formed on an upper portion of the lower dielectric layer 215 . Accordingly, a first discharge cell that emits red (R) light, a second discharge cell that emits blue (B) light, and a second discharge cell that emits green (Green) light are provided between the front substrate 201 and the rear substrate 211, : G) a third discharge cell that emits light, or the like.

At least one first discharge cell, a second discharge cell and a third discharge cell may be gathered to form a pixel.

On the other hand, in the discharge cell, the address electrode 213 may cross the scan electrode 202 and the sustain electrode 203. That is, the discharge cells are formed at the intersections of the address electrodes 213 with the scan electrodes 202 and the sustain electrodes 203.

A predetermined discharge gas may be filled in the discharge cells partitioned by the barrier ribs 212.

In addition, in the discharge cells partitioned by the barrier ribs 212, a phosphor layer 214 that emits visible light for image display upon address discharge may be formed. For example, a first phosphor layer for generating red light, a second phosphor layer for generating blue light, and a third phosphor layer for generating green light may be formed.

The width and thickness of the address electrode 213 formed on the rear substrate 211 may be substantially constant in width or thickness but may be different from the width or thickness of the inside of the discharge cell outside the discharge cell . For example, the width or thickness inside the discharge cell may be wider or thicker than that outside the discharge cell.

When a predetermined signal is supplied to at least one of the scan electrode 202, the sustain electrode 203, and the address electrode 213, a discharge may occur in the discharge cell. When a discharge is generated in the discharge cell, ultraviolet rays can be generated by the discharge gas filled in the discharge cell, and such ultraviolet rays can be irradiated to the phosphor particles of the phosphor layer 214. Then, the phosphor particles irradiated with the ultraviolet rays emit visible light, so that a predetermined image can be displayed on the screen of the plasma display panel 100.

2 to 4 are views for explaining the substrate in detail. In the following, the description of the contents described above can be omitted.

2, the side surface of at least one of the front substrate 201 and the rear substrate 211 of the display panel according to the present invention may include a portion having a difference in height.

In other words, a protrusion 200 protruding at a predetermined height H1 may be formed on at least one side surface of the front substrate 201 and the rear substrate 211.

2 illustrates a case where protrusions 200 are formed on a first long side (LS1) and a second long side (LS2) of at least one of the front substrate 201 and the rear substrate 211 The present invention is not limited to this.

For example, a protrusion 200 having a predetermined height H1 may be formed on a first short side (SS1) of at least one of the front substrate 201 and the rear substrate 211.

The protrusion 200 may be used as an alignment mark in the manufacturing process.

In detail, the manufacturing process of the plasma display panel may include a joining process in which the front substrate 201 and the rear substrate 211 are joined together.

The operator can align the front substrate 201 and the rear substrate 211 with respect to the protrusions 200 formed on at least one of the front substrate 201 and the rear substrate 211. [

Accordingly, the process of attaching the front substrate 201 and the rear substrate 211 to each other without additional alignment marks can be easily performed.

Here, if the height step of the protrusion 200, that is, the height H1 is excessively low, the visibility deteriorates, so that it may be difficult to sufficiently utilize the protrusion 200 as a seal mark in the laminating process.

On the other hand, if the height H1 of the protrusion 200 is excessively high, the structural stability of the substrates 201 and 211 can be reduced.

In consideration of this, it is preferable that the height H1 of the protrusion 200 is 1 占 퐉 to 20 占 퐉.

The protrusion 200 can have a left-right asymmetric shape.

For example, referring to FIG. 3, the left portion of the protrusion 200 may be referred to as a first portion (hereinafter referred to as a first portion) by reference to a straight line (CL, center line) perpendicular to the substrates 201 and 211, The size of the first portion 220 and the size of the second portion 230 may be different from each other when the right portion of the protrusion 200 is referred to as a second portion 230. [

The angle between the surface of the first part 220 and the side surface of the substrates 201 and 211 is defined as a first angle 1 and the angle between the surface of the second part 230 and the side surfaces of the substrates 201 and 211 The first angle? 1 and the second angle? 2 may be different from each other when the angle between the first angle? 1 and the second angle? 2 is the second angle? 2.

In detail, when the first angle? 1 is larger than the second angle? 2, the size of the first portion 220 may be smaller than the size of the second portion 230.

Referring to FIG. 4, the surface roughness of the portion having the height difference in the sides of the substrates 201 and 211, that is, the protrusion 200, may be larger than the surface roughness of the other portions around the substrate 201 and 211.

For example, the surface roughness of the first portion 220 may be greater than the surface roughness of the side surfaces of the substrates 201 and 211.

In this case, the visibility of the protrusion 200 is improved, so that the process of attaching the front substrate 201 and the rear substrate 211 can be more easily performed.

5 to 16 are views for explaining a substrate processing apparatus and a substrate processing method according to the present invention. In the following description of the parts described in detail above may be omitted.

A method of processing a substrate according to the present invention will be schematically described with reference to Fig.

First, a predetermined substrate may be placed in a transportation part (S100).

Then, the substrate can be grinded (S110) with the substrate placed on the transfer section.

Thereafter, the ground substrate can be rotated (S120).

The substrate can be ground again in a state in which the substrate is rotated (S130).

Hereinafter, the grinding performed before the substrate is rotated is referred to as a first grinding, and the grinding performed after the substrate is rotated is referred to as a second grinding.

6, the substrate processing apparatus according to the present invention for performing the first grinding step includes a first grinder 310 and a second grinder 310 each including at least one wheel 301, , 320).

The first grinder 310 and the second grinder 320 may each include a plurality of grinder wheels 301. For example, the first grinder 200 includes at least one grinder wheel 301 disposed on the first long side (LS1) side of the substrate 300 and a first long side LS1 of the substrate 300, And at least one grinder wheel 301 disposed on the second long side (LS2) side to oppose the second long side (LS2).

Here, the substrate 300 may be at least one of the front substrate 201 and the rear substrate 211, or may be another glass substrate.

The first grinder 310 may grind a first area AR1 on one side of the substrate 300. [

The second grinder 320 is configured to grind the first region AR1 of the substrate 300 while the first grinder 310 grinds the first region AR1 of the substrate 300, (Second Area, AR2).

For example, the first grinder 310 may grind the long sides LS1 and LS2 in the first area AR1 of the substrate 300. For example,

The second grinder 320 is disposed on the first area AR1 of the substrate 300 while the first grinder 310 grinds the long sides LS1 and LS2 in the first area AR1 of the substrate 300. [ And the long sides LS1 and LS2 can be ground in the second area AR2 adjacent to the first area AR2.

In this case, a part of the long sides LS1 and LS2 of the substrate 300 can be grinded by the first grinder 310 and the second part can be grinded by the second grinder 320.

When the first grinder 310 and the second grinder 320, which are arranged in parallel to each other on a predetermined area of the substrate 300, grind together, the time required for the grinding process can be reduced.

7, when one grinder 330 grinds the long sides LS1 and LS2 of the substrate 300 differently from the present invention, one grinder 330 is arranged on the long side LS1, and LS2), the time required for the grinding process may be relatively long.

Here, the case where the first grinder 310 and the second grinder 320 grind together a predetermined region of the substrate 300 is described as an example, but the present invention is not limited thereto. For example, it is also possible that three grinders, each including at least one wheel 301, grind the long sides LS1, LS2 of the substrate 300.

The first area AR1 of the substrate 300 to which the first grinder 310 grinds and the second area AR2 of the substrate 300 to which the second grinder 320 grinds are partially overlapped, can do.

8, the first grinder 310 is disposed on the long side LS1, LS2 of the substrate 300 from the predetermined first point P1a, P1b to the third point P3a, P3b, for example, Can be grinded.

In addition, the second grinder 320 may grind the area from the second predetermined points P2a and P2b to the fourth points P4a and P4b at the long sides LS1 and LS2 of the substrate 300.

In this case, the areas from the second points P2a and P2b to the third points P3a and P3b at the long sides LS1 and LS2 of the substrate 300 are not only grinded by the first grinder 310, And may be ground by a grinder 320.

In this case, the height H1 of the protrusion 200 can be prevented from becoming excessively high.

The first grinding process will be described in more detail with reference to FIG.

9A, the first grinder 310 and the second grinder 320 are positioned at predetermined positions on the substrate 300 after the substrate 300 is positioned at a predetermined position .

LS1 and LS2 of the substrate 300 are moved while moving the first grinder 310 and the second grinder 320 in the first direction DR1 as in the case of FIG. . ≪ / RTI >

9B, the second grinder 320 may start grinding at the central portions of the long sides LS1 and LS2 of the substrate 300. In this case,

Thus, in the initial stage of the grinding process of the second grinder 320, as in the overlap area ARVP of the substrate 300, a relatively large height step may occur on the side surface of the substrate 300. [

Thereafter, the grinding process is further performed so that when the first grinder 310 performs grinding to the overlap region ARVP of the substrate 300, the first grinder 310 and the second grinder 310 320 may be formed on the side surface of the substrate 300 as the projections 300P having the appropriate height H1 are appropriately deformed. Here, the protrusion 300P may correspond to the protrusion 200 formed on at least one side of the front substrate 201 and the rear substrate 211 described above.

As described above, in the process of grinding the predetermined region of the substrate 300 together using the first grinder 310 and the second grinder 320, the alignment of the first grinder 310 and the second grinder 320 It is possible to reduce the time required for the grinding process and to form the protrusion 300P on the side surface of the substrate 300 even if no additional process is performed.

The number of the wheels 301 included in the first grinder 310 is equal to the number of the wheels 301 included in the second grinder 320 in order to prevent the height H1 of the protrusions 200 from becoming excessively high. May be the same as the number.

Meanwhile, in the grinding process of the substrate 300, it is possible to use a conveyor belt.

11, a substrate processing apparatus according to the present invention includes a conveyor belt 500 for conveying a substrate 300, a rotary roller 510 for rotating the conveyor belt 500, And may include a moving unit 520.

In this configuration, the conveyor belt 500 can rotate in response to the rotation of the rotating roller 510. Accordingly, the substrate 300 disposed on the conveyor belt 500 can move horizontally in accordance with the movement of the conveyor belt 500, as in the case of FIG. 12 (A).

For example, in FIG. 12 (A), the conveyor belt 500 rotates and the substrate 300 can be positioned in the area where the conveyance unit 400 is located.

12 (B), when the conveyor belt 500 moves downward in association with the downward movement of the moving unit 520, the substrate (e.g., 300 may be positioned on the transfer unit 400.

As in the case of Figs. 12 (B) and 13 (A), in a state in which the substrate 300 is disposed on the conveying unit 400, the first grinder 310 And the second grinder 320 may be used to grind the substrate 300. The grinding method using the first grinder 310 and the second grinder 320 has been described in detail above.

When the first grinding process of the substrate 300 is completed, the conveyor belt 500 moves upward in conjunction with the upward movement of the moving part 520, as in the case of FIG. 14 (A) .

Then, as in the case of FIG. 14 (B), the substrate 300 placed on the conveying unit 400 can be placed on the conveyor belt 500.

Thereafter, when the conveyor belt 500 rotates, the substrate 300 can be put into the next process.

Referring to FIG. 15, the transfer unit 400 may include a suction unit 401 for fixing the substrate 300.

Such a suction portion 401 can have a circular or elliptic shape as in the case of Fig. 15A.

In addition, as in the case of FIG. 15 (B), the adsorption unit 401 can be adsorbed to the substrate 300 by the force of sucking air.

Meanwhile, in a state where the substrate 300 is fixed, the first grinder 310 and the second grinder 320 can move while grinding one side of the substrate 300. That is, the substrate 300 may be fixed while the substrate 300 is being ground.

16 (A), when the first grinder 310 and the second grinder 320 move in the first direction DR1 while the substrate 300 is fixed, the substrate 300 The first long side LS1 and the second long side LS2 of the first long side LS1 can be grinded.

Here, the first direction DR1 may be the proceeding direction of the substrate processing process. In other words, the grinding process of the substrate can proceed in the first direction DR1.

Alternatively, it is possible for the transfer part 400 to transfer the substrate 300 so that one side of the substrate 300 is grinded by the first grinder 310 and the second grinder 320 during transfer of the substrate 300 . That is, the first grinder 310 and the second grinder 320 may be fixed while the substrate 300 is being ground.

16B, the first grinder 310 and the second grinder 320 are fixed to the substrate 300 in the first direction DR1 by the transfer unit 400, The first long side LS1 and the second long side LS2 of the substrate 300 can be ground.

In this case, it is also possible for the substrate 300 to proceed according to the process flow in the grinding process. Thus, the time required for the grinding process can be saved.

17 to 18 are views for explaining an apparatus and a method for rotating a substrate and processing a substrate in a rotated state. In the following description of the parts described in detail above may be omitted.

Referring to FIG. 17, after the substrate 300 is ground in the first grinding step, the substrate 300 may be rotated.

For example, in the first grinding step, the first long side LS1 and the second long side LS2 of the substrate 300 are connected to the first grinder 310 and the second grinder The substrate 300 may be rotated by 90 degrees to grind the first short side SS1 and the second short side SS2 of the substrate 300. In this case,

17B, the substrate processing apparatus according to the present invention includes a first grinder 310 and a second grinder 320 for rotating the substrate 300 by rotating the first and second grinders 310 and 320, And a rotation unit 700 for rotating the substrate 300 after the grinding is completed.

Referring to FIG. 18, the substrate processing apparatus according to the present invention may include a third grinder 610 and a fourth grinder 620 to perform the second grinding step.

Here, the third grinder 610 and the fourth grinder 620 may each include a plurality of wheels.

The third grinder 610 may grind the first area of the other side of the substrate 300.

The fourth grinder 620 may grind a second region adjacent to the first region of the other side of the substrate 300 while the third grinder 610 grinds the first region of the substrate 300. [

For example, the third grinder 610 may grind the short sides SS1, SS2 in the first region of the substrate 300.

The fourth grinder 620 may also be configured such that the third grinder 610 is positioned in the second region adjacent to the first region of the substrate 300 while the third grinder 610 grinds the short sides SS1 and SS2 in the first region of the substrate 300 It is possible to grind the short sides SS1 and SS2.

In this case, a part of the short sides LS1 and LS2 of the substrate 300 can be grinded by the third grinder 610 and the remaining part can be grinded by the fourth grinder 620. [

In FIG. 18, the third grinder 610 and the fourth grinder 620 may correspond to the first grinder 310 and the second grinder 320 described above. In detail, when the third grinder 610 and the fourth grinder 620 are compared with the first grinder 310 and the second grinder 320, the first and second grinders 310 and 320 are disposed on the substrate 300 And the third and fourth grinders 610 and 620 are used to grind one side of the substrate 300 before rotating the substrate 300 after the grinding by the first and second grinders 310 and 320 is applied To grind the other side of the substrate 300, and the remainder may be substantially the same. Accordingly, further description of the third grinder 610 and the fourth grinder 620 will be omitted.

As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

It should be understood, therefore, that the embodiments described above are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, And all changes or modifications derived from equivalents thereof should be construed as being included within the scope of the present invention.

Claims (10)

A first grinder including at least one wheel; And
A second grinder including at least one wheel;
Lt; / RTI >
The first grinder grinds a first area on one side of a substrate,
Wherein the second grinder grinds a second area adjacent to the first area on one side of the substrate while the first grinder grinds the first area of the substrate,
The first region and the second region are partially overlapped,
Wherein the substrate grinds one side of the substrate while the first grinder and the second grinder move in a fixed state. delete The method according to claim 1,
Wherein the number of wheels included in the first grinder is equal to the number of wheels included in the second grinder. delete The method according to claim 1,
And a transfer part (First Transportation Part) for transferring the substrate such that one side of the substrate is grinded by the first grinder and the second grinder while the substrate is being transferred. The method according to claim 1,
Further comprising a rotation part for rotating the substrate after the grinding of the substrate by the first and second grinders is completed. The method according to claim 6,
A third grinder including at least one wheel; And
A fourth grinder including at least one wheel;
Lt; / RTI >
The third grinder grinding a first region of the other side of the substrate,
And the fourth grinder grinds a second region adjacent to the first region on the other side of the substrate while the third grinder grinds the first region of the substrate. delete delete delete

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