KR20060114983A - Microphone assembly - Google Patents

Abstract

A microphone assembly is provided to minimize a waste of product resource due to a simultaneous disuse of a PCB and an apparatus by saving one element selectively without an additional problem even in case of a whole test result determined as an imperfection. In a microphone assembly(100), an apparatus set(120) comprising an integrated signal part oscillates by a sound inputted from the outside. A PCB(Print Circuit Board)(102) including a circuit structure device electrically processes a capacitance variation according to an oscillation of the apparatus set(120) through the circuit structure device and transforms the sound into an electric signal, wherein each of the circuit structure device and the apparatus set(120) is mounted at a different zone of the PCB(102) respectively. And, a case(101) covers the PCB(102) and accommodates the apparatus set(120).

Description

Microphone assembly

1 is an exemplary view showing a microphone assembly according to the prior art.

Figure 2 is an exploded perspective view showing a separate microphone assembly according to the present invention.

Figure 3 is a cross-sectional view showing the assembled state of the microphone assembly according to the present invention.

Figure 4 is an exploded perspective view showing a separate microphone assembly according to another embodiment of the present invention.

Figure 5 is a cross-sectional view showing the assembly state of the microphone assembly according to another embodiment of the present invention.

6 and 7 illustrate a microphone assembly according to another embodiment of the present invention.

The present invention relates to a microphone assembly, and more particularly, to separate the printed circuit board (PCB) and the instruments into separate, independent sets, the apparatus set being physically located in a different region of the PCB that is distinct from the region in which the circuit structures are formed. Electrically part-mounted to induce the tool set to partially cover only a few areas of the PCB, thereby making it possible to easily design the PCB and the tool set independently to their characteristics without any problems. The present invention relates to a microphone assembly capable of effectively avoiding the problem of increasing the overall size of the assembly on the producer side, a problem in which the manufacturing cost of the assembly is greatly increased, and the like.

Recently, with the rapid development of technology in the field of information and communication devices such as mobile phones and telephones, and in the field of acoustic devices such as amplifiers, there is a demand for a microphone assembly for converting acoustic energy into electrical energy. It also shows a sharp increase.

Typically, such a microphone assembly is surface-mounted on a printed circuit board embedded in an electronic device (information and communication device, sound device, etc.), thereby forming an electrical connection with the printed circuit board, thereby converting the acoustic energy / electric energy given to it. You will be able to perform the role normally.

As shown in FIG. 1, the microphone assembly 10 according to the related art is accommodated in a cylindrical case 1 having an acoustic inlet 1a and a receiving space inside the case 1, The instrument vibrating by the sound M input through the sound inlet 1a above, and the PCB 2 for electrically processing the capacitance change caused by the vibration of the instruments are combined.

In this case, the PCB 2 is collectively mounted in the case 1 together with them, while maintaining a size similar to those of the previous apparatuses, thereby forming a series of laminated unitary structures. A plurality of circuit structures, for example transistors 2a, capacitors 2b, and the like, for electrically handling the capacitance change of these devices are additionally arranged.

At this time, for example, a polar ring (3) and a diaphragm (4) constituting the diaphragm assembly (5), a dielectric plate (7), a diaphragm (4), which maintains a gap with the diaphragm (4), and the like. Spacer-ring 6 for forming gaps between the dielectric plates 7, conductive base rings 8 and conductive base rings 8 for electrically connecting the dielectric plates 7 and the PCB 2. ) And an insulating base ring 9 for insulating the dielectric plate 7 from the case 1 may be selected.

In this situation, the outer rim 1b of the case 1 is bent in the direction of the receiving space through a series of curling procedures to form a structure to isolate the mechanism inside the case 1 from the outside.

However, under the microphone assembly according to the prior art, as described above, the PCB 2 accommodated in the case 1 includes circuit structures for electrically treating the capacitance change of the apparatuses, for example, the transistor 2a, Since the capacitors 2b and the like must be additionally arranged, the producer should keep the size of the PCB 2 above a certain level in order to consider the arrangement area of the circuit structures, unless special measures are taken.

Of course, due to the arrangement of the circuit structures, when the size of the PCB 2 is increased, each of which was collectively mounted on top of the PCB 2 while covering the entire PCB 2, forming a series of single stacked structures. Appliances (e.g., polar ring, diaphragm, dielectric plate, spacer ring, conductive base ring, insulated base ring, etc.) are also unaffected by the PCB 2 and do not require size unless special measures are taken. It will be forced to grow.

Even in the case of the PCB 2, when each apparatus covers a whole area of its own, and forms a series of unitary stacked structures, and is placed on the same sound inflow path as the back chamber 10a placed thereon, In addition to the size increase due to the arrangement of the circuit structures, there is no choice but to bear the burden of maintaining the size, balance, etc. of the back-chamber 10a above a certain level.

In short, as long as the PCB 2 and the respective devices form a unitary stack structure as described above to maintain an unnecessarily interfering structure with each other, on the producer side, the size of the PCB 2 and the devices can be independently adjusted according to their characteristics. The design work cannot be performed at all, and as a result, the overall size of the assembly 10 increases, as well as the problem that the manufacturing cost of the assembly 10 increases significantly due to the increase in size. There is no choice but to take it.

On the other hand, under the conventional system described above, when the assembly procedure of the microphone assembly 10 is finally completed, the producer side uses various test tools to measure the performance of the assembly, and through this, the shipment of defective products is sorted and filtered in advance. The procedure is to proceed.

At this time, as mentioned above, the PCB 2 having the circuit structures and the respective devices (eg, polar ring, diaphragm, dielectric plate, spacer ring, conductive base ring, insulating base ring, etc.) have a similar size, If one of the PCB 2 and the apparatus is defective, since it is mounted inside the case and forms a single-piece structure of a completed form that is electrically and physically precisely single stacked and assembled before a full-scale test procedure, If the entire test result is judged to be defective, the producer must dispose of both components at the same time, even if the other one is of normal quality, with no selective remedy taken. Inevitably face the unreasonable situation, and eventually, the serious problem that the entire product resources are wasted You will have to accept it as it is.

Accordingly, it is an object of the present invention to physically and electrically mount and / or mount a set of instruments in a separate zone of the PCB, separate from the zone of formation of circuit structures, with the PCB and instruments separated into separate and independent sets. Induces partial coverage of only a portion of the PCB, thereby guiding the independent design of the PCB and fixture set to its own characteristics, making it easier and more realistic to realize the entire assembly of the assembly. In order to effectively avoid the problem of increasing the size, the problem of significantly increasing the manufacturing cost of the assembly, and the like.

Another object of the present invention is to separate the PCB and the fixtures into separate sets, thereby inducing the PCB and the instrument set to form independent unit parts, thereby causing any one of the PCBs and the fixtures to fail, and thus the overall test result is bad. Even in the situation where it is determined to be, one of these components can be selectively rescued without any problem, thereby minimizing unnecessary waste of product resources due to simultaneous disposal of both components.

Still other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

In order to achieve the above object, in the present invention, the circuit structures and the tool set are provided on different zones while having a single set of integrated parts, and having a set of instruments vibrating by externally input sound, and circuit structures. A circuit board which divides and is mounted on the circuit board and electrically processes the capacitance change caused by the vibration of the apparatus set through the circuit structures, converts the sound into an electrical signal, and covers the PCB to accommodate the apparatus set inside. A microphone assembly consisting of a combination of cases is disclosed.

Hereinafter, with reference to the accompanying drawings, described in more detail the microphone assembly according to the present invention.

As shown in Figures 2 and 3, the microphone assembly 100 according to the present invention comprises a set of instruments, which vibrate by a sound (M) input from the outside, while forming a rectangular shape, the set of instruments 120 PCB 102 which converts the sound M into a series of electrical signals by electrically processing the change in capacitance according to the vibration of the circuit through self-equipped circuit structures, for example, the transistor 102a and the capacitor 102b. ) And the case 101 for covering the PCB 102 from above and accommodating the front set of instruments 120 therein are closely combined. In this case, the case 101 has a series of metal materials such as aluminum (Al), copper (Cu) and the like, forming a rectangular shape.

At this time, the case 101 has a flexible inlet 101a for the inflow of the sound M is formed in this case, in this situation, for example, the curling portion 101b formed on the outer edge of the case 101 is a series of curling Through the procedure, the structure is bent in the direction of the receiving space to firmly form a structure that isolates the components inside the case 101, for example, the circuit structures, the tool set 120 and the like from the outside.

In this case, depending on the situation, the Curing part 101b of the case 101 is stably inserted into and fixed to the outer region of the PCB 102 corresponding to the Curing part 101b of the case 101, and the mounting state of the accommodation space is provided. A separate insertion groove (102c) may be further formed to maintain the more reliable.

Here, as shown in the figure, the previous set of instruments 120 is the mechanism 110 that vibrates by the sound (M) input through the sound inlet 101a of the case 101, for example, solder cream Taking the structure of electrical contact (physical) with the PCB 102 in front of the junction 103 such as (Solder cream) and the like, the capacitance change according to the vibration of the mechanism (110) PCB 102 Interface board (119) to be delivered to the interface, and the interface board 119 from the top, the container 118 for housing the instruments (110) in its interior as a series of unitary parts form integrally assembled Will be taken.

Of course, the electrical contact (bonding) form of the interface board 119 and the PCB 102 may be modified in various ways depending on the situation. For example, the PCB 102 may be further formed with a joining groove for easily bonding the interface board 119 (set of fixtures) in a state of filling a series of joints, in which case, the interface board 119: set of fixtures. ) Can take the structure of being bonded to the PCB 102 flexibly through this bonding groove.

At this time, the container 118, like the case 101 in the front, is formed with a flexible inlet hole 118a for the inflow of sound (M), in this situation, the outer edge of the container 118 is a series of Through the curling procedure, the structure is bent in the direction of the receiving space to form a structure to isolate the internal mechanisms 110 from the outside.

Here, the former mechanism 110 is, for example, the diaphragm assembly 113, the spacer ring 114, the insulating base ring 115, the dielectric plate 116, the conductive base sequentially mounted in the receiving space of the container 118, for example. The ring 117 or the like may take a combined configuration (of course, such appliances may make elastic deformation depending on the situation, type, arrangement, etc.).

In this case, the diaphragm assembly 113 has a configuration in which the diaphragm 112 and the polar ring 111 fixing the diaphragm 112 are combined, and the dielectric plate 116 is formed through the spacer ring 114. While taking the structure of supporting the polar ring 111, depending on the situation, for example, a metal material or Si material is elastically taken.

At this time, the previous container 118 is made of, for example, aluminum (Al) or copper (Cu), the polar ring 111 is, for example, nickel (Ni) Plating (Prass) plate (Prass plate) The spacer ring 114 is made of, for example, a polyethylene film (PET), and the diaphragm 112 is made of a gold film or a nickel coated PET film. It will be obvious that various modifications can be made).

In this situation, the spacer ring 114 supports the diaphragm 112 in a state where the spacer ring 114 is mounted on the dielectric plate 116, thereby inducing a gap formed between the dielectric plate 116 and the diaphragm 112. The diaphragm 112 vibrates in accordance with the sound M introduced through the acoustic inlet hole 118a while maintaining a gap with the dielectric plate 116, thereby changing the potential of the dielectric plate 116. In the state where the conductive base ring 117 is mounted on the interface board 119, the dielectric plate 116 and the interface board 119 are electrically connected to each other so that the diaphragm 112 and the dielectric of the diaphragm assembly 113 are electrically connected. When a current signal variation occurs according to a gap change between the plates 116, the current signal variation is transferred to the interface board 119, and the insulating base ring 115 is provided with a conductive base ring 117. Covering the edge of the dielectric plate 116, the conductive base ring ( 117 and the dielectric plate 116 serve to block electrical contact with the inner wall of the container 118. In this case, the preceding insulating base ring 115 may be replaced with an insulating film (film) coated on the inner wall of the container 118 according to the situation.

Under this microphone assembly 100 of the present invention, as shown in the figure, the PCB 102 may be arranged in different zones A2, A1 such as circuit structures and the instrument set 120, such as transistors 102a, capacitors 102b, and the like. The structure is divided and mounted on the phase.

In this case, the fixture set 120 naturally occupies some other area A1 of the PCB 102, except for the area A2 occupied by the circuit structures, taking the individual unit structure independent of the PCB 102, resulting in <PCB The package is sequentially mounted on the upper portion of the PCB, thereby leaving the existing monolithic stack structure covering the front surface of the PCB, and flexibly forming a series of binary stack structures partially covering only a portion of the area A1 of the PCB 102. .

Of course, in this way, when the tool set 120 is separated into individual independent cells to partially cover only the other area A1 of the PCB 102 which is separated from the occupied area A2 of the circuit structures, on the producer side, the transistor 102a, the capacitor ( Due to the placement of circuit structures such as 102b) and the like, although the size of the PCB 102 will inevitably increase, irrespective of such a PCB 102, each component of the tool set 120, for example, the container 118 ), Interface board 119, polar ring 111, diaphragm 112, dielectric plate 116, spacer ring 114, conductive base ring 117, insulated base ring 115, back chamber 120a It is possible to independently minimize the size of the back, and, consequently, in proportion to the minimization of the apparatus set 120, the size of the overall assembly 100 is reduced to an optimal state, and the manufacturing cost of the overall assembly 100 is greatly reduced. Falling Advantages And More Effects It is possible to enjoy a.

Furthermore, the instrument set 120 separated into individual independent cells partially covers only the other region A1 of the PCB 102 that is distinct from the occupied region A2 of the circuit structures, so that the chamber 100a and the instrument set (top) of the circuit structure are located. When the acoustic inflow path of the 120 is naturally dualized, the producer side can reduce the size of the chamber 100a defined above the circuit structure to an appropriate level, without any burden on the apparatus set 120, as well as its equilibrium. It can be more easily adjusted, and eventually, can effectively enjoy the advantage that the size of the overall assembly 100 is reduced to the optimal state.

In short, under the implementation environment of the present invention, as described above, when the PCB 102 and the tool set 120 to minimize unnecessary interference with each other, on the producer side, the size of the PCB 120 and the tool set 120, It is possible to naturally perform the task of independently designing the configuration and the like to the characteristics of each, after all, the problem that the overall size of the assembly 100 increases, of course, due to this increase in size, the manufacture of the assembly 100 Even if the cost rises significantly, it can be easily avoided.

On the other hand, under the above-described system of the present invention, when the assembly procedure of the microphone assembly 100 is finally completed, the producer side measures the performance of the assembly 100 by using various test tools, and through this, to release the defective product The screening and filtering process is carried out in advance.

At this time, as described above, under the framework of the present invention, since the apparatus set 120 and the PCB 102 take a separate unit structure separately and independent from each other, when the present invention is implemented, the PCB 102 on the producer side And even in a situation where any one of the tool sets 120 is defective and the entire test result is determined to be defective, it is possible to selectively remedy any one of these components without any problems. Unnecessary waste of product resources due to simultaneous disposal of components can be minimized.

For example, under the implementation environment of the present invention, the case 101 is only separated from the PCB 102 even when a difficult situation occurs in which the apparatus set 120 is defective on the producer side and the entire test result is determined to be defective. After that, only the procedure of extracting the apparatus set 120 mounted on the PCB 102 enables the PCB 102 and the case 101 to be effectively recycled, and furthermore, the PCB 102 causes a defect, Even when a difficult situation occurs in which the entire test result is determined to be defective, only by removing the case 102 from the PCB 102 and then extracting the set of instruments 120 mounted on the PCB 102. The apparatus set 120 can be effectively recycled.

On the other hand, under the system of the present invention having the above-described configuration, after a series of sound waves (M) is introduced through the sound wave inlet 101a of the case 101, the sound wave inlet hole of the chamber (100a) and the container 118 ( When passing through 118a, the diaphragm 112 immediately takes a mechanism which vibrates at a constant speed by this sound wave M. As shown in FIG.

Of course, when the vibration of the diaphragm 112 proceeds, the gap formed between the diaphragm 112 and the dielectric plate 116 is changed at a constant speed by the vibration, and the diaphragm 112 and The electrostatic field between the dielectric plates 116 also changes in response to sound waves. As a result, according to a general law of electrostatic induction, the potential of the dielectric plate 116 may also be rapidly changed in response to sound waves.

In this state, the potential variable value of the dielectric plate 116 is transferred to the interface board 119 via the conductive base ring 117 and then to the PCB 102 in electrical contact with the interface board 119. When the PCB 102 utilizes circuit structures such as the transistor 102a, the capacitor 102b, and the like, the PCB 102 may quickly execute an operation of amplifying and outputting the current value according to the corresponding potential variable value to the outside. As a result, the microphone assembly 100 according to the present invention flexibly completes its inherent task of converting acoustic energy into electrical energy.

On the other hand, as shown in Figures 4 and 5, under another embodiment of the present invention, the producer side may make a change to form the sound wave inlet (102d) in the PCB 102, not the case 101.

Of course, the reason why such a change is freely possible without any problem is that, as described above, under the framework of the present invention, the PCB 102 and the case 01 are separate from each other and separate from the set 120 of the apparatus, unlike the prior art. This is because the unit structure is taken to naturally maintain a pattern for minimizing unnecessary interference with the apparatus set 120.

In such an implementation environment of the present invention, on the producer side, depending on the site situation, the case 101 or the PCB 102 formed with the sound wave inlet 101d is formed irrespective of the shape of the apparatus set 120 according to the site situation. Taken in a flexible manner, it is possible to more freely select the direction of the sound wave inlet, and, as a result, can effectively enjoy the advantage that the overall production efficiency of the assembly 100 is greatly improved.

Of course, even under this embodiment of the present invention, the producer side has the advantage that the size of the overall assembly 100 is optimally reduced, the manufacturing cost of the overall assembly 100 is greatly reduced, unnecessary waste of product resources is minimized It is possible to enjoy the back effectively.

The present invention can take various modifications depending on the situation.

For example, in the present invention, as shown in Figs. 6 and 7, measures may be taken to change the PCB and the case from the rectangular structure of the previous embodiment to the circular structure.

Of course, even in this case, the producer side can effectively enjoy the advantages of reducing the size of the overall assembly 100 to an optimal state, greatly reducing the manufacturing cost of the overall assembly 100, minimizing unnecessary waste of product resources, etc. Will be.

As described in detail above, in the present invention, in the state of separating the PCB and the apparatus into separate and independent sets, the apparatus set is physically and electrically part-mounted in another area of the PCB which is separated from the formation area of the circuit structures, On the producer side, by inducing the tool set to partially cover only a partial area of the PCB, thereby guiding the design of the PCB and the tool set independently to their characteristics can be easily realized without any problems. It is possible to effectively avoid the problem of increasing the overall size of the assembly, the problem of significantly increasing the manufacturing cost of the assembly.

In addition, in the present invention, by separating the separate set of the PCB and the instruments, the PCB and the set of instruments to form a separate unit parts from each other, through which, any one of the PCB and the instruments cause a failure, the entire test result is defective Even in the situation to be determined, it is possible to minimize unnecessary waste of product resources due to simultaneous disposal of both components, by allowing any one of these components to be selectively rescued without any problems.

The present invention described above has an overall useful effect in various types of microphone assemblies.

And, in the foregoing, specific embodiments of the present invention have been described and illustrated, but it is obvious that the present invention may be variously modified and implemented by those skilled in the art. Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

Claims (3)

A set of instruments oscillating by an externally input sound while forming an integrated unitary component; Having circuit structures, the circuit structures and the apparatus set are divided and mounted on different zones, and the capacitance changes due to the vibration of the apparatus set are electrically processed through the circuit structures, thereby electrically transmitting the sound. PCB (Printed Circuit Board) for converting the signal; And a case covering the PCB to house the set of instruments therein. The apparatus of claim 1, wherein the set of instruments comprises: a diaphragm vibrating by sound; Polar ring fixing the diaphragm; A dielectric plate supporting the polar ring and maintaining a predetermined gap with the diaphragm; A conductive base ring supporting the dielectric plate; An interface board electrically connected to the dielectric plate through the conductive base ring, and in electrical contact with the PCB to transfer a change in capacitance due to vibration of the diaphragm to the PCB; And a container for covering the interface board and accommodating the diaphragm, the polar ring, the dielectric plate, and the conductive base ring while having an acoustic inlet for introducing the sound. The microphone assembly of claim 1, wherein the PCB or the case further includes a sound inlet for introducing the sound.

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