KR20060112463A - Dual panel apparatus - Google Patents

Abstract

A dual panel apparatus is provided to reduce manufacturing cost by using two organic EL(Electro-Luminescence) panels as a main display window and a sub-display window. A dual panel apparatus includes a first panel(100), a second panel(102), and a data driver(104). The first panel includes a first sub-ITO layer, a second sub-ITO layer, and a first metal electrode layer, which crosses the first and second sub-ITO layers. The second panel includes a second ITO layer and a second metal electrode layer, which crosses the second ITO(Indium Tin Oxide) layer. The data driver includes first pads, which are connected to the first sub-ITO layers, and second pads, which are connected to the second sub-ITO layers. The data driver is positioned between the first and second panels. The second pads are connected to the second ITO layers, which correspond to the second sub-ITO layers.

Description

Dual Panel Unit {DUAL PANEL APPARATUS}

1 is a view showing a dual panel device according to a first embodiment of the present invention.

2 illustrates a dual panel device according to a second preferred embodiment of the present invention.

3 is a diagram illustrating a dual panel device according to a third embodiment of the present invention.

4 illustrates a dual panel device according to a fourth preferred embodiment of the present invention.

The present invention relates to a dual panel device, and more particularly, to a dual panel device using two organic electroluminescent panels.

The dual panel device refers to a device using two panels as a main display window and a sub display window.

For example, the dual panel device is a mobile communication terminal.

The conventional dual panel device uses a liquid crystal display device as a main display window and an organic electroluminescent panel as a sub display window.

Therefore, the dual panel device had to separately include an integrated circuit chip for driving the liquid crystal display and an integrated circuit chip for driving the organic electroluminescent panel.

Therefore, the dual panel device was forced to increase in size.

In addition, the liquid crystal display device has a higher manufacturing cost compared to the organic electroluminescent panel due to its characteristics, thereby increasing the unit price of the dual panel device.

Therefore, there is a need for a dual panel device capable of lowering the manufacturing cost and reducing its size.

It is a first object of the present invention to provide a dual panel device using two organic electroluminescent panels.

It is a second object of the present invention to provide a dual panel device for positioning a data driver between a stack type first panel and a stripe type second panel.

In order to achieve the above object, the dual panel device according to the first preferred embodiment of the present invention includes a first panel, a second panel and a data driver. The first panel includes first sub indium tin oxide layers, second sub indium tin oxide layers, and first metal electrode layers intersecting the sub indium tin oxide layers. The second panel includes second indium tin oxide layers and second metal electrode layers intersecting the second indium tin oxide layers. The data driver is positioned between the first panel and the second panel, and includes first pads connected to the first sub indium tin oxide layers and a second pad connected to the second sub indium tin oxide layers. Include them. Here, the second pads are also connected to the second indium tin oxide layers corresponding to the second sub indium tin oxide layers.

The dual panel device according to the second preferred embodiment of the present invention includes a first panel, a second panel, and a data driver. The first panel includes first sub indium tin oxide layers, second sub indium tin oxide layers, and first metal electrode layers intersecting the sub indium tin oxide layers. The second panel includes second indium tin oxide layers and second metal electrode layers intersecting the second indium tin oxide layers. The data driver may be disposed between the first panel and the second panel, and may include first pads connected to the first sub indium tin oxide layers and a second pad connected to some of the second sub indium tin oxide layers. Second pads and third pads connected to the rest of the second sub indium tin oxide layers. Here, the second pads are also connected to the second indium tin oxide layers corresponding to some of the second sub indium tin oxide layers.

The dual panel device according to the third preferred embodiment of the present invention includes a first panel, a second panel, and a data driver. The first panel includes first indium tin oxide layers and first metal electrode layers crossing the first indium tin oxide layers. The second panel includes second indium tin oxide layers and second metal electrode layers crossing the second indium tin oxide layers. The data driver includes pads positioned between the first panel and the second panel and connected to the first indium tin oxide layers and corresponding second indium tin oxide layers.

The dual panel device according to the fourth preferred embodiment of the present invention includes a first panel, a second panel, and a data driver. The first panel includes first indium tin oxide layers and first metal electrode layers crossing the first indium tin oxide layers. The second panel includes second indium tin oxide layers and second metal electrode layers crossing the second indium tin oxide layers. The data driver is positioned between the first panel and the second panel, the first pads and the first pads being connected to some of the first indium tin oxide layers and corresponding second indium tin oxide layers. Second pads connected to the rest of the one indium tin oxide layers.

 The dual panel device according to the present invention uses two organic electroluminescent panels as a main display window and a sub display window, and thus can be miniaturized while lowering the unit cost.

In addition, since the dual panel device according to the present invention uses a stack type panel, it is suitable for realizing a large capacity panel.

Furthermore, the dual panel device according to the present invention can be miniaturized since the data driver is located between the first panel and the second panel.

Hereinafter, exemplary embodiments of the dual panel device according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a dual panel device according to a first embodiment of the present invention.

Referring to FIG. 1, the dual panel device of the present invention includes a first panel 100, a second panel 102, a data driver 104, a first scan driver 106, and a second scan driver 108. do.

The first panel 100 according to an embodiment of the present invention is a main panel, and the second panel 102 is a sub-panel.

The first panel 100 is a stripe-type panel, and includes first indium tin oxide films 110 (hereinafter referred to as “first ITO layers”) and first metal electrode layers. And a plurality of first pixels 114 formed in regions where 112 crosses.

Each of the first pixels 114 includes a first ITO layer 110, an organic material layer, and a metal electrode layer 112 that are sequentially stacked.

The second panel 102 includes a plurality of second pixels 120 formed in regions where the second ITO layers 116 and the second metal electrode layers 118 intersect.

The data driver 104 includes pads 124 and a data driver 122 that are respectively connected to the first ITO layers 110 through the first data lines 126.

The data driver 122 transmits data signals to the first ITO layers 110 through the pads 124 and the first data lines 126.

In this case, data signals transmitted to the first ITO layers 110 are transmitted to the second ITO layers 116 through the second data lines 128.

The first scan driver 106 transmits the first scan signals to the first metal electrode layers 112 through the first scan lines 130.

The second scan driver 108 transmits second scan signals to the second metal electrode layers 118 through the second scan lines 132.

In short, the dual panel device of the present invention uses two organic electroluminescent panels unlike the conventional dual panel device.

Therefore, the dual panel device of the present invention can drive the panels 100 and 102 using one integrated circuit chip, unlike the conventional dual panel device which used two integrated circuit chips. Here, the integrated circuit chip includes a data driver 104 and scan drivers 106 and 108.

As a result, the dual panel device of the present invention can be miniaturized as compared with the conventional dual panel device.

In addition, since the organic electroluminescent panel is less expensive than the liquid crystal display device, the unit price of the dual panel device can be reduced.

2 illustrates a dual panel device according to a second preferred embodiment of the present invention.

Referring to FIG. 2, the dual panel apparatus of the present invention includes a first panel 200, a second panel 202, a data driver 204, a first scan driver 206, and a second scan driver 208. do.

The first panel 200 is a stack-typed panel and includes first ITO layers and first metal electrode layers 214.

The first ITO layers each include a first sub ITO layer 210 and a second sub ITO layer 212.

First subpixels 216 are formed in regions where the first sub-ITO layers 210 and the metal electrode layers 214 intersect.

Second sub-pixels 218 are formed in regions where the second sub-ITO layers 212 and the metal electrode layers 214 intersect.

In this case, the stack type panel has a number of metal electrode layers cut in half and a width doubled as compared with the stripe type panel.

Since the width of the metal electrode layers is doubled, the resistance of the metal electrode layers is reduced.

Therefore, as the size of the panel increases, the stack type panel is preferable.

Since the first panel 200 according to the exemplary embodiment of the present invention has a large size as the main panel, the first panel 200 is preferably a stack type.

The second panel 202 includes a plurality of second pixels 224 formed in regions where the second ITO layers 220 and the second metal electrode layers 222 intersect.

The data driver 204 provides first data signals to the first sub ITO layers 210 through the first data lines 230 and second data signals to the second sub ITO layers 212.

The data driver 204 includes pads 228 and data drivers 226 connected to the sub ITO layers 210 and 212, respectively.

The data driver 226 transmits data signals to the first sub ITO layers 110 through the pads 228 and the first data lines 230.

In this case, data signals transmitted to the first sub ITO layers 210 are transmitted to the second ITO layers 220 through the second data lines 232.

The first scan driver 206 transmits first scan signals to the first metal electrode layers 214 through the first scan lines 234.

The second scan driver 208 transmits the second scan signals to the second metal electrode layers 222 through the second scan lines 236.

3 is a diagram illustrating a dual panel device according to a third embodiment of the present invention.

Referring to FIG. 3, the dual panel device of the present invention includes a first panel 300, a second panel 302, a data driver 304, a first scan driver 306, and a second scan driver 308. do.

The first panel 300 includes a plurality of first pixels 314 formed in regions where the first ITO layers 310 and the first metal electrode layers 312 intersect.

The second panel 302 includes a plurality of second pixels formed in regions where the second ITO layers 316 and the second metal electrode layers 318 intersect.

The data driver 304 is positioned between the first panel 300 and the second panel 302, and includes a data driver 320 and a plurality of pads 322.

Pads 322 are connected to ITO layers 310 and 316, respectively, through data lines 324 and 326.

The first scan driver 306 transmits the first scan signals to the first metal electrode layers 312 through the first scan lines 328.

The second scan driver 308 transmits the second scan signals to the second metal electrode layers 318 through the second scan lines 330.

Hereinafter, the dual panel device of the first embodiment and the dual panel device of the third embodiment will be compared.

In the dual panel device of the first embodiment, data currents corresponding to the data signals are transmitted to the second ITO layers 116 through the first ITO layers 110. Therefore, the data driver 122 provides the first ITO layers 110 with a current corresponding to twice the data current required for the first panel 100 to provide the data currents required for the second ITO layers 110. do.

On the other hand, in the dual panel device of the third embodiment, since the data driver 304 is located between the first panel 300 and the second panel 302, the data driver 320 is formed of the first panel 300 and the first panel. The two panels 302 need only provide the data currents required for each.

That is, the data driver 320 of the third embodiment may generate a data current having a smaller value than that of the data driver 122 of the first embodiment.

Therefore, the dual panel device of the third embodiment can be made smaller than the dual panel device of the first embodiment.

In a dual panel device according to another embodiment of the present invention, the first ITO layers of the first panel may be larger than the number of second ITO layers of the second panel.

That is, the first data lines of the first panel are larger than the number of second data lines of the second panel.

In this case, the data driver includes first pads connected to both some of the first data lines and corresponding second data lines, and second pads connected to the other of the first data lines.

4 illustrates a dual panel device according to a fourth preferred embodiment of the present invention.

Referring to FIG. 4, the dual panel apparatus of the present invention includes a first panel 400, a second panel 402, a data driver 404, a first scan driver 406, and a second scan driver 408. do.

The first panel 400 includes first ITO layers and metal electrode layers 414.

The first ITO layers include first sub ITO layers 410 and second sub ITO layers 412.

In addition, the first panel 400 includes the first sub pixels 416 and the second sub ITO layers 412 formed in regions where the first sub ITO layers 410 and the metal electrode layers 414 intersect. And second sub pixels 418 formed in regions where the metal electrode layers 414 intersect with each other.

The second panel 402 includes second pixels 424 formed in regions where the second ITO layers 420 and the second metal electrode layers 422 intersect.

The data driver 404 includes a data driver 426, first pads 428, second pads 430, and third pads 432.

The data driver 426 transmits data signals to the first sub ITO layers 410 and the second ITO layers 420 through the first and second pads 428 and 430.

The first pads 428 are connected to the first sub ITO layers 410 through the first data lines 434.

The second pads 430 may pass through the second sub ITO layers 412 and the second ITO through the second data lines 436 and the third data lines 438 corresponding to the second data lines 436. Connected to layers 420.

The third pads 432 are pads for bonding, which balance the bonding when the data driver 404 and the first and second panels 400 and 402 are bonded to bond.

The first scan driver 406 transmits the first scan signals to the first metal electrode layers 414 through the first scan lines 440.

The second scan driver 408 transmits the second scan signals to the second metal electrode layers 422 through the second scan lines 442.

Hereinafter, the dual panel device of the fourth embodiment and the dual panel device of the third embodiment will be compared.

The first panel 400 of the fourth embodiment is a stack type and the first panel 300 of the third embodiment is a stripe type.

 Here, since the stack type panel has twice the width of the metal electrode layers 414 as compared with the stripe type panel, the resistance of the metal electrode layers 414 is reduced.

Therefore, the characteristics of the first panel 400 of the fourth embodiment are superior to those of the first panel 300 of the third embodiment.

Therefore, the larger the panel, the more suitable the first panel 400 of the fourth embodiment is.

Hereinafter, the dual panel device of the fourth embodiment and the dual panel device of the second embodiment will be compared.

 In the dual panel device of the second exemplary embodiment, data currents corresponding to the data signals are transmitted to the second ITO layers 220 through the first sub ITO layers 210. Therefore, the data driver 226 supplies a current corresponding to twice the data current required by the first panel 200 to the first sub ITO layers 210 in order to provide a data current necessary for the second ITO layers 220. to provide.

On the other hand, in the dual panel apparatus of the fourth embodiment, since the data driver 404 is located between the first panel 400 and the second panel 402, the data driver 426 is formed of the first panel 400 and the first panel. The two panels 402 need only provide the data currents required.

That is, the data driver 426 of the fourth embodiment needs to generate a data current having a smaller value than that of the data driver 226 of the second embodiment.

Therefore, the dual panel device of the fourth embodiment can be made smaller than the dual panel device of the second embodiment.

In a dual panel device according to another embodiment of the present invention, the first ITO layers of the first panel may be larger than the number of second ITO layers of the second panel.

That is, the first and second data lines of the first panel are larger than the number of third data lines of the second panel.

In this case, the data driver may include first pads connected only to the first data lines, second pads connected to some of the second data lines and corresponding third data lines, and a third pad for bonding. And fourth pads connected to the other of the second data lines.

Preferred embodiments of the present invention described above are disclosed for purposes of illustration, and those skilled in the art having ordinary knowledge of the present invention will be able to make various modifications, changes, additions within the spirit and scope of the present invention, such modifications, changes and Additions should be considered to be within the scope of the following claims.

As described above, since the dual panel device according to the present invention uses two organic electroluminescent panels as the main display window and the sub display window, there is an advantage that it can be miniaturized while lowering the unit cost.

In addition, since the dual panel device according to the present invention uses a stack type panel, there is an advantage suitable for implementing a large capacity panel.

In addition, the dual panel device according to the present invention has an advantage of miniaturization since the data driver is located between the first panel and the second panel.

Claims (8)

A first panel including first sub indium tin oxide layers, second sub indium tin oxide layers, and first metal electrode layers intersecting the sub indium tin oxide layers; A second panel including second indium tin oxide layers and second metal electrode layers intersecting the second indium tin oxide layers; And A data driver positioned between the first panel and the second panel and having first pads connected to the first sub indium tin oxide layers and second pads connected to the second sub indium tin oxide layers Including, And the second pads are also connected to the second indium tin oxide layers corresponding to the second sub indium tin oxide layers. The dual panel device of claim 1, wherein the second pads are positioned between the first pads. The dual panel apparatus of claim 2, wherein the second pads and the first pads are located on different planes. The display apparatus of claim 1, further comprising: a first scan driver connected to the first metal electrode layers; And And a second scan driver connected to the second metal electrode layers. A first panel including first sub indium tin oxide layers, second sub indium tin oxide layers, and first metal electrode layers intersecting the sub indium tin oxide layers; A second panel including second indium tin oxide layers and second metal electrode layers intersecting the second indium tin oxide layers; And First pads disposed between the first panel and the second panel and connected to the first sub indium tin oxide layers, second pads connected to some of the second sub indium tin oxide layers; A data driver having third pads connected to the rest of the second sub indium tin oxide layers, And the second pads are also connected to the second indium tin oxide layers corresponding to some of the second sub indium tin oxide layers. A first panel including first indium tin oxide layers and first metal electrode layers crossing the first indium tin oxide layers; A second panel including second indium tin oxide layers and second metal electrode layers crossing the second indium tin oxide layers; And A data driver positioned between the first panel and the second panel, the data driver having pads connected to the first indium tin oxide layers and corresponding second indium tin oxide layers. Dual panel unit. The semiconductor device of claim 6, further comprising: a first scan driver connected to the first metal electrode layers; And And a second scan driver connected to the second metal electrode layers. A first panel including first indium tin oxide layers and first metal electrode layers crossing the first indium tin oxide layers; A second panel including second indium tin oxide layers and second metal electrode layers crossing the second indium tin oxide layers; And First pads and the first indium tin oxide, which are positioned between the first panel and the second panel, are connected to some of the first indium tin oxide layers and the corresponding second indium tin oxide layers. And a data driver having second pads connected to the rest of the layers.

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