KR20060109011A - Plasma display apparatus, plasma display panel and manufacturing method thereof - Google Patents

Abstract

A plasma display apparatus, a plasma display panel, and a manufacturing method thereof are provided to improve an exhaust characteristic and a discharge characteristic by forming differently barrier ribs of a discharge region and a non-discharge region. A plurality of row and column barrier ribs(610a,610b) having different height are formed in a discharge region(A) of a panel. The plurality of row and column barrier ribs having the same height are formed in a non-discharge region(B) of the panel. The height of the low barrier ribs formed in the discharge region is lower than the height of the column barrier ribs formed in the discharge region. The height of the low barrier ribs formed in the discharge region corresponds to 70 to 80 percent of the height of the column barrier ribs formed in the discharge region.

Description

Plasma Display Apparatus, Plasma Display Panel and Manufacturing Method Thereof {Plasma Display Apparatus, Plasma Display Panel and Manufacturing Method Thereof}

1 is a view showing the structure of a typical plasma display panel.

2 to 4 is a view showing a partition structure of a conventional plasma display panel.

5 is a view for explaining a process of forming a phosphor layer of a conventional plasma display panel using a dispensing apparatus.

6 is a perspective view showing a partition structure of the plasma display panel according to the present invention.

7A to 7F are diagrams sequentially illustrating a method of manufacturing a partition wall of a plasma display panel according to the present invention.

<Explanation of symbols for the main parts of the drawings>

A: discharge region B: non-discharge region

600: lower glass 630: lower dielectric layer

610a: low bulkhead 610a ': low bulkhead

610b: column bulkhead

The present invention relates to a plasma display panel. More particularly, the present invention relates to a plasma display panel and a plasma display panel, which can prevent infiltration of impurities, noise, and color mixing when phosphors are applied by improving partition walls that partition discharge cells of the plasma display panel. And a method for producing the same.

In general, a plasma display panel is a partition wall formed between a front panel and a rear panel to form one unit cell, and each cell includes neon (Ne), helium (He), or a mixture of neon and helium (Ne + He). An inert gas containing a main discharge gas such as and a small amount of xenon is filled. When discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such a plasma display panel has a spotlight as a next generation display device because of its thin and light configuration.

1 illustrates a structure of a general plasma display panel.

As shown in FIG. 1, a plasma display panel includes a front panel in which a plurality of sustain electrode pairs formed by pairing a scan electrode 102 and a sustain electrode 103 are arranged on a front glass 101 that is a display surface on which an image is displayed. A rear panel 110 having a plurality of address electrodes 113 arranged so as to intersect the plurality of sustain electrode pairs on the back glass 111 forming the back surface 100 and the rear surface is coupled in parallel with a predetermined distance therebetween. .

The front panel 100 is a bus made of a scan material 102 and a sustain electrode 103, that is, a transparent electrode a made of a transparent material and a metal material to mutually discharge and maintain light emission of the cells in one discharge cell. The scan electrode 102 and the sustain electrode 103 provided as the electrodes b are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by a dielectric layer 104 which limits the discharge current and insulates the electrode pairs, and the upper surface of the upper dielectric layer 104 is magnesium oxide to facilitate the discharge conditions. A protective layer 105 on which (MgO) is deposited is formed.

The rear panel 110 has an address electrode 113 arranged in a direction crossing the scan electrode 102 and the sustain electrode 103 arranged in parallel on the top glass 101 on the rear glass 111. The lower dielectric layer 115 is formed on the electrode 113. In addition, a partition wall 112 is formed on the lower dielectric layer 115 to partition the discharge cells, and a fluorescent layer 114 is applied to the discharge cell space to discharge R (red), G (green), and B (blue). Visible light having any one color is generated.

On the other hand, in the conventional plasma display panel having such a structure, the partition wall 112 for forming a plurality of discharge spaces, that is, the discharge cells on the rear panel has a stripe type and a well type according to the structure. Divided. The partition wall 112 has various designs in consideration of brightness characteristics, exhaust characteristics, phosphor coating area, and the like.

2 to 4 illustrate a partition structure of a conventional plasma display panel.

FIG. 2 is a stripe type structure in which the partition walls 112 formed on the lower dielectric layer 115 on the rear glass 111 are arranged in a row. The partition walls 112 are scan electrodes (not shown) formed of a bus electrode and a transparent electrode. ) And a sustain electrode (not shown). In this stripe type barrier rib structure, the bus electrode is exposed on the discharge space to facilitate interaction with the address electrode 113 of the rear glass 111 and the manufacturing process is simple. However, there is a disadvantage in that visible light generated at the time of discharge is leaked in the stripe direction of the partition wall, and phosphor printing and exhausting are easy, but there is a disadvantage in that the luminescence efficiency is not high due to the small discharge area and phosphor coating area affecting adjacent cells.

FIG. 3 is a well-type structure in which the partition wall 112 formed on the lower dielectric layer 115 on the rear glass 111 has a lattice shape, and as shown, the partition wall 112 is a bus electrode and a transparent electrode. It is arranged horizontally or vertically with a scan electrode (not shown) and a sustain electrode (not shown). The well-type barrier rib structure can increase luminance by increasing phosphor coating area of each discharge cell, and can prevent crosstalk in all directions, but the manufacturing process is difficult and the plasma display panel is difficult. There is a problem in that the impurity gas is not easily exhausted to the outside in the exhaust process of the manufacturing process.

In order to improve the exhaust characteristics of the well-type partition wall structure, as shown in FIG. 4, a difference in height is provided between the first partition wall 112a and the second partition wall 112b for partitioning the discharge cell to improve the exhaust characteristic. Now.

However, such a partition structure has a noise problem of the plasma display panel due to the unbalance of the partition wall. In addition, there is a problem that impurity gases generated by the firing process after the exhaust process of the panel affect the discharge region and thus deteriorate the image quality of the plasma display panel.

On the other hand, the phosphor layer applied between the partition walls of the plasma display panel described above is formed through screen printing using a mask or dispensing using a dispensing apparatus.

Referring to a method of forming a phosphor layer of a plasma display panel using a screen printing method, first, a phosphor paste is prepared, and a phosphor paste is printed a plurality of times between partition walls using a mask.

As a result, a phosphor showing a specific color of red, green, and blue is printed on each pixel area, and the light-emitting layer is repeated several times to form a phosphor layer having a suitable thickness and uniformity. In other words, printing is performed on all of the red pixel pastes at the same time using the red phosphor paste, and then the mask is changed again to print the green phosphor paste, and finally, the blue phosphor paste is replaced with the mask.

Between such printing process includes a process of drying at a temperature of 80 ℃ or more and 150 ℃ or less, if all the phosphors are printed through the above-described process, the phosphor layer is formed by firing at a temperature of 350 ℃ or more and 550 ℃ or less.

However, the method of forming the phosphor layer between the partition walls using the screen printing method has the advantage of using low-cost equipment, but the mask clogging may occur due to the phosphor paste, thereby reducing the reliability of the process. In addition, it is not easy to precisely adjust the thickness of the phosphor layer to be printed, there is a problem that may occur due to the wear of the squeegee for printing the paste through a mask may increase the manufacturing cost.

Due to the problem of the screen printing method, recently, a phosphor layer is formed through a dispensing method using a dispensing apparatus, which is one of direct patterning methods.

5 is a view for explaining a process of forming a phosphor layer of a conventional plasma display panel using a dispensing apparatus.

As shown in FIG. 5, the dispensing apparatus includes a server 510, a pressure pump 520, a header 530, and the like, and the phosphor slurry 550 supplied from the server 510 is a pressure pump ( The pressure is supplied to the header 530 by 520.

First, the slurry chamber 530a and the nozzle 540 are provided in the header 530, and the phosphor slurry 550 pressurized and supplied to the slurry chamber 530a is continuously discharged from the nozzle 540.

Although not illustrated, the header 530 is configured to be linearly driven by a header scanning mechanism, and the rear panel 110 is formed by continuously scanning the header 530 and simultaneously discharging the phosphor slurry 550 from the nozzle 540. The phosphor slurry is uniformly applied between the partition walls 112. Thereafter, when fired at a temperature of 350 ° C or more and 550 ° C or less, a phosphor layer is formed.

As described above, when the phosphor layer is formed using a dispensing apparatus, the phosphor slurry is uniformly applied between the partition walls, but the viscosity characteristic of the phosphor slurry is generally the viscosity of the phosphor paste used when forming the phosphor layer by screen printing. Lower than The viscosity characteristic of the phosphor slurry has a problem of causing mixing of the phosphor formed in the discharge cell. That is, when dispensing a low-viscosity phosphor slurry between partition walls, the phosphor slurry should be formed only in a desired discharge cell, but flows into an undesired discharge cell due to the high spreadability of the slurry, thereby causing a mixture of phosphors.

In particular, such phosphor mixing occurs easily due to misalignment between the dispensing device and the partition wall formed in the panel.

In addition, the phosphor mixture color generation easily occurs according to the discharge cell structure when discharging the phosphor slurry, that is, when the structure of the barrier rib is a closed type including a row barrier rib and a column barrier rib. This is because, during slurry dispensing, the phosphor slurry flows through the upper row row of the closed partition walls to the upper row row of neighboring row partitions, thereby forming unwanted phosphors in other discharge cells. Here, the low barrier rib is a barrier rib for partitioning into one unit pixel in a discharge space in which phosphors of the same color, for example, only R phosphor, only G phosphor, or only phosphor B are applied, and the column barrier means R, Means a partition for separating each of the R, G, B phosphors in the discharge space coated with the G, B phosphors to divide into unit pixels.

On the other hand, when the phosphor layer is formed using the dispensing apparatus, it is possible to increase the viscosity of the phosphor slurry to prevent color mixing, but if the viscosity is too high, it may cause clogging to the nozzle of the dispensing apparatus and the desired spray may not be performed. As a result, there is a problem in that the phosphor slurry cannot be applied.

In order to solve this problem, the present invention can improve the barrier rib structure of the plasma display panel to prevent exhaust gas and discharge characteristics, as well as to prevent noise problems of the plasma display panel due to the unbalance of the barrier rib and inflow of impurity gas into the discharge region. Another object of the present invention is to provide a plasma display device, a plasma display panel, and a method of manufacturing the same, which can prevent misalignment between the phosphor dispensing device and the partition wall.

In the plasma display panel according to the present invention for achieving the above object, the row partitions and column partitions having different heights are formed in the discharge region of the panel, and the row partitions and column partitions having the same height in the non-discharge region of the panel. Are formed.

Low-level partitions among the row partitions and the column partitions formed in the discharge region of the panel are characterized in that the row partitions.

The height of the row partitions formed in the discharge region of the panel is 70% or more and 80% or less with respect to the height of the column partitions.

The row barrier ribs formed in the discharge region of the panel do not have the same height.

The height of at least one of the row barrier ribs formed in the discharge region of the panel is not constant.

The height of at least one of the column barrier ribs formed in the discharge region of the panel is not constant.

The row partitions formed in the non-discharge region of the panel and the row partitions among the column partitions do not have the same height.

The height of at least one of the row partitions formed in the non-discharge area of the panel is not constant.

In addition, the plasma display apparatus according to the present invention includes a plasma display panel in which row partitions and column partitions having different heights are formed in the discharge region of the panel, and row partitions and column partitions having the same height are formed in the non-discharge region of the panel. Include.

In addition, in the method of manufacturing a plasma display panel in which row barrier ribs and column barrier ribs are formed on glass in a discharge region and a non-discharge region, a discharge cell is partitioned, and a phosphor is coated on the discharge cell. The process of forming the barrier ribs and the column barrier ribs includes: (a) applying a barrier paste on top of a dielectric formed in the glass of the discharge zone and the non-discharge zone; (b) the row barrier ribs and the column barrier ribs at a first height on the barrier paste; Forming a predetermined pattern in the field; and (c) forming an upper portion of the row partition walls among the row partition walls formed in the discharge region so as to have a second height lower than the first height.

The upper portion of at least one of the row barrier ribs in the discharge region may be etched to form a row barrier lower than the second height.

At least one of the row partitions and the column partitions in the discharge region may be partially etched to form row partitions and column partitions of which height is not constant.

An upper portion of at least one of the row partitions in the non-discharge region is etched to form a row partition lower than the first height.

The upper portion of the row barrier ribs in the non-discharge region are partially etched to characterize the row barrier ribs whose height is not constant.

Etching on the row partitions and the column partitions is characterized by the etching method.

The phosphor is characterized in that it is formed by a direct patterning method.

The direct patterning method is characterized by any one of an inkjet method and a dispensing method.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

6 is a perspective view illustrating a partition structure of a plasma display panel according to the present invention.

Before looking at FIG. 6, although not shown in the drawing, the plasma display panel according to the present invention is formed by bonding a front panel, which is a display surface on which an image is displayed, and a rear panel, which forms a rear surface, to be bonded to each other at a predetermined interval.

The front panel includes a sustain electrode formed by pairing a scan electrode and a sustain electrode on the front glass, and an upper dielectric layer is stacked on the front glass where the scan electrode and the sustain electrode are arranged in parallel to limit the discharge current. In addition, the upper dielectric layer is formed with a protective layer on which magnesium oxide (MgO) is deposited to prevent damage to the upper dielectric layer and to increase emission efficiency of secondary electrons by sputtering generated during plasma discharge.

An address electrode is provided on the upper side of the rear glass of the rear panel in a direction crossing the sustain electrodes arranged parallel to the upper side of the front glass, and a lower dielectric layer is formed on the address electrode to accumulate wall charges. In addition, a partition wall is formed on the lower dielectric layer to partition the discharge cells, and a fluorescent layer is applied to the discharge cell space so that visible light having any one of R (red), G (green), and B (blue) color is discharged. Will occur.

As shown in FIG. 6, the partition wall formed in the plasma display panel having the structure is surrounded by the row partition walls 610a and the column partition walls 610b on the lower dielectric layer 630 on the rear glass 600. The height of the row partition wall 610a and the column partition wall 610b in the discharge area A in which the image is displayed and the non-discharge area B in which the image is displayed, which is formed of a well type that partitions the discharge cells. Is formed differently. Here, the row partition wall 610a is a partition wall for partitioning one unit pixel in a discharge space in which phosphors of the same color, for example, R only phosphors, G only phosphors or B only phosphors are applied, and the column partitions 610b. ) Refers to a partition wall for separating each of the R, G and B phosphors into unit pixels in a discharge space coated with R, G and B phosphors.

First, referring to the partition wall in the discharge region A, as shown in FIG. 6, the row partition walls 610a and the column partition walls 610b have different heights. As such, among the row partitions 610a and the column partitions 610b having different heights, the partitions having the lower height are the row partitions 610a. This is because R, G, and R, G, and the like are prevented in order to prevent phosphors from flowing into the undesired neighboring discharge cells due to phosphor viscosity characteristics when the phosphor is applied to the discharge cells partitioned by the row partitions 610a and the column partitions 610b. In the discharge space to which the B phosphor is applied, the heights of the column partitions 610b separating each of the R, G, and B phosphors are formed to have a height higher than that of the low partitions 610a. That is, the heights of the row partitions 610a are lower than those of the column partitions 610b. At this time, the height of the row partitions 610a to be formed has a height of 70% or more and 80% or less with respect to the height of the column partitions 610b. If the height of the row partitions 610a is less than 70% of the height of the column partitions 610b, among the row partitions 610a having the predetermined height, that is, among the row partitions 610a having the first height It is difficult to form a row partition wall 610a 'having a height lower than that of the first height, and when the height of the row partition walls 610a exceeds 80% of the height of the column partition wall 610b, it is possible to sufficiently prevent phosphor mixing. It becomes impossible. As described above, among the row partitions 610a having the first height, one or more row partitions 610a 'having a lower height are included. This is to further improve exhaust characteristics.

In the discharge region formed as described above, portions having different heights are formed on the row partitions 610a and the column partitions 610b. In other words, a groove may be formed on the row partitions 610a and the column partitions 610b and a protrusion may be formed. It also includes a row partition 610a 'having a lower height than the row partitions 610a having a first height. Here, the reason for forming a portion having a different height from the row partitions 610a and the column partitions 610b is to further prevent phosphor mixing and improve exhaust characteristics.

Meanwhile, referring to the partition wall in the non-discharge area B, as shown in FIG. 6, the row partition walls 610a and the column partition walls 610b have the same height, and one or more partition walls having different heights may be formed. Form. Here, when forming the partition having one or more different heights, the partition having the low height is the row partition 610a '.

As such, the heights of the row partitions 610a and the column partitions 610b in the non-discharge area B are the same, but the row partitions 610a 'having one or more other heights, that is, the row having a lower height The reason for forming the partition wall 610a 'is to further improve the exhaust characteristics. In this case, portions having different heights are formed on the row partitions 610a 'formed above. The predetermined portion refers to the groove or the protrusion as described above in the discharge region. As such, the reason for forming a portion having a different height on a part of the lower partition 610a 'having a low height is to improve exhaust characteristics.

Thus, by forming the heights of the partition walls of the discharge region A and the non-discharge region B different from each other, it is possible to prevent foreign substances generated during the manufacture of the plasma display panel into the discharge region.

In addition, since there is almost no height difference between the partition walls in the non-discharge region B, the partition structure is stabilized, thereby preventing noise problems of the plasma display panel.

On the other hand, the plasma display device according to the present invention includes a partition structure of the plasma display panel as described above, and comprises a drive unit (not shown) for driving the plasma display panel.

Such a process of forming the partition wall of the plasma display panel according to the present invention is as shown in Figs. 7a to 7f.

7A to 7F are diagrams sequentially illustrating a method of manufacturing a partition wall of a plasma display panel according to the present invention.

First, as shown in FIG. 7A, a lower dielectric 630 is formed on a back glass 600 on which an electrode (not shown) is mounted, and a partition paste 610 having a predetermined thickness is formed on the lower dielectric 630. Is formed by a printing method or a coating method. At this time, the thickness of the partition paste 610 formed in the discharge region A of the panel and the thickness of the partition paste 610 formed in the non-discharge region B are the same.

Thereafter, a dry film resin (hereinafter referred to as a DFR) 611 is formed on the partition paste 610 through a laminating process, and a photo mask 612 having a predetermined pattern on the DFR 611. ), And an exposure step of irradiating light such as vacuum ultraviolet rays is performed.

Thereafter, as in FIG. 7B, the developing step is performed after the DFR 611 exposure step. The DFR 611 of the area not exposed to light by this developing process (hereinafter referred to as 'unexposed area') remains on the partition paste 610, while the area exposed to light (hereinafter referred to as 'exposure'). Region ”DFR 611 is etched away.

Thereafter, as shown in FIG. 7C, the sand blasting apparatus 650 is positioned and driven on the partition paste 610 and the DFR 611 that have undergone the development process to spray sand particles onto the partition paste 610. At this time, the partition paste 610 is shaved due to the stuffing of the sand particles, while the paste 610 corresponding to the partition is protected by the DFR 611 pattern.

Thereafter, as illustrated in FIG. 7D, the barrier ribs protected and protected by the DFR 611 are formed to form the row barrier ribs 610a and the column barrier ribs 610b. At this time, the row partitions 610a and the column partitions 610b formed have the same height, that is, the first height.

As described above, the barrier rib manufacturing method of FIGS. 7A to 7D is similarly applied in the discharge region A and the non-discharge region B. FIG.

Meanwhile, the row barrier ribs 610a and the column barrier ribs 610b of the present invention are exposed by forming a DFR on the barrier paste as shown in FIGS. 7A to 7D to expose the row barrier ribs 610a and the column having a predetermined pattern. Although the partitions 610b may be formed, the row partitions 610a and the column partitions 610b may be formed through an exposure process by including a photosensitive material in the partition paste itself.

Thereafter, as shown in FIG. 7E, a second height lower than the first height is formed on the row partitions 610a of the discharge region A by an etching method. Accordingly, the row partitions 610a and the column partitions 610b having different heights are formed in the discharge region A, and the row partitions 610a having the same height, that is, the first height, are formed in the non-discharge region B. And column partitions 610b are formed.

Thereafter, one or more row barrier ribs 610a 'of the row barrier ribs 610a of the discharge region A are formed by etching to form a row barrier rib 610a' having a height lower than the second height. The non-discharge region B also forms a row partition 610a ′ lower than the first height by etching an upper portion of one or more row partitions 610a among the row partitions 610a.

Thereafter, as shown in FIG. 7F, at least one of the row partitions 610a having the second height of the discharge region A and the row partitions 610a 'and the column partitions 610b having a height lower than the second height. The upper part of the bulkhead is etched so that the upper part of the bulkhead is formed at a certain height. Further, in the non-discharge area B, a portion of the upper portion of the partition wall of the row partition wall 610a 'having a height lower than the first height is etched so that a portion having a predetermined height is formed.

The row barrier ribs and the column barrier ribs fabricated in this manner divide the discharge cells of the plasma display panel.

On the other hand, the phosphor slurry is coated on the discharge cells partitioned by the partition wall to form the phosphor layer. The phosphor coating method may use a screen printing method which is generally used in general, but preferably uses a direct patterning method. Here, the direct patterning method does not form a phosphor pattern by using an auxiliary means such as a pattern mast like a screen printing method, and forms a phosphor layer by directly applying a phosphor slurry to a discharge cell through a nozzle of an inkjet device or a nozzle of a dispensing device. Say how. Therefore, the method of forming the phosphor layer may be any method as long as it is a direct patterning method applied directly to a discharge cell.

As described above, the technical configuration of the present invention can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the above-described embodiments are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the detailed description, and the meaning and scope of the claims and their All changes or modifications derived from equivalent concepts should be construed as being included in the scope of the present invention.

As described above, the present invention further improves the exhaust characteristics and the discharge characteristics of the plasma display panel by differently forming the partition walls of the discharge region and the non-discharge region of the plasma display panel, and the contaminants generated during the fabrication of the plasma display panel are discharge regions. By preventing the inflow to the stabilization of the partition structure of the non-discharge area, there is an effect that can solve the noise problem of the plasma display panel.

In addition, in the method of manufacturing a plasma display panel, there is an effect that it is possible to more effectively prevent the color mixture of the phosphor flowing into the adjacent discharge cells when the phosphor is applied.

Claims (17)

Row partitions and column partitions having different heights are formed in the discharge region of the panel, And a row barrier rib and a column barrier rib having the same height in the non-discharge region of the panel. The method of claim 1, And among the row barrier ribs and the column barrier ribs formed in the discharge region of the panel are low barrier ribs. The method of claim 2, And the height of the row partitions is greater than or equal to 70% and less than or equal to 80% of the height of the column partitions. The method of claim 2 or 3, And the row partition walls do not have the same height. The method according to any one of claims 1 to 3, And a height of at least one of the row barrier ribs formed in the discharge region of the panel is not constant. The method according to claim 1 or 2, And a height of at least one of the column barrier ribs formed in the discharge region of the panel is not constant. The method of claim 1, And among the row partitions and the column partitions formed in the non-discharge area of the panel, the row partitions do not have the same height. The method of claim 7, wherein And a height of at least one of the row barrier ribs is not constant. Row partitions and column partitions having different heights are formed in the discharge region of the panel, And a plasma display panel having row partitions and column partitions having the same height in a non-discharge area of the panel. A method of manufacturing a plasma display panel in which row partitions and column partitions are formed in glass of a discharge region and a non-discharge region to partition a discharge cell, and a phosphor is coated on the discharge cell. The process of forming the row partitions and column partitions (a) applying a barrier paste on top of the dielectric formed in the glass of the discharge region and the non-discharge region; (b) forming a predetermined pattern in the row partitions and the column partitions at a first height in the partition paste; And (c) etching an upper portion of a row barrier rib among the row barrier ribs formed in the discharge region to have a second height lower than the first height; Method of manufacturing a plasma display panel comprising a. The method of claim 10, And forming a row partition wall lower than a second height by etching an upper portion of one or more row partition walls among the row partition walls in the discharge region. The method of claim 10 or 11, At least one of the row partitions and the column partitions in the discharge region is partially etched to form row partitions and column partitions of which height is not constant. Manufacturing method. The method of claim 10, And forming a row partition wall lower than a first height by etching an upper portion of at least one of the row partition walls in the non-discharge region. The method of claim 13, And partially row upper portions of the row partition walls, wherein the row partition walls are not fixed in height. The method according to any one of claims 11 to 14, And etching the row partitions and the column partitions by etching. The method of claim 10, Wherein the phosphor is formed by a direct patterning method. The method of claim 16, The direct patterning method is any one of an inkjet method or a dispensing method.

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