KR20060099746A - Plasma display panel module - Google Patents

Abstract

Plasma display module according to an embodiment of the present invention, the plasma display panel (PDP) consisting of a front panel and a rear panel; A heat dissipation plate is included to dissipate heat generated from the PDP, and a heat dissipation sheet of a conductive material is inserted between the plasma display panel and the heat dissipation plate to bond the plasma display panel and the heat dissipation plate, and the heat dissipation sheet is provided on the PDP panel. According to the present invention, a conductive material is provided on the bottom surface of the PDP rear panel or on the side surface of the PDP including the rear panel, thereby reducing the return current path. By providing a heat dissipation sheet for the ground, the field radiated from the electrode provided in the panel is induced to the ground plane, and the return current path is shortened, so that the EMI of the low frequency band in the PDP is reduced. There is an advantage that the radiation dose can be minimized.

Description

Plasma display panel module

1 is an exploded perspective view of a conventional PDP.

FIG. 2 is a sectional view of the PDP shown in FIG. 1. FIG.

3A and 3B are exploded views and cross-sectional views showing the configuration of a conventional PDP module.

4 is a cross-sectional view showing a part of a configuration of a conventional PDP module.

5 is a cross-sectional view of a PDP module according to an embodiment of the present invention.

6 is a cross-sectional view showing a part of a configuration of a PDP module according to an embodiment of the present invention.

7 is a cross-sectional view of a PDP module according to another embodiment of the present invention.

8 is a graph comparing EMI radiation levels of the heat radiation sheet provided in the conventional PDP module structure and the PDP module structure according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

500: PDP 510: heat dissipation sheet

520: heat sink

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel module (PDP module), and more particularly, to a plasma display panel module that minimizes EMI (electromagnetic interference) radiation generated in a panel.

In general, a flat panel display (FPD) forms an electrode on each pixel constituting a screen, controls a voltage applied to the pixel electrode, refractive index, which is an optical characteristic of an electro-optic material formed on the pixel electrode, A device that displays images by controlling the properties of light that passes or reflects through pixel electrodes by changing transmittance, luminescence, and polarization characteristics. LCD (Liquid Crystal Display), EL (Electro Luminescence), PDP (Plasma Display Panel), etc. There is this.

Here, the PDP of the flat panel display device is a large flat panel display as shown in FIGS. 1 and 2, and phosphors coated on each plasma by ultraviolet rays emitted from the discharge gas filled in each plasma between the front panel and the rear panel. Is a device that displays an image including characters and graphics by emitting light.

Specifically, the front panel 10 of the PDP includes a front glass substrate 12 through which an image is projected to the outside, a scan electrode 14 mounted to be paired with each plasma behind the front glass substrate 12, and The insulating electrode 15 and the rear glass substrate 12 are attached to cover the scan electrode 14 and the sustain electrode 15 to insulate the scan electrode 14 and the sustain electrode 15 from each other. In addition, the plasma layer may include a front dielectric layer 16 that accumulates wall charges during plasma discharge, and a protective film 18 formed of phosphorous oxide and attached to the back of the dielectric layer 16.

Here, the auxiliary electrode 19 is mounted on the front glass substrate 12 to apply a high voltage to the scan electrode 14 and the sustain electrode 15.

In addition, the rear panel 20 is a rear glass substrate 22 installed in parallel with the front glass substrate 12 and an address electrode mounted on the upper surface of the rear glass substrate 22 for each plasma to receive image data. A dielectric layer 26 attached to an upper surface of the rear glass substrate 22 to cover the address electrodes 24 to insulate the address electrodes 24 and to accumulate wall charges during plasma discharge; And partition walls 28 formed on the top surface of the dielectric layer 26 to prevent electrical and optical cross talk between the plasmas, and surfaces of the partition walls 28 and the rear dielectric layer 26. It is made of a red, green, blue phosphor 30 is applied to the light emitting intrinsic visible light during plasma discharge.

In such a PDP, when a voltage is applied to the address electrode 24, a discharge occurs in each plasma to generate wall charges, and when a high voltage is applied to the scan electrode 14 and the sustain electrode 15, the discharge gas G is applied. When the UV rays are excited, the ultraviolet rays are generated. When the ultraviolet rays collide with the phosphors 30 of each plasma, the phosphors of each plasma emit light to display an image through the windshield. 3A and 3B are exploded views and cross-sectional views showing the structure of a conventional PDP module.

3A and 3B, a conventional PDP module includes a plasma display panel, that is, a PDP 300 including a front panel 302 and a rear panel 304 as described above with reference to FIGS. 1 and 2; A predetermined signal is applied to a scan electrode (not shown) and a sustain electrode (not shown) provided in the front panel 302, or a predetermined signal is applied to an address electrode (not shown) provided in the rear panel 304. PCB circuit portion 340 to be hidden; The PCB circuit unit 340 is mounted and includes a heat sink 320 for dissipating heat generated from the PDP 300.

In this case, the scan electrode and the sustain electrode provided in the front panel 302, the predetermined PCB 342 provided in the PCB circuit unit 340, the address electrode provided in the rear panel 304, and the PCB circuit unit are provided. The predetermined PCB 344 provided at 340 is connected by the flexible printed circuit board (FPC) 350.

In addition, the heat dissipation plate 320 is attached to the rear panel 304 through the heat dissipation sheet 310 of the silicon material having the adhesive force, and serves to dissipate heat generated from the PDP 300 to the outside. .

In addition, the heat dissipation plate 320 has a predetermined thickness to serve as a fixing stand as well as the discharge mechanism.

However, in such a conventional PDP module structure, an address signal applied to the address electrode (24 of FIG. 1) formed on the rear panel reaches the end via the entire address electrode 24, and then can be returned. No ground (GND) structure was formed.

That is, accordingly, a signal applied to the address electrode 24 is reflected to make the address electrode 24 itself an electrical antenna, thereby causing a problem of increasing the amount of electromagnetic radiation, which is a major cause of electromagnetic wave emission from the panel. It became.

4 is a cross-sectional view showing a part of the configuration of a conventional PDP module, illustrating a return current path with respect to the current applied from the PCB.

As shown in FIG. 4, when the heat dissipation sheet 310 uses a silicon material having a dielectric constant of about 12, when a current and a high voltage pulse driving waveform are applied to the electrodes of the PDP panel, The return current path of the generated displacement current is lengthened by the heat dissipation sheet made of the high dielectric constant material, and the peaking noise of the driving waveform is also not effectively grounded.

In addition, in the case of the scan electrode 14 and the sustain electrode 15 formed on the front panel of PDP, the ground structure is not formed, which causes a problem of increasing the amount of electromagnetic radiation, which is a major cause of electromagnetic emission from the panel.

As a result, the conventional PDP module structure described above, in particular, the panel structure, when the predetermined signal is applied to the electrode, the address electrode becomes an antenna structure, causing a high amount of EMI (Electro Magnetic Interference) radiation, that is, has an EMI-vulnerable structure. There are disadvantages.

That is, the conventional PDP module structure has a plurality of driving PCBs and various coupling paths of EMI radiation make it difficult to control EMI of the PDP module. Since the capacitor-type rod side antenna structure is formed, the electrode provided in the panel is a monopole antenna, and the entire panel structure may be similar to the array antenna structure.

Therefore, when a pulse type voltage is applied to the address electrode, the bus electrode, and the sustain electrode in the panel structure, electromagnetic waves are radiated, which has a disadvantage that it is more difficult to control EMI as long as the PDP module structure is an antenna structure. .

The present invention serves as a ground by providing a heat-dissipating sheet made of a conductive material on the bottom surface of the PDP rear panel or on the side surface of the PDP including the rear panel, thereby inducing a field radiated from the electrode provided in the panel to the ground surface, An object of the present invention is to provide a plasma display panel module which shortens a return current path to minimize high EMI radiation in a low frequency band in a PDP.

Plasma display module according to an embodiment of the present invention to achieve the above object, the plasma display panel (PDP) consisting of a front panel and a rear panel; A heat dissipation plate is included to dissipate heat generated from the PDP, and a heat dissipation sheet of a conductive material is inserted between the plasma display panel and the heat dissipation plate to bond the plasma display panel and the heat dissipation plate.

The heat dissipation sheet may serve as a ground of a signal applied to an electrode provided in the PDP panel to shorten a return current path.

In addition, the heat dissipation sheet is adhesive such as 95% of a filler made of at least one of silver, nickel, graphite, and carbon, and an epoxy resin, and a silicone. It is formed by mixing 5% of a synthetic resin having a conductivity of 7.00 * 104 ohms / m and a volume resistance of 10-5 ohm * cm.

In addition, the height of the heat dissipation sheet is 1mm to 2mm, the thermal characteristics are -50 ℃ to 150 ℃ heat resistant cold resistance, the adhesive strength is maintained at 8-14N / mm2, which is the lower surface or the rear panel of the PDP back panel Characterized in that formed on the side of the PDP.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

5 is a cross-sectional view of a PDP module according to an embodiment of the present invention.

Referring to FIG. 5, a PDP module according to an embodiment of the present invention may include a plasma display panel including a front panel 502 and a rear panel 504, that is, the PDP 500 as described above with reference to FIGS. 1 and 2. ; A predetermined signal is applied to a scan electrode (not shown) and a sustain electrode (not shown) provided in the front panel 502, or a predetermined signal is applied to an address electrode (not shown) provided in the rear panel 504. PCB circuit sections 542 and 544, which are invisible; The PCB circuit units 542 and 544 are mounted, and a heat sink 520 is included to dissipate heat generated from the PDP 500.

In this case, the scan electrode and the sustain electrode provided in the front panel 502 are connected by a predetermined PCB 542 and a flexible printed circuit board (FPC) 550 provided in the PCB circuit unit, and the rear panel 504. The address electrode provided at the C) and the predetermined PCB 544 provided at the PCB circuit 540 are connected by a flexible printed circuit board (FPC) 550.

In addition, the heat dissipation plate 520 has a predetermined thickness to serve as a fixing stand as well as a discharge mechanism.

The embodiment of the present invention is characterized in that the heat dissipation plate 520 is attached to the rear panel 504 through a heat dissipation sheet 510 containing a conductive material, through which the PDP 500 In addition to the discharge of generated heat to the outside, the role of the ground applied to the signal applied to the electrode provided in the PDP panel to reduce the return current path (Return Current Path) compared to the conventional PDP module structure. .

According to an embodiment of the present invention, the heat dissipation sheet 510 may include at least one of silver, nickel, graphite, carbon, and 95% filler and epoxy resin. And, it is characterized by forming by mixing 5% synthetic resin, such as silicone.

The heat dissipation sheet 510 of such a material has a conductivity of 7.00 * 104 ohms / m or more and a volume resistivity of 10-5 ohm * cm, through which the heat dissipation plate has improved conductivity and thermal conductivity efficiency, Since the 510 serves as the ground, the return current path can be shortened as compared with the conventional PDP module structure.

In addition, the heat dissipation sheet 510 has a height of 1mm-2mm to perform the role of absorbing the noise generated when driving the panel, and the thermal properties have a heat resistance cold resistance of -50 ℃ ~ 150 ℃, the adhesion The strength is maintained at 8-14N / mm2 to support the weight of the panel when the heat sink is attached to the panel, and can prevent the IC breakdown of the FPC 550 during the high temperature repair process. In addition, in consideration of the efficiency of the process, the curing time required for manufacturing the heat dissipation sheet 510 may be set to 60 minutes / 125 ° C. and 20 minutes / 150 ° C., and 24 times in consideration of the current process. It is also possible to prevent the price rise by having a time / 25 ℃ 60 minutes / 65 ℃.

FIG. 6 is a cross-sectional view illustrating a part of a configuration of a PDP module according to an embodiment of the present invention, and illustrates a return current path with respect to a current applied from a PCB.

As shown in FIG. 6, in the exemplary embodiment of the present invention, since the heat dissipation sheet 510 is made of a conductive material, when the current and the high voltage pulse driving waveform applied to the electrode of the PDP panel are applied, The return current path of the displacement current is shortened.

That is, in the related art, the heat dissipation sheet is made of a high dielectric constant material, so that a recovery current path is lengthened to the heat dissipation plate of the conductive material. However, the present invention can recover the current from the heat dissipation sheet 510, so It is possible to shorten the return current path.

In addition, the peaking noise (peaking noise) grounding of the driving waveform is effectively made through this.

FIG. 7 is a cross-sectional view of a PDP module according to another embodiment of the present invention, in which a heat dissipation sheet 512 is formed on a side surface of a PDP including a PDP rear panel, as compared with FIG. 6. It will be possible to overcome the EMI radiation problem generated in the scan electrode and the sustain electrode formed.

That is, the embodiment shown in Figure 7 is the same as the embodiment shown in Figure 6 described above except that the shape and size of the heat dissipation sheet 512 is different, the same components are to use the same reference numerals and the description Omit.

8 is a graph comparing EMI radiation levels of a heat radiation sheet provided in a conventional PDP module structure and the PDP module structure according to an embodiment of the present invention.

As shown in FIG. 8, the EMI radiation level of the heat dissipation sheet according to the present invention is 3dB-6dB in the 90MHz-270MHz band and 12dB in the 270MHz-300MHz band when compared with the EMI radiation level of the conventional heat dissipation sheet. You can see that this has been innovatively reduced.

According to the present invention, by providing a heat radiation sheet of a conductive material on the lower surface of the PDP rear panel or the PDP side surface including the rear panel serves as a ground, the field radiated from the electrode provided in the panel to the ground surface It is advantageous to minimize the high EMI radiation of the low frequency band in the PDP by allowing it to be induced and shortening the return current path.

Claims (6)

A plasma display panel (PDP) including a front panel and a rear panel; A heat sink for radiating heat generated from the PDP is included, And a heat radiation sheet made of a conductive material is inserted between the plasma display panel and the heat sink to bond the plasma display panel and the heat sink. The method of claim 1, The heat dissipation sheet may serve as a ground of a signal applied to an electrode provided in the PDP panel, thereby shortening a return current path. The method of claim 1, The heat dissipation sheet may include 95% of a filler made of at least one of silver, nickel, graphite, and carbon, an epoxy resin, and an adhesive synthetic resin such as silicon. Plasma display module, characterized in that formed by mixing 5%. The method of claim 1, The heat dissipation sheet has a conductivity of 7.00 * 104 ohms / m or more and a volume resistance of 10-5 ohm * cm. The method of claim 1, The height of the heat dissipation sheet is 1mm to 2mm, the thermal properties are -50 ℃ to 150 ℃ has a heat resistance cold resistance, the adhesive strength is characterized in that maintained at 8-14N / mm2 plasma display module. The method of claim 1, The heat dissipation sheet is formed on the lower surface of the PDP rear panel or the PDP side portion including the rear panel.

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