KR20060092735A - Plasma display panel and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a protective layer of a plasma display panel.

The plasma display panel according to the present invention includes a front panel and a rear panel bonded to a seal material, and the front panel includes a dielectric layer formed on the scan electrode and the sustain electrode, a first protective layer formed on the dielectric layer, and a first protective layer. And a second protective layer formed on the layer and including a protrusion formed to protrude from the first protective layer.

In addition, another method of manufacturing a plasma display panel according to the present invention includes (a) mounting a front panel having a dielectric layer formed in a vacuum chamber, (b) depositing a first protective layer over the dielectric layer, and (c) first protective And depositing a second passivation layer on the layer, the second passivation layer including a protrusion formed by protruding from the first passivation layer using a mask having a predetermined pattern.

Therefore, according to the present invention, the protective layer of the plasma display panel forms the first protective layer and the second protective layer including the protrusions is formed thereon, thereby increasing the surface area of the entire protective layer and increasing the secondary electron emission coefficient. Accordingly, there is an effect of improving the lifetime and brightness of the plasma display panel.

Description

Plasma Display Panel and Manufacturing Method Thereof

1 is a view showing the structure of a typical plasma display panel.

2A and 2B illustrate a process of depositing a protective layer of a conventional plasma display panel using an E-beam method.

3 is a view showing the structure of a plasma display panel according to the present invention;

4 illustrates a protective layer of a plasma display panel according to the present invention;

5 is a block diagram sequentially illustrating a method of manufacturing a plasma display panel according to the present invention;

6A to 6D illustrate a process of forming a protective layer of a plasma display panel according to the present invention.

<Explanation of symbols for the main parts of the drawings>

300: front panel 301: front glass

302: scan electrode 303: sustain electrode

a: transparent electrode b: bus electrode

304: upper dielectric layer 305: first protective layer

306: second protective layer 310: rear panel

311 rear glass 312 bulkhead

313: address electrode 314: phosphor

315: lower dielectric layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a plasma display panel having an improved protective layer of a front panel and a method of manufacturing the same.

In general, a plasma display panel is a partition wall formed between a front panel and a rear panel to form one unit cell, and each cell includes neon (Ne), helium (He), or a mixture of neon and helium (Ne + He). An inert gas containing a main discharge gas such as and a small amount of xenon is filled. When discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such a plasma display panel has a spotlight as a next generation display device because of its thin and light configuration.

1 illustrates a structure of a general plasma display panel.

As shown in FIG. 1, a plasma display panel includes a front panel in which a plurality of sustain electrode pairs formed by pairing a scan electrode 102 and a sustain electrode 103 are arranged on a front glass 101 that is a display surface on which an image is displayed. The rear panel 110 on which the plurality of address electrodes 113 are arranged so as to intersect the plurality of sustain electrode pairs on the back glass 111 forming the back surface 100 and the rear surface is coupled in parallel with a predetermined distance therebetween. .

The front panel 100 includes a scan electrode 102 and a sustain electrode 103 for mutually discharging and maintaining light emission of the cells in one discharge cell, that is, transparent electrodes a and silver Ag formed of a transparent material. The scan electrode 102 and the sustain electrode 103 provided as a bus electrode b made of a metal material are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by an upper dielectric layer 104 that limits the discharge current and insulates the pair of electrodes, and the upper surface of the upper dielectric layer 104 is magnesium oxide to facilitate the discharge conditions. A protective layer 105 on which (MgO) is deposited is formed.

The rear panel 110 is arranged in such a manner that a plurality of discharge spaces, that is, stripe-type partitions 112 for forming discharge cells are maintained in parallel. In addition, a plurality of address electrodes 113 which perform address discharge to generate vacuum ultraviolet rays are arranged in parallel with the partition wall 112. On the upper side of the rear panel 110, R, G, and B phosphors 114 which emit visible light for image display during address discharge are coated. A lower dielectric layer 115 is formed between the address electrode 113 and the phosphor 114 to protect the address electrode 113.

In such a plasma display panel, the protective layer of the front panel supplies secondary electrons for lowering the discharge voltage of the plasma display panel and prevents damage of the upper dielectric layer from ions.

2A and 2B show a process in which a protective layer having such a role is deposited using an E-beam method.

2A and 2B illustrate a process of depositing a protective layer of a conventional plasma display panel using an E-beam method.

As shown in FIG. 2A, the front panel 200 having the upper dielectric layer 204 formed on the sustain electrode pair is introduced into the vacuum chamber 210 to deposit the protective layer 205. At this time, the protective layer 205 is deposited on the front panel 200 that enters the vacuum chamber 210 through a device for depositing the protective layer 205 on the dielectric layer 204. The panel fixing part 230 fixing the front panel 200 and the front panel 200 are spaced apart by a predetermined distance, and vapor diffusion for depositing a protective layer 205 made of magnesium oxide (MgO) on the front panel 200. The unit 250 is included. Here, the vapor diverging unit 250 contains a magnesium oxide (MgO) material (250b) in the H (Hearth) 250a through an orifice (250a ₁ ) formed in the H (earth) 250a, the electron beam (E-Beam) , 270) refers to a device for intensively irradiating magnesium oxide (MgO) material (250b).

As shown in FIG. 2B, the magnesium oxide material 250b of the vapor dissipation unit 250 may be transferred to the hearth 250a by using the protective layer deposition apparatuses 230 and 250 in the vacuum chamber 210 manufactured as described above. When concentrated irradiation with an electron beam (E-Beam, 270) through the formed orifice (Orifice, 250a ₁ ) Magnesium oxide material (250b) is changed to heat most of the energy is a sublimation of the vapor vapor of the dielectric layer of the front panel 200 ( 204) It is attached to the surface to form a protective layer.

On the other hand, as the surface area of the protective layer made of magnesium oxide (MgO) increases, the secondary electron emission coefficient generated during discharge increases.

However, the protective layer of the conventional plasma display panel has a low surface area and a low secondary electron emission coefficient. Therefore, the discharge voltage and the discharge efficiency of the plasma display panel are deteriorated, thereby reducing the lifetime of the plasma display panel.

Accordingly, an object of the present invention is to provide a plasma display panel and a manufacturing method which can improve the lifespan and brightness of the plasma display panel by improving the protective layer of the front panel to increase the secondary electron emission coefficient of the protective layer, thereby lowering the discharge voltage. have.

The plasma display panel of the present invention for achieving the above object comprises a front panel and a rear panel bonded with a seal material, the front panel is a dielectric layer formed on the scan electrode and the sustain electrode, the first protection formed on the dielectric layer And a second protective layer formed over the layer and the first protective layer, the second protective layer including a protrusion formed to protrude from the first protective layer.

A plurality of protrusions of the second protective layer is formed.

The plurality of protrusions may be arranged in a mesh shape.

The protrusion is characterized in that at least one of conical, semi-circular, trapezoidal, square, rectangular.

The first protective layer is deposited by any one of the electron beam method, the sputtering method, and the CVD method.

The thickness of the 1st protective layer is characterized by being 2000 micrometers or more and 1 micrometer or less.

The second protective layer is deposited by any one of the electron beam method, the sputtering method, and the CVD method.

The height of the protruding portion is characterized by being 1000 mW or more and 1 m or less.

In addition, a method of manufacturing a plasma display panel according to the present invention includes (a) mounting a front panel having a dielectric layer formed in a vacuum chamber, (b) depositing a first protective layer over the dielectric layer, and (c) first protective And depositing a second passivation layer on the layer, the second passivation layer including a protrusion formed by protruding from the first passivation layer using a mask having a predetermined pattern.

A plurality of protrusions of the second protective layer is formed.

The mask is characterized in that it has a mesh-shaped pattern such that the protrusions are arranged in a mesh shape.

The protrusion is characterized in that at least one of conical, semi-circular, trapezoidal, square, rectangular.

The first protective layer is deposited by any one of the electron beam method, the sputtering method, and the CVD method.

The thickness of the 1st protective layer is characterized by being 2000 micrometers or more and 1 micrometer or less.

The second protective layer is deposited by any one of the electron beam method, the sputtering method, and the CVD method.

The height of the protruding portion is characterized by being 1000 mW or more and 1 m or less.

The temperature of the front panel in the chamber is characterized in that more than 100 ℃ 200 ℃.

Oxygen in the chamber is characterized in that more than 10sccm 50sccm.

MgO deposition rate in the chamber is characterized in that more than 2 Å / sec 10 Å / sec.

The temperature in the chamber is characterized in that more than 25 ℃ 400 ℃.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

3 is a view showing the structure of a plasma display panel according to the present invention.

As shown in FIG. 3, a plasma display panel includes a front panel in which a plurality of sustain electrode pairs formed by pairing a scan electrode 302 and a sustain electrode 303 are formed on a front glass 301 that is a display surface on which an image is displayed. A rear panel 310 having a plurality of address electrodes 313 arranged so as to intersect the plurality of sustain electrode pairs on the back glass 311 forming the back surface 300 and the rear surface is coupled in parallel with a predetermined distance therebetween. .

The front panel 300 includes a scan electrode 302 and a sustain electrode 303 for discharging each other in one discharge cell and maintaining light emission of the cells, that is, transparent electrodes a and silver Ag formed of a transparent material. The scan electrode 302 and the sustain electrode 303 provided as the bus electrode b made of a metal material are included in pairs. The scan electrode 302 and the sustain electrode 303 are covered by an upper dielectric layer 304 that limits the discharge current and insulates the electrode pairs, and is oxidized on the upper dielectric layer 304 to facilitate discharge conditions. A first protective layer 305 and a second protective layer 306 on which magnesium (MgO) is deposited are formed. At this time, the second protective layer 305 is formed to protrude from the first protective layer 305, it is preferable that a plurality of such protrusions are formed as shown. A detailed description of the first protective layer and the second protective layer will be described later with reference to FIG. 4.

On the other hand, the rear panel 310 is arranged in parallel with the stripe-type partition wall 312 for forming a plurality of discharge spaces, that is, discharge cells. In addition, a plurality of address electrodes 313 that perform address discharge to generate vacuum ultraviolet rays are arranged in parallel with the partition 312. The upper surface of the rear panel 310 is coated with R, G, and B phosphors 314 that emit visible light for image display during address discharge. In addition, a lower dielectric layer 315 is formed between the address electrode 313 and the phosphor 314 to protect the address electrode 313.

In the plasma display panel according to the present invention, the protective layer of the front panel will be described in more detail as follows.

4 is a view showing a protective layer of the plasma display panel according to the present invention.

As shown in FIG. 4, the protective layer of the plasma display panel according to the present invention is formed of two layers, that is, the first protective layer 305 and the second protective layer 306, as described above with reference to FIG. 3.

First, the first protective layer 305 will be described. The first protective layer 305 is formed by being deposited by any one of the electron beam method, the sputtering method, and the CVD method. At this time, the thickness of the first protective layer 305 is formed to be 2000 μm or more and 1 μm or less. If the first passivation layer 305 has a thickness of 2000 Å or less, the upper dielectric layer does not play a role of preventing damage from ions. When the thickness of the first passivation layer 305 is 1 μm or more, the discharge voltage is lowered. Supply of secondary electrons is slowed.

In addition, referring to the second protective layer 306, the second protective layer 306 includes a protrusion formed by protruding from the first protective layer 305. The plurality of protrusions formed as described above is formed, and the second protective layer 306 is formed in a mesh shape. Since the second protective layer is deposited by any one of the electron beam method, the sputtering method, and the CVD method like the first protective layer, in FIG. 4, the second protective layer, that is, the protrusion part, is shown as a square, but the protrusion part is conical, semi-circular, It may be trapezoidal or rectangular. The reason for forming the second protective layer as the protrusion is to increase the secondary electron emission coefficient by increasing the surface area of the protective layer. At this time, the height of the second protective layer, that is, the protrusion, is formed to be 1000 m or more and 1 m or less. If the protrusion has a height of 1000 μs or less, the desired surface area cannot be obtained in the present invention, and when the height of the protrusion is 1 μm or more, the supply of secondary electrons for lowering the discharge voltage becomes slow.

Looking at the manufacturing method of the plasma display panel according to the present invention including such a protective layer as follows.

5 is a block diagram sequentially illustrating a method of manufacturing a plasma display panel according to the present invention.

As shown in FIG. 5, the method of manufacturing a plasma display panel according to the present invention includes an assembly process including a front panel manufacturing process listed on the right side of FIG. 5, a rear panel manufacturing process listed on the left side, and a sealing process listed below. .

First, the front panel listed on the right side of FIG. 5 prepares a front glass as a substrate (500), and then a plurality of sustain electrode pairs are formed on the front glass (501). Thereafter, an upper dielectric layer is formed over the sustain electrode pair (502), and a first protective layer made of magnesium oxide for protecting the sustain electrode pair is formed over the upper dielectric layer (503), and then a second protection is performed using a mesh. A layer is formed (504).

Subsequently, referring to the rear panel manufacturing process listed on the left side of FIG. 5, similarly to the front panel, a rear glass which is first described is prepared (510), and a plurality of address electrodes are formed on the rear glass so as to face and cross the sustain electrode pair formed on the front panel. 511. Thereafter, a lower dielectric layer is formed on the upper surface of the address electrode (512), and a phosphor layer is formed on the upper surface of the lower dielectric layer (513).

The front panel and the rear panel manufactured as described above are sealed to each other (520) to form a plasma display panel (530).

Looking at the process of forming a protective layer of the front panel in the plasma display panel according to the present invention formed as described above are as follows.

6A through 6D illustrate a process of forming a protective layer of the plasma display panel according to the present invention.

As shown in FIG. 6A, the front panel 301 having the dielectric layer 304 formed on the sustain electrode pair enters the vacuum chamber 610 to deposit the first protective layer 305. At this time, the first protective layer 305 is deposited on the front panel 301 that enters the vacuum chamber 610 through a device for depositing the first protective layer 305 on the dielectric layer 304. In the layer deposition apparatus, the panel fixing part 630 for fixing the front panel 301 and the front panel 301 are separated from each other by a predetermined distance to form a protective layer 305 which is usually made of magnesium oxide (MgO) on the front panel 301. It includes a vapor diverging portion 650 to deposit. Here, the vapor dissipation unit 650 contains a magnesium oxide (MgO) material 650b in the hearth (Hearth, 650a) and through an orifice (650a ₁ ) formed in the hearth (Hearth, 650a), the electron beam (E-Beam, 670) refers to a device for intensive irradiation of magnesium oxide (MgO) material (650b). In addition, the temperature in the chamber for the deposition of magnesium oxide (MgO) is 25 ℃ or more and 400 ℃ or less, the temperature of the front panel deposited in the chamber is 100 ℃ or more and 200 ℃ or less, oxygen in the chamber is 10sccm or more and 50sccm or less. Has

Thereafter, as shown in FIG. 6B using the protective layer deposition apparatuses 630 and 650, the orifice 650a _{1 in which the} magnesium oxide material 650b of the vapor diverging part 650 is formed in the hearth 650a. When concentrated irradiation with the electron beam (E-Beam, 670) through the), the magnesium oxide (650b) is sublimated to the gas state, the vapor of the sublimation state of the magnesium oxide gas is different from the surface of the dielectric layer 304 of the front panel 301 The first protective layer is formed as shown in FIG. 6C. The thickness of the 1st protective layer formed at this time is 2000 micrometers or more and 1 micrometer or less.

Thereafter, as illustrated in FIG. 6D, a mesh 620 is disposed between the upper portion of the first protective layer 305 formed on the dielectric layer 304 of the front panel 301 and the vapor diverging portion 650 spaced a predetermined distance apart. Is mounted. Here, the mesh 620 is formed of a plurality of holes (Hole) in a material formed of a metal material, for example, has a form of a net. Using the mesh 620 and the protective layer deposition apparatuses 630 and 650, the electron beam 670 through the orifice 650a ₁ formed on the hus 650a of the magnesium oxide material 306 of the vapor diverging part 650. In this case, the magnesium oxide 306 is sublimated into a gaseous state, and the magnesium oxide 306 gas passes through the mesh 306 and adheres to the surface of the first protective layer 305 to include a protrusion. 306 is formed. The protrusion 306 formed as described above has a plurality of holes because the mesh 620 is formed of a plurality of holes. The height of the protrusion 306 formed at this time is 1000 micrometers or more and 1 micrometer or less. However, since the protrusion 306 is formed by vapor deposition, the protrusion 306 may have various shapes such as a cone, a semicircle, a trapezoid, a square, and a rectangle.

Meanwhile, the method of depositing the first protective layer and the second protective layer of the plasma display panel according to the present invention has been described above by taking an electron beam method as an example, but may be formed using a stuffing method, a CVD method, or the like. The deposition rate of magnesium oxide (MgO) in the chamber is 2 kPa / sec or more and 10 kPa / sec or less.

As described above, the protective layer of the plasma display panel according to the present invention is formed of the second protective layer including the first protective layer and the protrusion, thereby increasing the surface area of the protective layer and increasing the secondary electron emission coefficient.

As described above, the technical configuration of the present invention can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the above-described embodiments are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the detailed description, and the meaning and scope of the claims and their All changes or modifications derived from equivalent concepts should be construed as being included in the scope of the present invention.

As described above, according to the present invention, the protective layer of the plasma display panel forms a first protective layer and a second protective layer including protrusions is formed thereon, thereby increasing the surface area of the entire protective layer and increasing the secondary electron emission coefficient. Accordingly, there is an effect of improving the lifetime and brightness of the plasma display panel.

Claims (20)

Including a front panel and a rear panel bonded with a seal material, The front panel A dielectric layer formed on the scan electrode and the sustain electrode; A first protective layer formed on the dielectric layer; And A second protective layer formed on the first protective layer and including a protrusion formed to protrude from the first protective layer; Plasma display panel comprising a. The method of claim 1, And a plurality of protrusions of the second protective layer. The method of claim 2, And the plurality of protrusions are arranged in a mesh shape. The method according to any one of claims 1 to 3, And the protrusion is at least one of a cone, a semicircle, a trapezoid, a square, and a rectangle. The method of claim 1, And the first protective layer is deposited by any one of an electron beam method, a sputtering method, and a CVD method. The method according to claim 1 or 5, And the thickness of the first protective layer is 2000 m 3 or more and 1 m or less. The method of claim 1, And the second protective layer is deposited by any one of an electron beam method, a sputtering method, and a CVD method. The method of claim 4, wherein And a height of the protruding portion is 1000 m or more and 1 m or less. (a) mounting a front panel having a dielectric layer formed in the vacuum chamber; (b) depositing a first passivation layer over the dielectric layer; And (c) depositing a second passivation layer on the first passivation layer, the second passivation layer including a protrusion formed by protruding from the first passivation layer using a mask having a predetermined pattern; Method of manufacturing a plasma display panel comprising a. The method of claim 9, And a plurality of protrusions of the second protective layer are formed. The method of claim 9, And wherein the mask has a mesh-shaped pattern in which the protrusions are arranged in a mesh shape. The method according to any one of claims 9 to 11, The protrusion may be at least one of a cone, a semicircle, a trapezoid, a square, and a rectangle. The method of claim 9, And the first protective layer is deposited by any one of an electron beam method, a sputtering method, and a CVD method. The method according to claim 9 or 13, And the thickness of the first protective layer is 2000 m 3 or more and 1 m or less. The method of claim 9, And said second protective layer is deposited by any one of an electron beam method, a sputtering method, and a CVD method. The method of claim 12, And a height of the protruding portion is 1000 m 3 or more and 1 m or less. The method of claim 9, And a temperature of the front panel in the chamber is 100 ° C. or more and 200 ° C. or less. The method of claim 9, And oxygen in the chamber is 10 sccm or more and 50 sccm or less. The method of claim 9, And a magnesium oxide (MgO) deposition rate in the chamber is 2 kW / sec or more and 10 kW / sec or less. The method of claim 9, And a temperature in the chamber is 25 ° C. or more and 400 ° C. or less.

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