KR20060091636A - Ic card - Google Patents

Abstract

The present invention relates to an IC card. An antenna circuit having an open loop on one side of the insulating film, the first terminal portion and the fourth terminal portion being provided at both ends thereof, and a predetermined portion in the middle having a circuit portion having two or more ends; As connected to the antenna circuit, a bridge connecting the first terminal portion and the fourth terminal portion, the outside formed on one side of the bridge and connected to the ends formed in the circuit portion and can be in electrical contact with the external terminal for communication A connection unit including a contact pad; A combination chip connected to the external connection pad; And a dielectric layer in close contact with the antenna circuit and supporting the connection unit and the combination chip.

In the IC card of the present invention as described above, since the external contact pad and the bridge are packaged in one connection unit, installation of the external contact pad and the bridge to the antenna circuit is simple and the manufacturing process is not complicated.

Description

IC card {IC Card}

1 and 2 are diagrams for explaining the basic structure and manufacturing method of a conventional IC card.

3 is a plan configuration diagram of an IC card according to an embodiment of the present invention.

4 is an exploded cross-sectional view illustrating a method of manufacturing an IC card according to an embodiment of the present invention.

FIG. 5 is a sectional view of the IC card shown in FIG.

<Explanation of symbols for the main parts of the drawings>

11, 51: IC card 13, 53: insulating film 15, 55: antenna circuit

15a, 55a: first terminal portion 15b, 55b: second terminal portion 15c, 55c: third terminal portion

15d, 55d: fourth terminal portion 17: protective layer 19, 61: dielectric layer

21a, 23a: bonding layer 21b, 23b: print layer 21c, 23c: cover layer

25: Combi Chip 25a: Solder Ball 27: Bridge

29: external contact pad 31: conductive bonding film 33: mounting groove

57: solder register 59: insulating adhesive 63: connection unit

63a: bridge 63b: connection portion 63c: external connection pad

65: Opening 67: Bridge receiving home

The present invention relates to an IC card.

The IC card refers to a card on which integrated circuit chips such as various memories and CPUs are mounted. The IC card may be used as an electronic ID card, a license card, an electronic money or a credit card, and the like by inputting various information into the integrated circuit chip in advance.

For example, by inputting personally identifiable information such as address, name, social security number, driver's license number, medical insurance number, etc. into the integrated circuit chip, it is used as a basic electronic identity card or when depositing in a bank, information corresponding to the amount is stored on the chip. It can also be used as an electronic money that allows payment by entering and deducting the deposit information instead of cash at the store.

As another example, the integrated circuit chip may be used as a so-called traffic card that charges a certain amount of money with electronic money and deducts the amount of money by using a subway or a train.

The IC card may be divided into a contact method and a non-contact method according to a communication method with an external terminal.

The contact method is a method in which a predetermined operation is performed by the external contact pad disposed outward on the IC card contacting the contact terminal of the terminal. In addition, the non-contact method is a method of implementing a communication between the IC card and the terminal using a radio frequency (RF). The radio frequency includes high frequency or low frequency.

Combi-type IC cards, on the other hand, are cards that operate in both contact and contactless systems. To this end, the combination IC card includes a low frequency radio frequency chip module and a combination chip module, and the combination chip module includes an external contact pad and a high frequency radio frequency chip module.

In this way, the combination IC card can be used as a contact method, and both low and high frequency radio frequencies can be used.

1 and 2 are diagrams for explaining the manufacturing method and basic structure of a conventional IC card.

Referring to FIG. 1, the conventional IC card 11 includes an insulating film 13 having a predetermined thickness and taking the form of a square plate, and an antenna circuit 15 formed in a predetermined pattern on the bottom surface of the insulating film 13. And a protective layer 17 for covering and protecting the antenna circuit 15, a combination chip 25 connected to a predetermined region of the antenna circuit 15, and the combination chip 25 in a state of being accommodated. A dielectric layer 19 attached to the bottom of the protective layer 17. The combination chip 25 is electrically connected to a predetermined portion of the antenna circuit 15 through the solder ball 25a.

In addition, the bonding layer 21a, the print layer 21b, and the cover layer 21c are sequentially stacked on the lower portion of the dielectric layer 19, and the bonding layer 23a and the print layer 23b are also disposed on the insulating film 13. ) And the cover layer 23c are laminated.

The antenna circuit 15 includes a periphery having a substantially rectangular open loop shape as shown in FIG. 3 by going back several times along the edge of the rectangular film-shaped insulating film 13; It is formed inside the open loop and connected to the external contact pad 29.

Predetermined portions of the inner portion of the antenna circuit 15 are cut off to install the external contact pads 29 described above. Therefore, the antenna circuit 15 is provided with four terminal portions 15a, 15b, 15c, and 15d. That is, the first terminal portion 15a is formed at the outer end of the antenna circuit 15, and the fourth terminal portion 15d is formed at the inner end, and the second terminal portion 15b and the third terminal portion 15c are disposed between the disconnected portions. Is located.

The first terminal portion 15a and the fourth terminal portion 15d are connected by a bridge 27 so that the antenna circuit 15 becomes a closed circuit. The bridge 27 usually uses silver (Ag) as a metal piece that connects the first terminal portion 15a and the fourth terminal portion 15d.

In addition, the insulating film 13, the bonding layer 23a, the print layer 23b, and the cover layer 23c are mounted on the second terminal portion 15b and the third terminal portion 15c to raise the external contact pads 29. The installation groove 33 is formed in the removal part (Z of FIG. 2) of the laminated body which consists of. The installation groove 33 is a hole formed by machining the removal portion Z through an end mill to expose the second and third terminal portions 15b and 15c of the antenna circuit 15 to the upper portion.

Accordingly, when the external contact pad 29 is inserted into the installation groove 33 with the installation groove 33 formed therein, the external contact pad 29 and the antenna circuit 15 are connected to each other, thereby the combination chip 25. The external contact pad 29 can communicate with an external terminal. Reference numeral 31 is a conductive bonding film. The conductive bonding film 31 is an adhesive means for fixing the external contact pad 29 to the antenna circuit 15.

FIG. 2 is a diagram for explaining a method for installing the bridge 27 in the IC card shown in FIG.

As described above, since the bridge 27 connects the first terminal portion 15a and the fourth terminal portion 15d, the bridge 27 takes the form of an upper convex arc so as not to contact another portion of the antenna circuit.

In order to mount the bridge 27, heat is applied to the insulating film 13 while the bridge 27 is positioned on the insulating film 13, and the bridge 27 is connected to the first and fourth terminal portions 15a and 15d. Pressurize toward). In this way, both ends of the bridge 27 pass through the insulating film 13 and are connected to the first terminal portion 15a and the fourth terminal portion 15d, respectively.

However, in the conventional IC card 11 configured as described above, the process of installing the external contact pads 29 and the process of joining the bridges 27 are performed separately, so that the manufacturing process is complicated and the manufacturing cost is high.

In addition, there is a problem that the antenna circuit 15 in the installation groove 33 is easily damaged when the installation groove 33 is processed. Since the antenna circuit 15 is a very thin flexible layer, if the precision of processing is not maintained, the antenna circuit 15 may be instantly injured or removed by the milling cutter.

The present invention has been made to solve the above problems, and since the external contact pad and the bridge are packaged in one connection unit, the IC card is simple to install the external contact pad and bridge for the antenna circuit and the manufacturing process is not complicated. The purpose is to provide.

In order to achieve the above object, the present invention takes the form of an open loop on one side of the insulating film, and both ends thereof are provided with a first terminal portion and a fourth terminal portion, respectively, and a predetermined portion in the middle has two or more ends. An antenna circuit having a circuit portion having a; As connected to the antenna circuit, a bridge connecting the first terminal portion and the fourth terminal portion, the outside formed on one side of the bridge and connected to the ends formed in the circuit portion and can be in electrical contact with the external terminal for communication A connection unit including a contact pad; A combination chip connected to the external connection pad; And a dielectric layer in close contact with the antenna circuit and supporting the connection unit and the combination chip.

In addition, the bottom surface of the bridge is provided with a contact portion respectively in contact with the first terminal portion and the fourth terminal portion, the portion corresponding to the connection portion of the bottom surface of the bridge has a concave shape so as to cut off the connection with the antenna circuit do.

In addition, the connection unit is fixed with an adhesive to the antenna circuit, characterized in that the adhesive is filled between the recess of the bottom surface of the bridge and the antenna circuit.

In addition, a first bonding layer, a first print layer, and a first cover layer are sequentially stacked on the lower portion of the insulating film, and a second bonding layer, a second print layer, and a second cover layer are sequentially stacked on the dielectric layer. And an opening for exposing the external contact pad to the outside of the card is formed in the dielectric layer, the second bonding layer, the second print layer, and the second cover layer.

In addition, the connection unit and the bridge is characterized in that formed in one unit.

Hereinafter, one embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan configuration diagram of an IC card according to an embodiment of the present invention.

Referring to the figure, it can be seen that the IC card 51 according to the present embodiment takes the form of a square flat plate like an ordinary credit card. In addition, the IC card 51 has a multilayer structure as shown in FIG.

In any case, as shown in FIG. 5, the antenna circuit 55 is formed on the top surface of the quadrangular insulating film 53. The antenna circuit 55 is formed by a known etching method using a photoresist, a mask and the like, the pattern of which is different depending on the case of an IC card.

The antenna circuit 55 is positioned in the form of a square open loop at the edge of the insulating film 53. That is, the antenna circuit 55 proceeds along the rim of the first terminal portion 55a located at one corner of the insulating film 53 as a starting point, and is retracted inward to take a rectangular loop shape. The antenna circuit 55 proceeds as described above, and the other end thereof, that is, the fourth terminal portion 55d, is located close to the first terminal portion 55a.

In addition, the second terminal portion 55b and the third terminal portion 55c are positioned at the side portions of the fourth terminal portion 55d. The second terminal portion 55b and the third terminal portion 55c are provided at a portion of the antenna circuit 55 which is advanced to the inside of the insulating film 53, and the external contact pad 63c of the connection unit 63 is seated thereon. .

The connection unit 63 is seated on the insulating film 53 to connect the first terminal portion 55a and the fourth terminal portion 55d and to connect the second terminal portion 55b and the third terminal portion 55c. Connect it.

The connection unit 63 is manufactured by etching one sheet of conductive thin plate, and a bridge 63a is provided at one side thereof, and an external connection pad 63c is formed at the other side thereof.

The bridge 63a connects the first terminal portion 55a and the fourth terminal portion 55d so that the antenna circuit 55 becomes a closed circuit as a whole, and the external contact pad 63c is connected to the second terminal portion 55b. At the same time as connecting the third terminal portion 55c, an external terminal (not shown) and the combi chip 25 are connected to each other so as to communicate with each other.

Each of the bridge 63a and the external contact pad 63c plays the same role as the conventional bridge (27 of FIG. 1) and the external contact pad (29 of FIG. 1). However, in the case of the IC card of the present embodiment, the bridge 63a and the external contact pad 63c are manufactured integrally, so installation is as simple as that. That is, in the conventional case, the bridge 27 and the external contact pad 29 had to be separately installed as separate components. However, in the present embodiment, the bridge 63a and the external contact pad 63c are integrated, and thus, the installation of the bridge 27 and the external contact pad 29 are performed in one installation. The parts are settled.

The combi chip 25 is positioned at the side of the contact unit 63. The combination chip 25 may be connected to the contact unit 63 to communicate with an external terminal through an external contact pad 63c.

4 is an exploded cross-sectional view illustrating a method of manufacturing an IC card according to an embodiment of the present invention. The same reference numerals as those in FIG. 3 indicate the same members having the same functions.

As shown, the IC card 51 according to the present embodiment has an insulating film 53 having the shape of a square plate having a predetermined thickness and having an antenna circuit 55 formed thereon, and the antenna circuit 55. A combination chip 25 that is bonded and fixed to a predetermined portion of the solder ball 25a, a connection unit 63 which connects the terminal portion of the antenna circuit 55, and communicates the combi chip 25 with an external terminal; And a bonding layer 21a, a print layer 21b, and a cover layer 21c that are sequentially stacked on the bottom surface of the insulating film 53. In addition, a dielectric layer 61, a bonding layer 23a, a print layer 23b, and a cover layer 23c are sequentially provided on the antenna circuit 55.

As described above, the connection unit 63 connects the bridge 63a for connecting the first terminal portion 55a and the fourth terminal portion 55d to the second terminal portion 55b and the third terminal portion 55c. Since the external contact pad 63c is included, the operation of the IC card 51 is performed by bonding the connection unit 63 to a predetermined position of the antenna circuit 55.

The connection unit 63 is fixed to the antenna circuit 55 by the insulating adhesive 59. That is, when the insulating adhesive 59 is positioned at the position where the connection unit 63 is to be seated, the connection unit 63 is positioned thereon and pressed downward to fix the connection unit 63 to the antenna circuit 55. This is done.

On the other hand, connecting portions 63b are provided at both ends of the bridge 63a. Each of the connection portions 63b is a portion that protrudes lower than the center portion of the bottom surface of the bridge 63a to be in contact with the first terminal portion 55a and the fourth terminal portion 55d. The said connecting part 63b is formed by half-etching the site | part except the center part of the bottom face of the bridge 63a, ie, the connection part 63b.

Reference numeral 57 is a solder register. The solder register 57 is inserted into a groove of the bottom surface of the bridge 63a when the connection unit 63 is seated so that the bridge 63a does not come into contact with an antenna other than the first and fourth terminal portions 55a and 55d. do. The solder register 57 may be added if necessary, and the insulating adhesive 59 may replace its function.

A bridge receiving groove 67 is provided at one side of the dielectric layer 61 for the connection unit 63. In addition, the opening 65 is formed on the side of the bridge receiving groove (67). In addition, the bridge receiving groove 67 may be formed or omitted depending on the shape or thickness of the bridge. This does not affect the overall thickness when the thickness of the bridge is thin, so that it is not necessary to form the bridge receiving groove 67 as an additional process.

The opening 65 is a hole for exposing the external contact pad 63c of the connection unit 63 to the outside, and has been processed before fixing the dielectric layer 61 to the insulating film 53. The opening 65 has corresponding portions of the dielectric layer 61, the bonding layer 23a, the print layer 23b, and the cover layer 23c stacked in a shape corresponding to the planar shape of the external contact pad 63c. It is a through hole.

Fig. 5 is a sectional view of the IC card composed of the elements shown in Fig. 4 above.

As shown, the connection unit 63 is seated at the corresponding position of the antenna circuit 55. The bridge 63a connects the first and fourth terminal portions 55a and 55d in the seated state, and the external contact pad 63c connects the second and third terminal portions 55b and 55c.

In addition, the external contact pad 63c is exposed to the outside of the card through the opening 65 and internally connected to the combination chip 25. Therefore, when the IC card 51 is placed on an external terminal (not shown), the external contact pad 63c contacts the terminal to communicate with the terminal and the combi chip 25.

As described above, in the IC card 51 according to the present embodiment, since the bridge 63a and the external contact pad 63c are packaged in one connection unit 63, the operation is as simple as that.

In addition, a pattern of the antenna may be designed differently to enable a function as the bridge by half etching a portion of the lower portion of the external contact pad.

As mentioned above, although this invention was demonstrated in detail through the specific Example, this invention is not limited to the said Example, A various deformation | transformation is possible for a person with ordinary knowledge within the scope of the technical idea of this invention.

In the IC card of the present invention as described above, since the external contact pad and the bridge are packaged in one connection unit, installation of the external contact pad and the bridge to the antenna circuit is simple and the manufacturing process is not complicated.

Claims (5)

An antenna circuit in the form of an open loop on one side of the insulating film, the both ends of which are provided with a first terminal portion and a fourth terminal portion, and a predetermined portion of the intermediate portion having a circuit portion having two or more ends; As connected to the antenna circuit, a bridge connecting the first terminal portion and the fourth terminal portion, the outside formed on one side of the bridge and connected to the ends formed in the circuit portion and can be in electrical contact with the external terminal for communication A connection unit including a contact pad; A combination chip connected to the external connection pad; And a dielectric layer adhered to the antenna circuit and supporting the connection unit and the combination chip. The method of claim 1, The bottom of the bridge is provided with a connecting portion in contact with each of the first terminal portion and the fourth terminal portion, the portion between the connection portion of the bottom of the bridge has an concave shape so as to cut off the connection with the antenna circuit Card. The method of claim 2, And the connection unit is fixed with an adhesive to the antenna circuit, and the adhesive is filled between the recess of the bottom surface of the bridge and the antenna circuit. The method of claim 1, The first bonding layer, the first print layer and the first cover layer are sequentially stacked on the lower portion of the insulating film, The second bonding layer, the second print layer, and the second cover layer are sequentially stacked on the dielectric layer, and the external contact pads are disposed on the dielectric layer, the second bonding layer, the second print layer, and the second cover layer to the outside of the card. An IC card, characterized in that the opening is formed to expose.  The method of claim 1, And the connection unit and the bridge are formed in one unit.

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