KR20060091624A - A method for manufacturing printed circuit board of side connector type - Google Patents

Abstract

The present invention relates to a method for manufacturing a side connector type PCB applied to an RF module, etc.

A side connector type PCB manufacturing method using an outer press processing method, the method comprising: forming a plurality of connector holes penetrating both sides of a PCB manufacturing substrate at a predetermined interval along a preset press working line; Forming a metal film on an inner wall of each of the plurality of connector holes; And forming a plurality of buffer holes passing through both sides of the substrate by a drill process at each of a plurality of positions where the press working line and the connector holes meet each other. In the outer press working, each buffer hole is made to cushion the friction and impact caused by the press working.

Main Board, Side Connector Type PCB, Press Machining, Buffer Hole, Counterclockwise Drill, Clockwise Drill

Description

Side connector type PC manufacturing method {A METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD OF SIDE CONNECTOR TYPE}

1 is a perspective view of a side connector type PCB mounted on a main board according to the prior art

Figure 2 is a manufacturing process explanatory diagram of the side connector type PCB according to the prior art

Figure 3 is a perspective view of the side connector type PCB and side connector enlarged view according to the prior art

Figure 4 is a flow chart showing a manufacturing method of the side connector type PCB according to the present invention

Figure 5 is a perspective view and an enlarged view of the connector hole formed with the connector hole in accordance with the present invention

6 is a perspective view of a substrate on which a connector hole and a buffer hole are formed according to the present invention, and an enlarged view of the connector hole and the buffer hole according to the direction of the press working line;

Figure 7 is an explanatory view of the drill rotation direction of the buffer hole according to the present invention

8 is a shape view of the connector hole and the buffer hole after the drill process according to the present invention

9 is a conceptual diagram illustrating the shock absorbing force of the press during the outer press process according to the present invention

10 is a perspective view of a side connector type PCB produced by the manufacturing method of the present invention

11 is an enlarged view of the side connector of FIG. 10.

Explanation of symbols on the main parts of the drawings

50: substrate

CH: Connector Hole

BH: Buffer Hole

The present invention relates to a method for manufacturing a side connector type PCB (Printed Circuit Board) applied to an RF module and the like, and in particular, a buffer hole can be formed without adversely affecting a metal film, The side connector type PCB which prevents the press working blade from coming into direct contact with the connector hole, and also cushions the impact force applied to the connector hole, thereby protecting the metal film formed on the inner wall of the connector hole from the contact and impact caused by the press working. It is about a manufacturing method.

In general, a mobile communication terminal such as a cellular phone includes a main board, and a plurality of functional modules are mounted on the main board. The functional module may be implemented by employing a side connector type PCB. For example, the functional module may be an RF module for processing an RF signal.

The conventional side connector type PCB applied to such an RF module is shown in FIG. 1.

1 is a perspective view of a side connector type PCB mounted on a main board according to the prior art.

Referring to FIG. 1, a plurality of side connectors 12 are formed on an outer side of a conventional side connector type PCB 11, and after the PCB 11 is mounted on the main board 13, the plurality of side surfaces are provided. The PCB 11 is electrically connected to the main board 13 through the connector 12. That is, the side connector type PCB 11 is placed on the mounting position of the main board 13, and the inner wall metal film 12a of the side connector 12 of the PCB 11 and the circuit of the main board 13 are mounted. The bonding pads 13a connected to the pattern are electrically connected through soldering 14 or the like.

At this time, in order to more securely connect the side connector type PCB 11 and the main board 13, the metal film 12a to be plated on the inner wall of the side connector 12 should be formed normally.

 The method of processing the side connector type PCB is divided into the outer press method and the outer router method according to the outer processing method, and the manufacturing process of the side connector type PCB by the outer router method will be described with reference to FIG. 2.

2 is a manufacturing process explanatory diagram of a side connector type PCB according to the prior art.

As shown in Figure 2, when describing the manufacturing process of the conventional side connector type PCB, after designing the PCB processing pattern including the circuit pattern (S21), to manufacture the side connector type PCB according to this PCB processing pattern In order to process the substrate (S22). Thereafter, the connector hole is processed in the processed substrate by a CNC (Computer Numerical Control) method (S23). Next, a metal film is plated on the inner wall of the connector hole (S24). Next, a circuit pattern designed in advance on the substrate is formed (S25). In this way, the substrate on which the circuit pattern is formed is subjected to surface treatment such as hot air solder leveling (HAL) treatment for protecting the circuit pattern and improving solderability (S26), and in the outer press process, the formed connector hole is According to the press process (S27). At this time, in the press process, the press working blade acts to bisect the connector hole to both sides. Accordingly, the side connector is formed on the side surface of the PCB by the bisecting of the connector hole, and thus the side connector type PCB is manufactured and shipped (S28). ). Here, the substrate between the side connector type PCB and the substrate of the edge are discarded.

In the above-described side connector type PCB manufacturing process, when the press working blade acts on the connector hole, there is a problem that the shape of the connector hole is crushed or the metal film plated on the connector hole is detached. It demonstrates with reference to 3.

3 is a perspective view and an enlarged side view of a conventional side connector type PCB.

When the side connector of the side connector type PCB manufactured by the conventional manufacturing method shown in FIG. 3 is enlarged, a case where the shape of the side connector becomes distorted, such as the shape thereof becomes poor, and also the inner wall of the side connector When the formed metal film is torn or severely, there is a problem that a metal film defect occurs such as the metal film is separated from the side connector.

There is a problem in that the electrical connection between the side connector type PCB and the main board is in a bad state due to the poor shape of the side connector or the poor plating state of the metal film.

The present invention has been proposed to solve the above problems, and its object is to form a buffer hole without adversely affecting the metal film, and that the press working blade is in direct contact with the connector hole by the buffer hole during the outer press working. The present invention provides a method for manufacturing a side connector type PCB which is prevented and also cushions the impact force applied to the connector hole, thereby protecting the metal film formed on the inner wall of the connector hole from contact and impact due to press working.

In order to achieve the above object of the present invention, the side connector type PCB manufacturing method of the present invention, in the side connector type PCB manufacturing method using the outer press processing method, along a preset press processing line, a predetermined interval Forming a plurality of connector holes penetrating both sides of the PCB fabrication substrate by using; Forming a metal film on an inner wall of each of the plurality of connector holes; And forming a plurality of buffer holes passing through both sides of the substrate by a drill process at each of a plurality of positions where the press working line and the connector holes meet each other. In the outer press working, each buffer hole is characterized in that made to buffer the friction and impact caused by the press working.

The forming of the buffer hole may include forming a buffer hole at a center point of each of the connector holes among the two points where the press processing line and each connector hole meet in a state where a PCB to be separated from the substrate is raised above the press processing line. Forming a left buffer hole by a drill process rotating in a counterclockwise direction with respect to a left point of the; And

And forming a right buffer hole by a drill process that rotates clockwise with respect to the right point at the center point of each connector hole.

Each said buffer hole is characterized by having a diameter smaller than the diameter of the said connector hole.

The plurality of connector holes have the same diameters, and the plurality of buffer holes have the same diameters.

Each of the plurality of buffer holes may be formed with a center point at which the press working line meets each connector hole.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings referred to in the present invention, components having substantially the same configuration and function will use the same reference numerals.

The side connector type PCB manufacturing method of the present invention, in the PCB manufacturing process using the outer press processing method, to form a buffer hole along the press processing line to overlap with the connector hole, at this time, it is possible to protect the metal film plated on the connector hole By forming the buffer hole in a predetermined drill rotation direction so that the buffer hole can be formed without adversely affecting the metal film, the connector hole and the inner wall metal of the connector hole can be formed from the friction and impact force caused by the press working in the outer press process. It is a technique to protect the membrane.

The PCB manufacturing method of the present invention will be described with reference to FIGS. 4 to 11.

Figure 4 is a flow chart showing a method of manufacturing a side connector type PCB according to the present invention, Figure 5 is a perspective view and a connector hole enlarged view of a substrate on which a connector hole is formed according to the present invention.

4 and 5, first, a plurality of connector holes CH are formed in a substrate 50 for manufacturing a side connector type PCB, wherein the plurality of connector holes CH are previously set presses. Along the processing line, it is formed to penetrate both sides of the substrate 50 at a predetermined interval (S41). Next, a metal film is plated and formed on the inner wall of each of the plurality of connector holes CH to electrically connect the upper and lower portions of the substrate 50 (S42).

After the process as described above, as described in the prior art with reference to Figure 2, after forming a pre-designed circuit pattern on the substrate 50 on which the connector hole (CH) is formed, the surface treatment (HAL treatment) is performed (S43).

Thereafter, a plurality of buffer holes are formed in the substrate 50, that is, a plurality of buffers passing through both surfaces of the substrate by a drill process at each of a plurality of positions where the press working line and the respective connector holes meet. Form a hole (S44). Next, an outer press process of cutting the substrate 50 along the connector hole to manufacture the side connector type PCB is performed (S45).

6 is a perspective view of a substrate on which a connector hole and a buffer hole are formed according to the present invention, and an enlarged view of the connector hole and the buffer hole according to the direction of the press working line.

5 and 6, a plurality of buffer holes BH are formed in the substrate 50. More specifically, the plurality of buffer holes BH may include the press working line and the connector holes. Each of the plurality of positions P1 and P2 (shown in FIG. 5) where (CH) meets is formed to pass through both surfaces of the substrate 50 by a drill process. Here, the substrate between the side connector type PCB and the substrate of the edge are discarded.

Accordingly, when the outer press is bisected into the plurality of connector holes CH to both sides, the respective buffer holes BH prevent direct contact between the press working blade and the connector hole CH. And, it is made to buffer the impact force transmitted to the connector hole (CH) by the press working.

In addition, each of the buffer holes is formed such that the press working blade does not directly contact the connector holes CH at the time of press working, and has a diameter that can sufficiently disperse friction and impact due to press working. do. Preferably, it has a diameter smaller than the diameter of the connector hole.

In addition, when machining the plurality of connector holes (CH), it is convenient in the manufacturing process to be processed using a drill of the same size without replacing the drill, it is preferable that the plurality of connector holes (CH) have the same diameter to each other It is preferable that the plurality of buffer holes BH also have the same diameter to each other for the same reason as the connector hole CH.

5 and 6, each of the plurality of buffer holes BH is preferably formed with a center point at which the press working line meets each connector hole CH. In this case, since the formation positions of the plurality of buffer holes BH are set correctly, the manufacturability is improved, and in addition, it is possible to avoid the direct contact between the press blade and the plated metal film on the inner wall of the connector hole during the press working, and thus the metal by friction Since it is possible to prevent the damage to the membrane and the impact applied at this time can be uniformly distributed to each other at both points of each connector hole, it is possible to prevent the impact force from being concentrated at any one point. Such impact force dispersion is described below with reference to FIG. 9.

7 is an explanatory view of the drill rotation direction of the buffer hole according to the present invention, Figure 8 is a shape diagram of the connector hole and the buffer hole after the drill process according to the present invention.

Referring to FIGS. 7 and 8, in the forming of the buffer hole BH, the press processing line and each connector hole CH may be formed in a state where a PCB to be separated from the substrate is raised above the press processing line. ), The left point at the center point of each of the connector holes CH is formed in the left side at each point where)), and a left buffer hole is formed by a drill process that rotates counterclockwise, and the right point at the center point of each connector hole. For the right side, the right buffer hole is formed by a drill process that rotates clockwise.

More specifically, for example, when the substrate on the upper side of the press working line becomes a side connector type PCB, and the substrate on the lower side of the press working line is discarded, the connector On the left side of the hole CH, a left buffer hole is formed by a counterclockwise drill process, and on the right side of each of the connector holes CH, a right buffer hole is formed by a clockwise drill process. Accordingly, the metal film plated on the inner wall of each connector hole CH is protected as much as possible from the drill process for forming the buffer hole.

At this time, in the outer press work which bisects the plurality of connector holes CH to both sides, a press working blade passes through the plurality of buffer holes BH, and the buffer holes BH are subjected to friction by the press work. Or / and cushions the impact, and, as shown in FIG. 5, the impact force during the press working is significantly reduced by the respective buffer holes BH and transmitted to the connector holes CH. Done. This will be described with reference to FIG. 9.

9 is an explanatory view of the impact shock absorbing conceptual concept during the outer press process according to the present invention.

Referring to FIG. 9, during the outer press working, the press working blade separates the plurality of connector holes CH from both sides. In this case, since the press working blade passes through the plurality of buffer holes BH, Accordingly, each buffer hole (BH) that meets the press working blade can disperse the shock from the press working blade in different directions, thereby reducing the impact force transmitted to the connector hole (CH). have.

That is, buffer holes are formed at both sides of the connector hole CH, and as described above, each buffer hole distributes the impact force caused by friction with the press transmitted to the connector hole in which the metal film is formed. The hole BH can protect the connector hole and the inner wall metal film of the connector hole from the impact force by the press working.

10 is a perspective view of a side connector type PCB manufactured by the manufacturing method of the present invention, and FIG. 11 is an enlarged view of the side connector of FIG.

10 and 11, the side connector type PCB manufactured by the PCB manufacturing method of the present invention includes a plurality of side connectors (SC) on the outside. Referring to FIG. 11, the side connector SC includes a central connector hole CH and a buffer hole BH formed at both sides of the connector hole CH.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, but is defined by the claims, and the apparatus of the present invention may be substituted, modified, and modified in various ways without departing from the spirit of the present invention. It is apparent to those skilled in the art that modifications are possible.

According to the present invention as described above, in the side connector type PCB manufacturing method applied to the RF module, etc., at the point where the connector hole for the side connector of the board and the press working line immediately before the outer press working of the PCB manufacturing board, By forming the buffer hole in the direction of drill rotation to protect the plated metal film in the connector hole, the buffer hole buffers the impact force applied to the connector hole during the outer press work, and thus the inner wall of the connector hole from the impact force caused by the press work. There is an effect that can protect the metal film formed on the.

In addition, according to the drill rotation direction of both buffer holes, it is possible to prevent the metal film formed on the inner wall of the connector hole to escape, significantly reduce the failure rate of the PCB, more securely ensure the connection between the PCB and the main board Therefore, there is an effect that can improve the productivity.

Claims (6)

In the side connector type PCB manufacturing method using the outer press processing method, Forming a plurality of connector holes penetrating both sides of the PCB fabrication substrate at predetermined intervals along a preset press working line; Forming a metal film on an inner wall of each of the plurality of connector holes; And Forming a plurality of buffer holes passing through both sides of the substrate by a drill process at each of a plurality of positions where the press working line and the connector holes meet each other; The method of manufacturing a side connector type PCB, characterized in that the buffer hole is made to buffer the friction and the impact caused by the pressing during the outer press process of dividing the plurality of connector holes to both sides. The method of claim 1, wherein the forming of the buffer hole In the state where the PCB to be separated from the substrate on the upper side of the press processing line is raised, the left side at the center point of each connector hole among the two points where the press processing line meets each connector hole is rotated counterclockwise. Forming a left buffer hole by a drill process; And Forming a right buffer hole by a drill process that rotates clockwise with respect to the right point at the center point of each connector hole; Side connector type PCB manufacturing method comprising a. The method of claim 2, wherein each buffer hole is Side connector type PCB manufacturing method characterized in that it has a diameter smaller than the diameter of the connector hole. The method of claim 3, wherein the plurality of connector holes Side connector type PCB manufacturing method characterized by having the same diameter to each other. The method of claim 4, wherein the plurality of buffer holes Side connector type PCB manufacturing method characterized by having the same diameter to each other. The method of claim 5, wherein each of the plurality of buffer holes Side connector type PCB manufacturing method characterized in that formed by the center point of the meeting point of the press processing line and each connector hole.

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