KR20060089326A - 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치 - Google Patents
반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치 Download PDFInfo
- Publication number
- KR20060089326A KR20060089326A KR1020050009942A KR20050009942A KR20060089326A KR 20060089326 A KR20060089326 A KR 20060089326A KR 1020050009942 A KR1020050009942 A KR 1020050009942A KR 20050009942 A KR20050009942 A KR 20050009942A KR 20060089326 A KR20060089326 A KR 20060089326A
- Authority
- KR
- South Korea
- Prior art keywords
- failure
- gear
- fixed
- shaft
- coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 230000002265 prevention Effects 0.000 title claims description 5
- 241000218202 Coptis Species 0.000 claims abstract description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 241000099774 Cuscuta salina Species 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims 1
- 239000000615 nonconductor Substances 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 3
- 230000005856 abnormality Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K35/00—Means to prevent accidental or unauthorised actuation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/44—Mechanical actuating means
- F16K31/60—Handles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
Claims (3)
- 본체에 수용된 상. 하 기어의 하부 기어에 모터의 회전축이 연결되고 상부 기어 회전축에 실패가 결합된 실패고정체의 고정축이 결합되어 금실을 풀 수 있도록 구성된 장치에 있어서, 본체 내부에 수용되어 상. 하로 결합되고 비전도체의 재질로 구성된 헬리컬기어와 본체의 상부 좌. 우로 노출된 상부 헬리컬기어의 회전축과 상부 헬리컬기어 좌측 회전축에 금실이 풀리는 실패를 결합하는 실패고정체가 고정되며 탄성부재가 고정되고 고정판이 고정되는 고정축으로 구성되는 것을 특징으로 하는 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치.
- 제1항에 있어서, 고정축의 단부에 스프링이 내재되고 스프링 위에는 받침대가 거치되며 상기 받침대 위에는 실패탈리방지부재가 양 방향으로 굴절이 가능하도록 설치되어 받침대의 탈리를 차단하며 상기 스프링의 탄성이 실패탈리방지부재에 제공되므로서 실패탈리방지부재가 실패의 탈리를 방지하도록 구성되는 것을 특징으로 하는 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치.
- 제1항에 있어서, 상부 헬리컬기어의 우측 회전축 단부에 본체에 형성되는 전위를 제로로 하기 위해 접지부가 형성되는 것을 특징으로 하는 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050009942A KR100619606B1 (ko) | 2005-02-03 | 2005-02-03 | 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050009942A KR100619606B1 (ko) | 2005-02-03 | 2005-02-03 | 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060089326A true KR20060089326A (ko) | 2006-08-09 |
KR100619606B1 KR100619606B1 (ko) | 2006-09-01 |
Family
ID=37177423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050009942A Expired - Fee Related KR100619606B1 (ko) | 2005-02-03 | 2005-02-03 | 반도체 접합용 와이어스풀의 노이즈와 틸팅의 방지장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100619606B1 (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970053705A (ko) * | 1995-12-14 | 1997-07-31 | 김광호 | 패키지 조립용 리드 프레임 공급장치 |
KR19980064247A (ko) | 1996-12-19 | 1998-10-07 | 윌리엄비.켐플러 | 와이어 본딩 캐필러리의 연속 자동 회전 |
KR100420483B1 (ko) * | 2001-07-25 | 2004-03-02 | 주식회사 팬탑 | 칩 마운터용 피더의 릴 이송장치 |
-
2005
- 2005-02-03 KR KR1020050009942A patent/KR100619606B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100619606B1 (ko) | 2006-09-01 |
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