KR20060078957A - Transfer device having function detecting wafer - Google Patents

Transfer device having function detecting wafer Download PDF

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KR20060078957A
KR20060078957A KR1020040118213A KR20040118213A KR20060078957A KR 20060078957 A KR20060078957 A KR 20060078957A KR 1020040118213 A KR1020040118213 A KR 1020040118213A KR 20040118213 A KR20040118213 A KR 20040118213A KR 20060078957 A KR20060078957 A KR 20060078957A
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wafer
chuck
transfer device
sensor
guides
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KR1020040118213A
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Korean (ko)
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강영신
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동부일렉트로닉스 주식회사
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Priority to KR1020040118213A priority Critical patent/KR20060078957A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체장치에서 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치에 관한 것으로, 반도체의 각종 공정챔버와 로드락 챔버간에 웨이퍼를 이송하는 이송아암과 웨이퍼 홀더에 구비되어 웨이퍼가 물린 상태로 이송될 수 있는 홈이 형성된 수개의 척가이드가 구비된 웨이퍼 이송장치에 있어서, 상기 척가이드 각각에 구비된 센서; 상기 센서로부터 모든 척가이드 각각의 홈에 웨이퍼가 감지된 신호를 수신받은 경우 웨이퍼 이송을 수행하도록 명령을 송신하는 제어부; 를 포함하여 이루어진 것을 특징으로 한다. 이와 같은 구성에 의한 본 발명에 의하면, 웨이퍼 드롭(Drop) 및 파손(Broken)으로 인한 공정사고를 방지하고 생산성을 향상시킬 수 있는 효과가 있다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer device equipped with a wafer bite detection function in a semiconductor device. A wafer transfer apparatus having a plurality of chuck guides having grooves formed therein, the wafer transfer apparatus comprising: a sensor provided in each of the chuck guides; A control unit which transmits a command to perform wafer transfer when a wafer is detected in a groove of each chuck guide from the sensor; Characterized in that comprises a. According to the present invention by such a configuration, there is an effect that can prevent the process accident due to the wafer (Drop) and broken (Broken) and improve the productivity.

웨이퍼, 로드락챔버, 이송장치, 척가이드Wafer, Load Lock Chamber, Conveyer, Chuck Guide

Description

웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치{Transfer device having function detecting wafer} Wafer transfer device with wafer bleed detection function {Transfer device having function detecting wafer}             

도 1은 종래의 척가이드에 웨이퍼가 물려있는 상태를 보여주는 개략도,1 is a schematic view showing a state in which a wafer is held in a conventional chuck guide,

도 2는 본 발명의 일실시예에 따른 웨이퍼 이송장치를 보여주는 개략도.
2 is a schematic view showing a wafer transfer device according to an embodiment of the present invention.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1 : 웨이퍼 10 : 척가이드1: wafer 10: chuck guide

11 : 홈 20 : 센서11: home 20: sensor

30 : 제어부
30: control unit

본 발명은 반도체장치에서 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치에 관한 것으로, 보다 상세하게는 다수개의 척가이드에 모두 웨이퍼가 물린 경우에만 완전하게 웨이퍼가 물린 것으로 인식할 수 있는 센서를 구비함으로써 웨이퍼의 센 싱이 잘못됨으로 인한 웨이퍼 드롭(Drop)이나 파손(Broken)을 방지할 수 있는 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치에 관한 것이다.
The present invention relates to a wafer transfer device equipped with a wafer bite detection function in a semiconductor device. More specifically, the present invention relates to a wafer transfer device, in which a plurality of chuck guides have a sensor that can recognize a wafer completely when the wafer is bitten. The present invention relates to a wafer transfer device equipped with a wafer bleed detection function that can prevent wafer drop or breakage due to incorrect sensing.

최근에는 반도체장치가 고집적화됨에 따라 반도체장치의 수율을 개선시키기 위하여 반도체장치의 제조설비에서 발생하는 오염입자의 크기 및 양을 감소시키기 위한 노력이 활발해지고 있다. 이러한 반도체 제조설비들은 대부분 고진공 분위기에서 소정의 공정, 예컨대 확산공정 내지 식각공정을 진행할 수 있도록 밀폐된 챔버설비를 구비한다.Recently, as semiconductor devices have been highly integrated, efforts have been made to reduce the size and amount of contaminant particles generated in the manufacturing facilities of semiconductor devices in order to improve the yield of semiconductor devices. Most of these semiconductor manufacturing facilities are provided with a closed chamber facility to perform a predetermined process, such as a diffusion process or an etching process, in a high vacuum atmosphere.

구체적으로 상기 챔버설비는 고진공 상태에서 소정의 공정을 진행하기 위한 공정챔버(process chamber)와, 상기 공정챔버와 연결되어 있는 것으로 공정챔버에 웨이퍼를 투입하기 전에 웨이퍼를 일시적으로 보관시키기 위한 것으로 공정챔버로 웨이퍼를 로딩하거나 공정 수행이 완료된 웨이퍼를 언로딩되도록 하기 위해 로드락 챔버(load lock chamber)를 구비한다.Specifically, the chamber facility is a process chamber for performing a predetermined process in a high vacuum state, and is connected to the process chamber to temporarily store the wafer before putting the wafer into the process chamber. A load lock chamber is provided for loading a wafer into a furnace or for unloading a wafer in which a process is completed.

상기 로드락 챔버는 대기중의 웨이퍼를 직접 공정챔버에 투입시키거나 공정챔버 내의 웨이퍼를 직접 대기중으로 꺼낼 때, 공정챔버가 대기중의 먼지 등에 의해 오염되는 현상을 방지하기 위하여 완충역할을 하도록 설치한다. 또한, 공정챔버 내의 공간을 대기압 상태에서 고진공 상태로 만들기 위하여 웨이퍼를 투입시키거나 꺼낼 때마다 오랜시간 동안 펌프를 가동시켜야 하는 문제점을 해결하기 위한 목적으로 설치한다. 이를 위해 로드락 챔버는 외부와 밀폐되게 하므로서 공정챔버와 동일한 조건으로 환경을 조성해주는 웨이퍼의 대기 위치이다. The load lock chamber is provided to act as a buffer to prevent the process chamber from being contaminated by atmospheric dust when the wafer in the atmosphere is directly put into the process chamber or the wafer in the process chamber is directly taken out into the atmosphere. . In addition, in order to solve the problem of operating the pump for a long time every time the wafer is put or taken out in order to make the space in the process chamber from the atmospheric pressure to a high vacuum state. To this end, the load lock chamber is a stand-by position of the wafer to create an environment under the same conditions as the process chamber by being sealed to the outside.                         

한편, 반도체장치로 제조되기까지 웨이퍼는 카세트에 복수개씩 탑재되어 각 공정을 수행하는 공정챔버로 이송되고, 이들 웨이퍼는 각 공정을 수행하는 공정챔버 내에서도 그 내부에 설치된 로봇에 의해 일매씩 인출되어 요구되는 위치로 이송되는 과정을 거치게 된다.On the other hand, until a semiconductor device is manufactured, a plurality of wafers are mounted in a cassette and transferred to a process chamber for performing each process, and these wafers are taken out one by one by a robot installed therein within the process chamber for performing each process. It goes through the process of being transferred to the position.

여기서 로드락 챔버와 공정챔버간에 웨이퍼를 이송하는 장치에는 로드락 챔버에서 공정챔버의 디스크 패드(Disk Pad)로 로딩시켜주는 이송아암(Arm)과 웨이퍼를 잡는 웨이퍼 홀더(Wafer Holder)라는 장치가 있고, 상기 웨이퍼 홀더에는 3개의 척가이드(Chuck Guide)가 구비되어 있어 웨이퍼를 잡아 디스크 패드로 이동시킨다.
Here, the apparatus for transferring wafers between the load lock chamber and the process chamber includes a transfer arm loading the disk pad of the process chamber from the load lock chamber and a wafer holder for holding the wafer. The wafer holder is provided with three chuck guides to hold the wafer and move it to the disk pad.

도 1은 종래의 척가이드에 웨이퍼가 물려있는 상태를 보여주는 개략도이다.1 is a schematic view showing a state in which a wafer is held in a conventional chuck guide.

웨이퍼 홀더 및 이송아암에는 웨이퍼(1)를 감지하고 다음 공정으로 이동하기 위해 척가이드(Chuck Guide)(10)가 구비된다. 상기 척가이드(10)에는 홈(11)이 형성되어 있어 상기 홈(11)에 웨이퍼(1)가 물리게 된다.The wafer holder and the transfer arm are provided with a chuck guide 10 for sensing the wafer 1 and moving to the next process. A groove 11 is formed in the chuck guide 10 so that the wafer 1 is snapped into the groove 11.

상기 척가이드(10)는 실린더(Cylinder)(도면에 미도시)에 의해 작동이 되는데, 척가이드(10)에 웨이퍼(1)가 물리지 않은 경우에 경고음(Alarm)을 발생시키게 되어 있고, 척가이드(10)에 웨이퍼(1)가 완전히 물린 경우 다음 공정이 진행되도록 되어 있다.The chuck guide 10 is operated by a cylinder (not shown in the drawing), and generates an alarm when the wafer 1 is not bitten by the chuck guide 10, and the chuck guide When the wafer 1 is completely bitten by 10, the next step is to proceed.

그러나, 종래의 척가이드(10)는 웨이퍼(1)가 전혀 없는 경우에만 지정된 값 이상으로 감지하여 경고음을 발생시키고, 만약 3개의 척가이드(10)중 어느 하나만 웨이퍼(1)를 잡지 못한 경우에는 웨이퍼(1)를 잡지 못하였다는 미싱(Missing)을 감 지하지 못하는 문제점을 안고 있다.
However, the conventional chuck guide 10 detects more than a specified value only when there is no wafer 1 at all, and generates a warning sound. If only one of the three chuck guides 10 does not hold the wafer 1, Missing (missing) that does not hold the wafer (1) has a problem that does not detect.

따라서 본 발명은 상술한 제반 문제점을 해결하고자 안출된 것으로, 본 발명의 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치는 3개의 척가이드에 모두 센서를 설치하여 3개의 척가이드에 웨이퍼가 완전하게 물린 것을 감지한 경우 다음 공정으로 진행되도록 함으로써 웨이퍼의 드롭(Drop) 및 파손(Broken)이 발생하는 것을 방지할 수 있는 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치를 제공함에 그 목적이 있다.
Therefore, the present invention has been made to solve the above-mentioned problems, the wafer transfer device equipped with a wafer bite detection function of the present invention is that the wafer is completely bitten by the three chuck guides by installing the sensors in all three chuck guides It is an object of the present invention to provide a wafer transfer device equipped with a wafer bleed detection function that can prevent a drop and break of a wafer from occurring when the sensing process proceeds to the next process.

상술한 바와 같은 목적을 구현하기 위한 본 발명의 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치는, 반도체의 각종 공정챔버와 로드락 챔버간에 웨이퍼를 이송하는 이송아암과 웨이퍼 홀더에 구비되어 웨이퍼가 물린 상태로 이송될 수 있는 홈이 형성된 수개의 척가이드가 구비된 웨이퍼 이송장치에 있어서, 상기 척가이드 각각에 구비된 센서; 상기 센서로부터 모든 척가이드 각각의 홈에 웨이퍼가 감지된 신호를 수신받은 경우 웨이퍼 이송을 수행하도록 명령을 송신하는 제어부; 를 포함하여 이루어진 것을 특징으로 한다.
The wafer transfer device equipped with a wafer bite detection function of the present invention for realizing the above object is provided in a transfer arm and a wafer holder for transferring wafers between various process chambers and load lock chambers of a semiconductor, so that the wafer is bitten. Claims [1] A wafer conveying apparatus having a plurality of chuck guides having grooves formed therein, the sensor comprising: a sensor provided in each of the chuck guides; A control unit which transmits a command to perform wafer transfer when a wafer is detected in a groove of each chuck guide from the sensor; Characterized in that comprises a.

이하 첨부한 도면을 참조하여 본 발명의 바람직한 실시예에 대한 구성 및 작 용을 상세히 설명하면 다음과 같다.
Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 일실시예에 따른 웨이퍼 이송장치를 보여주는 개략도이다.2 is a schematic view showing a wafer transfer apparatus according to an embodiment of the present invention.

반도체 제조공정은 이온주입공정, 화학기상증착공정, 건식식각공정 등 여러 공정으로 이루어진다. 웨이퍼(1)가 이와 같은 여러 공정을 거치는 과정에는 로드락 챔버가 구비되어 웨이퍼(1)를 로딩(Loading)하거나 언로딩(Unloading)하여 일시적으로 보관하게 된다.The semiconductor manufacturing process consists of various processes such as ion implantation process, chemical vapor deposition process, and dry etching process. In the process of the wafer 1 undergoing such various processes, a load lock chamber is provided to temporarily store the wafer 1 by loading or unloading the wafer 1.

상기 과정에서 웨이퍼(1)의 이송은 로봇으로 이루어진 이송아암(Arm)과 웨이퍼 홀더(Wafer Holder)가 구비되어 있어 상기 웨이퍼(1)를 공정챔버와 로드락 챔버간에 이송을 담당하게 된다.In the process, the transfer of the wafer 1 is provided with a transfer arm made of a robot and a wafer holder, which is responsible for transferring the wafer 1 between the process chamber and the load lock chamber.

이와 같은 웨이퍼(1)의 이송은 3개로 이루어진 척가이드(10)가 웨이퍼(1)를 물어 홀딩(Holding)한 다음 원하는 장소로 이송된다.The transfer of the wafer 1 is carried out by holding the three holding chuck guide 10 bit the wafer (1) and then transferred to the desired place.

웨이퍼(1)의 이송시 3개의 척가이드(10)에 의한 웨이퍼(1) 물림작업은 매우 중요한 작업이다. 따라서 본 발명은 웨이퍼(1)가 3개의 척가이드(10) 모두에 정확하게 물렸는지 여부를 감지할 수 있는 센서(20)가 구비된다.In the transfer of the wafer 1, the chucking operation of the wafer 1 by the three chuck guides 10 is a very important task. Therefore, the present invention is provided with a sensor 20 that can detect whether the wafer 1 is accurately bitten by all three chuck guides (10).

만약 3개의 척가이드(10)중 하나의 척가이드(10)에서라도 웨이퍼(1)가 잘못 물린 경우에는 웨이퍼(1) 파손(Broken)이나 드롭(Drop)이 발생하여 공정사고가 발생하므로, 3개의 센서(20)로부터 웨이퍼(1)가 모두 정확하게 물림이 감지된 경우에만 제어부(30)에 신호를 송신하고 이러한 신호를 수신받은 상기 제어부(30)는 다음 이송작업을 진행하도록 명령을 송신한다. If one of the three chuck guides 10 is misaligned with the wafer 1, a breakdown or drop occurs in the wafer 1 and thus a process accident occurs. Only when all of the wafers 1 are accurately detected from the sensor 20 are transmitted to the control unit 30, and the control unit 30 having received the signal transmits a command to proceed with the next transfer operation.                     

상기 센서(20)에는 5V의 전원이 인가되도록 전원공급부와 연결되어 있다. 웨이퍼(1) 물림명령을 하는 경우에는 척가이드(10)의 스위치가 푸쉬(Push)되고, 이와 동시에 센서(20)에 5V의 전원이 인가되어 웨이퍼(1)가 정확하게 척가이드(10)의 홈(11)에 물려 있는지 여부를 감지하게 된다.The sensor 20 is connected to a power supply so that 5V power is applied. When the wafer 1 is engaged, the switch of the chuck guide 10 is pushed, and at the same time, 5 V power is applied to the sensor 20, so that the wafer 1 is correctly grooved in the chuck guide 10. It is detected whether or not it is bitten by (11).

이 경우 3개의 척가이드(10)중 어느 하나에라도 웨이퍼(1)가 정확하게 물리지 않았다는 신호를 센서(20)로부터 송신받게 되면 이송작업은 중단된다.In this case, when the sensor 20 receives a signal indicating that the wafer 1 is not correctly pinched in any one of the three chuck guides 10, the transfer operation is stopped.

본 실시예에서는 상기 척가이드 3개가 구비된 경우에 대해 기재하고 있지만, 본 발명은 상기 척가이드의 개수에 관계없이 다수개의 척가이드에 센서가 구비될 수 있다.
In the present embodiment, the case where the three chuck guides are provided, but the present invention may be provided with a sensor in a plurality of chuck guides irrespective of the number of the chuck guides.

이상에서 상세히 설명한 바와 같이 본 발명에 따른 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치에 의하면, 웨이퍼를 이송하기 위한 다수개의 척가이드 각각에 센서를 구비하고 상기 다수개의 척가이드에서 웨이퍼가 정확하게 물렸다는 신호를 센서로부터 수신받은 경우에 제어부에서 다음 이송작업을 진행하도록 명령을 송신함으로써, 웨이퍼 드롭(Drop) 및 파손(Broken)으로 인한 공정사고를 방지하고 생산성을 향상시킬 수 있는 효과가 있다.As described in detail above, according to the wafer transfer apparatus equipped with a wafer bleed detection function according to the present invention, a plurality of chuck guides for transferring wafers have a sensor and a signal indicating that the wafer is correctly snapped from the plurality of chuck guides. When the control unit receives a command from the sensor, the controller transmits a command to proceed to the next transfer operation, thereby preventing a process accident due to wafer drop and broken and improving productivity.

Claims (1)

반도체의 각종 공정챔버와 로드락 챔버간에 웨이퍼를 이송하는 이송아암과 웨이퍼 홀더에 구비되어 웨이퍼가 물린 상태로 이송될 수 있는 홈이 형성된 수개의 척가이드가 구비된 웨이퍼 이송장치에 있어서,Claims [1] A wafer transfer device comprising a transfer arm for transferring a wafer between various process chambers and a load lock chamber of a semiconductor, and a chuck guide having a groove formed in a wafer holder to transfer the wafer in a bite state. 상기 척가이드 각각에 구비된 센서;A sensor provided in each of the chuck guides; 상기 센서로부터 모든 척가이드 각각의 홈에 웨이퍼가 감지된 신호를 수신받은 경우 웨이퍼 이송을 수행하도록 명령을 송신하는 제어부;A control unit which transmits a command to perform wafer transfer when a wafer is detected in a groove of each chuck guide from the sensor; 를 포함하여 이루어진 것을 특징으로 하는 웨이퍼 물림감지기능이 구비된 웨이퍼 이송장치.Wafer transfer device equipped with a wafer bleed detection function, characterized in that consisting of.
KR1020040118213A 2004-12-31 2004-12-31 Transfer device having function detecting wafer KR20060078957A (en)

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