KR20040078349A - Device for mapping of semiconductor product device - Google Patents

Device for mapping of semiconductor product device Download PDF

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Publication number
KR20040078349A
KR20040078349A KR1020030013257A KR20030013257A KR20040078349A KR 20040078349 A KR20040078349 A KR 20040078349A KR 1020030013257 A KR1020030013257 A KR 1020030013257A KR 20030013257 A KR20030013257 A KR 20030013257A KR 20040078349 A KR20040078349 A KR 20040078349A
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KR
South Korea
Prior art keywords
wafer
load lock
lock chamber
cassette
door
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KR1020030013257A
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Korean (ko)
Inventor
송호기
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삼성전자주식회사
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Priority to KR1020030013257A priority Critical patent/KR20040078349A/en
Publication of KR20040078349A publication Critical patent/KR20040078349A/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

PURPOSE: A wafer mapping apparatus of semiconductor fabrication equipment is provided to detect a breaking state of a wafer by sensing an inserting state of the wafer to a diagonal direction of a slot of a cassette. CONSTITUTION: A cassette(102) is installed in an inside of a load lock chamber and includes a slot for receiving a plurality of wafers. A door(106) is installed at one side of the load lock chamber performing an opening operation and a shutting operation. A plurality of light emitting sensors(108,110) are installed at a left side and a right side of the inside of the load lock chamber. A plurality of light receiving sensors(112,114) are installed at a left side and a right side of the inside of the door.

Description

반도체 제조설비의 웨이퍼 맵핑장치{DEVICE FOR MAPPING OF SEMICONDUCTOR PRODUCT DEVICE}Wafer Mapping Apparatus for Semiconductor Manufacturing Equipment {DEVICE FOR MAPPING OF SEMICONDUCTOR PRODUCT DEVICE}

본 발명은 반도체 제조설비의 웨이퍼 맵핑장치에 관한 것으로, 특히 로드락쳄버 내에 구비된 카세트에 적재된 웨이퍼의 상태를 정확히 검출하는 웨이퍼 맵핑장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer mapping apparatus for semiconductor manufacturing equipment, and more particularly, to a wafer mapping apparatus for accurately detecting a state of a wafer loaded on a cassette provided in a load lock chamber.

일반적으로 반도체소자는 실리콘 웨이퍼 상에 제조공정을 반복적으로 진행하여 완성되며, 반도체 제조공정은 확산공정, 식각공정, 포토리소그래피공정 및 성막공정 등으로 나눌 수 있다.Generally, a semiconductor device is completed by repeatedly performing a manufacturing process on a silicon wafer, and the semiconductor manufacturing process may be divided into a diffusion process, an etching process, a photolithography process, and a film forming process.

이러한 공정을 처리하는 반도체 제조설비는 웨이퍼 맵핑장치를 구비하고 있다. 웨이퍼 맵핑장치는 로드락쳄버에 구비되어 있으며, 웨이퍼가 적재된 카세트가 스테이지에 장착되면 센서를 이용하여 카세트내의 어느 슬롯에 웨이퍼가 위치하고몇 장의 웨이퍼가 카세트 내에 적재되어 있는지를 감지하는 장치를 나타낸다.The semiconductor manufacturing equipment which processes such a process is equipped with the wafer mapping apparatus. The wafer mapping apparatus is provided in the load lock chamber, and when the cassette on which the wafer is loaded is mounted on the stage, the wafer mapping apparatus is used to detect which slot in the cassette is located and how many wafers are loaded in the cassette.

도 1은 종래의 웨이퍼 맵핑장치의 구성도이고,1 is a block diagram of a conventional wafer mapping apparatus,

도 2는 종래의 매핑센서가 설치된 로드락쳄버(10)의 절개사시도이다.2 is a cutaway perspective view of a load lock chamber 10 in which a conventional mapping sensor is installed.

로드락쳄버(10)와, 상기 로드락쳄버(10)의 내측에 설치되어 다수의 웨이퍼들을 수납하기 위한 슬롯(24)을 구비하는 카세트(14)와, 상기 카세트(14)를 장착하기 위한 스테이지(16)와, 상기 스테이지(16)를 수직으로 고정 지지하고 상,하 운동에 의해 상기 스테이지(16)를 상승 및 하강시키는 엘리베이터 구동부(12)와, 상기 로드락쳄버(10)의 일측에 장착되어 개,폐동작을 하는 도어(18)와, 상기 로드락쳄버(10)의 내측벽 중앙부분에 설치되어 빛을 조사하는 발광센서(20)와, 상기 도어(18)의 내측 중앙부분에 설치되어 빛을 수광하는 발광센서(22)로 구성되어 있다. 상기 스테이지(16)와 엘리베이터 구동부(12)는 엘리베이터를 구성하는 요소가 된다.A stage 14 for mounting the cassette 14, a cassette 14 having a load lock chamber 10, a slot 24 provided inside the load lock chamber 10 for accommodating a plurality of wafers; (16) and the elevator drive unit 12 for fixing and supporting the stage 16 vertically and raising and lowering the stage 16 by up and down movement, and on one side of the load lock chamber 10 A door 18 for opening and closing, a light emitting sensor 20 installed at a central portion of an inner wall of the load lock chamber 10, and a light sensor 20 for irradiating light and a central portion of the door 18. And a light emitting sensor 22 for receiving light. The stage 16 and the elevator drive unit 12 become elements of the elevator.

도 3a 및 도 3b는 종래의 매핑센서의 설치상태도이다.3A and 3B are installation state diagrams of a conventional mapping sensor.

발광센서(20)는 로드락쳄버(10)의 내측 중앙부분에 설치되어 웨이퍼의 수납여부를 센싱하기 위한 빛을 조사하고, 수광센서(22)는 도어(18)의 내측 중앙부분 설치되어 상기 발광센서(20)로부터 조사된 빛의 수광유무에 따라 웨이퍼의 수납여부를 센싱한다.The light emitting sensor 20 is installed at the inner center portion of the load lock chamber 10 to irradiate light for sensing whether the wafer is received, and the light receiving sensor 22 is installed at the inner center portion of the door 18 to emit light. The storage of the wafer is sensed according to whether light received from the sensor 20 is received.

도 4a는 카세트(14)에 다수의 웨이퍼들이 정상적으로 수납된 상태의 예시도이고,4A is an exemplary view of a state in which a plurality of wafers are normally stored in the cassette 14,

도 4b는 카세트(14)에 다수의 웨이퍼들 중에 하나의 웨이퍼가 비정상적으로수납된 상태의 예시도이다.4B is an illustration of a state in which one wafer among a plurality of wafers is abnormally stored in the cassette 14.

도어(18)가 열린 상태에서 20 내지 25장의 웨이퍼들을 카세트(14)의 각 슬롯(24)에 수납하고, 웨이퍼들이 수납된 카세트(14)를 스테이지(16)에 장착한다. 그런 후 도시하지 않은 콘트롤러는 도어(18)를 닫고 엘리베이터 구동부(12)를 동작시켜 카세트(14)의 최하위 슬롯이 발광센서(20) 및 수광센서(22)의 광축상에 위치되도록 하고, 로드락쳄버(10)의 내측을 진공상태로 유지한다. 그런 다음 콘트롤러에서는 엘리베이터 구동부(12)를 동작시켜 스테이지(16)에 장착된 카세트(14)를 한 슬롯씩 하측으로 이동시켜 발광센서(20)와 수광센서(22)를 통해 20 내지 25개의 웨이퍼 수납 상태를 인식한다.20 to 25 wafers are stored in each slot 24 of the cassette 14 with the door 18 open, and the cassette 14 containing the wafers is mounted on the stage 16. Then, the controller not shown closes the door 18 and operates the elevator driver 12 so that the lowermost slot of the cassette 14 is positioned on the optical axis of the light emitting sensor 20 and the light receiving sensor 22, and the load lock The inside of the chamber 10 is kept in a vacuum state. Then, the controller operates the elevator driver 12 to move the cassette 14 mounted on the stage 16 downward by one slot to accommodate 20 to 25 wafers through the light emitting sensor 20 and the light receiving sensor 22. Recognize the state.

이때 카세트(14)에 웨이퍼가 도 4a와 같이 정상적으로 수납된 경우에는 발광센서(20)로부터 조사된 빛이 웨이퍼에 의해 차단되어 수광센서(22)에 전달되지 않게 되어 수광센서가 동작하지 않으므로 콘트롤러는 20 내지 25개의 웨이퍼가 정상적으로 수납된 것으로 인식한다.In this case, when the wafer is normally stored in the cassette 14 as shown in FIG. 4A, light emitted from the light emitting sensor 20 is blocked by the wafer and is not transmitted to the light receiving sensor 22, so that the light receiving sensor does not operate. It is recognized that 20 to 25 wafers are normally stored.

그리고 카세트(14)에 웨이퍼가 도 4b와 같이 비정상적으로 수납된 경우에도 발광센서(20)가 중앙부에 하나만이 설치되어 있기 때문에 발광센서(20)로부터 조사된 빛이 웨이퍼에 의해 차단되어 수광센서(22)에 전달되지 않게 되어 수광센서(22)가 동작하지 않으므로 콘트롤러는 웨이퍼가 모두 정상적으로 수납된 것으로 인식한다.In addition, even when the wafer 14 is abnormally stored in the cassette 14 as shown in FIG. 4B, since only one light emitting sensor 20 is installed at the center, light emitted from the light emitting sensor 20 is blocked by the wafer, and thus the light receiving sensor ( Since the light receiving sensor 22 does not operate because it is not transmitted to the controller 22, the controller recognizes that all of the wafers are normally stored.

이러한 공정을 수행한 다음 카세트(14)의 각 슬롯(24)에 적재된 웨이퍼를 공정쳄버 내로 이송하여야 한다. 이러한 웨이퍼 이송은 주로 로봇암 등에 의해 자동으로 이루어지며, 웨이퍼 이송시에 카세트(14)에 웨이퍼가 도 4b와 같이 대각선 방향으로 놓여지거나 혹은 카세트의 각 슬롯에 2개의 웨이퍼가 놓여지면 웨이퍼의 손상이 발생한다.After this process, the wafer loaded in each slot 24 of the cassette 14 must be transferred into the process chamber. Such wafer transfer is mainly performed automatically by a robot arm or the like. If wafers are placed diagonally in the cassette 14 as shown in FIG. 4B or two wafers are placed in each slot of the cassette, wafer damage may occur. Occurs.

이렇게 되면 웨이퍼 브로큰이나 웨이퍼에 스크래치를 유발하여 웨이퍼 불량이 발생하는 문제가 있었다.In this case, there is a problem that wafer defects occur due to scratching of the wafer or the wafer.

따라서 본 발명의 목적은 웨이퍼 맵핑 시 웨이퍼가 카세트의 슬롯에 대각선 방향으로 놓여져 있는 상태를 검출하여 웨이퍼의 브로큰을 방지할 수 있는 반도체 제조설비의 웨이퍼 맵핑장치를 제공함에 있다.Accordingly, an object of the present invention is to provide a wafer mapping apparatus of a semiconductor manufacturing apparatus capable of preventing a wafer from being broken by detecting a state in which a wafer is placed diagonally in a slot of a cassette during wafer mapping.

도 1은 종래의 웨이퍼 맵핑장치의 구성도이고,1 is a block diagram of a conventional wafer mapping apparatus,

도 2는 종래의 매핑센서가 설치된 로드락쳄버(10)의 절개사시도2 is a cutaway perspective view of a load lock chamber 10 installed with a conventional mapping sensor

도 3a 및 도 3b는 종래의 매핑센서의 설치상태도3a and 3b is an installation state diagram of a conventional mapping sensor

도 4a는 카세트(14)에 다수의 웨이퍼들이 정상적으로 수납된 상태의 예시도4A is an exemplary view of a state in which a plurality of wafers are normally stored in the cassette 14.

도 4b는 카세트(14)에 다수의 웨이퍼들 중에 하나의 웨이퍼가 비정상적으로 수납된 상태의 예시도4B is an illustration of a state in which one wafer among a plurality of wafers is abnormally stored in the cassette 14.

도 5는 본 발명의 실시 예에 따른 매핑센서가 설치된 로드락쳄버(100)의 절개사시도5 is a cutaway perspective view of the load lock chamber 100 is installed mapping sensor according to an embodiment of the present invention

도 6a는 본 발명의 실시 예에 따른 로드락쳄버(100)의 내측에 설치된 발광센서의 위치상태도Figure 6a is a position state diagram of the light emitting sensor installed inside the load lock chamber 100 according to an embodiment of the present invention

도 6b는 본 발명의 실시 예에 따른 로드락쳄버(100)의 도어(106)에 설치된 수광센서의 위치 상태도Figure 6b is a state diagram of the position of the light receiving sensor installed in the door 106 of the load lock chamber 100 according to an embodiment of the present invention

도 7a는 카세트(102)에 다수의 웨이퍼들이 정상적으로 수납된 상태의 예시도7A is an exemplary view of a state in which a plurality of wafers are normally stored in the cassette 102.

도 7b는 카세트(102)에 다수의 웨이퍼들 중에 하나의 웨이퍼가 비정상적으로수납된 상태의 예시도7B is an illustration of a state in which one wafer among a plurality of wafers is abnormally stored in the cassette 102.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

100: 로드락쳄버 102: 카세트100: load lock chamber 102: cassette

104: 스테이지 106: 도어104: stage 106: door

108, 110: 제1 및 제2 발광센서 112, 114: 제1 및 제2 수광센서108, 110: first and second light emitting sensors 112, 114: first and second light receiving sensors

116: 슬롯116: slot

상기 목적을 달성하기 위한 본 발명의 로드락쳄버를 구비하는 반도체 제조설비에서 웨이퍼 맵핑장치는, 상기 로드락쳄버의 내측에 설치되어 다수의 웨이퍼들을 수납하기 위한 슬롯을 구비하는 카세트와, 상기 로드락쳄버의 일측면에 장착되어 개,폐동작을 하는 도어와, 상기 도어와 마주보는 로드락쳄버의 내측 중앙 좌, 우측부분에 각각 설치되어 빛을 각각 조사하는 복수의 발광센서와, 상기 도어의 내측 중앙 좌,우측부분에 설치되어 빛을 각각 수광하는 복수의 수광센서를 포함함을 특징으로 한다.In the semiconductor manufacturing equipment having a load lock chamber of the present invention for achieving the above object, a wafer mapping apparatus is provided inside the load lock chamber, the cassette having a slot for storing a plurality of wafers, and the load lock A door mounted on one side of the chamber to open and close the door, a plurality of light emitting sensors respectively installed at the inner center left and right sides of the load lock chamber facing the door to irradiate light, and the inside of the door It is characterized in that it comprises a plurality of light receiving sensors which are installed at the left and right parts of the center, respectively.

상기 복수의 발광센서와 수광센서는 각각 2개로 구성함을 특징으로 한다.The plurality of light-emitting sensors and light-receiving sensors are characterized in that each consists of two.

이하 본 발명에 따른 바람직한 실시 예를 첨부한 도면을 참조하여 상세히 설명한다. 그리고 본 발명을 설명함에 있어서, 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

본 발명에 따른 웨이퍼 맵핑장치의 구성도는 도 1과 동일한 구성을 갖으며, 제1 및 제2 발광센서(108, 11)와 제1 및 제2 수광센서(112, 114)의 위치만이 다르게 구성되어 있다.The configuration of the wafer mapping apparatus according to the present invention has the same configuration as that of FIG. 1, and only the positions of the first and second light emitting sensors 108 and 11 and the first and second light receiving sensors 112 and 114 are different. Consists of.

도 5는 본 발명의 실시 예에 따른 매핑센서가 설치된 로드락쳄버(100)의 절개사시도이다.5 is a cutaway perspective view of the load lock chamber 100 is installed in accordance with an embodiment of the present invention.

로드락쳄버(100)와, 상기 로드락쳄버(100)의 내측에 설치되어 다수의 웨이퍼들을 수납하기 위한 슬롯(116)을 구비하는 카세트(102)와, 상기 카세트(102)를 장착하기 위한 스테이지(104)와, 상기 로드락쳄버(100)의 일측에 장착되어 상, 하방향으로 개,폐 동작하는 도어(106)와, 상기 로드락쳄버(100)의 내측 중앙 좌, 우측부분에 각각 설치되어 빛을 각각 조사하는 제1 및 제2 발광센서(108, 110)와, 상기 도어(18)의 내측 중앙 좌,우측부분에 설치되어 빛을 각각 수광하는 제1 및 제2 수광센서(112, 114)로 구성되어 있다.A stage 102 for mounting the cassette 102, a cassette 102 having a load lock chamber 100, a slot 116 provided inside the load lock chamber 100 for accommodating a plurality of wafers; (104), the door 106 is mounted on one side of the load lock chamber 100, the door 106 to open and close in the up and down directions, and installed in the inner center left and right portions of the load lock chamber 100, respectively First and second light emitting sensors 108 and 110 to irradiate light, respectively, and first and second light receiving sensors 112 to be installed at left and right portions of the inner center of the door 18 to receive light, respectively. 114).

도 6a는 본 발명의 실시 예에 따른 로드락쳄버(100)의 내측에 설치된 발광센서의 위치상태도이고,Figure 6a is a position state diagram of the light emitting sensor installed inside the load lock chamber 100 according to an embodiment of the present invention,

도 6b는 본 발명의 실시 예에 따른 로드락쳄버(100)의 도어(106)에 설치된 수광센서의 위치 상태도이다.6B is a positional view of a light receiving sensor installed in the door 106 of the load lock chamber 100 according to the embodiment of the present invention.

제1 및 제2 발광센서(108, 110)는 로드락쳄버(10)의 내부벽 중앙 좌,우 부분에 설치되어 웨이퍼의 수납여부를 센싱하기 위한 빛을 각각 조사하고, 제1 및 제2 수광센서(112, 114)는 도어(106)의 내부 중앙 좌, 우측 부분 설치되어 상기 제1 및 제2 발광센서(108, 110)로부터 각각 조사된 빛의 수광유무에 따라 웨이퍼의 수납여부를 센싱한다.The first and second light emitting sensors 108 and 110 are installed at the left and right centers of the inner wall of the load lock chamber 10 to irradiate light for sensing whether the wafer is stored, and the first and second light receiving sensors respectively. 112 and 114 are installed at the inner center left and right portions of the door 106 to sense whether the wafer is accommodated according to whether light received from the first and second light emitting sensors 108 and 110 is received.

도 7a는 카세트(102)에 다수의 웨이퍼들이 정상적으로 수납된 상태의 예시도이고,7A is an exemplary view of a state in which a plurality of wafers are normally stored in the cassette 102,

도 7b는 카세트(102)에 다수의 웨이퍼들 중에 하나의 웨이퍼가 비정상적으로 수납된 상태의 예시도이다.7B is an exemplary view of a state in which one wafer among a plurality of wafers is abnormally stored in the cassette 102.

상술한 도 5 내지 도 7a 및 도 7b를 참조하여 본 발명의 바람직한 실시 예의 동작을 상세히 설명한다.5 to 7a and 7b described above will be described in detail the operation of the preferred embodiment of the present invention.

도어(106)가 열린 상태에서 20 내지 25장의 웨이퍼들을 카세트(102)의 각 슬롯(116)에 수납하고, 웨이퍼들이 수납된 카세트(102)를 스테이지(104)에 장착한다. 그런 후 도시하지 않은 콘트롤러는 도어(106)를 닫고 엘리베이터를 동작시켜 카세트(102)의 최하위 슬롯이 제1 및 제2 발광센서(108, 110) 및 제1 및 제2 수광센서(112, 114)의 광축상에 위치되도록 하고, 로드락쳄버(100)의 내부공간을 진공상태로 유지한다. 그런 다음 콘트롤러에서는 엘리베이터를 동작시켜 스테이지(104)에 장착된 카세트(102)를 한 슬롯씩 하측으로 이동시켜 제1 및 제2 발광센서(108, 110)와 제1 및 제2 수광센서(112, 114)를 통해 20 내지 25개의 웨이퍼 수납 상태를 인식한다. 이때 카세트(102)에 웨이퍼가 도 7a와 같이 정상적으로 수납된 경우에는 제1 및 제2 발광센서(108, 110)로부터 조사된 빛이 웨이퍼에 의해 차단되어 제1 및 제2 수광센서(112, 114)에 전달되지 않게 되어 콘트롤러는 20 내지 25개의 웨이퍼가 정상적으로 수납된 것으로 인식한다.20 to 25 wafers are stored in each slot 116 of the cassette 102 with the door 106 open, and the cassette 102 containing the wafers is mounted on the stage 104. Then, the controller (not shown) closes the door 106 and operates the elevator so that the lowermost slots of the cassette 102 have the first and second light emitting sensors 108 and 110 and the first and second light receiving sensors 112 and 114. It is positioned on the optical axis of the load lock chamber 100 to maintain the internal space of the vacuum state. Then, the controller operates the elevator to move the cassette 102 mounted on the stage 104 downward by one slot, so that the first and second light emitting sensors 108 and 110 and the first and second light receiving sensors 112, 114 to 20 to 25 wafer storage states are recognized. In this case, when the wafer is normally accommodated in the cassette 102 as shown in FIG. 7A, light emitted from the first and second light emitting sensors 108 and 110 is blocked by the wafer so that the first and second light receiving sensors 112 and 114 are blocked. ), The controller recognizes that 20 to 25 wafers are normally stored.

그러나 카세트(102)에 웨이퍼가 도 7b와 같이 비정상적으로 수납된 경우에는 제1 발광센서(108)로부터 조사된 빛이 제1 수광센서(108)로 전달되어 제1 수광센서(112)가 동작하고, 제2 발광센서(110)로부터 조사된 빛이 웨이퍼에 의해 차단되어 제2 수광센서(114)로 전달되지 않으므로 콘트롤러는 웨이퍼가 잘못 수납된 것으로 인식한다. 이때 콘트롤러는 경보를 발생하여 에러가 발생하였음을 작업자에게 통보하고 도시하지 않은 핸들러에서 그 슬롯에 수납되어 있는 웨이퍼를 가져가지 못하도록 공정진행 동작을 중지시킨다.However, when the wafer is abnormally stored in the cassette 102 as shown in FIG. 7B, light emitted from the first light emitting sensor 108 is transmitted to the first light receiving sensor 108 to operate the first light receiving sensor 112. Since the light emitted from the second light emitting sensor 110 is blocked by the wafer and is not transmitted to the second light receiving sensor 114, the controller recognizes that the wafer is stored incorrectly. At this time, the controller generates an alarm to notify the operator that an error has occurred and stops the process operation so that a handler not shown can not take the wafer stored in the slot.

상술한 바와 같이 본 발명은 반도체 제조용 설비에서 웨이퍼 맵핑하는 경우 카세트의 슬롯에 웨이퍼가 대각선 방향으로 수납되는 상태를 인식하여 핸들러에 의해 웨이퍼를 이송할 시 웨이퍼의 브로큰을 방지할 수 있는 이점이 있다.As described above, the present invention has an advantage of preventing the wafer from being broken when the wafer is transferred by the handler by recognizing a state in which the wafer is accommodated diagonally in the slot of the cassette when the wafer is mapped in the semiconductor manufacturing facility.

Claims (2)

로드락쳄버를 구비하는 반도체 제조설비에서 웨이퍼 맵핑장치에 있어서,A wafer mapping apparatus in a semiconductor manufacturing facility having a load lock chamber, 상기 로드락쳄버의 내측에 설치되어 다수의 웨이퍼들을 수납하기 위한 슬롯을 구비하는 카세트와,A cassette provided inside the load lock chamber and having a slot for accommodating a plurality of wafers; 상기 로드락쳄버의 일측면에 장착되어 개,폐동작을 하는 도어와,A door mounted to one side of the load lock chamber to open and close the door; 상기 도어와 마주보는 로드락쳄버의 내측 중앙 좌, 우측부분에 각각 설치되어 빛을 각각 조사하는 복수의 발광센서와,A plurality of light emitting sensors respectively installed at the inner center left and right portions of the load lock chamber facing the door to irradiate light; 상기 도어의 내측 중앙 좌,우측부분에 설치되어 빛을 각각 수광하는 복수의 수광센서를 포함함을 특징으로 하는 반도체 제조설비의 웨이퍼 맵핑장치.Wafer mapping device of the semiconductor manufacturing equipment, characterized in that it comprises a plurality of light receiving sensors which are installed at the inner left, right of the inner side of the door to receive light respectively. 제1항에 있어서,The method of claim 1, 상기 복수의 발광센서와 수광센서는 각각 2개로 구성함을 특징으로 하는 반도체 제조설비의 웨이퍼 맵핑장치.And a plurality of light emitting sensors and light receiving sensors, respectively.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108630561A (en) * 2017-03-15 2018-10-09 北京北方华创微电子装备有限公司 The detection device and detection method of substrate surface, pass sheet chamber room

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108630561A (en) * 2017-03-15 2018-10-09 北京北方华创微电子装备有限公司 The detection device and detection method of substrate surface, pass sheet chamber room

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