KR20060072936A - A icchip sticking process for plastic card - Google Patents

A icchip sticking process for plastic card Download PDF

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Publication number
KR20060072936A
KR20060072936A KR1020040111730A KR20040111730A KR20060072936A KR 20060072936 A KR20060072936 A KR 20060072936A KR 1020040111730 A KR1020040111730 A KR 1020040111730A KR 20040111730 A KR20040111730 A KR 20040111730A KR 20060072936 A KR20060072936 A KR 20060072936A
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South Korea
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elastic body
integrated circuit
circuit chip
metal terminals
terminals
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KR1020040111730A
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Korean (ko)
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KR100699069B1 (en
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강성일
이재희
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주식회사 제이디씨텍
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

본 발명은 플라스틱카드의 집적회로칩 부착방법 및 플라스틱카드에 관한 것으로서, 더욱 상세하게는 양측 안테나코일에 고정된 금속단자가 탄성체에 지지된 상태에서 집적회로칩의 양측 접점단자에 탄력적으로 접촉되어 별도의 납땜 작업을 하지 않더라도 접점의 단락을 효과적으로 방지할 수 있도록 한 발명에 관한 것이다.The present invention relates to a method for attaching an integrated circuit chip and a plastic card of a plastic card, and more particularly, a metal terminal fixed to both antenna coils is elastically contacted with both contact terminals of an integrated circuit chip in a state in which it is supported by an elastic body. The present invention relates to an invention capable of effectively preventing a short circuit of a contact even without soldering.

전술한 본 발명은, 코어시트(10)의 일측에 탄성체(23)를 삽입할 수 있는 2개의 구멍(21)을 뚫는 단계; 코어시트(10)의 표면에 안테나코일(24)이 둘레를 따라서 감겨지도록 하고, 안테나코일(24)의 양단에 탄력성 있는 금속단자(22)들을 각각 고정한 후 금속단자(22)를 접착제(22a)로 고정하여 양측 금속단자(22)들이 구멍(21)들의 상부에 각각 위치되도록 하는 단계; 상기 코어시트(10)에 뚫려진 구멍(21)에 탄성체(23)를 삽입하여 구멍(21)들을 통해 돌출되는 탄성체(23)의 상부면이 양측 금속단자(22)의 하부면들을 각각 탄력적으로 지지하도록 하는 단계; 상기 코어시트(10)의 상부에는 상부 인쇄지(11)와 상부 코팅지(12)를 적층하고, 코어시트(10)의 하부에는 하부 인쇄지(13)와 하부 코팅지(14)를 적층하는 단계; 적층된 카드원단을 프레스의 정반에 올려놓고, 약 150℃∼200℃의 온도로 가열 및 가압하여 금속단자(22)와 탄성체(23)가 눌려지면서 고정되도록 하여 열 접착하는 단계; 밀링머신에 장치된 커터로 양측 금속단자(22)의 주위를 커팅하여 집적회로칩(30)이 수납될 수 있는 가이드홈(20)을 1차가공하는 단계; 정밀한 밀링커터로 가이드홈 (20) 주위를 2차 커팅하여 금속단자(22)가 손상되지 않도록하면서 노출되도록 하여 눌려져 있던 양측 금속단자(22)와 압축되었던 탄성체(23)가 탄성 복원되면서 가이드홈(20)의 양측에서 탄력적으로 돌출되도록 하는 단계; 집적회로칩(30)의 하부 둘레에 열가소성 접착제(30a)를 부착한 후 집적회로칩(30)을 가이드홈(20) 내부에 삽입한 후 120∼150℃의 열을 가하면서 가압하여 열 접착시켜 집적회로칩(30)의 하부 양측 접점단자(31)들이 양측 금속단자(22)를 압박하여 탄성체(23)로 지지되는 금속단자(22)들이 탄력적으로 접점단자(31)에 밀착되도록 하는 단계로 이루어진 것을 특징으로 하는 플라스틱카드의 집적회칩 부착방법에 의하여 달성될 수 있는 것이다.The present invention described above, drilling two holes 21 into which the elastic body 23 can be inserted into one side of the core sheet 10; The antenna coil 24 is wound around the core sheet 10 along the circumference, and the elastic metal terminals 22 are fixed to both ends of the antenna coil 24, and then the metal terminals 22 are attached to the adhesive 22a. Fixing both sides so that both metal terminals 22 are positioned on the upper portions of the holes 21; The upper surface of the elastic body 23 protruding through the holes 21 by inserting the elastic body 23 into the hole 21 drilled in the core sheet 10 is to elastically lower the lower surfaces of both metal terminals 22, respectively. Supporting; Stacking an upper printing paper (11) and an upper coating paper (12) on an upper portion of the core sheet (10), and laminating a lower printing paper (13) and a lower coating paper (14) on a lower portion of the core sheet (10); Placing the stacked card fabrics on the surface of the press, and heating and pressing them to a temperature of about 150 ° C. to 200 ° C. so that the metal terminals 22 and the elastic body 23 are pressed and fixed to be thermally bonded; Cutting the circumferences of the metal terminals 22 on both sides with a cutter installed in the milling machine to primaryly process the guide groove 20 in which the integrated circuit chip 30 can be accommodated; Secondary cutting around the guide groove 20 with a precision milling cutter to expose the metal terminal 22 without damaging the metal terminal 22 and the compressed elastic body 23 that were pressed to restore the guide groove ( Elastically projecting on both sides of 20); After the thermoplastic adhesive 30a is attached to the lower circumference of the integrated circuit chip 30, the integrated circuit chip 30 is inserted into the guide groove 20 and pressurized while applying heat at 120 to 150 ° C. to heat-bond it. The lower both side contact terminals 31 of the integrated circuit chip 30 press the both metal terminals 22 so that the metal terminals 22 supported by the elastic body 23 are elastically in close contact with the contact terminals 31. It can be achieved by the integrated circuit chip attach method of the plastic card, characterized in that made.

Description

플라스틱카드의 집적회로칩 부착방법 및 플라스틱카드{a ICchip sticking process for plastic card} IC card sticking process for plastic card             

도 1은 본 발명에 의한 플라스틱카드를 예시한 사시도,1 is a perspective view illustrating a plastic card according to the present invention;

도 2는 본 발명에 의한 플라스틱카드를 예시한 분해사시도,Figure 2 is an exploded perspective view illustrating a plastic card according to the present invention,

도 3은 본 발명에 의한 플라스틱카드를 예시한 분해단면도,3 is an exploded cross-sectional view illustrating a plastic card according to the present invention;

도 4a∼ 도 4i는 본 발명에 의한 집적회로칩이 플라스틱카드에 부착되는 과정을 순차적으로 나타낸 단면도,4A to 4I are cross-sectional views sequentially illustrating a process of attaching an integrated circuit chip to a plastic card according to the present invention;

도 5는 본 발명에 의한 플라스틱카드의 일부를 확대한 사시도.Figure 5 is an enlarged perspective view of a part of the plastic card according to the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 플라스틱카드 10 : 코어시트1: plastic card 10: core sheet

11 : 상부 인쇄지 12 : 상부 코팅지11 top printing paper 12 top coating paper

13 : 하부 인쇄지 14 : 하부 코팅지13: lower printing paper 14: lower coating paper

20 : 가이드홈 21 : 구멍20: guide groove 21: hole

22 : 금속단자22: metal terminal

22a, 30a : 접착제22a, 30a: adhesive

23 : 탄성체23: elastic body

24 : 안테나코일24: antenna coil

30 : 집적회로 칩30: integrated circuit chip

31 : 접점단자31: Contact terminal

본 발명은 플라스틱카드의 집적회로칩 부착방법 및 플라스틱카드에 관한 것으로서, 더욱 상세하게는 양측 안테나코일에 고정된 금속단자가 탄성체에 지지된 상태에서 집적회로칩의 양측 접점단자에 탄력적으로 접촉되어 별도의 납땜 작업을 하지 않더라도 접점의 단락을 효과적으로 방지할 수 있도록 한 발명에 관한 것이다.The present invention relates to a method for attaching an integrated circuit chip and a plastic card of a plastic card, and more particularly, a metal terminal fixed to both antenna coils is elastically contacted with both contact terminals of an integrated circuit chip in a state in which it is supported by an elastic body. The present invention relates to an invention capable of effectively preventing a short circuit of a contact even without soldering.

일반적으로 플라스틱 카드는 신용카드(credit card), 현금카드(cash card), 교통카드와 같이 현금을 대신하여 사용할 수 있을 뿐 아니라 대용량의 정보를 수록할 수 있는 집적회로 칩들이 내장된 카드는 병원의 진료카드, 각종 멤버쉽카드 등으로 활용되는 것으로서 현대에는 다양한 용도의 플라스틱 카드들이 널리 사용된다.In general, plastic cards can be used in place of cash, such as credit cards, cash cards, and transportation cards. Cards with integrated circuit chips that store large amounts of information can be used in hospitals. As a medical card and various membership cards, plastic cards of various purposes are widely used in modern times.

이중에서도 직접회로칩이 안테나코일과 접점으로 연결되어 리더기와 접촉식 및 비접촉식으로 접촉되면서 전자유도 작용에 의한 전원구동 방식에 의하여 데이터 가 읽혀지는 콤비형 카드(combi card)가 제안된 바 있고, 이러한 콤비 카드들은 카드의 표면에 가이드홈(hall)을 가공한 후 집적회로칩의 접점단자들을 안테나코일의 양측에 납땜하여 접점들을 연결하면서 집적회로칩을 가이드홈의 내부에 부착하여 고정시킬 수 있도록 되어 있다.Among them, a combi card has been proposed in which the integrated circuit chip is connected to the antenna coil by contact with the reader and in contact and non-contact with the reader, and the data is read by the power driving method by the electromagnetic induction action. Combi cards can be fixed by attaching the integrated circuit chip inside the guide groove while connecting the contacts by soldering the contact terminals of the integrated circuit chip to both sides of the antenna coil after processing the guide groove (hole) on the surface of the card have.

그러나, 전술한 바와 같이 작은 가이드홈의 내부에 집적회로칩을 부착하면서 양측 접점단자들을 납땜하는 작업이 매우 까다로울 뿐 아니라 상당한 시간이 소요되는 등의 폐단이 발생되었다.However, as described above, the operation of soldering both contact terminals while attaching the integrated circuit chip inside the small guide groove is not only very difficult, but also takes a considerable time.

또한, 납땜 작업에는 상당한 유해가스가 발생되어 작업자의 건강을 나쁘게 하였을 뿐 아니라 별도의 환기장치를 설치해야 하는 등의 문제점이 있었으며 특히, 카드를 폐기할 때도 납(pb) 성분에 의하여 법정폐기물로 분류되어 처리되어야하므로 별도의 폐기물 처리비용이 추가되는 등의 폐단이 있었다.In addition, significant harmful gases were generated during soldering, which not only deteriorated the worker's health, but also required to install a separate ventilator. Especially, when disposing of the card, the waste was classified as legal waste by pb. There was a discontinuity such as additional waste disposal cost added because it had to be treated.

본 발명은 상기와 같은 문제점을 해결하기 위하여 창안한 것으로서, 그 목적은 양측 안테나코일에 고정된 금속단자가 탄성체에 지지된 상태에서 집적회로칩의 양측 접점단자에 탄력적으로 접촉되어 별도의 납땜 작업을 수행하지 않더라도 접점의 단락을 효과적으로 방지할 수 있는 플라스틱카드의 집적회칩의 부착방법 및 플라스틱카드를 제공함에 있는 것이다.The present invention has been made to solve the above problems, the object of which is to contact the contact terminals on both sides of the integrated circuit chip in the state that the metal terminals fixed to both antenna coils are supported by the elastic body to perform a separate soldering operation The present invention provides a method of attaching an integrated circuit chip of a plastic card and a plastic card which can effectively prevent a short circuit of a contact even if not performed.

상기한 목적을 달성하기 위한 본 발명의 특징은, 코어시트(10)의 일측에 탄성체(23)를 삽입할 수 있는 2개의 구멍(21)을 뚫는 단계; 코어시트(10)의 표면에 안테나코일(24)이 둘레를 따라서 감겨지도록 하고, 안테나코일(24)의 양단에 탄력성 있는 금속단자(22)들을 각각 고정한 후 금속단자(22)를 접착제(22a)로 고정하여 양측 금속단자(22)들이 구멍(21)들의 상부에 각각 위치되도록 하는 단계; 상기 코어시트(10)에 뚫려진 구멍(21)에 탄성체(23)를 삽입하여 구멍(21)들을 통해 돌출되는 탄성체(23)의 상부면이 양측 금속단자(22)의 하부면들을 각각 탄력적으로 지지하도록 하는 단계; 상기 코어시트(10)의 상부에는 상부 인쇄지(11)와 상부 코팅지(12)를 적층하고, 코어시트(10)의 하부에는 하부 인쇄지(13)와 하부 코팅지(14)를 적층하는 단계; 적층된 카드원단을 프레스의 정반에 올려놓고, 약 150℃∼200℃의 온도로 가열 및 가압하여 금속단자(22)와 탄성체(23)가 눌려지면서 고정되도록 하여 열 접착하는 단계; 밀링머신에 장치된 커터로 양측 금속단자(22)의 주위를 커팅하여 집적회로칩(30)이 수납될 수 있는 가이드홈(20)을 1차가공하는 단계; 정밀한 밀링커터로 가이드홈(20) 주위를 2차 커팅하여 금속단자(22)가 손상되지 않도록하면서 노출되도록 하여 눌려져 있던 양측 금속단자(22)와 압축되었던 탄성체(23)가 탄성 복원되면서 가이드홈(20)의 양측에서 탄력적으로 돌출되도록 하는 단계; 집적회로칩(30)의 하부 둘레에 열가소성 접착제(30a)를 부착한 후 집적회로칩(30)을 가이드홈(20) 내부에 삽입한 후 120∼150℃의 열을 가하면서 가압하여 열 접착시켜 집적회로칩(30)의 하부 양측 접점단자(31)들이 양측 금속단자(22)를 압박하여 탄성체(23)로 지지되는 금속단자(22)들이 탄력적으로 접점단자(31)에 밀착되도록 하는 단계로 이루어진 것을 특징으로 하는 플라스틱카드의 집적회칩 부착방법에 의하여 달성될 수 있는 것이다.
Features of the present invention for achieving the above object, the step of drilling two holes 21 into which the elastic body 23 can be inserted into one side of the core sheet 10; The antenna coil 24 is wound around the core sheet 10 along the circumference, and the elastic metal terminals 22 are fixed to both ends of the antenna coil 24, and then the metal terminals 22 are attached to the adhesive 22a. Fixing both sides so that both metal terminals 22 are positioned on the upper portions of the holes 21; The upper surface of the elastic body 23 protruding through the holes 21 by inserting the elastic body 23 into the hole 21 drilled in the core sheet 10 is to elastically lower the lower surfaces of both metal terminals 22, respectively. Supporting; Stacking an upper printing paper (11) and an upper coating paper (12) on an upper portion of the core sheet (10), and laminating a lower printing paper (13) and a lower coating paper (14) on a lower portion of the core sheet (10); Placing the stacked card fabrics on the surface of the press, and heating and pressing them to a temperature of about 150 ° C. to 200 ° C. so that the metal terminals 22 and the elastic body 23 are pressed and fixed to be thermally bonded; Cutting the circumferences of the metal terminals 22 on both sides with a cutter installed in the milling machine to primaryly process the guide groove 20 in which the integrated circuit chip 30 can be accommodated; Secondary cutting around the guide groove 20 with a precision milling cutter to expose the metal terminal 22 so as not to damage the metal terminal 22 and the compressed elastic body 23 was pressed to restore the guide groove ( Elastically projecting on both sides of 20); After the thermoplastic adhesive 30a is attached to the lower circumference of the integrated circuit chip 30, the integrated circuit chip 30 is inserted into the guide groove 20 and pressurized while applying heat at 120 to 150 ° C. to heat-bond it. The lower both side contact terminals 31 of the integrated circuit chip 30 press the both metal terminals 22 so that the metal terminals 22 supported by the elastic body 23 are elastically in close contact with the contact terminals 31. It can be achieved by the integrated circuit chip attach method of the plastic card, characterized in that made.

이하, 상기한 목적을 달성하기 위한 바람직한 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings a preferred embodiment for achieving the above object is as follows.

도 4a에서 도시한 바와 같이, PVC로 이루어진 코어시트(10)의 일측을 원통형의 칼금형으로 펀칭하여 2개의 구멍을 천공하였다. 상기 구멍(21)들에는 후술되는 고무재질의 탄성체(23)가 삽입된다.As shown in Figure 4a, one side of the core sheet 10 made of PVC was punched in a cylindrical knife mold to drill two holes. The holes 21 are inserted with an elastic body 23 of rubber material to be described later.

이어서, 도 4b에서 도시한 바와 같이 코어시트(10)의 표면에 안테나코일(24)이 둘레를 따라서 감겨지도록 하고, 안테나코일(24)의 양단에 탄력성 있는 금속단자(22)들을 와이어 본딩하여 각각 고정시킨 후 금속단자(22)를 코어시트(10)의 표면에 접착제(22a)로 고정하여 양측 금속단자(22)들이 구멍(21)들의 상부에 각각 위치되도록 하였다.Subsequently, as shown in FIG. 4B, the antenna coil 24 is wound around the core sheet 10 along the circumference, and wire-bonding elastic metal terminals 22 are formed at both ends of the antenna coil 24. After fixing, the metal terminals 22 were fixed to the surface of the core sheet 10 with an adhesive 22a so that both metal terminals 22 were positioned on the upper portions of the holes 21.

상기 금속단자(22)는 연속 절곡되어 코어시트(10)에 접착면을 제외한 선단부는 상당한 탄성력을 갖도록 되어 있다. 상기 금속단자(22)의 선단부는 구멍(21)들의 상부에서 약 0.15mm의 간격을 이격하여 들려진 상태로 설치되어 있다.The metal terminal 22 is continuously bent so that the tip portion excluding the adhesive surface of the core sheet 10 has a considerable elastic force. The tip end of the metal terminal 22 is installed in a state of being lifted at a distance of about 0.15 mm from the upper portion of the holes 21.

이어서, 도 4c에서 도시한 바와 같이, 상기 코어시트(10)에 뚫려진 구멍(21)에 고무재질의 탄성체(23)를 삽입하여 구멍(21)들을 통해 약 0.15mm 돌출되도록 하였다.Subsequently, as shown in FIG. 4C, an elastic body 23 made of rubber material is inserted into the hole 21 drilled into the core sheet 10 to protrude about 0.15 mm through the holes 21.

따라서, 구멍(21)에서 돌출된 탄성체(23)의 상부면은 양측 금속단자(22)의 하부면들을 각각 탄력적으로 지지할 수 있도록 되어 있다.Therefore, the upper surface of the elastic body 23 protruding from the hole 21 is able to elastically support the lower surfaces of both metal terminals 22, respectively.

이어서, 도 4d에서 도시한 바와 같이 상기 코어시트(10)의 상부면에 상부 인쇄지(11)와 상부 코팅지(12)를 차례로 적층하고, 코어시트(10)의 하부에는 하부 인쇄지(13)와 하부 코팅지(14)를 차례로 적층하였다.Subsequently, as shown in FIG. 4D, the upper printing paper 11 and the upper coating paper 12 are sequentially stacked on the upper surface of the core sheet 10, and the lower printing paper 13 is disposed below the core sheet 10. And the lower coated paper 14 were stacked in this order.

이어서, 도 4e에서 도시한 바와 같이 적층된 카드원단을 프레스의 정반에 올려놓고, 약 150℃∼200℃의 온도로 가열 및 가압하였더니 금속단자(22)와 함께 탄성체(23)가 눌려지면서 압축되어 견고하게 열 접착되었다.Subsequently, as shown in FIG. 4E, the stacked card fabrics were placed on the surface of the press, and heated and pressed at a temperature of about 150 ° C. to 200 ° C. to compress the elastic body 23 together with the metal terminals 22. And firmly heat bonded.

이어서, 도 4f에서 도시한 바와 같이 밀링머신에 장치된 커터로 양측 금속단자(22)의 주위를 커팅하여 집적회로칩(30)이 수납될 수 있는 가이드홈(20)을 1차로 가공하였다.Subsequently, as shown in FIG. 4F, the guide groove 20 in which the integrated circuit chip 30 can be accommodated was primarily processed by cutting around the metal terminals 22 on both sides with a cutter installed in the milling machine.

이어서, 도 4g에서 도시한 바와 같이 엔드밀과 같은 정밀한 밀링커터로 가이드홈(20) 주위 즉, 금속단자(22)들의 상부를 2차로 정밀 커팅하여 금속단자(22)가 손상되지 않도록 하면서 노출되도록 하였더니, 눌려져 있던 양측 금속단자(22)와 압축되었던 탄성체(23)가 탄력적으로 복원되면서 가이드홈(20)의 양측에서 금속단자(22)들이 각각 탄력적으로 돌출되었다.Subsequently, as illustrated in FIG. 4G, the precision milling cutter such as the end mill is precisely cut around the guide groove 20, that is, the upper part of the metal terminals 22, so that the metal terminals 22 are exposed while being not damaged. In addition, as the pressed both metal terminals 22 and the compressed elastic body 23 are elastically restored, the metal terminals 22 are elastically protruded from both sides of the guide groove 20, respectively.

이어서, 도 4h에서 도시한 바와 같이, 집적회로칩(30)의 하부 둘레에 핫 멜트(hat melt)와 같은 열가소성 접착제(30a)를 부착하고, 집적회로칩(30)을 가이드홈(20) 내부에 삽입한 후 120∼150℃의 열을 가하면서 가압하여 열 접착시켰더니, 도 4i에서 도시한 바와 같이 집적회로칩(30)이 가이드홈(20)의 내부에 견고하게 고정되면서 집적회로칩(30)의 하부 양측 접점단자(31)들이 양측 금속단자(22)를 압박하여 탄성체(23)로 지지되는 금속단자(22)들이 탄력적으로 접점단자(31)에 밀착되 었다.Subsequently, as shown in FIG. 4H, a thermoplastic adhesive 30a such as a hot melt is attached to the lower circumference of the integrated circuit chip 30, and the integrated circuit chip 30 is inserted into the guide groove 20. After inserting it into the substrate and applying heat at 120 to 150 ° C. to pressurize and heat bond, the integrated circuit chip 30 is firmly fixed to the inside of the guide groove 20, as shown in FIG. 4I. The lower both sides of the contact terminals 31 press the two metal terminals 22 and the metal terminals 22 supported by the elastic body 23 are elastically in close contact with the contact terminals 31.

따라서, 압축된 탄성체(23)의 탄발력에 의하여 금속단자(22)가 집적회로칩(30)의 접점단자(31)들에 탄력적으로 밀착되는 것이므로 별도의 납땜 작업을 하지 않더라도 접점들이 단락되지 않고 정확하게 전원이 연결되는 등의 이점이 있는 것이다.Therefore, since the metal terminal 22 is elastically in close contact with the contact terminals 31 of the integrated circuit chip 30 by the elastic force of the compressed elastic body 23, the contacts are not short-circuited even without a separate soldering operation. There is an advantage of being connected to a power source correctly.

전술한 부착과정에 의하여 집적회로칩이 고정된 본 발명의 플라스틱카드(1)는 플라스틱카드(1)의 일측에 가공된 가이드홈(20)의 양측에 뚫려진 구멍(21)들에는 탄성체(23)가 삽입되고, 탄성체(23)의 양측에는 안테나코일(24)의 양측과 각각 연결된 접점단자(31)가 고정되어 접점단자(31)의 하부가 탄성체(23)에 의하여 탄력 지지되며, 가이드홈(20) 내부에는 집적회로칩(30)이 접착제(30a)에 의하여 열 접착되어 고정되고, 압축된 탄성체(23)에 의하여 탄력 지지되는 금속단자(22)들이 집적회로칩(30)의 하부 양측 접점단자(31)들에 탄력적으로 밀착되어 접점이 단락되지 않도록 구성되어 있다.The plastic card 1 of the present invention, in which the integrated circuit chip is fixed by the above-described attaching process, has an elastic body 23 in the holes 21 formed in both sides of the guide groove 20 processed on one side of the plastic card 1. ) Is inserted, and contact terminals 31 respectively connected to both sides of the antenna coil 24 are fixed to both sides of the elastic body 23 so that the lower part of the contact terminal 31 is elastically supported by the elastic body 23 and guide grooves. Inside the 20, the integrated circuit chip 30 is thermally bonded and fixed by the adhesive 30a, and the metal terminals 22 elastically supported by the compressed elastic body 23 are provided at both lower sides of the integrated circuit chip 30. The contact terminals 31 are elastically in close contact with each other so that the contacts are not short-circuited.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the above-described embodiments without departing from the spirit of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such modifications are intended to fall within the scope of the appended claims.

이상에서 상술한 바와 같은 본 발명은 플라스틱카드(1)의 일측에 가공된 가이드홈(20)의 내부에 집적회로칩(30)이 삽입되어 접착제(30a)에 의하여 견고하게 열 접착되고, 압축된 탄성체(23)의 탄발력에 의하여 금속단자(22)가 집적회로칩(30)의 접점단자(31)들에 탄력적으로 밀착되는 것이므로 별도의 납땜 작업을 하지 않더라도 접점들이 단락되지 않고 정확하게 전원이 연결되는 것이므로 좁은 가이드홈에서 납땜 작업을 하는 종래의 부착방법에 비하여 집적회로칩의 부착 작업이 신속 간편하게 이루어질 수 있을 뿐 아니라 납땜 작업으로 이하여 야기되는 유해가스의 발생 및 납(pb) 성분에 의하여 카드가 법정폐기물로 분류되어야 하는 등의 종래 제반 문제점들이 완벽하게 해소되어 플라스틱카드의 대외 경쟁력을 최대한 높여줄 수 있는 등의 이점이 있는 것이다. In the present invention as described above, the integrated circuit chip 30 is inserted into the inside of the guide groove 20 processed on one side of the plastic card 1, and is firmly thermally bonded by the adhesive 30a and compressed. Since the metal terminal 22 is elastically in close contact with the contact terminals 31 of the integrated circuit chip 30 due to the elastic force of the elastic body 23, the contacts are not short-circuited without a separate soldering operation. Compared to the conventional attachment method of soldering in a narrow guide groove, the integrated circuit chip can be attached quickly and easily, and the card is generated by the generation of harmful gas and lead (pb) caused by the soldering operation. Conventional problems such as having to be classified as statutory waste are completely solved, so that the external competitiveness of plastic card can be maximized. A.

Claims (2)

코어시트(10)의 일측에 탄성체(23)를 삽입할 수 있는 2개의 구멍(21)을 뚫는 단계;Drilling two holes 21 into which the elastic body 23 can be inserted into one side of the core sheet 10; 코어시트(10)의 표면에 안테나코일(24)이 둘레를 따라서 감겨지도록 하고, 안테나코일(24)의 양단에 탄력성 있는 금속단자(22)들을 각각 고정한 후 금속단자(22)를 접착제(22a)로 고정하여 양측 금속단자(22)들이 구멍(21)들의 상부에 각각 위치되도록 하는 단계;The antenna coil 24 is wound around the core sheet 10 along the circumference, and the elastic metal terminals 22 are fixed to both ends of the antenna coil 24, and then the metal terminals 22 are attached to the adhesive 22a. Fixing both sides so that both metal terminals 22 are positioned on the upper portions of the holes 21; 상기 코어시트(10)에 뚫려진 구멍(21)에 탄성체(23)를 삽입하여 구멍(21)들을 통해 돌출되는 탄성체(23)의 상부면이 양측 금속단자(22)의 하부면들을 각각 탄력적으로 지지하도록 하는 단계;The upper surface of the elastic body 23 protruding through the holes 21 by inserting the elastic body 23 into the hole 21 drilled in the core sheet 10 is to elastically lower the lower surfaces of both metal terminals 22, respectively. Supporting; 상기 코어시트(10)의 상부에는 상부 인쇄지(11)와 상부 코팅지(12)를 적층하고, 코어시트(10)의 하부에는 하부 인쇄지(13)와 하부 코팅지(14)를 적층하는 단계;Stacking an upper printing paper (11) and an upper coating paper (12) on an upper portion of the core sheet (10), and laminating a lower printing paper (13) and a lower coating paper (14) on a lower portion of the core sheet (10); 적층된 카드원단을 프레스의 정반에 올려놓고, 약 150℃∼200℃의 온도로 가열 및 가압하여 금속단자(22)와 탄성체(23)가 눌려지면서 고정되도록 하여 열 접착하는 단계;Placing the stacked card fabrics on the surface of the press, and heating and pressing them to a temperature of about 150 ° C. to 200 ° C. so that the metal terminals 22 and the elastic body 23 are pressed and fixed to be thermally bonded; 밀링머신에 장치된 커터로 양측 금속단자(22)의 주위를 커팅하여 집적회로칩(30)이 수납될 수 있는 가이드홈(20)을 1차가공하는 단계;Cutting the circumferences of the metal terminals 22 on both sides with a cutter installed in the milling machine to primaryly process the guide groove 20 in which the integrated circuit chip 30 can be accommodated; 정밀한 밀링커터로 가이드홈(20) 주위를 2차 커팅하여 금속단자(22)가 손상 되지 않도록하면서 노출되도록 하여 눌려져 있던 양측 금속단자(22)와 압축되었던 탄성체(23)가 탄성 복원되면서 가이드홈(20)의 양측에서 탄력적으로 돌출되도록 하는 단계;The secondary cutting around the guide groove 20 with a precision milling cutter to expose the metal terminal 22 to prevent damage to the metal terminal 22 and the compressed elastic body 23 was pressed to restore the guide groove ( Elastically projecting on both sides of 20); 집적회로칩(30)의 하부 둘레에 열가소성 접착제(30a)를 부착한 후 집적회로칩(30)을 가이드홈(20) 내부에 삽입한 후 120∼150℃의 열을 가하면서 가압하여 열 접착시켜 집적회로칩(30)의 하부 양측 접점단자(31)들이 양측 금속단자(22)를 압박하여 탄성체(23)로 지지되는 금속단자(22)들이 탄력적으로 접점단자(31)에 밀착되도록 하는 단계로 이루어진 것을 특징으로 하는 플라스틱카드의 집적회로칩의 부착방법.After the thermoplastic adhesive 30a is attached to the lower circumference of the integrated circuit chip 30, the integrated circuit chip 30 is inserted into the guide groove 20 and pressurized while applying heat at 120 to 150 ° C. to heat-bond it. The lower both side contact terminals 31 of the integrated circuit chip 30 press the both metal terminals 22 so that the metal terminals 22 supported by the elastic body 23 are elastically in close contact with the contact terminals 31. Method for attaching an integrated circuit chip of a plastic card, characterized in that made. 플라스틱카드(1)의 일측에 가공된 가이드홈(20)의 양측에 뚫려진 구멍(21)들에는 탄성체(23)가 삽입되고, 탄성체(23)의 양측에는 안테나코일(24)의 양측과 각각 연결된 접점단자(31)가 고정되어 접점단자(31)의 하부가 탄성체(23)에 의하여 탄력 지지되며, 가이드홈(20) 내부에는 집적회로칩(30)이 접착제(30a)에 의하여 열 접착되어 고정되고, 압축된 탄성체(23)에 의하여 탄력 지지되는 금속단자(22)들이 집적회로칩(30)의 하부 양측의 접점단자(31)들에 탄력적으로 밀착되도록 한 것을 특징으로 하는 플라스틱카드.An elastic body 23 is inserted into holes 21 formed in both sides of the guide groove 20 processed on one side of the plastic card 1, and both sides of the antenna coil 24 are respectively inserted on both sides of the elastic body 23. The connected contact terminal 31 is fixed so that the lower portion of the contact terminal 31 is elastically supported by the elastic body 23, and the integrated circuit chip 30 is thermally bonded by the adhesive 30a in the guide groove 20. The plastic card, characterized in that the metal terminals 22 are fixed and elastically supported by the compressed elastic body 23 to be in close contact with the contact terminals 31 on both lower sides of the integrated circuit chip 30.
KR1020040111730A 2004-12-24 2004-12-24 Plastic card KR100699069B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008147061A1 (en) * 2007-05-31 2008-12-04 Jdc Tech Co., Ltd. Method of fabricating smart display card having liquid crystal display unit
JP2015077748A (en) * 2013-10-17 2015-04-23 大日本印刷株式会社 Certification card
KR20190044188A (en) * 2017-10-20 2019-04-30 (주)바이오스마트 Method of Producing Ceramic Cards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008147061A1 (en) * 2007-05-31 2008-12-04 Jdc Tech Co., Ltd. Method of fabricating smart display card having liquid crystal display unit
JP2015077748A (en) * 2013-10-17 2015-04-23 大日本印刷株式会社 Certification card
KR20190044188A (en) * 2017-10-20 2019-04-30 (주)바이오스마트 Method of Producing Ceramic Cards

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