KR20060070508A - A bonding of guttation type for metal key making - Google Patents

A bonding of guttation type for metal key making Download PDF

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KR20060070508A
KR20060070508A KR1020060048957A KR20060048957A KR20060070508A KR 20060070508 A KR20060070508 A KR 20060070508A KR 1020060048957 A KR1020060048957 A KR 1020060048957A KR 20060048957 A KR20060048957 A KR 20060048957A KR 20060070508 A KR20060070508 A KR 20060070508A
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South Korea
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adhesive
keypad
acetate
metal
weight
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KR1020060048957A
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Korean (ko)
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김현회
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주식회사 인성기업
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Publication of KR20060070508A publication Critical patent/KR20060070508A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

본 발명은 휴대폰, PDA, MP3등과 같은 각종 정보 통신기기에 사용되는 메탈 키패드에 관한 것으로, 보다 상세하게는 메탈 키패드에 실리콘패드를 성형할 때 이형되어지지 않도록 하는 매개물인 접착의 개발로 제조공정의 단순화에 따른 생산성 향상과 함께 생산원가를 절감할 수 있고, 접착액이 새어나와 상품 가치를 저하시키는 문제를 해소한 발명에 관한 것이다.The present invention relates to a metal keypad used in various information and communication devices such as mobile phones, PDAs, MP3, etc. More specifically, the development of the manufacturing process by the development of the adhesive medium that is not released when molding the silicon pad on the metal keypad It is related with the invention which can reduce the production cost along with the improvement of productivity due to the simplification, and solve the problem of leaking the adhesive liquid and lowering the value of the product.

본 발명은 부틸글리콜 아세테이트, 메톡시 메틸레씰 아세테이트, 비스페놀(에피클로리드린), 씨클로헥사논, 솔벤트나프타(페트로리염)헤비아롬, 크실렌, 솔벤트나프타(페트로리염)라이트아롬, 트리메틀벤젠으로 이루어진 접착액에 N-브틸아세이트, 돌루엔 디이쏘씨아네트로 이루어진 경화제의 혼합으로 이루어진 메탈키패드 제조용 일액형 접착제에 의하여 달성될 수 있는 것이다.The present invention consists of butylglycol acetate, methoxy methylleseal acetate, bisphenol (epichloridrin), cyclohexanone, solvent naphtha (petroleum salt) heviarom, xylene, solvent naphtha (petroleum salt) light arom, trimetal benzene It can be achieved by a one-component adhesive for producing a metal keypad consisting of a mixture of a curing agent consisting of N-butyl acetyl acetate, toluene diisocynet to the adhesive liquid.

키패드판, 성형금형, 하형, 상형, 실리콘, 필름 일액형 접척제,실리콘패드 Keypad board, molding mold, lower mold, upper mold, silicone, film one-component adhesive, silicone pad

Description

메탈키패드 제조용 일액형 접착제{A bonding of guttation type for metal key making} One-part adhesive for metal key pad manufacturing {A bonding of guttation type for metal key making}

도 1a~e는 본 발명에 의한 일액형 접착제를 이용한 메탈키패드의 제조 공정도.1a to e is a manufacturing process diagram of a metal keypad using a one-component adhesive according to the present invention.

<도면의 주요 부분에 사용된 부호 설명 ><Description of the symbols used in the main parts of the drawing>

10 : 키패드판 20 : 필름10: keypad 20: film

30 : 실리콘 40 : 실리콘 패드30: silicon 40: silicon pad

100 : 일액형 접착제100: one component adhesive

본 발명은 휴대폰, PDA, MP3등과 같은 각종 정보 통신기기에 사용되는 메탈 키패드에 관한 것으로, 보다 상세하게는 메탈 키패드에 실리콘패드를 성형할 때 이형되어지지 않도록 하는 매개물인 접착의 개발로 제조공정의 단순화에 따른 생산성 향상과 함께 생산원가를 절감할 수 있고, 접착액이 새어나와 상품 가치를 저하시키는 문제를 해소한 발명에 관한 것이다.The present invention relates to a metal keypad used in various information and communication devices such as mobile phones, PDAs, MP3, etc. More specifically, the development of the manufacturing process by the development of the adhesive medium that is not released when molding the silicon pad on the metal keypad It is related with the invention which can reduce the production cost along with the improvement of productivity due to the simplification, and solve the problem of leaking the adhesive liquid and lowering the value of the product.

일반적으로 휴대폰, PDA, MP3등과 같은 각종 정보 통신기기에는 스위칭 장치 로 메탈 키패드가 사용하게 된다.In general, a metal keypad is used as a switching device for various information communication devices such as mobile phones, PDAs, and MP3s.

상기와 같이 사용되어지는 메탈 키패드는 그 두께가 얼마나 슬림화 되어질 수 있느냐에 따라 상기한 통신기기의 두께 슬림화에 영향을 미치게 된다.The metal keypad used as described above affects the slimming of the communication device according to how thin the thickness can be.

상기 통신기기의 메탈 키패드는 키패드판과 필름 및 실리콘패드로 구성되어 진다.The metal keypad of the communication device is composed of a keypad plate, a film and a silicon pad.

상기와 같은 구성을 이루며 형성되어지는 메탈 키패드는 메탈소재인 키패드에 수지계열인 실리콘패드가 서로 난접착성 소재이기 때문에 메탈키패드와 실리콘패드 사이에 필름을 개재시키게 된다.The metal keypad formed as described above has a metal pad interposed between the metal keypad and the silicon pad because the resin-based silicone pads are hard-adhesive materials.

그런데, 상기와 같이 필름을 개재시켜 실리콘패드를 성형할 경우에는 키패드판에 대해 난접착성을 가지는 필름을 접착수단을 이용하여 접착시켜야 한다.By the way, in the case of molding the silicone pad through the film as described above, the film having a poor adhesion to the keypad plate should be bonded using an adhesive means.

상기 키패드판에 필름을 접착시키는 수단으로는 양면테이프와 이액형 접착제를 사용하게 된다.As a means for adhering the film to the keypad, a double-sided tape and a two-component adhesive are used.

상기의 방법중 양면테이프를 이용하여 메탈소재인 키패드판에 필름을 접착시킬 경우, 시간이 지남에 따라 양면테이프의 접착액이 외부로 새어나오는 문제가 발생함은 물론 별도 제작되어진 실리콘패드를 조립 형성하는 방식이어서 키패드판에 실리콘패드를 접착 조립하였을 때 접착테이프의 두께로 인하여 실리콘패드를 형성하는 리브살, 키버튼이 키패드판의 키홈으로 충분하게 들어나지 못할 뿐만 아니라, 키패드판의 키버튼 성형이 가능하도록 관통 형성된 키홈이 관통된 상태에 있게 되는 경우가 발생하여 상기 키홈을 엑폭시나 멜라민수지를 채워 넣어야 하는 제조공정이 더 추가되어져 제조공정이 복잡해지는 단점을 가지고 있다.When the film is adhered to the keypad plate of the metal material using the double-sided tape of the above method, the adhesive liquid of the double-sided tape leaks to the outside as time passes, as well as the assembly of the silicon pad manufactured separately When the silicone pad is adhesively assembled to the keypad plate, the ribs and key buttons forming the silicone pad may not sufficiently enter the key grooves of the keypad plate due to the thickness of the adhesive tape. The penetratingly formed key grooves may be in a penetrating state so that a manufacturing process for filling the key grooves with an epoxy or melamine resin is added, thereby making the manufacturing process complicated.

상기 양면테이프를 이용한 메탈 키패드 제조방법의 단점을 해결하기 위하여 개발한 방법이 접착제를 이용하여 메탈소재인 키패드판에 필름지를 접착하는 방법으로써 그 예로는 한국특허 제568963호를 예로 들을 수 있다.The method developed to solve the shortcomings of the metal keypad manufacturing method using the double-sided tape is a method of adhering a film paper to the keypad plate of a metal material using an adhesive, for example, Korean Patent No. 568963.

상기의 선등록발명은, 각각의 접착제를 2회에 걸쳐 도포하는 키패드를 제조할 수 있는 것으로 기술하면서 각각의 접착제를 혼합하여 사용할 수있는 방법 또한 기술하고 있음을 알 수 있습니다.The above-mentioned pre-invention describes that a keypad for applying each adhesive twice can be produced, and it can also be seen that a method for mixing each adhesive can also be used.

그러나 선등록발명은 상세한 설명에 의해 알 수 있듯이 메탈키시트에 열경화 타입으로 이루어진 액상의 1차 접착제 즉, PMMA수지25~60중량과, 프로필렌 글리콜 모노메틸 에테르5~20중량으로 이루어진 접착액에 폴리이소시아네이트수지70~80중량과 에틸아세테이트20~30중량으로 이루어진 경화제의 혼합으로 이루어진 접착제를 메탈키시트에 먼저 도포한 후 소정의 온도를 가지는 건조장치에서 경화시켜 접착제층을 형성하게 된다.However, as can be seen from the detailed description, the pre-registered invention is applied to the adhesive liquid consisting of a liquid primary adhesive made of a thermosetting type on the metal key sheet, that is, 25 to 60 weight of PMMA resin and 5 to 20 weight of propylene glycol monomethyl ether. The adhesive consisting of a mixture of a polyisocyanate resin 70 ~ 80 weight and a curing agent consisting of 20 ~ 30 weight of ethyl acetate is first applied to the metal key sheet and then cured in a drying apparatus having a predetermined temperature to form an adhesive layer.

상기와 같이 메탈키시트에 형성된 접착층에 폴리우레탄 계열의 필름을 접착하게 되는데, 이때 상기 접착제층에 우레탄계열의 합성수지20~30중량, 시클로헥산논40~50중량으로 이루어진 접착제를 먼저 도포한 후 상기의 폴리우레탄 계열의 필름을 접착시킨다.The polyurethane-based film is adhered to the adhesive layer formed on the metal key sheet as described above, wherein an adhesive made of urethane-based synthetic resin 20-30 weight and cyclohexanone 40-50 weight is first applied to the adhesive layer. To the polyurethane-based film of

상기와 같이 접착되어진 폴리우레탄 계열의 필름위에 액상 실리콘 러버를 도포한 다음 상부금형으로 열압착함에 따라 키패드의 제조가 완료되도록 한 것이다.After the liquid silicone rubber is applied onto the polyurethane-based film bonded as described above, the manufacturing of the keypad is completed as the upper mold is thermocompressed.

한편, 선등록발명은 전술한 이액형 접착제를 구성하는 접착액과 경화제를 모두를 포함하는 접착제를 사용하여 메탈키시트를 제조할 수도 있다라고 기술되어 있 음을 알 수 있다.On the other hand, it can be seen that the pre-registered invention can also be used to prepare a metal key sheet using an adhesive comprising both the adhesive and the curing agent constituting the two-component adhesive described above.

상기의 선등록발명은, 메탈키시트에 1차 접착제를 도포한 후 경화과정을 거친 후, 경화된 접착제에 또 다른 성분의 접착제를 도포한 상태에서 필름을 합지한 다음 필름위에 실리콘 러버를 도포하여 상부금형으로 실리콘 러버를 열압착시켜 메탈키패드를 제조 완성하는 방법(일명"이액형 접착방식"이라고도 함)이어서 작업공정이 복잡할 뿐만 아니라, 메탈키시트에 1차 도포한 접착제를 경화시키는 시간이 오래걸려 생산성을 향상시키는데 어려움이 있으며, 1차 도포되어 경화된 접착제가 절취라인과 숫자 및 문자라인으로 노출되어져 생산된 메탈키패드의 품질을 떨어뜨리는 문제를 야기시키기도 한다.In the above-described pre-invention, after applying the primary adhesive to the metal key sheet, the curing process, after laminating the film in the state of applying the adhesive of another component to the cured adhesive, and then applying a silicone rubber on the film It is a method of manufacturing and completing a metal keypad by thermo-compressing a silicon rubber with an upper mold (also called "two-component adhesive method"), which not only complicates the work process but also takes time to cure the adhesive applied to the metal key sheet first. It takes a long time to improve productivity, and the first applied cured adhesive is exposed to the cutting line, the number, and the character line, which causes the problem of degrading the quality of the produced metal keypad.

한편, 메탈키시트에 1차 도포되는 접착제와 1차도포된 접착제에 2차도포되는 접착제를 동일한 혼합비율로 혼합하여서 간단하게 메탈키패드를 제작할 수 있는 것으로 기술하고 있으나, 일정한 경화시간을 거쳐야만 경화가 이루어지는 1차 도포용 접착제를 경화된 1차 도포용 접착제에 2차 도포되는 접착제를 단순 혼합 하였을 뿐만 아니라, 그 혼합 비율까지도 동일하게 가져가는 것으로 기술되어 있다.On the other hand, it is described that the metal key pad can be easily manufactured by mixing the adhesive applied first to the metal key sheet and the adhesive applied second to the first coated adhesive at the same mixing ratio, but only after a certain curing time, It is described that not only the mixing | blending of the adhesive agent apply | coated secondary to the hardened | cured primary application | coating adhesive agent but also the mixing ratio similar to the primary application adhesive which consists of this is described.

상기와 같이 1차 도포용 접착제와 2차도포용 접착제를 단순 혼합사용할 경우, 경화제가 성능을 재대로 발휘하지 못하여 접착성이 저하되어 난접착에 의한 메탈키시트에서 필름이 떨어지는 현상이 발생하는 문제점이 나타나게 된다.As described above, when the primary coating adhesive and the secondary coating adhesive are simply mixed, the curing agent does not exhibit the proper performance and the adhesiveness is lowered, causing the film to fall from the metal key sheet due to the poor adhesion. Will appear.

본 발명은 메탈 키패드를 제조할 때 사용되어지는 이액형 접착제의 단점을 해결하기 위한 한 것으로, 그 목적은 난접착성인 메탈키패드소재(스테인레스스틸, 인청동, 합금)와 필름(TPU,PC,PU,PA등)을 접착제 1회 도포로 안정적인 합지가 이루어질 수 있도록 한 일액형접착제를 사용함에 따라 종래 이액형접착제를 사용할 때 나타났던 문제점인 메탈키패드의 생산성 저하 및 생산원가 상승요인을 해소함과 동시에 메탈키패드소재와 필름의 안정적인 합지로 메탈키패드의 품질을 향상시킬 수 있는 메탈키패드 제조용 일액형 접착제를 제공함에 있다.The present invention is to solve the shortcomings of the two-component adhesives used in the manufacture of metal keypads, the purpose of which is a hard-adhesive metal keypad material (stainless steel, phosphor bronze, alloy) and film (TPU, PC, PU, By using a one-component adhesive that enables stable lamination by applying a single adhesive to PA, etc., it reduces the productivity and the cost of production of metal keypad, which is a problem when using the conventional two-component adhesive. It is to provide a one-component adhesive for producing a metal keypad that can improve the quality of the metal keypad with a stable lamination of the material and the film.

상기 목적을 달성하기 위한 본 발명은, 부틸글리콜 아세테이트, 메톡시 메틸레씰 아세테이트, 비스페놀(에피클로리드린), 씨클로헥사논, 솔벤트나프타(페트로리염)헤비아롬, 크실렌, 솔벤트나프타(페트로리염)라이트아롬, 트리메틀벤젠으로 이루어진 접착액에 N-브틸아세이트, 돌루엔 디이쏘씨아네트로 이루어진 경화제의 혼합으로 이루어진 것을 특징으로 하는 메탈키패드 제조용 일액형 접착제에 의하여 달성될 수 있는 것이다. The present invention for achieving the above object, butyl glycol acetate, methoxy methylleseal acetate, bisphenol (epichloridrin), cyclohexanone, solvent naphtha (petroleum salt) heviarom, xylene, solvent naphtha (petrol salt) light It can be achieved by a one-component adhesive for producing a metal keypad, characterized in that the mixture consisting of a hardening agent consisting of N- butyl acetate, toluene diisocynet to the adhesive liquid consisting of arom, trimetal benzene.

이하, 상기한 목적을 달성하기 위한 바람직한 실시예를 첨부된 도면에 의하여 상세하게 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings a preferred embodiment for achieving the above object is as follows.

본 발명의 메탈키패드 제조용 일액형 접착제는, 접착액과 경화제의 혼합으로 이루어 진다.The one-component adhesive for producing a metal keypad of the present invention consists of a mixture of an adhesive liquid and a curing agent.

상기 접착액은 부틸글리콜 아세테이트(BUTYLGLYCOL ACETATE)20~25%중량, 메톡시 메틸레씰 아세테이트(METHOXY METHYLETHYL ACETATE)10~15%중량, 비스페놀(BISPHENOL)(에피클로리드린:EPICHLORHYDRIN)10~15%중량, 씨클로헥사논(CYCLOHEXANONE)5~10%중량, 솔벤트나프타(SOLVENT NAPHTHA(페트로리염PETROLEUM) 헤비아롬(HEAVY AROM)1~5%중량, 크실렌(XYLENE)1~5%중량, 솔벤트나프타(SOLVENT NAPHTHA(페트로리염PETROLEUM)라이트아롬(LIGHT AROM)0.5~1%중량, 트리메틀벤젠(TRIMETHYLBENZENZE)0~0.5%중량로 이루어져 있다.The adhesive solution is 20 to 25% by weight of butyl glycol acetate (BUTYLGLYCOL ACETATE), 10 to 15% by weight of methoxy methyl acetylyl acetate (BISPHENOL) (epichloridrin: EPICHLORHYDRIN) 10 to 15% by weight , Cyclohexanone (CYCLOHEXANONE) 5-10% weight, SOLVENT NAPHTHA (petroleum salt PETROLEUM) HEAVY AROM 1-5% weight, xylene (XYLENE) 1-5% weight, solvent naphtha (SOLVENT NAPHTHA) It consists of 0.5-1% by weight of petroleum salt (PETROLEUM) and 0-0.5% by weight of TRIMETHYLBENZENZE.

상기 접착액에 혼합되어지는 경화제는, N-브틸아세이트(N-BUTYL ACETATE)23~52.5%중량, 톨루엔 디이쏘씨아네트(TOLUENE DIISOCYANATE)0~0.5%중량으로 이루어진 것이다.The curing agent to be mixed in the adhesive solution, N-BUTYL ACETATE 23 to 52.5% by weight, toluene DIISOCYANATE (TOLUENE DIISOCYANATE) 0 to 0.5% by weight.

상기와 같이 이루어진 접착액과 경화제의 혼합으로 이루어진 일액형 접착제를 이용하여 메탈키패드를 제조할 때에는 메탈키패드소재(스테인레스스틸, 인청동, 합금)를 에칭에 의해 버튼의 경계부가 되는 절취라인과 숫자 및 문자 라인이 천공되어서 준비된 키패드판(10)을 도1 a)에서와 같이 준비한다.When manufacturing a metal keypad using a one-component adhesive consisting of a mixture of the adhesive solution and the curing agent as described above, the cutting line and the numbers and letters that form the boundary of the button by etching the metal keypad material (stainless steel, phosphor bronze, alloy) A keypad plate 10 prepared by drilling a line is prepared as in FIG. 1 a).

상기와 같이 준비되어진 키패드판(10)에 일액형 접착제(100)를 도1 b)에서와 같이 도포한다.One-part adhesive 100 is applied to the keypad plate 10 prepared as described above, as shown in FIG.

일액형 접착제(100)가 도포되어진 키패드판(10)에 필름(TPU,PC,PU,PA 등)(20)을 합지시 킨다.The film (TPU, PC, PU, PA, etc.) 20 is laminated on the keypad 10 to which the one-component adhesive 100 is applied.

일액형 접착제(100)를 매개로 필름(20)이 합지되어진 키패드판(10)을 성형금형의 하형 성형부에 키패드판(10)에 형성된 숫자 및 문자 등이 일치하도록 위치시킨 다.The keypad plate 10 on which the film 20 is laminated through the one-component adhesive 100 is positioned so that the numbers and letters formed on the keypad plate 10 coincide with each other.

하형에 키패드판(10)이 위치되어진 상태에서 필름(20)위에 실리콘(30)을 도1 d)에서와 같이 골고루 분포(도포)시킨다.In the state where the keypad plate 10 is positioned in the lower mold, the silicon 30 is evenly distributed (coated) on the film 20 as shown in FIG.

필름(20) 위에 실리콘(30)이 골고루 분포되어진 상태에서 상형을 하형으로 이동시키게 된다.In the state where the silicon 30 is evenly distributed on the film 20, the upper mold is moved to the lower mold.

상기와 같이 키패드판(10)이 얹혀져 메탈키패드를 성형하는 성형금형은 하형과 상형이 100℃~150℃의 열을 가지고 가열되어 있는 것이어서 필름 (20)위에 분포(도포)된 실리콘(30)이 열압착되어지면서 필름(20) 전체면에 대하여 펼쳐지면서 실리콘패드(40)를 형성하게 됨과 동시에 일액형 접착제(100)가 열경화되어 키패드판(10)과 필름(20)이 견고하게 접착되어 메탈키패드의 제조가 도1 e)에서와 같이 완료되어지게 되는 것이다.As described above, the molding mold for placing the keypad 10 and forming the metal keypad is heated with a heat of 100 ° C. to 150 ° C. in the lower mold and the upper mold so that the silicon 30 distributed (coated) on the film 20 is formed. While being thermally compressed, the silicone pad 40 is formed while being unfolded with respect to the entire surface of the film 20. At the same time, the one-component adhesive 100 is thermally cured so that the keypad 10 and the film 20 are firmly bonded to each other. The manufacture of the keypad is to be completed as in Figure 1 e).

이상에서 설명한 바와 같이 본 발명의 메탈키패드 제조용 일액형 접착제는, 난접착성인 메탈키패드소재(스테인레스스틸, 인청동, 합금)인 키패드판(10)과 필름(TPU,PC,PU,PA 등)(20)을 부틸글리콜 아세테이트, 메톡시 메틸레씰 아세테이트, 비스페놀(에피클로리드린), 씨클로헥사논, 솔벤트나프타(페트로리염)헤비아롬, 크실렌, 솔벤트나프타(페트로리염)라이트아롬, 트리메틀벤젠으로 이루어진 접착액에 N-브틸아세이트, 돌루엔 디이쏘씨아네트로 이루어진 경화제의 혼합으로 이루어진 일액형 접착제(100)의 1회 도포로 안정적인 합지가 이루어질 수 있도록 함에 따라 종래 이액형 접착제를 사용할 때 접착제를 2회에 걸쳐 도포해야 했던 작업상의 번거러움을 해소함과 동시에 메탈키패드의 생산성 저하 및 생산원가 상승요인을 해소함은 물론 메탈키패드소재인 키패드판(10)과 필름(20)의 안정적인 합지로 메탈키패드의 품질을 향상시킬 수 있는 이점을 가지고 있다.As described above, the one-component adhesive for producing a metal keypad of the present invention includes a keypad plate 10 and a film (TPU, PC, PU, PA, etc.) that are hard-adhesive metal keypad materials (stainless steel, phosphor bronze, alloy) (20). ) Is composed of butylglycol acetate, methoxy methylleseal acetate, bisphenol (epichloridrin), cyclohexanone, solvent naphtha (petroleum salt) heviarom, xylene, solvent naphtha (petroleum salt) light arom, trimetal benzene When one-component adhesive 100 is used, a stable application can be achieved by applying a one-component adhesive 100 composed of a mixture of a hardener composed of N-butyl acetylacetate and doluene diisocynet to the liquid. It eliminates the work hassles that had to be applied at all times, as well as reducing the productivity of metal keypads and the increase in production costs, as well as metal keypad materials. It has the advantage of being able to improve the quality of the metal keypad stable lamination of the keypad plate (10) and the film (20).

Claims (2)

부틸글리콜 아세테이트, 메톡시 메틸레씰 아세테이트, 비스페놀(에피클로리드린), 씨클로헥사논, 솔벤트나프타(페트로리염)헤비아롬, 크실렌, 솔벤트나프타(페트로리염)라이트아롬, 트리메틀벤젠으로 이루어진 접착액에 N-브틸아세이트, 돌루엔 디이쏘씨아네트로 이루어진 경화제의 혼합으로 이루어진 것을 특징으로 하는 메탈키패드 제조용 일액형 접착제.Butyl glycol acetate, methoxy methylleseal acetate, bisphenol (epichloridrin), cyclohexanone, solvent naphtha (petroleum salt) heviarom, xylene, solvent naphtha (petroleum salt) light arom, trimetalbenzene A one-component adhesive for producing a metal keypad, comprising a mixture of a curing agent consisting of N-butyl acetate and doluene diisocynet. 제1항에 있어서, 상기 메탈키패드 제조용 일액형 접착제의 성분비는, According to claim 1, Component ratio of the one-component adhesive for producing the metal keypad, 부틸글리콜 아세테이트 20~25%중량, 메톡시 메틸레씰 아세테이트 10~15%중량, 비스페놀(에피클로리드린)10~15%중량, 씨클로헥사논 5~10%중량, 솔벤트나프타(페트로리염)헤비아롬 1~5%중량, 크실렌 1~5%중량, 솔벤트나프타(페트로리염)라이트아롬 0.5~1%중량, 트리메틀벤젠 0~0.5%중량으로 이루어진 접착액에 N-브틸아세이트 23~52.5%중량, 돌루엔 디이쏘씨아네트0~0.5%중량부인 것을 특징으로 하는 메탈키패드 제조용 일액형 접착제.20-25% of butyl glycol acetate, 10-15% of methoxy methylleseal acetate, 10-15% of bisphenol (epichloridrin), 5-10% by weight of cyclohexanone, solvent naphtha (petroli salt) heviarom N-Butyl Acetate 23 to 52.5% by weight in an adhesive liquid consisting of 1 to 5% by weight, 1 to 5% by weight of xylene, 0.5 to 1% by weight of solvent naphtha (petroleum salt) light arom, and 0 to 0.5% by weight of trimetalbenzene , Doluene diisocyanine 0-0.5% by weight of a one-part adhesive for metal keypad manufacturing, characterized in that.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116975A (en) * 1984-07-02 1986-01-24 Tachikawa:Kk Adhesive for molded styrene resin containing polybutadiene blocks
JP2000243175A (en) * 1999-02-18 2000-09-08 Polymatech Co Ltd Key pad with resin key top and manufacture thereof
KR20040095702A (en) * 2003-05-08 2004-11-15 신에쓰 가가꾸 고교 가부시끼가이샤 Silicone Rubber Adhesive Composition for Mobile
KR100568963B1 (en) * 2005-10-10 2006-04-07 이수열 Metal keypad manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116975A (en) * 1984-07-02 1986-01-24 Tachikawa:Kk Adhesive for molded styrene resin containing polybutadiene blocks
JP2000243175A (en) * 1999-02-18 2000-09-08 Polymatech Co Ltd Key pad with resin key top and manufacture thereof
KR20040095702A (en) * 2003-05-08 2004-11-15 신에쓰 가가꾸 고교 가부시끼가이샤 Silicone Rubber Adhesive Composition for Mobile
KR100568963B1 (en) * 2005-10-10 2006-04-07 이수열 Metal keypad manufacturing method

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