KR20060061167A - Plasma display panel - Google Patents

Abstract

The present invention relates to a plasma display panel that can effectively dissipate heat generated from a driving circuit IC.

According to the present invention, a plasma display panel includes: an address electrode, a scan electrode, and a sustain electrode to which a driving voltage is applied to drive the panel; A display panel including the address electrode, the scan electrode and the sustain electrode; A driving circuit chip for generating the driving voltage; A printed circuit board on which the driving circuit chip is formed; And a flexible circuit board for electrically connecting the printed circuit board to the address electrode, the scan electrode, and the sustain electrode, wherein the driving circuit chip is mounted inside the module, and radiates heat between the driving circuit chip and the display panel. A layer is formed.

Description

Plasma Display Panel {PLASMA DISPLAY PANEL}             

1 is a cross-sectional view of a three-electrode surface discharge plasma display panel.

2 is a view schematically showing a conventional plasma display panel.

3A is a sectional view of a double-sided FPC.

3B is a cross-sectional view showing a cross-section FPC.

4A is a view showing the edge portion of the module using the double-sided FPC.

4B is a view showing the edge portion of the module using the cross-sectional FPC.

5 is a diagram illustrating an edge portion of the module according to the first embodiment of the present invention.

6 is a diagram illustrating an edge portion of the module according to the first embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

70: upper substrate 72: lower substrate

36: heat sink 32: cabinet

49: back cover 40, 140: printed circuit board

80: tip tube 29: double-sided FPC

31, 131: cross section FPC 41, 141: drive circuit IC

120: heat dissipation sheet 110: support

150: heat dissipation pad

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a plasma display panel capable of effectively dissipating heat generated from a driving circuit IC.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays, field emission displays, electro luminescence, and plasma display panels (PDPs). .

Referring to FIG. 1, a discharge cell of a three-electrode AC surface discharge type PDP includes a scan electrode 8Y and a sustain electrode 8Z formed on the upper substrate 10, and an address electrode formed on the lower substrate 12. 2) is provided.

Each of the scan electrodes 8Y and the sustain electrodes 8Z has a line width smaller than that of the transparent electrodes 4Y and 4Z and the transparent electrodes 4Y and 4Z, and is formed on one edge of the transparent electrodes 4Y and 4Z. Bus electrodes 6Y and 6Z. The transparent electrodes 4Y and 4Z are usually formed on the upper substrate 10 using indium tin oxide (ITO) as a material. The metal bus electrodes 6Y and 6Z are formed of a metal such as chromium (Cr) on the transparent electrodes 4Y and 4Z, thereby reducing the voltage drop caused by the transparent electrodes 4Y and 4Z having high resistance. The upper dielectric layer 14 and the passivation layer 18 are stacked on the upper substrate 10 on which the scan electrode 4Y and the sustain electrode 4Z are formed. The upper dielectric layer 14 accumulates wall charges generated during plasma discharge. The protective film 18 protects the upper dielectric layer 14 from sputtering generated during plasma discharge and increases the emission efficiency of secondary electrons. As the protective film 18, magnesium oxide (MgO) is usually used.

The address electrode 2 is formed on the lower substrate 12 in a direction crossing the scan electrode 8Y and the sustain electrode 8Z. The lower dielectric layer 16 and the partition wall 20 are formed on the lower substrate 12 on which the address electrode 2 is formed. The phosphor layer 22 is formed on the surfaces of the lower dielectric layer 16 and the partition wall 20. The partition wall 20 is formed parallel to the address electrode 2 to structurally distinguish the discharge cells, and prevents ultraviolet rays and visible light generated by the discharge from leaking to the adjacent discharge cells. The phosphor layer 22 is excited and emitted by ultraviolet rays generated during plasma discharge to generate visible light of any one of red, green, and blue. An inert mixed gas such as He + Xe, Ne + Xe or He + Ne + Xe for discharging is injected into the discharge space of the discharge cells provided between the upper and lower substrates 10 and 12 and the partition wall 20.

A PDP including such a display panel will be described with reference to the drawings.

2 is a perspective view schematically showing the inside of a general PDP.

Referring to FIG. 2, a general PDP includes a display panel 34, a heat sink 36, a back cover 49, a cabinet 32, and a printed circuit board (PCB) 40. .

The display panel 34 includes an upper substrate and a lower substrate, not shown, and phosphors are coated on the lower substrate. The upper substrate transmits light generated from the phosphor to display a predetermined image.

The display panel 34 includes a plurality of driving integrated circuits (hereinafter referred to as "driver ICs") connected to scan electrodes and address electrodes (not shown) to supply data signals and scan signals, respectively. Is formed. The driver ICs include a scan driver IC and a data driver IC, each of which is installed between the printed circuit board 40 and the display panel 34 to display a display panel 34 in response to a control signal supplied from the printed circuit board 40. Supply a driving signal. The double-sided adhesive tape 30 is attached to the surface of the display panel 34 facing the heat sink 36. The display panel 34 and the heat sink 36 are bonded to each other by the double-sided adhesive tape 30.

The heat dissipation plate 36 is bonded to the display panel 34 by the double-sided adhesive tape 30 to support the display panel 34 and to dissipate heat generated when the display panel 34 is driven. As the material of the heat sink 36, a metallic material having high thermal conductivity, for example, aluminum is used to efficiently dissipate heat generated from the display panel 34. The heat sink 36 is formed with a projection 38 on which the printed circuit board 40 is stacked. The screw 44 penetrates the hole 42 formed in the printed circuit board 40, and the printed circuit board 40 is fastened to the heat sink 36.

In addition, guards 25 protruding from the heat sink 36 are formed at four corners of the heat sink 36. A hole 15 is formed in the guard 25, and a screw 35 penetrates the hole 15 to fix the heat sink 36 to the back cover 49.

The printed circuit board 40 supplies a predetermined driving signal to the electrodes of the display panel 34. To this end, the printed circuit board 40 includes various driving units, and the printed circuit board 40 and the display panel 34 are connected by a plurality of flexible printed circuits (FPCs). The printed circuit board 40 has a hole 42 formed therein and fastened to the heat sink 36 by a screw 44.

The cabinet 32 is installed on the front of the display panel 34 to protect the display panel 12 from external shocks and is composed of a glass and a front filter. The front filter is composed of an optical characteristic film, an electromagnetic shield (EMI) shielding film, and an ultraviolet shielding film. The glass protects the front filter from damage from external impact. The optical characteristic film improves the optical characteristics of the PDP by lowering the luminance of red (R) and green (G) and increasing the luminance of blue (B) among the light incident from the display panel 34. The electromagnetic shielding film shields electromagnetic waves and prevents electromagnetic waves incident from the display panel 34 from being emitted to the outside. The infrared shielding film shields the infrared rays emitted from the display panel 34 to prevent the infrared rays above the reference from being emitted to the outside so that signals transmitted using the infrared rays such as a remote controller can be normally transmitted.

When the PDP is shipped, the back cover 49 is installed to surround the PDP. The back cover 49 is coupled to the cabinet 32 to protect the plasma display panel from external shocks and to block electromagnetic waves emitted to the rear surface.

The PDP is a display using visible light emitted from a discharge cell formed in the display panel 134. Each discharge cell is provided with an address electrode, a scan electrode, and a sustain electrode to which a voltage is applied to generate a discharge. The driving circuit ICs for driving each of the electrodes are electrically connected to each other by using an FPC and an electrode of the display panel 134.

FIG. 3A is a diagram illustrating a cross-sectional FPC, and FIG. 4A is a cross-sectional view illustrating a connection between the printed circuit board 140 and the display panel 134 using the cross-sectional FPC.

3A and 4A, a heat sink and a printed circuit board are formed on the rear side of the display panel on which the upper substrate 11 and the lower substrate 21 are bonded. When the printed circuit board 40 and the display panel 34 are connected by using the single-sided FPC, the driving circuit ICs on the printed circuit board 40 are formed toward the heat sink 36. In this case, the heat generation problem of the driving circuit ICs becomes serious because the driving circuit ICs do not have a space for dissipating heat dissipated when the circuit is driven. Since the driving circuit ICs are particularly sensitive to heat, the driving reliability cannot be guaranteed when driving for a long time.

As a way to solve this problem, there is a method of connecting the printed circuit board and the display panel using a double-sided FPC.

3B is a cross-sectional view showing a double-sided FPC, and FIG. 4B is a cross-sectional view showing a connection between the printed circuit board 40 and the display panel 34 using the double-sided FPC.

3B and 4B, a heat sink and a printed circuit board are formed on the rear side of the display panel on which the upper substrate 11 and the lower substrate 21 are bonded. When the printed circuit board 40 and the display panel 34 are connected by using a double-sided FPC, the driving circuit ICs of the printed circuit board are located at the rear side of the heat sink and are located in an open space with respect to the module. The heat generated can easily escape to the outside. However, the cost of the double-sided FPC is expensive, and the thickness of the module increases as the driving circuit ICs are exposed to the outside.

Accordingly, an object of the present invention is to provide a plasma display panel capable of reducing heat generation of driving circuit ICs while reducing manufacturing costs and reducing the thickness of a module.

In order to achieve the above object, a PDP according to the present invention comprises: an address electrode, a scan electrode and a sustain electrode to which a driving voltage is applied for driving a panel; A display panel including the address electrode, the scan electrode and the sustain electrode; A driving circuit chip for generating the driving voltage; A printed circuit board on which the driving circuit chip is formed; And a flexible circuit board for electrically connecting the printed circuit board to the address electrode, the scan electrode, and the sustain electrode, wherein the driving circuit chip is mounted inside the module, and radiates heat between the driving circuit chip and the display panel. A layer is formed.

The driving circuit chip and the scan electrode of the display panel are electrically connected to a flexible circuit board having electrodes formed on one side thereof.

The heat dissipation layer is formed on a heat dissipation plate disposed between the heat dissipation plate formed on the rear surface of the display surface of the display panel and the driving circuit chip.

The heat dissipation layer is a silicon pad.

The heat dissipation layer includes an auxiliary support and a heat dissipation sheet formed on the heat dissipation plate.

The heat dissipation sheet is made of silicon.

Other objects and advantages of the present invention in addition to the above object will be apparent from the description of the preferred embodiment of the present invention with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 5 to 6.

5 is a cross-sectional view illustrating an edge portion of the PDP module according to the first embodiment of the present invention.

Referring to FIG. 5, an edge portion of a module according to the first exemplary embodiment of the present invention may include a display panel 134 formed of an upper substrate 111 and a lower substrate 121, driving circuit ICs 141, and a driving circuit. The printed circuit board 140 having the ICs 141 formed thereon, a heat sink 136 formed between the printed circuit board 140 and the display panel 134, and formed between the driving circuit IC 141 and the heat sink 136. The heat radiation pad 150 is provided.

The display panel 134 includes an upper substrate 111 including a scan electrode 108Y, a sustain electrode (not shown), and a lower substrate 121 including an address electrode. The scan electrode 108Y and the sustain electrode are mainly applied with a voltage for causing scan and sustain discharge. A data voltage for causing an address discharge for specifying a discharge cell is applied to the address electrode.

The display panel 134 includes a discharge space including a discharge gas, and discharges according to an applied voltage to emit visible light.

The driving circuit ICs 141 for driving address electrodes, scan electrodes 108Y, and sustain electrodes formed on the upper substrate 111 and the lower substrate 121 are formed on the printed circuit board 140. In particular, the scan electrode 108Y is electrically connected to the drive circuit ICs 141 using the cross-section FPC 133. By using the single-sided FPC 133, the manufacturing cost can be reduced than using the double-sided FPC. In addition, when the single-sided FPC 133 is used, the driving circuit ICs 141 formed on the printed circuit board 140 may be mounted inside the module, thereby making the module slim. The heat generation problem generated when the driving circuit ICs 141 are mounted in the module can be solved by forming a heat radiating pad 150 between the heat sink 136 and the driving circuit IC 141. The heat dissipation pad 150 may effectively release heat generated when the driving circuit ICs are driven for a long time, thereby increasing reliability of the operation of the driving circuit ICs 141. The heat radiation pad 150 may use any known technique such as a silicon pad.

6 is a cross-sectional view illustrating an edge portion of the PDP module according to the second embodiment of the present invention.

Referring to FIG. 2, the edge portion of the module according to the second exemplary embodiment of the present invention includes a display panel 134 formed of an upper substrate 111 and a lower substrate 121, driving circuit ICs 141, and driving circuit ICs. The printed circuit board 140 having the 141 formed thereon, the heat dissipation plate 136 formed between the printed circuit board 140 and the display panel 134, and the heat dissipation sheet 120 formed between the driving circuit IC and the heat dissipation plate 136. And a support 110 formed between the heat sink 136 and the heat dissipation sheet 120 to support the driving circuit IC 141 and the heat dissipation sheet 120 formed on the rear surface of the printed circuit board 140.

In FIG. 6, the same reference numerals are used to refer to components substantially the same as the above-described embodiment, and detailed description thereof will be omitted.

The heat dissipation layer in this embodiment is characterized in that the heat dissipation sheet 120 is used. The heat generated when the driving circuit ICs 141 are operated may solve the heat generation problem even by using a thin heat dissipation sheet 120. In order to form the thin heat dissipation sheet 120, the heat dissipation plate 136 includes the support 110 at a position where the driving circuit ICs 141 are formed, and the heat dissipation sheet 120 is attached to the support 110 using an adhesive. As such, since the wide width between the heat sink 136 and the driving circuit IC 141 is not formed using the heat radiation pad, the material cost can be reduced. The heat dissipation sheet 120 may use any known technique.

As described above, the PDP according to the embodiment of the present invention can reduce the manufacturing cost by using the single-sided FPC and can also solve the heat problem of the driving circuit IC to maintain the stability and reliability of the operation of the driving circuit.                     

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (6)

A display panel including an address electrode, a scan electrode and a sustain electrode to which a driving voltage for driving the plasma display panel is applied, a display panel including the address electrode, the scan electrode and a sustain electrode, and a driving circuit chip for generating the driving voltage; A module of a plasma display panel comprising a printed circuit board on which the driving circuit chip is formed and a flexible circuit board for electrically connecting the printed circuit board with the address electrode, the scan electrode and the sustain electrode. And the driving circuit chip is disposed inside the module and has a heat dissipation layer formed between the driving circuit chip and the display panel. The method of claim 1, And the scan electrode of the driving circuit chip and the display panel are electrically connected to a flexible circuit board having electrodes formed on one side thereof. The method of claim 1, And the heat dissipation layer is formed on a heat dissipation plate disposed between the heat dissipation plate formed on the rear surface of the display surface of the display panel and the driving circuit chip. The method of claim 3, wherein The heat dissipation layer is a plasma display panel, characterized in that the silicon pad. The method of claim 3, wherein And the heat dissipation layer includes an auxiliary support and a heat dissipation sheet formed on the heat dissipation plate. The method of claim 5, The heat dissipation sheet is a plasma display panel, characterized in that the silicon material.

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