KR20080013226A - Plasma display apparatus - Google Patents

Abstract

A plasma display device is provided to isolate electrically a heat-radiating frame and a heat-sink from each other by using a non-conductive coupling unit. A plasma display panel(100) includes an electrode. A heat-radiating frame(110) is arranged on a rear surface of the plasma display panel. A driving unit is arranged on the heat-radiating frame and supplies a driving signal to the electrode. A heat-sink(160) is arranged at an upper part of the driving unit and is electrically independent from the heat-radiating frame in order to radiate the heat from the driving unit. The heat-sink is coupled with the heat-radiating frame by using a coupling unit including a non-conductive material. The coupling unit includes a resin material or a non-conductive metal material.

Description

Plasma Display Apparatus {Plasma Display Apparatus}

1 is a view for explaining an example of the configuration of a plasma display device according to an embodiment of the present invention.

2A to 2B are views for explaining an example of the structure of a plasma display panel included in a plasma display device according to an embodiment of the present invention.

3 is a diagram for explaining fastening of a heat sink and a heat dissipation frame.

4 is a diagram for explaining a first embodiment of the method for bonding the heat sink and the heat dissipation frame.

FIG. 5 is a diagram for explaining a second embodiment of the method for adhering the heat sink and the heat dissipation frame. FIG.

<Explanation of symbols for the main parts of the drawings>

100: plasma display panel 110: heat dissipation frame

120: data drive integrated circuit 130: flexible substrate

140: connector 150: data board

160: heatsink

The present invention relates to a plasma display device (Plasma Display Apparatus).

In general, the plasma display apparatus includes a plasma display panel in which electrodes are formed and a driving unit supplying a driving signal to the electrodes of the plasma display panel.

In the plasma display panel, a phosphor layer is formed in a discharge cell divided by a partition wall, and a plurality of electrodes are formed.

The driving signal is supplied to the discharge cell through the electrode.

Then, the discharge is generated by the drive signal supplied in the discharge cell. Here, when discharged by a drive signal in the discharge cell, the discharge gas filled in the discharge cell generates vacuum ultraviolet rays, and the vacuum ultraviolet light emits the phosphor formed in the discharge cell to emit visible light. Generate. The visible light displays an image on the screen of the plasma display panel.

On the other hand, the conventional plasma display device has a problem that occurs when the electromagnetic interference (Electro Magnetic Interference: EMI).

In order to solve the above problems, an object of the present invention is to provide a plasma display device in which the occurrence of electromagnetic interference is reduced by improving the fastening of the heat radiation frame and the heat sink.

A plasma display device according to an embodiment of the present invention for achieving the above object is a plasma display panel having an electrode, a heat dissipation frame disposed on the back of the plasma display panel, and a driving signal is provided on the heat dissipation frame It is preferable to include a heat sink (Heat Sink) which is disposed to be electrically independent from the heat dissipation frame on the drive unit and the drive unit to discharge the heat generated from the drive unit.

In addition, the heat sink is preferably fastened to the heat dissipation frame by a fastening means including a non-conductive material.

In addition, the fastening means preferably comprises a resin material or a non-conductive metal material.

In addition, the heat sink is preferably bonded to the heat dissipation frame by an adhesive means.

In addition, the heat sink is preferably electrically floating.

In addition, the electrode may include an address electrode, and the driving unit may include a data drive integrated circuit for supplying a driving signal to the address electrode through a switching operation.

Hereinafter, a plasma display device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining an example of the configuration of a plasma display device according to an embodiment of the present invention.

Referring to FIG. 1, a plasma display apparatus according to an exemplary embodiment of the present invention includes a plasma display panel 100, a heat radiating frame 110, a data driver 170, and a heat sink 160.

The heat dissipation frame 110 is disposed on the rear surface of the plasma display panel 100, and provides a space in which the data driver 170, the heat sink 160, and the like may be disposed.

The heat sink 160 has a plurality of protrusions, and emits heat generated by the data driver 170 to the outside. The fastening between the heat sink 160 and the heat dissipation frame 110 will be described in more detail later with reference to FIG. 3.

Here, it will be clear that the present invention is not limited to the data driver 170. For example, other driving units such as a drive integrated circuit (IC), a control board, a driving voltage generation circuit, and the like may be applied to the present invention. However, hereinafter, it will be assumed and described as a data driver 170 for driving the address electrode formed on the plasma display panel 100 for convenience.

The driver 170 includes a data board 150, a connector 140, a flexible substrate 130, and a data drive integrated circuit 120.

The data drive integrated circuit 120 supplies a driving signal to an address electrode of the plasma display panel 100 (not shown) through a switching operation. In addition, the data drive integrated circuit 120 may be disposed on the flexible substrate 130 having flexibility.

The data board 150 may be equipped with a reception circuit that receives image data generated by a timing board (not shown) and transmitted. In addition, other circuits for operating the data drive integrated circuit 120 may be mounted.

The connector 140 may electrically connect the flexible board 130 on which the data drive integrated circuit 120 is disposed and the data board 150.

In the plasma display panel 100, an electrode is formed and an image is implemented using plasma discharge.

The plasma display panel 100 will be described with reference to FIGS. 2A through 2B.

2A to 2B are views for explaining an example of the structure of a plasma display panel included in a plasma display device according to an embodiment of the present invention.

First, referring to FIG. 2A, a plasma display panel that may be included in a plasma display apparatus according to an embodiment of the present invention may include an electrode, preferably scan electrodes 202 and Y that are parallel to each other, and sustain electrodes 203 and Z. ) Is formed on the front panel 200 including the front substrate 201, and the electrodes intersecting the above-described scan electrodes 202 and Y and the sustain electrodes 203 and Z, preferably address electrodes 213 and X. ) May be formed by bonding the back panel 210 including the back substrate 211 formed thereon.

Here, the electrodes formed on the front substrate 201, preferably the scan electrodes 202 and Y and the sustain electrodes 203 and Z, generate a discharge in a discharge space, that is, a discharge cell, and at the same time Discharge can be maintained.

The dielectric layer, preferably on the upper surface of the front substrate 201 where the scan electrodes 202 and Y and the sustain electrodes 203 and Z are formed to cover the scan electrodes 202 and Y and the sustain electrodes 203 and Z. Upper dielectric layer 204 may be formed.

This upper dielectric layer 204 limits the discharge current of the scan electrodes 202 and Y and the sustain electrodes 203 and Z and can insulate between the scan electrodes 202 and Y and the sustain electrodes 203 and Z. have.

A protective layer 205 is formed on the top surface of the upper dielectric layer 204 to facilitate discharge conditions. The protective layer 205 may be formed through a method of depositing a material such as magnesium oxide (MgO) on the upper dielectric layer 204.

Meanwhile, electrodes, preferably address electrodes 213 and X, are formed on the rear substrate 211, and address electrodes 213 and X are disposed on the rear substrate 211 on which the address electrodes 213 and X are formed. A dielectric layer, preferably lower dielectric layer 215 may be formed to cover.

The lower dielectric layer 215 may insulate the address electrodes 213 and X.

On top of the lower dielectric layer 215, a discharge space, that is, a partition 212 such as a stripe type, a well type, a delta type, or a honeycomb type for partitioning the discharge cells, is formed. Can be formed. Accordingly, discharge cells such as red (R), green (G), and blue (B) may be formed between the front substrate 201 and the rear substrate 211.

In addition, in addition to the red (R), green (G), and blue (B) discharge cells, white (W) or yellow (Yellow: Y) discharge cells may be further formed.

Here, one or more of the plurality of discharge cells may be different in size from other discharge cells. For example, when the red (R), green (G), and blue (B) discharge cells are formed, the size of the blue (B) discharge cell is larger than that of the red (R) or green (G) discharge cell. Can be.

The partition 212 may be formed to have a differential height. For example, when the partition 212 includes a horizontal partition and a vertical partition crossing the horizontal partition, the heights of the vertical partition and the horizontal partition may be different. Alternatively, one or more of the horizontal bulkhead or the vertical bulkhead may be formed differentially in height. Alternatively, the heights of the vertical and horizontal partition walls may be substantially the same.

In addition, although not shown, one or more holes or depressions may be formed in the partition 212, and a channel having a predetermined depth may be formed.

Here, it is preferable that a predetermined discharge gas is filled in the discharge cells partitioned by the partition walls 212. In addition, the discharge gas preferably contains xenon (xeon: Xe).

In addition, a phosphor layer 214 that emits visible light for image display may be formed in the discharge cells partitioned by the partition wall 212. For example, red (R), green (G), and blue (B) phosphor layers may be formed.

In addition to the red (R), green (G), and blue (B) phosphors, it is also possible to further form a white (W) and / or yellow (Y) phosphor layer.

In the plasma display panel applicable to the plasma display device according to the exemplary embodiment described above, at least one or more of the scan electrodes 202 and Y, the sustain electrodes 203 and Z, and the address electrodes 213 and X may be used. When the driving signal is supplied, the discharge may occur in the discharge cell partitioned by the partition 212.

Then, vacuum ultraviolet rays are generated in the discharge gas filled in the discharge cells, and the vacuum ultraviolet rays are applied to the phosphor layer 214 formed in the discharge cells. Then, a predetermined visible light is generated in the phosphor layer 214, and the visible light is emitted to the outside through the front substrate 201 in which the upper dielectric layer 204 is formed. A predetermined image may be displayed on the outer surface.

Meanwhile, in the above description of FIG. 2A, only the case where the scan electrodes 202 and Y and the sustain electrodes 203 and Z are each formed of one layer is illustrated and described. However, the scan electrodes 202 and Y or the It is also possible that at least one of the sustain electrodes 203 and Z consists of a plurality of layers. This will be described with reference to FIG. 2B.

Referring to FIG. 2B, the scan electrodes 202 and Y and the sustain electrodes 203 and Z may each include a plurality of sides, for example, two layers.

In particular, in consideration of light transmittance and electrical conductivity, the scan electrodes 202 and Y and the sustain electrodes 203 and Z are opaque silver (Ag) to emit light generated in the discharge cell to the outside and to secure driving efficiency. Bus electrodes 202b and 203b and transparent electrodes 202a and 203a made of transparent indium tin oxide (ITO).

As such, the reason why the scan electrodes 202 and Y and the sustain electrodes 203 and Z include the transparent electrodes 202a and 203a is that when visible light generated in the discharge cells is emitted to the outside of the plasma display panel. To be released effectively.

In addition, the reason why the scan electrodes 202 and Y and the sustain electrodes 203 and Z include the bus electrodes 202b and 203b is that the scan electrodes 202 and Y and the sustain electrodes 203 and Z are transparent electrodes. In the case of including only 202a and 203a, the driving efficiency can be reduced because the electrical conductivity of the transparent electrodes 202a and 203a is relatively low, so that the transparent electrodes 202a and 203a can cause such a reduction in the driving efficiency. To compensate for the low electrical conductivity.

In the above description, only one example of the plasma display panel which can be applied to the plasma display apparatus according to the exemplary embodiment of the present invention is shown and described, and the present invention is not limited to the plasma display panel having the above-described structure. For example, in the above description, only the case where the upper dielectric layer 204 and the lower dielectric layer 215 are each one layer, at least one or more of the upper dielectric layer and the lower dielectric layer is a plurality of layers. It can also be layered.

Alternatively, a black layer (not shown) may be further formed on the partition 212 to prevent reflection of the external light due to the partition 212.

Alternatively, a black layer (not shown) may be further formed at a specific position on the front substrate 201 corresponding to the partition 212.

As such, the structure of the plasma display panel that may be applied to the plasma display apparatus according to the exemplary embodiment may be variously changed.

Next, FIG. 3 is a view for explaining fastening of the heat sink and the heat dissipation frame.

3, through-holes 310a and 310b through which predetermined fastening means 320a and 320b may pass may be formed in the heat sink 160.

In addition, fixing means 330a and 330b may be formed in the heat dissipation frame 110 to form fixing grooves 340a and 340b to which the fastening means 320a and 320b may be fixed. Pemnuts (PEM NUT) and the like may be applied to the fixing means 330a and 330b.

The heat dissipation frame 110 may include a driver, for example, a data drive integrated circuit 120, and a buffer sheet 300 to cover the data drive integrated circuit 120. In FIG. 3, for convenience of description, other components, such as a flexible substrate having a reference numeral 130 of FIG. 1, will be omitted.

Here, the buffer sheet 300 preferably has electrical and thermal conductivity, and preferably has elasticity.

The buffer sheet 300 prevents damage to the data drive integrated circuit 120 and also effectively transfers heat generated from the data drive integrated circuit 120 to the heat sink 160.

Here, the fastening means 320a, 320b preferably comprises a non-conductive material. For example, the fastening means 320a and 320b preferably include a resin material or a non-conductive metal material.

The fastening means 320a and 320b pass through the through holes 310a and 310b of the heat sink 160 to be fixed to the fixing grooves 340a and 340b of the fixing means 330a and 330b formed in the heat dissipation frame 110. Can be.

Then, the heat sink 160 is fixed to the heat dissipation frame 110, and the heat sink 160 and the heat dissipation frame 110 may be electrically independent. That is, the heat sink 160 is disposed on the heat dissipation frame 110 in an electrically independent state from the heat dissipation frame 110.

Accordingly, the heat sink may be electrically floating.

Then, radiation of electromagnetic waves during driving can be reduced.

For example, suppose that the heat dissipation frame 110 and the heat sink 160 are electrically connected differently from the present invention.

Then, the heat sink 160 is in a state of the ground GND rather than the floating state. On the other hand, when the ground is shaken during driving, the heat sink 160 serves as a radiation antenna of the electromagnetic waves, and thus the electromagnetic waves are emitted from the protrusions formed on the heat sink 160.

As a result, electromagnetic interference (EMI) occurs.

On the other hand, if the heat sink 160 is arranged to be electrically independent from the heat dissipation frame 110 as in the present invention, even if the ground is strongly shaken, radiation of electromagnetic waves does not occur, and as a result, the occurrence of electromagnetic interference is reduced. It can be done.

In the above description, one example of the driver is set as the data drive integrated circuit 120 because the data drive integrated circuit 120 performs a plurality of switching operations, so that electromagnetic waves are generated more frequently than other types of drivers. .

On the other hand, although the non-conductive fastening means was used to electrically separate the heat sink 160 from the heat dissipation frame 110, the heat dissipation frame 110 may be different from the heat sink 160 by using a predetermined adhesive means. It is also possible to attach the heat sink 160 to the heat dissipation frame 110 to be electrically independent. This is as follows.

4 is a view for explaining a first embodiment of the method for bonding the heat sink and the heat dissipation frame.

5 is a view for explaining a second embodiment of the method for bonding the heat sink and the heat dissipation frame.

First, referring to FIG. 4, the fixing means of 330a and 330b is omitted in the heat dissipation frame, and the through holes of 310a and 310b are omitted from the heat sink.

Instead, protrusions 440a and 440b may be formed on the heat dissipation frame 400, and adhesive layers 450a and 450b may be formed on the protrusions 440a and 440b. Here, the adhesive layers 450a and 450b preferably include a non-conductive material, and the adhesive layers 450a and 450b may have a sufficient thickness to keep the heat dissipation frame 400 and the heat sink 410 in an electrically independent state. It is preferable.

Here, reference numeral 420, which is not described, denotes a data drive integrated circuit, and reference numeral 430 denotes a buffer sheet.

Next, referring to FIG. 5, protrusions 540a and 540b may be formed on the heat sink 510, and adhesive layers 550a and 550b may be formed on the protrusions 540a and 540b. The adhesive layers 550a and 550b also preferably include a non-conductive material as in the case of FIG. 4, and the adhesive layers 550a and 550b electrically separate the heat radiating frame 500 and the heat sink 510. It is desirable to have sufficient thickness to leave it in the state.

Here, reference numeral 520 denotes a data drive integrated circuit, and reference numeral 530 denotes a buffer sheet.

4 to 5, the heat sink can be electrically independent from the heat dissipation frame while the heat sink is fixed to the heat dissipation frame without using the non-conductive fastening means.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

As described above in detail, the plasma display apparatus according to the exemplary embodiment of the present invention has an effect of reducing the occurrence of electromagnetic interference by disposing the heat sink and the heat dissipation frame electrically independently.

Claims (6)

A plasma display panel having electrodes formed thereon; A heat dissipation frame disposed on a rear surface of the plasma display panel; A driving unit disposed on the heat dissipation frame and supplying a driving signal to the electrode; And A heat sink disposed on an upper portion of the driving unit to be electrically independent of the heat dissipation frame and dissipating heat generated from the driving unit; Plasma display device comprising a. The method of claim 1, And the heat sink is fastened to the heat dissipation frame by a fastening means including a non-conductive material. The method of claim 2, And said fastening means comprises a resin material or a non-conductive metal material. The method of claim 1, And the heat sink is adhered to the heat dissipation frame by an adhesive means. The method of claim 1, And the heat sink is electrically floating. The method of claim 1, The electrode includes an address electrode, The driving unit includes a data drive integrated circuit for supplying a driving signal to the address electrode through a switching operation.

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