KR20060035171A - Method of manufacturing a flexible printed circuit board, flexible printed circuit board, display panel having the flexible printed circuit board and display device having the panel - Google Patents

Method of manufacturing a flexible printed circuit board, flexible printed circuit board, display panel having the flexible printed circuit board and display device having the panel Download PDF

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KR20060035171A
KR20060035171A KR1020040084535A KR20040084535A KR20060035171A KR 20060035171 A KR20060035171 A KR 20060035171A KR 1020040084535 A KR1020040084535 A KR 1020040084535A KR 20040084535 A KR20040084535 A KR 20040084535A KR 20060035171 A KR20060035171 A KR 20060035171A
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insulating member
signal lines
circuit board
width
cut
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KR1020040084535A
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Korean (ko)
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최길수
이건호
최선형
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삼성전자주식회사
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Publication of KR20060035171A publication Critical patent/KR20060035171A/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13452Conductors connecting driver circuitry and terminals of panels
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611Control of matrices with row and column drivers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/77Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/04Structural and physical details of display devices
    • G09G2300/0421Structural details of the set of electrodes

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

연성 회로기판 제조방법, 연성 회로기판, 연성 회로기판을 갖는 표시패널 및 표시패널을 갖는 표시장치가 개시된다. 연성 회로기판의 제조방법은 제 1 절연부재 상에 주기적으로 선폭이 감소된 절단부들이 형성된 신호선들을 형성하는 단계, 절단부들의 주변이 노출되도록 신호선들을 덮는 제 2 절연부재를 형성하는 단계 및 제 1 절연부재와 신호선들을 각 절단부에서 절단하는 단계를 포함한다. 이와 같이, 신호선의 절단부들이 각 신호선 몸체보다 좁은 폭을 가짐으로써, 절단부들이 절단될 때 발생되는 신호선들 간의 단락을 방지할 수 있다.A method for manufacturing a flexible circuit board, a flexible circuit board, a display panel having a flexible circuit board, and a display device having a display panel are disclosed. A method of manufacturing a flexible circuit board includes forming signal lines having cut portions periodically reduced in line width on the first insulating member, forming a second insulating member covering the signal lines so that the periphery of the cut portions are exposed, and the first insulating member. And cutting the signal lines at each cut portion. As such, since the cut portions of the signal lines have a narrower width than the signal line bodies, short circuits between the signal lines generated when the cut portions are cut can be prevented.

Description

연성 회로기판 제조방법, 연성 회로기판, 연성 회로기판을 갖는 표시패널, 표시패널을 갖는 표시장치{METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD, FLEXIBLE PRINTED CIRCUIT BOARD, DISPLAY PANEL HAVING THE FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE PANEL}TECHNICAL OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD, FLEXIBLE PRINTED CIRCUIT BOARD, DISPLAY PANEL HAVING THE FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE PANEL}

도 1은 본 발명의 제 1 실시예에 따른 연성 회로기판 제조방법의 제 1 단계를 도시한 평면도이다.1 is a plan view illustrating a first step in a method of manufacturing a flexible circuit board according to a first embodiment of the present invention.

도 2는 본 발명의 제 1 실시예에 따른 연성 회로기판 제조방법의 제 2 단계를 도시한 평면도이다.2 is a plan view illustrating a second step of the method of manufacturing a flexible printed circuit board according to the first embodiment of the present invention.

도 3은 도 2의 Ⅰ1 -Ⅰ2 선을 따라 절단한 단면도이다. 3 is a cross-sectional view taken along the line I1-I2 of FIG. 2.

도 4는 본 발명의 제 1 실시예에 따른 연성 회로기판 제조방법의 제 3 단계를 도시한 단면도이다.4 is a cross-sectional view illustrating a third step of the method of manufacturing a flexible printed circuit board according to the first embodiment of the present invention.

도 5는 본 발명의 제 2 실시예에 따른 연성 회로기판을 도시한 평면도이다.5 is a plan view illustrating a flexible circuit board according to a second exemplary embodiment of the present invention.

도 6은 도 5의 Ⅱ1-Ⅱ2 선을 따라 절단한 단면도이다.FIG. 6 is a cross-sectional view taken along the line II1-II2 of FIG. 5.

도 7은 본 발명의 제 3 실시예에 따른 표시패널을 도시한 단면도이다.7 is a cross-sectional view illustrating a display panel according to a third exemplary embodiment of the present invention.

도 8은 본 발명의 제 4 실시예에 따른 표시장치를 도시한 단면도이다.8 is a cross-sectional view illustrating a display device according to a fourth exemplary embodiment of the present invention.

<도면의 주요 부분에 대한 부호의 설명> <Description of the symbols for the main parts of the drawings>

10 : 제 1 절연부재 20 : 신호선     10: first insulating member 20: signal line                 

22 : 신호선 몸체 24 : 절단부    22: signal line body 24: cutout

30 : 제 2 절연부재 100 : 연성 회로기판    30: second insulating member 100: flexible circuit board

200 : 표시기판 300 : 표시패널    200: display substrate 300: display panel

400 : 광원 500 : 수납용기    400: light source 500: storage container

600 : 표시장치    600: display device

본 발명은 연성 회로기판, 연성 회로기판 제조방법, 연성 회로기판을 갖는 표시패널 및 표시패널을 갖는 표시장치에 관한 것이다.The present invention relates to a flexible printed circuit board, a flexible printed circuit board manufacturing method, a display panel having a flexible printed circuit board, and a display device having a display panel.

일반적으로, 이동통신 단말기, 디지털 카메라, 노트북, 모니터 등 여러 가지 전자기기는 외부로부터 입력되는 영상신호에 대응하여 영상을 표시하는 표시장치를 포함한다.In general, various electronic devices such as a mobile communication terminal, a digital camera, a notebook, a monitor, and the like include a display device for displaying an image in response to an image signal input from an external source.

표시장치는 다양한 종류, 예를 들면 음극선관 표시장치(Cathode-Ray Tube, CRT), 액정표시장치(Liquid Crystal Display, LCD), 플라즈마 표시패널(Plasma Display Panel, PDP), 필드방사표시장치(Field Emission Display, FED) 및 전기발광표시장치(Electro Luminescence, EL)가 있다. 이들 중, 액정표시장치(LCD)는 액정(liquid crystal)의 광학적 특성을 이용하여 영상을 표시한다. 액정표시장치(LCD)는 다른 표시장치들에 비하여 두께가 얇고 무게가 가벼우며, 낮은 소비전력 및 낮은 구동전압에서 작동하는 장점을 갖는다. Various types of display devices, for example, cathode-ray tube (CRT), liquid crystal display (LCD), plasma display panel (PDP), field radiation display device (Field) Emission Display (FED) and Electro Luminescence (EL). Among these, a liquid crystal display (LCD) displays an image by using optical characteristics of a liquid crystal. Liquid crystal displays (LCDs) have the advantages of being thinner and lighter than other displays and operating at low power consumption and low driving voltage.                         

종래 액정표시장치(LCD)는 광의 액정 투과율을 이용하여 영상을 표시하는 표시패널(display panel), 영상을 표시하도록 표시패널을 제어하는 구동신호를 발생시키는 인쇄회로기판(printed circuit board) 및 표시패널과 인쇄회로기판을 전기적으로 연결하여 구동신호를 표시패널로 전송하는 연성회로기판(flexible printed circuit board)을 포함한다.Conventional liquid crystal display (LCD) is a display panel for displaying an image by using the liquid crystal transmittance of light (printed circuit board) and a display panel for generating a drive signal for controlling the display panel to display the image And a flexible printed circuit board electrically connecting the printed circuit board and the driving signal to the display panel.

연성회로기판은 길이가 긴 테이프 형상을 갖는 베이스 몸체, 베이스 몸체 상에 배치된 신호선들을 포함하고, 베이스 몸체를 지정된 길이로 절단하여 제조된다.The flexible circuit board includes a base body having a long tape shape, signal lines disposed on the base body, and is manufactured by cutting the base body to a predetermined length.

그러나, 신호선들이 미세한 간격을 갖고 있기 때문에, 베이스 몸체를 절단하여 연성회로기판을 제조할 때, 절단된 신호선들 중 일부가 옆으로 밀리거나 신호선들의 절단면이 불균일하게 되어 신호선들이 상호 쇼트될 수 있고, 그 결과 영상의 표시품질이 저하되는 문제점을 갖는다.However, since the signal lines have a minute spacing, when cutting the base body to manufacture the flexible circuit board, some of the cut signal lines may be pushed to the side or the cutting lines of the signal lines may be uneven so that the signal lines may be mutually shorted. As a result, the display quality of the image is deteriorated.

따라서, 본 발명은 이러한 종래의 문제점을 감안한 것으로써, 본 발명의 제 1 목적은 연성회로기판을 제조하는 과정에서 신호선들이 쇼트되는 것을 방지한 연성 회로기판의 제조방법을 제공한다.Accordingly, the present invention has been made in view of such a conventional problem, and a first object of the present invention is to provide a method for manufacturing a flexible circuit board which prevents short circuit of signal lines in the process of manufacturing the flexible circuit board.

또한, 본 발명의 제 2 목적은 상기 제조방법에 의하여 제조된 연성 회로기판을 제공한다.In addition, a second object of the present invention to provide a flexible circuit board manufactured by the manufacturing method.

또한, 본 발명의 제 3 목적은 상기 연성 회로기판을 갖는 표시패널을 제공한다.In addition, a third object of the present invention is to provide a display panel having the flexible circuit board.

또한, 본 발명의 제 4 목적은 상기 표시패널을 갖는 표시장치를 제공한다.Further, a fourth object of the present invention is to provide a display device having the display panel.

이와 같은 본 발명의 제 1 목적을 달성하기 위한 연성 회로기판의 제조방법은 제 1 절연부재 상에 주기적으로 선폭이 감소된 절단부들이 형성된 신호선들을 형성하는 단계, 절단부들 주변이 노출되도록 신호선들을 덮는 제 2 절연부재를 형성하는 단계 및 제 1 절연부재와 신호선들을 각 절단부에서 절단하는 단계를 포함한다.In order to achieve the first object of the present invention, a method of manufacturing a flexible circuit board may include forming signal lines having cut portions having a reduced line width periodically on the first insulating member, and covering the signal lines to expose the periphery of the cut portions. Forming an insulating member and cutting the first insulating member and the signal lines at each cutting part;

또한, 이와 같은 본 발명의 제 2 목적을 달성하기 위한 연성 회로기판은 제 1 절연부재, 신호선들 및 제 2 절연부재를 포함한다. In addition, the flexible circuit board for achieving the second object of the present invention includes a first insulating member, signal lines and a second insulating member.

제 1 절연부재는, 예를 들어, 플랙시블한 성질을 갖는다. 신호선들은 제 1 절연부재 상에 제 1 폭으로 형성된 신호선 몸체들 및 각 신호선 몸체의 길이방향 양쪽 단부로부터 제 1 절연부재를 따라 연장되며 제 1 폭보다 좁은 제 2 폭을 가는 절단부들을 포함한다. 제 2 절연부재는 제 1 절연부재의 상부에 형성되며, 절단부들의 주변이 노출되도록 신호선 몸체들을 덮는다.The first insulating member has, for example, a flexible property. The signal lines include signal line bodies formed with a first width on the first insulating member and cut portions extending along the first insulating member from both longitudinal ends of each signal line body and having a second width narrower than the first width. The second insulating member is formed on the first insulating member, and covers the signal line bodies so that the periphery of the cut portions is exposed.

또한, 본 발명의 제 3 목적을 달성하기 위한 표시패널은 연성 회로기판 및 표시기판을 포함한다. In addition, a display panel for achieving the third object of the present invention includes a flexible circuit board and a display substrate.

연성 회로기판은 제 1 절연부재, 신호선들 및 제 2 절연부재를 포함한다. 제 1 절연부재는, 예를 들어, 플랙시블한 성질을 갖는다. 신호선들은 제 1 절연부재 상에 제 1 폭으로 형성된 신호선 몸체들 및 각 신호선 몸체의 길이방향 양쪽 단부로부터 제 1 절연부재를 따라 연장되며 제 1 폭보다 좁은 제 2 폭을 가는 절단부들을 포함한다. 제 2 절연부재는 제 1 절연부재의 상부에 형성되며, 절단부들의 주변 이 노출되도록 신호선 몸체들을 덮는다. 표시기판은 노출된 신호선과 전기적으로 연결되며, 영상을 표시한다. 또한, 본 발명의 제 4 목적을 달성하기 위한 표시장치는 표시패널, 광원 및 수납용기를 포함한다. The flexible circuit board includes a first insulating member, signal lines, and a second insulating member. The first insulating member has, for example, a flexible property. The signal lines include signal line bodies formed with a first width on the first insulating member and cut portions extending along the first insulating member from both longitudinal ends of each signal line body and having a second width narrower than the first width. The second insulating member is formed on the upper portion of the first insulating member and covers the signal line bodies so that the periphery of the cutting parts is exposed. The display substrate is electrically connected to the exposed signal line and displays an image. In addition, a display device for achieving the fourth object of the present invention includes a display panel, a light source, and a storage container.

표시패널은 연성 회로기판 및 표시기판을 포함한다. 연성 회로기판은 제 1 절연부재, 신호선들 및 제 2 절연부재를 포함한다. 제 1 절연부재는, 예를 들어, 플랙시블한 성질을 갖는다. 신호선들은 제 1 절연부재 상에 제 1 폭으로 형성된 신호선 몸체들 및 각 신호선 몸체의 길이방향 양쪽 단부로부터 제 1 절연부재를 따라 연장되며 제 1 폭보다 좁은 제 2 폭을 가는 절단부들을 포함한다. 제 2 절연부재는 제 1 절연부재의 상부에 형성되며, 절단부들의 주변이 노출되도록 신호선 몸체들을 덮는다. 표시기판은 노출된 신호선들과 전기적으로 연결되며, 영상을 표시한다. 광원은 광을 발생시켜 표시패널로 광을 제공한다. 수납용기는 표시패널 및 광원을 수납한다.The display panel includes a flexible circuit board and a display substrate. The flexible circuit board includes a first insulating member, signal lines, and a second insulating member. The first insulating member has, for example, a flexible property. The signal lines include signal line bodies formed with a first width on the first insulating member and cut portions extending along the first insulating member from both longitudinal ends of each signal line body and having a second width narrower than the first width. The second insulating member is formed on the first insulating member, and covers the signal line bodies so that the periphery of the cut portions is exposed. The display substrate is electrically connected to the exposed signal lines and displays an image. The light source generates light to provide light to the display panel. The storage container houses the display panel and the light source.

본 발명에 의하면, 신호선들의 각 절단부가 신호선 몸체들보다 좁은 폭을 가짐으로써, 절단부들이 절단될 때 발생되는 신호선들 간의 단락을 방지할 수 있다.According to the present invention, since each cut portion of the signal lines has a narrower width than the signal line bodies, it is possible to prevent a short circuit between the signal lines generated when the cut portions are cut.

이하, 첨부한 도면들을 참조하여, 본 발명의 바람직한 실시예들을 보다 상세하게 설명하기로 한다.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

연성 회로기판의 제조방법Manufacturing method of flexible circuit board

실시예 1Example 1

도 1은 본 발명의 제 1 실시예에 따른 연성 회로기판 제조방법의 제 1 단계 를 도시한 평면도이다.1 is a plan view illustrating a first step in a method of manufacturing a flexible circuit board according to a first embodiment of the present invention.

도 1을 참조하면, 본 실시예에 의한 연성 회로기판의 제조방법은, 우선, 제 1 절연부재(10) 상에 주기적으로 선폭이 감소된 절단부(24)들이 형성된 신호선(20)들을 형성한다. Referring to FIG. 1, in the method of manufacturing a flexible printed circuit board according to the present embodiment, first, signal lines 20 are formed on cutting portions 24 having a line width periodically reduced on the first insulating member 10.

본 실시예에 의한 신호선(20)들은, 예를 들어, 전기 전도성이 우수한 구리, 구리 합금, 알루미늄, 알루미늄 합금 등 을 포함하며, 신호선(20)들은 복수개가 병렬 방식으로 제 1 절연부재(10) 상에 배치된다.The signal lines 20 according to the present exemplary embodiment include, for example, copper, a copper alloy, aluminum, and an aluminum alloy having excellent electrical conductivity, and the plurality of signal lines 20 are parallel to the first insulating member 10. Is disposed on.

도 2는 본 발명의 제 1 실시예에 따른 연성 회로기판 제조방법의 제 2 단계를 도시한 평면도이다. 도 3은 도 2의 Ⅰ1 -Ⅰ2 선을 따라 절단한 단면도이다.2 is a plan view illustrating a second step of the method of manufacturing a flexible printed circuit board according to the first embodiment of the present invention. 3 is a cross-sectional view taken along the line I1-I2 of FIG. 2.

도 2 및 도 3을 참조하면, 이어서, 절단부(24)들의 주변이 노출되도록 제 1 절연부재(10) 상에는 제 2 절연부재(30)가 형성된다.2 and 3, a second insulating member 30 is formed on the first insulating member 10 so that the periphery of the cut portions 24 is exposed.

본 실시예에서, 제 2 절연부재(30)가 형성된 후, 대기중에 노출된 신호선(20)들이 산화되는 것을 억제하기 위해 노출된 신호선(20)들 상에는 도금층(26)이 더 형성될 수 있다. In the present embodiment, after the second insulating member 30 is formed, a plating layer 26 may be further formed on the exposed signal lines 20 to suppress oxidation of the signal lines 20 exposed to the atmosphere.

본 실시예에 의한 도금층(26)은, 예를 들어, 니켈 박막(26a) 및 금 박막(26b)의 이중층으로 구성될 수 있다. 이와 다르게, 도금층(26)은 무전해 도금 방식으로 신호선(20) 상에 형성된 주석 박막을 포함할 수 있다.The plating layer 26 according to the present embodiment may be formed of, for example, a double layer of the nickel thin film 26a and the gold thin film 26b. Alternatively, the plating layer 26 may include a tin thin film formed on the signal line 20 by an electroless plating method.

도 4는 본 발명의 제 1 실시예에 따른 연성 회로기판 제조방법의 제 3 단계를 도시한 단면도이다.4 is a cross-sectional view illustrating a third step of the method of manufacturing a flexible printed circuit board according to the first embodiment of the present invention.

도 4를 참조하면, 이어서, 제 1 절연부재(10), 제 2 절연부재(20) 및 신호선 (20)들은 각 절단부(24)에서 절단된다. 본 실시예에서, 각 절단부(24)에서 절단되는 절단선(24a)은 신호선(20)에 대하여 실질적으로 수직한 방향으로 형성되는 것이 바람직하다.Referring to FIG. 4, the first insulating member 10, the second insulating member 20, and the signal lines 20 are cut at each cut portion 24. In the present embodiment, it is preferable that the cutting lines 24a cut at each cutting portion 24 are formed in a direction substantially perpendicular to the signal lines 20.

이와 같이, 신호선(20)들에 형성된 각 절단부(24)의 폭을 신호선 몸체(22)들의 폭보다 좁게 형성함으로써, 제 1 절연부재(10) 및 제 2 절연부재(30)의 사이에 형성된 신호선(20)들이 절단될 때 신호선(20)들이 쇼트되는 것을 방지할 수 있다.
As such, the width of each cutout 24 formed in the signal lines 20 is smaller than the width of the signal line bodies 22, thereby forming a signal line formed between the first insulating member 10 and the second insulating member 30. It is possible to prevent the signal lines 20 from shorting when they are cut.

연성 회로기판Flexible circuit board

실시예 2Example 2

도 5는 본 발명의 제 2 실시예에 따른 연성 회로기판을 도시한 평면도이다. 도 6은 도 5의 Ⅱ1-Ⅱ2 선을 따라 절단한 단면도이다.5 is a plan view illustrating a flexible circuit board according to a second exemplary embodiment of the present invention. FIG. 6 is a cross-sectional view taken along the line II1-II2 of FIG. 5.

도 5 및 도 6을 참조하면, 본 실시예에 의한 연성 회로기판(100)은 제 1 절연부재(10), 신호선(20)들 및 제 2 절연부재(30)를 포함한다.5 and 6, the flexible circuit board 100 according to the present exemplary embodiment includes a first insulating member 10, signal lines 20, and a second insulating member 30.

본 실시예에 의한 제 1 절연부재(10)는, 예를 들어, 쉽게 구부러질 수 있도록 플랙시블(flexible)한 성질을 갖고, 플레이트 형상을 갖는 합성수지로 이루어질 수 있다.The first insulating member 10 according to the present exemplary embodiment may be made of a synthetic resin having a flexible property and having a plate shape so as to be easily bent, for example.

본 실시예에 의한 신호선(20)들은 신호선 몸체(22)들 및 절단부(24)들을 포함하며, 전기 전도성이 우수한 금속, 예를 들어, 구리, 구리 합금, 알루미늄, 알루미늄 합금 등으로 이루어질 수 있다.The signal lines 20 according to the present exemplary embodiment include the signal line bodies 22 and the cutting parts 24, and may be made of a metal having excellent electrical conductivity, for example, copper, copper alloy, aluminum, aluminum alloy, or the like.

신호선 몸체(22)들은 제 1 폭을 갖으며, 제 1 절연부재(10) 상에, 예를 들 어, 복수개가 병렬 방식으로 배치된다.The signal line bodies 22 have a first width and are arranged on the first insulating member 10, for example, in plurality in parallel.

절단부(24)들은 신호선 몸체(22)들의 길이방향의 양쪽 단부로부터 제 1 절연부재(10)를 따라 연장되며, 신호선 몸체(22)들의 제 1 폭보다 좁은 제 2 폭을 갖는다.The cut portions 24 extend along the first insulating member 10 from both ends in the longitudinal direction of the signal line bodies 22 and have a second width narrower than the first width of the signal line bodies 22.

본 실시예에 의한 제 2 절연부재(30)는 제 1 절연부재(10)의 상부에 형성되며, 절단부(24)들의 주변, 예를 들어, 절단부(24)들 및 신호선 몸체(22)들의 일부가 노출되도록 신호선(20)들을 덮는다.The second insulating member 30 according to the present embodiment is formed on the upper portion of the first insulating member 10, and is surrounded by the cut portions 24, for example, part of the cut portions 24 and the signal line bodies 22. The signal lines 20 are covered so as to expose.

본 실시예에서, 노출된 신호선(20)들 상에는 신호선(20)들이 산화되는 것을 억제하기 위해 도금층(26)이 형성된다. 본 실시예에 의한 도금층(26)은, 예를 들어, 니켈 박막(26a) 및 금 박막(26b)의 이중층으로 구성될 수 있다.In the present embodiment, the plating layer 26 is formed on the exposed signal lines 20 to suppress the oxidation of the signal lines 20. The plating layer 26 according to the present embodiment may be formed of, for example, a double layer of the nickel thin film 26a and the gold thin film 26b.

이와 같이, 신호선(20)들의 각 절단부(24)가 신호선 몸체(22)들보다 좁은 폭을 가지도록 제 1 절연부재(30) 상에 형성됨으로써, 절단부(24)들이 절단될 때 발생되는 신호선(20)들 간의 단락을 방지할 수 있다.
As such, each cutout portion 24 of the signal lines 20 is formed on the first insulating member 30 to have a narrower width than the signal line bodies 22, thereby generating a signal line that is generated when the cutout portions 24 are cut off. It is possible to prevent a short circuit between the 20).

표시패널Display panel

실시예 3Example 3

도 7은 본 발명의 제 3 실시예에 따른 표시패널을 도시한 단면도이다. 본 발명의 제 3 실시예에 의한 연성 회로기판은 앞서 설명한 제 2 실시예의 연성 회로기판과 동일한 구성을 가짐으로 그 중복된 설명은 생략하기로 하며, 동일한 구성 요소에 대해서는 동일한 참조부호 및 명칭을 사용하기로 한다. 7 is a cross-sectional view illustrating a display panel according to a third exemplary embodiment of the present invention. Since the flexible circuit board according to the third embodiment of the present invention has the same configuration as the flexible circuit board of the second embodiment described above, duplicate description thereof will be omitted, and the same reference numerals and names are used for the same components. Let's do it.                     

도 7을 참조하면, 본 실시예에 의한 표시패널(300)은 연성 회로기판(100) 및 표시기판(200)을 포함한다.Referring to FIG. 7, the display panel 300 according to the present exemplary embodiment includes a flexible circuit board 100 and a display substrate 200.

본 실시예에 의한 표시기판(200)은 광을 이용하여 영상을 표시하며, 연성 회로기판(100)의 신호선(20)들과 전기적으로 연결된다. The display substrate 200 according to the present exemplary embodiment displays an image using light, and is electrically connected to the signal lines 20 of the flexible circuit board 100.

본 실시예에 의한 표시기판(200)은 예를 들어, 제 1 기판(210), 제 2 기판(220) 및 액정층(230)을 포함한다.The display substrate 200 according to the present exemplary embodiment includes, for example, a first substrate 210, a second substrate 220, and a liquid crystal layer 230.

제 1 기판(210)은 복수개가 매트릭스 형태으로 배치된 화소전극(pixel electrode)들, 각 화소전극마다 배치되어 각 화소전극으로 구동전압을 인가하는 박막 트랜지스터(Thin Film Transistor, TFT)들 및 박막 트랜지스터(TFT)들을 각각 작동시키기 위한 박막 신호선(signal line; 212)들을 포함한다.The first substrate 210 includes a plurality of pixel electrodes arranged in a matrix form, thin film transistors (TFTs), and thin film transistors disposed at each pixel electrode to apply a driving voltage to each pixel electrode. Thin film signal lines 212 for operating the respective TFTs.

본 실시예에 의한 각 박막 신호선(212)은, 예를 들면, 제 1 기판(210)의 가장자리까지 연장되어, 연성 회로기판(100)의 신호선(20)들에 형성된 도금층(26)과 전기적으로 연결된다.Each of the thin film signal lines 212 according to the present exemplary embodiment may extend to the edge of the first substrate 210 to be electrically connected to the plating layer 26 formed on the signal lines 20 of the flexible circuit board 100. Connected.

제 2 기판(220)은 제 1 기판(210)과 마주보도록 배치된다. 제 2 기판(220)은 제 2 기판(220) 중 제 1 기판(210)에 형성된 화소전극과 마주보는 면에 형성되며 투명하면서 도전성인 공통 전극(common electrode), 각 화소전극들과 마주보는 곳에 배치된 컬러필터(color filter)들을 포함한다. The second substrate 220 is disposed to face the first substrate 210. The second substrate 220 is formed on a surface of the second substrate 220 that faces the pixel electrode formed on the first substrate 210 and is transparent and conductive to the common electrode, where each pixel electrode faces each other. Disposed color filters.

컬러필터들은 백색광 중 적색광을 선택적으로 통과시키는 적색 컬러필터, 백색광 중 녹색광을 선택적으로 통과시키는 녹색 컬러필터 및 백색광 중 청색광을 선택적으로 통과시키는 청색 컬러필터들을 포함한다. The color filters include a red color filter selectively passing red light of white light, a green color filter selectively passing green light of white light, and blue color filters selectively passing blue light of white light.                     

액정층(230)은 제 1 기판(210) 및 제 2 기판(220)의 사이에 개재되며, 화소전극 및 공통 전극의 사이에 형성된 전계에 의하여 재배열된다. 재배열된 액정층(230)에 의하여 외부의 광 발생장치(미도시)에서 발생한 광의 광 투과율은 조절되고, 액정층(230)에 의하여 조절된 광은 컬러필터들을 통과함으로써 영상이 표시된다.The liquid crystal layer 230 is interposed between the first substrate 210 and the second substrate 220 and is rearranged by an electric field formed between the pixel electrode and the common electrode. The light transmittance of light generated by an external light generator (not shown) is controlled by the rearranged liquid crystal layer 230, and the light controlled by the liquid crystal layer 230 passes through color filters to display an image.

본 실시예에 의한 표시패널(300)은 구동신호를 발생시키는 인쇄회로기판(미도시)을 더 포함할 수 있다.The display panel 300 according to the present exemplary embodiment may further include a printed circuit board (not shown) for generating a driving signal.

인쇄회로기판은 영상신호를 처리하는 구동회로를 포함하고, 구동회로는 외부로부터 입력된 영상신호를 박막 트랜지스터(TFT)를 제어하는 구동신호로 변경시킨다.The printed circuit board includes a driving circuit for processing an image signal, and the driving circuit converts the image signal input from the outside into a driving signal for controlling the thin film transistor TFT.

본 실시예에서, 연성 회로기판(300)은 인쇄회로기판과 제 1 기판(210)을 전기적으로 연결하여 인쇄회로기판에서 발생된 구동신호를 제 1 기판(210)으로 전송한다.
In the present exemplary embodiment, the flexible circuit board 300 electrically connects the printed circuit board and the first substrate 210 to transmit driving signals generated from the printed circuit board to the first substrate 210.

표시장치Display

실시예 4Example 4

도 8은 본 발명의 제 4 실시예에 따른 표시장치를 도시한 단면도이다. 본 발명의 제 4 실시예에 의한 표시패널은 앞서 설명한 제 3 실시예의 표시패널과 동일한 구성을 가짐으로 그 중복된 설명은 생략하기로 하며, 동일한 구성 요소에 대해서는 동일한 참조부호 및 명칭을 사용하기로 한다. 8 is a cross-sectional view illustrating a display device according to a fourth exemplary embodiment of the present invention. Since the display panel according to the fourth embodiment of the present invention has the same configuration as the display panel of the third embodiment described above, duplicate description thereof will be omitted, and the same reference numerals and names will be used for the same components. do.                     

도 8을 참조하면, 본 실시예에 의한 표시장치(600)는 표시패널(300), 광원(400) 및 수납용기(500)를 포함한다.Referring to FIG. 8, the display device 600 according to the present exemplary embodiment includes a display panel 300, a light source 400, and a storage container 500.

본 실시예에 의한 광원(400)은, 예를 들어, 표시패널(300)의 하부에 배치고, 광을 발생시켜 표시패널(300)로 광을 제공한다. 본 실시예에서, 광원(400)은, 예를 들어, 열 방출량이 낮은 냉음극 형광램프(Cold Cathode Fluorescent Lamp : CCFL)가 사용될 수 있다.The light source 400 according to the present exemplary embodiment is disposed below the display panel 300 and generates light to provide light to the display panel 300. In the present embodiment, for example, a cold cathode fluorescent lamp (CCFL) having a low heat emission amount may be used as the light source 400.

본 실시예에 의한 수납용기(500)는 표시패널(300) 및 광원(400)을 수납하여, 표시패널(300) 및 광원(400)을 외부의 충격으로부터 보호한다.The storage container 500 according to the present embodiment accommodates the display panel 300 and the light source 400 to protect the display panel 300 and the light source 400 from external impact.

이와 같은 본 발명에 의하면, 신호선들의 각 절단부가 신호선 몸체들보다 좁은 폭을 가짐으로써, 절단부들이 절단될 때 발생되는 신호선들 중 일부의 밀림현상 및 신호선들 상에 불순물 발생을 억제할 수 있고, 그 결과 신호선들 간의 단락을 방지하여 표시장치의 영상의 표시품질이 향상될 수 있다.According to the present invention, since each cut portion of the signal lines has a narrower width than the signal line bodies, it is possible to suppress the occurrence of impurities on some of the signal lines generated when the cut portions are cut and the occurrence of impurities on the signal lines. As a result, display quality of an image of the display device may be improved by preventing a short circuit between signal lines.

앞서 설명한 본 발명의 상세한 설명에서는 본 발명의 바람직한 실시예들을 참조하여 설명하였지만, 해당 기술분야의 숙련된 당업자 또는 해당 기술분야에 통상의 지식을 갖는 자라면 후술될 특허청구범위에 기재된 본 발명의 사상 및 기술 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다. In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

Claims (10)

제 1 절연부재 상에 주기적으로 선폭이 감소된 절단부들이 형성된 신호선들을 형성하는 단계;Forming signal lines on the first insulating member, the cut lines having periodically reduced line widths; 상기 절단부들의 주변이 노출되도록 상기 신호선들을 덮는 제 2 절연부재를 형성하는 단계; 및Forming a second insulating member covering the signal lines so that the periphery of the cut portions are exposed; And 상기 제 1 절연부재 및 상기 신호선들을 상기 각 절단부에서 절단하는 단계를 포함하는 연성 회로기판의 제조방법.And cutting the first insulating member and the signal lines at each cut portion. 제 1 항에 있어서, 상기 제 2 절연부재를 형성하는 단계는The method of claim 1, wherein the forming of the second insulating member 상기 절단부들의 주변이 노출되도록 상기 신호선들을 덮는 제 2 절연부재를 형성하는 단계; 및Forming a second insulating member covering the signal lines so that the periphery of the cut portions are exposed; And 상기 신호선들이 산화되는 것을 억제하기 위해 노출된 상기 신호선들 상에 도금층을 형성하는 단계를 포함하는 것을 특징으로 하는 연성 회로기판의 제조방법.And forming a plating layer on the exposed signal lines to suppress the signal lines from being oxidized. 제 2 항에 있어서, 상기 도금층은 니켈 박막 및 금 박막의 이중층으로 형성되는 것을 특징으로 하는 연성 회로기판의 제조방법The method of claim 2, wherein the plating layer is formed of a double layer of a nickel thin film and a gold thin film. 제 1 절연부재;A first insulating member; 상기 제 1 절연부재 상에 제 1 폭으로 형성된 신호선 몸체들 및 상기 각 신호선 몸체의 길이방향 양쪽 단부로부터 상기 제 1 절연부재를 따라 연장되며 상기 제 1 폭보다 좁은 제 2 폭을 갖는 절단부들을 포함하는 신호선들; 및Signal line bodies formed on the first insulating member with a first width and cut portions extending along the first insulating member from both longitudinal ends of the respective signal line bodies and having a second width narrower than the first width. Signal lines; And 상기 제 1 절연부재의 상부에 형성되며, 상기 절단부들의 주변이 노출되도록 상기 신호선들을 덮는 제 2 절연부재를 포함하는 연성 회로기판.And a second insulating member formed on the first insulating member and covering the signal lines to expose the periphery of the cut portions. 제 4 항에 있어서, 상기 노출된 신호선들 상에는 상기 신호선들이 산화되는 것을 억제하기 위한 도금층이 형성되는 것을 특징으로 하는 연성 회로기판.The flexible circuit board of claim 4, wherein a plating layer is formed on the exposed signal lines to prevent the signal lines from being oxidized. 제 5 항에 있어서, 상기 도금층은 니켈 박막 및 금 박막의 이중층으로 형성되는 것을 특징으로 하는 연성 회로기판.The flexible circuit board of claim 5, wherein the plating layer is formed of a double layer of a nickel thin film and a gold thin film. 제 1 절연부재, 상기 제 1 절연부재 상에 제 1 폭으로 형성된 신호선 몸체들과 상기 각 신호선 몸체의 길이방향 양쪽 단부로부터 상기 제 1 절연부재를 따라 연장되며 상기 제 1 폭보다 좁은 제 2 폭을 갖는 절단부들을 포함하는 신호선들, 및 상기 제 1 절연부재의 상부에 형성되며 상기 절단부들의 주변이 노출되도록 상기 신호선들을 덮는 제 2 절연부재를 포함하는 연성 회로기판; 및The first insulating member, the signal line bodies formed with a first width on the first insulating member, and a second width extending along the first insulating member from both ends in the longitudinal direction of each signal line body and narrower than the first width. A flexible circuit board including signal lines including cut lines having a cut portion, and a second insulating member formed on an upper portion of the first insulating member and covering the signal lines to expose the periphery of the cut portions; And 상기 노출된 신호선들과 전기적으로 연결되며, 영상을 표시하는 표시기판을 포함하는 것을 특징으로 하는 표시패널.And a display substrate electrically connected to the exposed signal lines and displaying an image. 제 7 항에 있어서, 상기 노출된 신호선들 상에는 상기 신호선들이 산화되는 것을 억제하기 위한 도금층이 형성되는 것을 특징으로 하는 표시패널.The display panel of claim 7, wherein a plating layer is formed on the exposed signal lines to prevent the signal lines from being oxidized. 제 1 절연부재, 상기 제 1 절연부재 상에 제 1 폭으로 형성된 신호선 몸체들과 상기 각 신호선 몸체의 길이방향 양쪽 단부로부터 상기 제 1 절연부재를 따라 연장되며 상기 제 1 폭보다 좁은 제 2 폭을 갖는 절단부들을 포함하는 신호선들 및 상기 제 1 절연부재의 상부에 형성되며 상기 절단부들의 주변이 노출되도록 상기 신호선들을 덮는 제 2 절연부재를 포함하는 연성 회로기판, 및 상기 노출된 신호선들과 전기적으로 연결되며, 영상을 표시하는 표시기판을 포함하는 표시패널;The first insulating member, the signal line bodies formed with a first width on the first insulating member, and a second width extending along the first insulating member from both ends in the longitudinal direction of each signal line body and narrower than the first width. A flexible circuit board including signal lines including cut lines having a cut portion and a second insulating member formed on an upper portion of the first insulating member and covering the signal lines to expose the periphery of the cut portions, and electrically connected to the exposed signal lines. A display panel including a display substrate displaying an image; 광을 발생시켜 상기 표시 패널로 상기 광을 제공하는 광원; 및A light source generating light to provide the light to the display panel; And 상기 표시패널 및 상기 광원을 수납하는 수납용기를 포함하는 것을 특징으로 하는 표시장치.And a storage container accommodating the display panel and the light source. 제 9 항에 있어서, 상기 노출된 신호선들 상에는 상기 신호선들이 산화되는 것을 억제하기 위한 도금층이 형성되는 것을 특징으로 하는 표시장치.The display device of claim 9, wherein a plating layer is formed on the exposed signal lines to prevent the signal lines from being oxidized.
KR1020040084535A 2004-10-21 2004-10-21 Method of manufacturing a flexible printed circuit board, flexible printed circuit board, display panel having the flexible printed circuit board and display device having the panel KR20060035171A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10448499B2 (en) 2018-01-25 2019-10-15 Gigalane Co., Ltd. Flexible printed circuit board with narrower line width

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10448499B2 (en) 2018-01-25 2019-10-15 Gigalane Co., Ltd. Flexible printed circuit board with narrower line width

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