KR20060028834A - Dicing film and manufacturing method for stacked csp containing two layer die adhesive films with different adhension strength - Google Patents

Abstract

The present invention relates to a dicing film for a semiconductor chip package having a different adhesive strength of two layers and a method of manufacturing the same. In an embodiment, a dicing film used for a semiconductor chip package includes two adhesive layers having different adhesive strengths. An adhesive film forming two adhesive layers; It characterized in that it comprises an adhesive film for dicing adhered to any one side of the adhesive film.

Semiconductor, Wafer, Die, Film, Adhesive Sheet, Chip, Polyolefin, Epoxy, Silica

Description

Dicing film and manufacturing method for stacked CSP containing two layer die adhesive films with different adhension strength

The following drawings, which are attached in this specification, illustrate preferred embodiments of the present invention, and together with the detailed description of the present invention, serve to further understand the technical spirit of the present invention. It should not be construed as limited to.

1 is a semiconductor package process diagram using a conventional dicing film.

Figure 2 is a cross-sectional view of the adhesive film obtained through a first process according to the present invention.

3 is a cross-sectional view of the adhesive film obtained through a second process according to the present invention.

Figure 4 is a cross-sectional view of the die-bonding film obtained through the process diagram and bonding the adhesive films obtained through the first process and the second process according to the present invention.

Figure 5 is a cross-sectional view of the bi-functional dicing film combined dicing film and dicing film according to the present invention.

6 is a graph of experimental results showing the relationship between die bonding temperature and peel force according to the first embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

11: adhesive film

12: release film

13: adhesive film

14: dicing film

The present invention relates to a dicing film for a semiconductor chip package manufactured by integrating a die-bonding adhesive sheet and a die bonding film applied to a high-performance semiconductor package, and in particular, a dicing film for a semiconductor chip package having two different adhesion strengths. And to a method for producing the same.

1 shows a semiconductor package process for a window chip size package (WCSP) using a dicing film 10 of a conventional single layer substrate.

This adheres the dicing film 10 to the back surface of the prepared wafer 1 and dicing the wafer into the dicing plate 3. The diced wafer is picked up by the collet 6, die-bonded to the PCB 5, and then subjected to a heat bonding process through heat treatment. After the bonding process, the semiconductor package is formed through molding and heat treatment.

Here, the dicing film consists only of a polyolefin adhesive film coated with an acrylic adhesive layer, and in the case of a dicing film for stacked CSP, which is commercially available in recent years, polyimide Alternatively, an epoxy-based die adhesive film is applied together to provide convenience for simultaneous die bonding and dicing.

However, unlike a dicing film intended only for dicing, it is difficult to simultaneously drop the die 7 and the die adhesive film 4 during the pickup process. In the process of adhering the die adhesive film 4 to the back surface of the wafer 1, bubbles may be generated.

In order to satisfy the above conditions, the dicing film, which is composed together with a die adhesive film, uses heat-peelable, pressure-sensitive and photosensitive materials, and dicing Ultraviolet irradiation and heat treatment after the process facilitate the pickup process of the die (die) / die adhesive film (die adhesive film).

However, these technologies reveal the limitation of the peeling force between the adhesive sheet for dicing and the die adhesive film according to the complexity of the process through UV irradiation and the heat and UV irradiation amount.

Another component of the dicing film for the stacked chip size package (CSP), the die adhesive film, must be evaluated for its reliability through the test results presented by JEDEC / IPC. The evaluation items considered in the technology include the Moisture Resistance Test (MRT) test, which is a moisture absorption and IR reflow resistance evaluation that defines the storage of semiconductor packages before board mounting, and the PCT (High Temperature, High Humidity, and High Pressure Resistance). Pressure Cook Test), and HAST (Highly Accelerated Tempe-rature and Humidity Stress Test), which evaluates the resistance to high temperature and high humidity while flowing a bias current for reliability evaluation when the semiconductor is actually operating.

The present invention is to solve the problems of the prior art as described above, consisting of two layers having different adhesive strength for high adhesion force with the die and low peel force with the dicing adhesive film, the pick-up process is easy, wafer adhesion It is an object of the present invention to provide a dicing film for a semiconductor chip package and a method of manufacturing the same, which do not cause bubbles.

Specific means of the present invention for achieving the above object,

In the dicing film used for the semiconductor chip package,

An adhesive film forming two adhesive layers having adhesive strengths of different sizes;

It is achieved by including an adhesive film for dicing adhered to either side of the adhesive film.

The adhesive film applied to the present invention includes silica added in an appropriate amount to polyimide or epoxy.

Dicing pressure-sensitive adhesive film applied to the present invention is characterized in that the polyolefin-based is adhered acrylic on either side.

According to the present invention, the adhesive film to which a relatively large amount of silica and solid epoxy is added is bonded to the dicing adhesive film.                         

According to the present invention, the adhesive film to which the relatively small amount of silica and solid epoxy is added is bonded to the dicing adhesive film.

According to the present invention, a PET release film is further attached to the adhesive film having a relatively high adhesive strength.

On the other hand, according to the manufacturing method of the dicing film for semiconductor chip package having different adhesive strength of the two layers of the present invention,

A first step of preparing a first adhesive film by coating and adhering an adhesive solution containing silica to polyimide or epoxy on a release film of PET to a thickness of 100 μm or less and then covering the protective film of PET material;

A second process of manufacturing a second adhesive film by coating and adhering the adhesive liquid, which has relatively more silica added on the release film of PET material, to a thickness of 100 μm or less, and then covering the protective film of the PET material. and;

A third step of manufacturing the die-bonding film by bonding the first adhesive film and the second adhesive film obtained through the first and second steps with each other without the protective film while removing the protective film;

A fourth step of attaching the polyolefin-based dicing adhesive film to the removed adhesive surface at the same time as removing the release film on one side of the die adhesive film prepared in the third step; It is characterized in that it is manufactured through.

The present invention is largely composed of a polyolefin adhesive film and a die adhesive film.

More specifically, a die adhesive film composed of an adhesive film having a high adhesive strength with a die and an adhesive film having a low adhesive strength with a dicing adhesive film, and an adhesive film for dicing on the die adhesive film ( It consists of a dicing film for staked CSP coated with a dicing film.

That is, the dicing film for a semiconductor chip package of the present invention is a relatively high adhesive film 11, as shown in Figure 4, the adhesive film 13 and a dicing for a relatively low adhesive strength to the adhesive film 11 The adhesive film 14 is composed of essential components.

In order to satisfy these conditions, first, two types of die adhesive films 11 and 13 are coated on a base film, and different adhesive films 11 and 13 are combined. The step of combining, and the die adhesive film (Die adhesive film) 11, 13 thus prepared is combined with the dicing adhesive film (14).

Hereinafter, a method of manufacturing a dicing film for a semiconductor chip package according to the present invention will be described in detail.

<Step 1>

(Step of preparing adhesive film with high adhesive strength with die)

As shown in FIG. 2, the release film 12 having polyethylene terephthalate (PET) as a base film has a high adhesive strength with a die at a thickness of 100 μm or less, more preferably 5 to 75 μm. The adhesive film 11 is coated. In order to satisfy the thickness of the die adhesive film described above, the line speed and discharge amount of the coater and the distance between the lip pad are precisely adjusted.

A heating process is involved to make the liquid coating liquid into the form of a film on the release film 12, and the heat-treated die adhesive film is irradiated with ultraviolet rays to maintain a B-stage state. do. The adhesive film (Die adhesive film) 11, which has been irradiated with UV light, is preferably maintained at 25 to 70 gf / cm of adhesive force with the release film 12, and protects the film from the roller of the coater. Cover the polyethylene terephthalate (PET) protective film 12 again. Figure 2 shows the configuration of the adhesive film (Die adhesive film) 20 obtained through the above process.

<Step 2>

(Step of preparing an adhesive film with low adhesion with dicing film)

In order to weaken the adhesive force with the polyolefin dicing film coated with an acrylic adhesive layer, 5-15 phr of silica was added to the stock solution of the adhesive film used in the first step, and the amount of solid epoxy was added. 2% wt or more compared to the liquid epoxy was mixed.

As shown in FIG. 3, a thickness of 100 μm or less, more preferably 5 to 75 μm, is coated on the release film 12 using polyethylene terephthalate (PET) as a base film. In addition, in order to satisfy the thickness of the die adhesive film 13, the line speed and discharge amount of the coater and the distance between the lip pad are precisely adjusted. In order to maintain the shape of the film is heated and irradiated with ultraviolet rays, the adhesive strength of the adhesive film (Die adhesive film) and the release film after the ultraviolet irradiation is preferably maintained at 25 ~ 70gf / cm as in the first step. The polyethylene terephthalate (PET) protective film is again covered to protect the adhesive film from the coater's roller, and FIG. 3 shows a die adhesive film 30 obtained through the above process. The schematic is shown.

<Step 3>

(Joining process of adhesive film with different adhesive strength)

The adhesive films obtained through the first and second processes form one die adhesive film through a lamination roll. At this time, the temperature of the lamination roll (lamination roll) 20 to be used is set to 40 ~ 80 ℃, one side of the polyethylene terephthalate (PET) release film 12 covering both sides of the adhesive film before passing through the lamination roll. When peeling off the lamination roll while peeling off, it is carried out by setting the working conditions so that the surfaces without the release film 12 can be bonded to each other. 4 shows a configuration diagram and a process diagram of a die adhesive film 40 obtained through the above process.

<Step 4>

(Joining process of die adhesive film and adhesive film for dicing)

When two adhesive films 20 and 30 having different adhesive strengths form one die adhesive film 40, as shown in FIG. 5, a polyolefin-based dicing film ( 14) and the bonding process is carried out.

The step of preparing the dicing adhesive film 14 and the process of combining the die adhesive film (40) prepared above is a polyethylene terephthalate (PET) protective film that protects both sides of the die adhesive film It involves the step of peeling off one side and the step of adhering the adhesive film for dicing through a lamination roll.

At this time, the polyethylene terephthalate (PET) release film to be peeled off is a surface protecting the adhesive film obtained through the second process, and peeled off at the same time with the adhesive film for dicing and the temperature of 40 ~ 80 ℃ through a lamination roll Will merge.

After the bonding process between the above-mentioned die adhesive film and the adhesive film for dicing, the adhesive force at the two interfaces should be maintained at 100 gf / cm or more, more preferably 150 gf / cm ~ 300 gf / cm or more Do. FIG. 5 shows a cross section of a dicing film 50 for a semiconductor chip package in which a die adhesive film and a dicing adhesive film are manufactured.

<Step 5>

(Wafer back bonding process and dicing process)

The dicing film 50 for stacked CSP manufactured through the above process should peel off the polyethylene terephthalate (PET) release film of the adhesive film obtained through the first process before performing the wafer backside lamination process. . The die adhesive film is exposed to the back side of the wafer where the circuit is not formed, and a polyethylene terephthalate (PET) protective film that has been released to protect the upper portion of the wafer is used. Cover. In addition, in order to enhance the adhesive force between the die adhesive film and the back surface of the wafer, the temperature and the feed rate of the lamination roller are controlled at room temperature to 180 ° C, more preferably 70 ° C to 120 ° C. The adhesion process is carried out at a constant rate of 1-5 m / min at ℃.

Wafer dicing film, shrinkable film, and dicing adhesive film, which has been completed with wafer backside lamination, are used for wafer dicing, washing, and drying process, as in the conventional dicing process. Through the process of the pickup (pickup) process. At this time, the drying process before the pick-up process is carried out in two stages.

First, the surface washed with water is blown dry air (Dry Air), and second, the heat is dried for 1 to 5 minutes at 80 ℃ ~ 200 ℃ preferably 100 ℃ ~ 170 ℃.

This drying process not only removes residual moisture, but also enhances the adhesion between the wafer and the die adhesive film, thereby increasing the pick-up process of the die / die adhesive film. You can proceed smoothly.

<Step 6>

(Mounting process)

The die adhesive film obtained through the above process should be picked up together with the die, and then transferred to a mounting process in which the die is placed on the substrate surface.

The mounting process consists of preparing a PCB circuit board, selecting a location for the die to rise, and applying pressure and heat. In order to bond a relatively inadequate die adhesive film onto a PCB substrate, bonding should be performed at a pressure of 0.5 to 5 MPa and a temperature of 100 to 250 ° C. for 0.5 to 5 seconds, more preferably. Preferably, the bonding operation is performed at a temperature of 120 to 200 ° C. under a pressure of 1 to 4 MPa for 0.5 to 4 seconds.

Hereinafter, the example performed at the said process is demonstrated.

Example 1

The raw material of the adhesive film used in the first step was performed using 36.7% liquid epoxy and 35% solid epoxy, and the amount of silica was 6 phr. In addition, the raw material of the adhesive film used in the second step was used as the liquid epoxy 35%, solid epoxy 39% and the amount of silica was 8phr. The thickness of each adhesive film was 12.5 μm, and the temperature of the lamination roll was 80 ° C. to produce a die adhesive film having a thickness of 25 μm. The bonding condition between the die and the die adhesive film was performed between 60 ° C. and 100 ° C., and the degree of peeling of the die / die adhesive film was confirmed at each temperature condition.

Example 2

The raw material of the adhesive film used in the first step was performed using 36.7% liquid epoxy and 35% solid epoxy, and the amount of silica was 6 phr. In addition, the raw material of the adhesive film used in the second step was 32% liquid epoxy and 42% solid epoxy, and the amount of silica was 9 phr. The thickness of each adhesive film was 12.5 μm, and the temperature of the lamination roll was 80 ° C. to produce a die adhesive film having a thickness of 25 μm. The bonding condition between the die and the die adhesive film was performed between 60 ° C. and 100 ° C., and the degree of peeling of the die / die adhesive film was confirmed at each temperature condition.

Example 3

The raw material of the adhesive film used in the first step was performed using 36.7% liquid epoxy and 35% solid epoxy, and the amount of silica was 6 phr. In addition, the raw material of the adhesive film used in the second step was a liquid epoxy 35%, solid epoxy 39% and the amount of silica was 10phr. The thickness of each adhesive film was 12.5 μm, and the temperature of the lamination roll was 80 ° C. to produce a die adhesive film having a thickness of 25 μm. The bonding condition between the die and the die adhesive film was performed between 60 ° C. and 100 ° C., and the degree of peeling of the die / die adhesive film was confirmed at each temperature condition.

As a result of carrying out the pickup process of the die / die adhesive film shown in the above through Examples 1, 2, and 3, it was confirmed that the smooth pickup process was carried out at 70 to 100 ° C. adhesive conditions. . Figure 6 shows the peel force according to the result of Example 1.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

As described above, according to the dicing film for semiconductor chip packaging having different adhesive strengths of the two layers of the present invention, the back surface of the wafer (die) may be attached without bubbles to the adhesive layer through the adhesive film.

In addition, the chip or die is bonded to the adhesive film with high adhesive strength, and when picked up after dicing, the chip or die is adhered with a relatively low adhesive force to easily peel off the dicing adhesive film, thereby reducing the defect rate of the semiconductor package process.

Claims (7)

In the dicing film used for the semiconductor chip package, An adhesive film forming two adhesive layers having adhesive strengths of different sizes; Dicing film for a semiconductor chip package having a different adhesive strength of the two layers, characterized in that the adhesive film for dicing attached to any one side of the adhesive film. The method of claim 1, The adhesive film is a dicing film for a semiconductor chip package having different adhesive strength of two layers, characterized in that the silica is added to the polyimide or epoxy in an appropriate amount. The method of claim 1, The dicing adhesive film is a dicing film for a semiconductor chip package having a different adhesive strength of two layers, characterized in that the polyolefin-based adhesive is adhered on either side. The method of claim 1, A dicing film for a semiconductor chip package having two different adhesive strengths, wherein an adhesive film having a relatively high amount of silica and solid epoxy is added to the dicing adhesive film. The method of claim 1, A dicing film for a semiconductor chip package having two different adhesive strengths, wherein an adhesive film having relatively low amounts of silica and solid epoxy is added to the dicing adhesive film. The method of claim 1, Dicing film for a semiconductor chip package having a different adhesive strength of the two layers, characterized in that the PET release film is further attached to the adhesive film having a relatively high adhesive strength. A first step of preparing a first adhesive film by coating and adhering an adhesive solution containing silica to polyimide or epoxy on a release film of PET to a thickness of 100 μm or less and then covering the protective film of PET material; A second process of manufacturing a second adhesive film by coating and adhering the adhesive liquid, which has relatively more silica added on the release film of PET material, to a thickness of 100 μm or less, and then covering the protective film of the PET material. and; A third step of manufacturing the die-bonding film by bonding the first adhesive film and the second adhesive film obtained through the first and second steps with each other without the protective film while removing the protective film; A fourth step of attaching the polyolefin-based dicing adhesive film to the removed adhesive surface at the same time as removing the release film on one side of the die adhesive film prepared in the third step; Method of manufacturing a dicing film for a semiconductor chip package having a different adhesive strength of the two layers characterized in that it is manufactured through.

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