KR20060023431A - Light emitting diode - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode, wherein a predetermined refracting portion is provided between a light emitting chip and a transmissive plate to adjust the refraction of light emitted by the light emitting chip, thereby concentrating the light of the light emitting diode, and providing a flat lens-shaped transmissive plate By mounting on the air gap between the transmissive plate and the light emitting chip, it is possible to form a fresh light emitting diode having excellent instantaneous condensing ability, which can be slimmed down and given a predetermined step to transmit a flat lens shape. Provided is a light emitting diode which can be easily mounted on a plate and can form an air gap between a transmission plate and a light emitting chip by using a step.

Light Emitting Diode, Transmissive Plate, Refraction, Air Gap, Step, Fluorescent Pigment, Flat Lens

Description

Light emitting diodes

1 is a cross-sectional view illustrating a conventional light emitting diode.

2A and 2B are conceptual views illustrating the improvement of the light intensity of the light emitting diode according to the present invention.

3 is a cross-sectional view for describing a light emitting diode according to a first embodiment of the present invention.

4A and 4B are enlarged conceptual views of region A of FIG. 3 for explaining mounting of a transmission plate.

5 is a cross-sectional view of a light emitting diode according to a second embodiment of the present invention. 6 is a plan view illustrating a light emitting diode according to a second embodiment.

7 is a cross-sectional view for describing a light emitting diode according to a third embodiment of the present invention.

8 is a cross-sectional view for describing a light emitting diode according to a fourth embodiment of the present invention.

9 is a cross-sectional view for describing a light emitting diode according to a fifth embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10, 110: printed circuit board 12, 14, 112, 114: electrode

16, 120: light emitting chip 17: wire

18: molding part 130: the receiver

140: transmission plate 142: paste

150: refracting portion 160: fluorescent pigment

170: bonding means

The present invention relates to a light emitting diode and to a light emitting diode capable of integrating light effectively.

In general, light emitting diodes are components for converting electrical signals into light.

1 is a cross-sectional view illustrating a conventional light emitting diode.

Referring to FIG. 1, a light emitting diode includes a printed circuit board 10 having electrodes 12 and 14 formed thereon, a light emitting chip 16 mounted on a predetermined electrode 12 or 14 of the printed circuit board 10, The molding unit 18 encapsulates the light emitting chip 16. And a wire 17 for connecting the light emitting chip 16 with the electrode 12 or 14. When a predetermined electrical signal is applied to the electrode, the light emitting chip 16 emits predetermined light. In the conventional light emitting diode, there is a problem in that the light collecting ability of the light emitted from the light emitting chip 16 falls. This is because the light emitting diode is not only the light emitting chip but also the brightness of the light emitted from the light emitting chip and the light condensing ability largely depend on the shape of the molding unit 18.

Therefore, many studies have been conducted to improve the light collecting capability of the light emitting diode by controlling the shape of the molding part 18. However, there are many limitations in controlling the shape of the molding part 18.

Accordingly, an object of the present invention is to provide a light emitting diode capable of improving a light collecting ability by changing a path of light emitted by a light emitting chip by providing a predetermined refractive surface to solve the above problem.

Provided is a light emitting diode comprising a receiver including a receiver in which a chip according to the present invention is mounted, and a transmissive plate covering the receiver of the receiver and maintaining a constant distance from the chip.

The transmissive plate is mounted on the upper portion of the receiver via an adhesive means, and the transmissive plate is interposed in the receiving portion of the receiver. At this time, the gap between the chip and the transmission plate includes an air gap of a predetermined interval.

Here, the transmission plate is a thin plate.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like numbers refer to like elements in the figures.

The light emitting diode forms a molding having an optical lens shape on the light emitting chip. As a result, the luminance of light emitted from the light emitting chip can be increased. In addition, in order to concentrate and emit light having a high linearity instantaneously, such as a flash, the light intensity of the light emitting device must be increased.

2A and 2B are conceptual views illustrating the improvement of the light intensity of the light emitting diode according to the present invention.

Referring to FIGS. 2A and 2B, the dotted line and solid line of FIG. 2A conceptualize the shape in which the light emitting chip is refracted and diverged through the sphere of the dotted line and the sphere of the solid line, respectively. Can focus light In addition, the solid line of FIG. 2B represents light that is refracted and diverged through the optical lens after passing through the predetermined refraction portion R, and the dotted line is light that is refracted and diffused through the optical lens only without passing through the refraction portion R. It is shown. This is a phenomenon exhibited by the refractive index between two predetermined transparent materials. Therefore, the light of the light emitting diode can be concentrated by adjusting the refraction of light emitted by the light emitting chip like a solid line. Of course, the light emitting diode may improve the degree of integration of light according to the material of the light emitting chip, the concentration and the structure of the impurities, and may improve the degree of integration of the light according to the shape of the molding part.

The light emitting diode of the present invention includes a printed circuit board, a light emitting chip mounted on the substrate, a transmissive plate encapsulating the light emitting chip, and a refractive portion formed in a region between the transmissive plate and the light emitting chip. It may further include a fluorescent pigment ported on the light emitting chip.

The refraction part refers to an area for refraction of light emitted by the light emitting chip using a difference in refractive index from the transmission plate. The refraction part may be formed of a transparent material film, and may be implemented in a form of a closed space filled with general air. This is possible. Accordingly, the structure of the above-described light emitting diode may appear in various ways.

A receptacle may be formed between the light emitting chip and the transmissive plate by using a separate receiver, and the refraction may be formed between the light emitting chip and the transmissive plate by using a substrate having a predetermined region recessed without using a receiver. In addition, it may further include a slug for effectively radiating heat emitted from the light emitting chip to the outside.

This will be described in detail with reference to the drawings.

3 is a cross-sectional view for describing a light emitting diode according to a first embodiment of the present invention.

Referring to FIG. 3, the light emitting diode according to the first embodiment includes a printed circuit board 110, a receiver 130 formed on the substrate 110 and including a predetermined through hole, and exposed below the through hole. The light emitting chip 120 mounted on the printed circuit board 110, the transmissive plate 140 mounted on the receiver 130, and the refracting portion 150 formed between the transmissive plate 140 and the light emitting chip 120. ). In addition, the light emitting chip 120 may further include a fluorescent pigment 160 ported on.

Printed circuit board 110 refers to a PCB substrate that includes first and second electrodes 112 and 114. The first and second electrodes 112 and 114 are formed on the substrate 110 by using a conductive material including copper or aluminum and using a metal plating or printing technique. The substrate 110 may be formed in a shape in which a plurality of chips have an array structure.

In addition, the light emitting chip 120 may further include a wire (not shown) for connection between the electrode on which the light emitting chip 120 is not mounted.

The light emitting chip 120 uses a material that emits visible light of a specific wavelength. In the mounting of the light emitting chip 120, it is effective to pot a predetermined conductive paste onto the first electrode 112 and then mount the light emitting chip 120 thereon. It is preferable to use silver paste as an electrically conductive paste. As a result, the cathode or anode terminal of the light emitting chip 120 is electrically connected to the first electrode 112. Thereafter, a wiring process is performed to electrically connect the terminal of the light emitting chip 120 that is not connected to the first electrode 112 and the second electrode 114. In addition, the light emitting chip 120 may be mounted on the substrate 110 and then electrically connected to the first and second electrodes 112 and 114 using predetermined wires through a wiring process. In addition, the light emitting chip 120 may be mounted on a separate heat sink.

Receptor 130 has a through-hole recessed in the shape of a truncated cone in the center region, the side of the through-hole is coated with a material that can reflect light. In addition, the receiver 130 is a predetermined housing, and the light emitting chip 120 is positioned under the through hole region. The shape of the through hole is not limited to the inverted truncated cone shape, and the upper opening surface may have various shapes. The shape of the receiver 130 may also be various polyhedral shapes such as cylindrical, rhombus, and trapezoidal columns as well as the shape of a rectangular parallelepiped.

The fluorescent pigment 160 uses a phosphorescent material for converting light of the light emitting chip 120 into light having a target wavelength. In this embodiment, it is effective to use a material for emitting white light.

The refraction unit 150 may be formed by filling a recessed through hole region of the receiver 130 using a material having a different refractive index from that of the transmission plate 140. In addition, it may exist as a region filled with air.

In the case of forming the refraction unit 150 by filling a predetermined material through-hole of the receiver, the transmissive plate 140 may be formed using a molding process.

Transmissive plate 140 is formed using a predetermined resin, it is preferable that the lower surface has a flat plate shape. The present invention is not limited thereto, and may be formed in various polyhedral forms. In addition, a predetermined optical lens shape may be further added thereon. When the above-described transmission plate 140 is mounted on the receiver, not only the light emitting chip 120 is encapsulated using the transmission plate 140 but also the refraction portion, that is, the air gap inside the through-hole region of the receiver 130. Is formed. Light emitted from the light emitting chip 120 by the refraction unit 150 is refracted once when passing through the refraction unit 150 to enter the transmissive plate 140, and passes through the transmissive plate 140 to the air. When it is refracted once more, the intensity of light can be improved. In this embodiment, the transmission plate 140 is manufactured separately, and then mounted on the receiver 130 described above.

4A and 4B are enlarged conceptual views of region A of FIG. 3 for explaining mounting of a transmission plate.

The above-described transmission plate 140 may be mounted by adhesion using a predetermined paste material, and may be performed by using a forced indentation method. That is, as shown in FIG. 4A, a predetermined paste 142 may be applied to the upper surface of the receiver 130 and then formed by laminating and compressing the transmission plate 140 thereon. In addition, as shown in FIG. 4B, a pillar having a protruding shape is formed in a predetermined region of the transmission plate 140, and a hole corresponding to the protruding pillar is formed in a predetermined region of the lower receiver 130, and then fitted with force. It can form by a press-fit method. You can also mix and use both methods. In other words, the paste may be applied to a predetermined area of the pillar or the hole by mounting it.

The present invention uses a light emitting diode that emits white light by adjusting the light emitting chip 120 and the fluorescent pigment 160 in order to manufacture a fresh light emitting diode. In addition, according to the present invention, when the refractive index of the refraction unit 150 is 1, it is effective to form the transmission plate 140 using a material having a refractive index of about 1.1 to about 1.8. In addition, the height of the refraction portion 150, that is, the distance between the light emitting chip 120 and the transmission plate is preferably 0.01 to 1mm.

Alternatively, a predetermined step may be given to the recessed region inside the receiver, and a refractive portion may be formed using the recessed area.

5 is a cross-sectional view of a light emitting diode according to a second embodiment of the present invention. 6 is a plan view illustrating a light emitting diode according to a second embodiment.

5 and 6, a receiver 130 including a printed circuit board 110, a through hole formed on the substrate 110 and having at least two stepped steps, and a lower portion of the through hole. The light emitting chip 120 mounted on the exposed printed circuit board 110, the transmissive plate 140 mounted in the uppermost stepped region of the through hole, and the refraction portion formed between the transmissive plate 140 and the light emitting chip 120. And 150. In addition, the light emitting chip 120 may further include a fluorescent pigment 160 ported on.

The printed circuit board and the light emitting chip and the mounting method thereof are similar to those of the first embodiment described above.

The receiver 130 may include a first hole in which the transmission plate 140 is to be built, a second hole in which the refracting unit 150 is to be formed, and a third hole in which the fluorescent pigment 160 is to be potted. . The receiver 130 of the present invention preferably includes at least two or more holes (the first and second holes), and the number thereof may vary depending on the characteristics of the light emitting diode. That is, a separate hole in which a resin film (not shown) for changing the light wavelength of the light emitting diode may be added may be further added, and a separate fin to improve the adhesive property between the transmission plate 140 and the receiver 130. A fixing hole (not shown) may be further added.

It is preferable that the above-mentioned first to third holes form one through hole, and each hole is a hole having a different diameter. In addition, the shape of the hole may be not only the shape of a rectangular parallelepiped but also various polyhedral shapes such as cylinders, rhombus columns, and trapezoidal columns. The diameter of the hole in this embodiment is formed so that the first hole is the largest, the third hole is the smallest (R1> R2> R3), the first hole is formed on the upper surface of the through hole region, and the third Preferably, the hole is formed in the lowermost surface (ie, the portion connected with the substrate). That is, a predetermined refraction is applied to the through-hole of the receiver so as to have the step-shaped step mentioned above. This can produce a receiver 130 having the above-described shape through the molding method, and can be produced a receptor 130 having the above-described shape through mechanical polishing.

The above-described holes may be formed to have the same thickness, or may have different thicknesses. This may vary depending on the nature of the material or region mounted or formed in each of the holes.

Fluorescent pigments use a phosphorescent material to convert the light of the light emitting chip into a light having a target wavelength. In this embodiment, it is effective to use a material for emitting white light. In addition, the fluorescent pigment 160 is potted so that the inside of the third hole (inside the bottom step of the through hole having the stepped stepped step) is completely filled out of the through hole of the receiver 130 to the entire outer region of the light emitting chip 120. It is possible to effectively distribute the fluorescent material.

The refraction unit 150 may be formed by filling the inside of the second hole among the through holes of the receiver 140 using a material having a different refractive index from that of the transmission plate 140. That is, it can be formed in the intermediate region of the through-hole having a stepped step. In addition, it may exist as a region filled with air. In the case of forming the refraction unit 150 by filling a predetermined material through-hole of the receiver, the transmissive plate 140 may be formed using a molding process.

The transmission plate 140 is mounted inside the first hole of the through hole of the receiver 130 by using a predetermined resin, but preferably has a flat plate shape having a lower surface.

The present invention is not limited thereto, and may be formed in various polyhedron shapes according to the shape of the through hole. In addition, a predetermined optical lens shape may be further added thereon. When the above-described transmission plate 140 is mounted on the receiver, not only the light emitting chip 120 is encapsulated using the transmission plate 140, but also the refraction unit 150, ie, inside the through hole region of the receiver 130. , An air gap is formed. Light emitted from the light emitting chip 120 by the refraction unit 150 is refracted once when passing through the refraction unit 150 to enter the transmissive plate 140, and passes through the transmissive plate 140 to the air. When it is refracted once more, the intensity of light can be improved. In this embodiment, after manufacturing the transmission plate 140 separately, it is mounted in the above-mentioned receiver 130. In addition, the shape of the transmission plate 140 may be manufactured in a 'T' shape and then mounted on the receiver 130 described above. In addition, as described above, it may be manufactured through a molding process. The mounting of the transmission plate 140 described above is the same as that described in FIGS. 4A and 4B.

In addition, the light emitting diode of the present invention does not have a separate receiver as described above, and has a refractive portion in a predetermined region of the substrate.

7 is a cross-sectional view for describing a light emitting diode according to a third embodiment of the present invention.

Referring to FIG. 7, the light emitting diode according to the third embodiment includes a printed circuit board 110 including a predetermined recessed region and a light emitting chip 120 mounted in the recessed region of the printed circuit board 110. And a transmission plate 140 mounted on the printed circuit board 110, and a refraction unit 150 formed between the transmission plate 140 and the light emitting chip 120. In addition, the light emitting chip 120 may further include a fluorescent pigment 160 ported on.

The printed circuit board 110 includes a first and second electrodes 112 and 114, and refers to a PCB substrate having a predetermined recessed region formed in the center thereof. In addition, it refers to a material having excellent thermal conductivity.

The recessed areas can be formed into various polyhedral shapes, such as cylinders, cones, rhombus columns, and trapezoidal columns. The width and depth of the recess region may vary depending on the size of the light emitting chip 120 and the characteristics of the refracting portion 150. In this embodiment, it is preferable that the depth of the recessed region is recessed to about 10 to 80% of the entire thickness of the substrate. It is effective to form the recessed region so that the light emitting chip 120 has a predetermined reflective surface that reflects a part of the light emitted by the light emitting chip 120. It is preferable that the inclination of a reflection surface shall be 45-135 degrees. Further, it can be formed as the formation having the stepped step mentioned in the second embodiment. The first and second electrodes 112 and 114 form a conductive material including copper or aluminum on the substrate 110 using a material and using metal plating or printing techniques. In addition, the first and second electrodes 112 and 114 may be formed not only on the upper surface of the substrate 110 but also on a portion of the recess region. That is, depending on the shape of the electrode of the light emitting chip 120, the light emitting chip 120 may be formed on the substrate 110 excluding the recess region, or may be formed on the substrate 110 including the recess region.

The light emitting chip 120 uses a material that emits visible light of a specific wavelength. In addition, the light emitting chip 120 may be mounted in a recessed region of the substrate 110 according to the electrode shape of the light emitting chip 120, and may be mounted on any one of the first or second electrodes 112 and 114. Can be. That is, in the mounting of the light emitting chip 120, it is effective to pot a predetermined conductive paste on the first electrode 112 and then mount the light emitting chip 120 thereon. It is preferable to use silver paste as an electrically conductive paste. As a result, the cathode or anode terminal of the light emitting chip 120 is electrically connected to the first electrode 112.

Thereafter, a wiring process is performed to electrically connect the terminal of the light emitting chip 120 that is not connected to the first electrode 112 and the second electrode 114. In addition, the light emitting chip 120 may be mounted on the substrate 110 and then electrically connected to the first and second electrodes 112 and 114 using predetermined wires through a wiring process. In addition, the light emitting chip 120 may be mounted on a separate heat sink.

The fluorescent pigment 160 uses a phosphorescent material for converting light of the light emitting chip 120 into light having a target wavelength. In this embodiment, it is effective to use a material for emitting white light.

The refraction unit 150 may be formed by filling a recessed through hole region of the receiver 130 using a material having a different refractive index from that of the transmission plate 140. In addition, it may exist as a region filled with air. In the case of forming the refraction unit 150 by filling a predetermined material through-hole of the receiver, the transmissive plate 140 may be formed using a molding process.

Transmissive plate 140 is formed using a predetermined resin, it is preferable that the lower surface has a flat plate shape. The present invention is not limited thereto, and may be formed in various polyhedral forms. In addition, a predetermined optical lens shape may be further added thereon. When the above-described transmission plate 140 is mounted on the printed circuit board 110, not only the light emitting chip 120 is encapsulated using the transmission plate 140, but also refracted in the recess region of the substrate 110. The part 150, that is, the air gap is formed. Light emitted from the light emitting chip 120 by the refraction unit 150 is refracted once when passing through the refraction unit 150 to enter the transmissive plate 140, and passes through the transmissive plate 140 to the air. When it is refracted once more, the intensity of light can be improved. In this embodiment, the transmission plate is manufactured separately, and then mounted on the above-mentioned receiver.

In this case, a separate pin may be used for mounting the substrate and the transmission plate.

8 is a cross-sectional view for describing a light emitting diode according to a fourth embodiment of the present invention.

Referring to FIG. 8, the light emitting diode according to the fourth embodiment includes a printed circuit board 110 including a predetermined recessed region and a light emitting chip 120 mounted in the recessed region of the printed circuit board 110. And a bonding means 170 formed on the printed circuit board 110, a transmissive plate 140 mounted on the bonding means 170, and a refraction portion formed between the transmissive plate 140 and the light emitting chip 120. And 150. In addition, the light emitting chip 120 may further include a fluorescent pigment 160 ported on. The adhesion means 170 may completely seal the printed circuit board 110 and the transmission plate 140. The bonding means 170 may be formed using a predetermined epoxy resin. In addition, the adhesive means 170 may be formed in a pin shape. Therefore, due to the adhesion means 170, a sufficient refractive portion 150 can be formed without having to deepen the depth of the recess region of the substrate 110. The descriptions of the printed circuit board 110, the light emitting chip 120, and the transmissive plate 140 will be omitted because they overlap with the above description.

In addition, the fluorescent pigment may be potted in the recessed region of the substrate, and a refractive portion may be formed by using an adhesive means.

9 is a cross-sectional view illustrating a light emitting diode according to a fifth embodiment of the present invention.

9, a light emitting diode according to a fifth embodiment includes a printed circuit board 110 including a predetermined recessed region and a light emitting chip 120 mounted in a recessed region of the printed circuit board 110. And a fluorescent pigment 160 potted in the recessed region, an adhesive means 170 formed on the printed circuit board 110, a transmissive plate 140 mounted on the adhesive means 170, and a transmissive plate. And a refracting portion 150 formed between the 140 and the fluorescent pigment 160. By porting a predetermined fluorescent pigment 160 in the entire recessed area, it is possible to completely cover the light emitting chip 120 mounted below the recess region, thereby effectively converting the light emitted from the light emitting chip 120 wavelength conversion. Can be. In addition, the transparent means 140 may be effectively mounted to the printed circuit board 110 by the adhesive means 170, and the refractive portion 150 may be formed under the sealed mounted transmissive plate 140. The above-described embodiments are not limited to the examples, but may be converted into various types of embodiments by being combined with each other.

As described above, the present invention can concentrate the light of the light emitting diode by adjusting a refraction of light emitted by the light emitting chip by placing a predetermined refraction portion between the light emitting chip and the transmission plate.

In addition, by mounting a flat plate-like transmission plate on a substrate and providing an air gap between the transmission plate and the light emitting chip, it is possible to form a fresh light emitting diode having excellent instantaneous light condensing ability, which can be slimmed down.

In addition, a predetermined step may be provided to facilitate mounting of the flat plate lens-shaped transmission plate, and an air gap may be formed between the transmission plate and the light emitting chip by using the step.

Claims (5)

A receiver having a receiver in which a chip is mounted; And a transmissive plate covering the accommodating portion of the receiver and maintaining a constant distance from the chip. The method of claim 1, The transmitting plate is light emitting diode, characterized in that mounted on the upper portion of the receiver via the bonding means. The method of claim 1, The transmissive plate is interposed in the housing portion of the receiver. The method of claim 2 or 3, The light emitting diode including a predetermined gap between the chip and the transmission plate. The method of claim 4, wherein The transmissive plate is a light emitting diode comprising a thin plate.

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