KR20060022777A - Piled film with ultra high insulating and dielectric characteristic - Google Patents

Abstract

The present invention can be used for insulators for electric cables, dielectrics for capacitors, etc. by having extremely high insulation and dielectric properties, and can also be manufactured at low cost by simply stacking conventionally developed materials. The present invention relates to a film binder having dielectric properties and a method of manufacturing the same.

The film assembly having the ultra high strength insulating and dielectric properties of the present invention is laminated by the required thickness using a plurality of mono films having the same characteristics, the same thickness, and the same shape, and the laminated mono film is formed by using an electrode. It is characterized in that it is configured by applying a predetermined size of power for a predetermined time and curing. In addition, the method for producing a film assembly of the present invention, the first step of preparing a plurality of layers so as to make the required thickness by laminating mono films of the same characteristics having the same thickness and shape; A second step of laminating the prepared plurality of mono films in close contact with electrodes and gradually applying power for 5 seconds until immediately before the electrode breakdown voltage; And a third step of drying the laminated film through which the power has passed by the second step.

Mono, film, dielectric, insulator, lamination, multi-layer, composite,

Description

Film assembly with ultra high insulating and dielectric properties {Piled film with ultra high insulating and dielectric characteristic}

1 is a side view showing a laminated state of a mono film according to the present invention;

2 is a flowchart showing a method of manufacturing a film assembly according to the present invention;

3 to 4 is a table of experimental results of the film assembly according to the present invention,

5 is a graph showing the life cycle of the film assembly according to the present invention,

※ Explanation of symbols about main part of drawing ※

10: mono film 20: electrode

The present invention relates to a film assembly having an ultra high strength insulating property and a dielectric property, and to a method of manufacturing the same. More specifically, the present invention can be used for insulators for electric cables, dielectrics for capacitors, and the like by having an extremely high insulating property and dielectric properties. The present invention also relates to a film assembly having a very high insulation and dielectric properties, which can be manufactured at a low cost by simply stacking conventionally developed materials, and a method of manufacturing the same.

In order to improve electrical properties such as insulation or dielectric properties of specific devices used in the electric or electronic fields, many researches and developments are being conducted on improving the structure of new materials or conventional materials having unique characteristics. As a result of research on improving the structure of the material, a plurality of mono films having a thickness of several tens to hundreds of micrometers are laminated to increase the tensile strength of the material or to improve the insulation characteristics.

However, the lamination method of the conventional material does not have a satisfactory effect. This is due to the fact that the stacking of mono films is a simple physical bonding method using an adhesive and does not achieve an organic bonding of mutual mono films. In addition, in the case of the laminated mono film, fusion may be performed using high voltage or high frequency, but breakage of the material occurs, and thus, it is not satisfactory and is costly.

Therefore, it is possible to provide sufficiently satisfactory characteristics at a low cost and to develop a laminated material that is easy to manufacture.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a film assembly which can be used for insulators for electric cables, dielectrics for capacitors, and the like, and having a very high insulation and dielectric properties. have.

Another object of the present invention is to provide a film assembly and a method of manufacturing the same having a very high insulation properties and dielectric properties at a low manufacturing cost by simply using the conventionally developed materials.

In order to achieve the above object, the film assembly having the ultra-high strength insulating property and the dielectric property of the present invention is laminated by the required thickness using a plurality of mono films having the same properties, the same thickness, and the same shape, and the laminated mono The film is characterized in that it is configured by applying a predetermined size of power for a predetermined time using an electrode and curing.

In addition, the method for producing a film assembly of the present invention, the first step of preparing a plurality of layers so as to make the required thickness by laminating mono films of the same characteristics having the same thickness and shape; A second step of laminating the prepared plurality of mono films in close contact with electrodes and gradually applying power for 5 seconds until immediately before the electrode breakdown voltage; And a third step of drying the laminated film through which the power has passed by the second step.

Hereinafter, with reference to the accompanying drawings will be described in detail the film assembly and the manufacturing method of the ultra-high strength insulating and dielectric properties of the present invention.

The film assembly having the ultra-high insulation and dielectric properties of the present invention, the same properties, each of the thickness of 10 ~ 20㎛ and a plurality of mono films of the same size are laminated to the required thickness, the laminated mono film using an electrode By applying a predetermined size of power for a predetermined time and then curing.

Figure 1 shows the structure of the film assembly according to the present invention and the electrode use state. Referring to the drawings is configured by stacking a plurality of mono film 10 having a predetermined thickness, preferably a thickness of 10 ~ 20㎛ to a desired thickness. At this time, the thickness of the mono film to be laminated should be the same. That is, when a mono film having a thickness of 10 μm is selected, only a mono film having a size of 10 μm is laminated to make a required thickness, and 10 μm, 15 μm, and 20 μm may not be mixed.

The mono film 10 laminated as described above should have the same properties, thickness and shape. In FIG. 1, the mono film 10 has only a thickness (10 to 20 μm) of the side surface, but the shape of the mono film may be configured to have various shapes, thicknesses, and widths according to the purpose of use.

Meanwhile, in the film binder according to the present invention, the shape of the mono film does not affect the properties of the film binder, and the same thickness has an effect of improving the properties as the number of mono films laminated is increased. At this time, the characteristics, thickness and shape of each mono film should match.

The mono film used in the present invention is the use of all polymeric films based on polyimides, polytetrafluoroethylenes, polyethylenes, polystyrenes, and polyethylene terephthalate. This is possible. The choice of polymer depends primarily on the condition of service, environmental conditions, the material on which the film is used, and the like.

According to the present invention, a 1 mm thick laminated film assembly processed by winding a mono film having a thickness of 10 μm 100 times and a 20 mm mono film having a thickness of 50 μm treated by a laminated film assembly The characteristic is more excellent. In particular, the present invention was developed using a mono film having a thickness of 10 ~ 20㎛, the use of a mono film having a thickness of 40 ~ 50㎛ laminated was found to have a very small effect.

According to the present invention, a monolithic film 10 is bonded to the mono film laminated by applying a predetermined power using the electrode 10. Of course, even when the power is applied it can be used by using an additional adhesive, such as conventionally used to enhance the bonding force. It is obvious that the shape of the mono film has a sheet shape, but the shape can be changed as necessary.

It is also possible in the present invention to use a coated mono film or to coat the mono film in the manufacture of the film binder. That is, after the power is applied once to the laminated mono films, the surface of the mono films may be coated once or several times to perform single or multi-coating.

On the other hand, the shape of the electrode 10 is shown as a square in the figure, this shape can be modified into a protrusion, a planar string, a sphere or the like according to the shape of the film assembly.

 2 is a flowchart showing a method of manufacturing a film assembly according to the present invention. Referring to the drawings, first, the shape and width of the mono film, etc. are determined and prepared according to a specific purpose. At this time, the thickness of one mono film is determined within the range of 10 ~ 20㎛.

A plurality of mono films 10 prepared as described above are closely stacked on the electrode 20 to the required thickness and gradually applied power for 5 seconds until just before the breakdown voltage of the electrodes. Although the electrode 20 is shown in a plane form in the figure, the shape of the electrode can be changed according to the shape of the film assembly.

In addition, in the present invention, the power applied to the electrode 20 may be applied regardless of direct current or alternating current.

After the power is applied as described above, the laminated mono film is dried (cured) to complete the manufacture of the film assembly. At this time, if necessary, the power-up step may be repeated several times.

Referring to the experimental results of the film assembly according to the present invention prepared as described above are as follows. In the figure mkm denotes the same unit as μm.

As shown in the table of FIG. 3, the average breakdown voltage of the mono film of 3 mu m is 1.4 KV. However, it can be seen that the breakdown voltage is 4.5 KV, which is three times better in the case of the 33 μm film assembly in which 11 monolayer films of 3 μm are laminated.

In addition, compared to the breakdown voltage of 0.26 kV / µm of a mono film having a thickness of 60 µm, the breakdown voltage of a film assembly having the same thickness manufactured by stacking six mono films having a thickness of 10 µm was 1.4 kV. It can be seen that it is about 5.4 times larger as / μm. Therefore, it can be seen that the insulation effect of the film assembly according to the present invention is very excellent.

In addition, as shown in FIG. 4, the monolayer film having a thickness of 145 μm and the film assembly obtained by laminating 8 layers (144 μm) of 18 μm have almost the same thickness, but the mechanical strength at breakage is 100 MPa in the former case. In contrast, the latter has a value of 700MPa. Therefore, it can be seen that the effect of increasing the tensile force of the film assembly according to the present invention is very excellent.

In addition, when comparing the lifecycle, as shown in FIG. 5, in the case of the mono film (curve 3), the film assembly having the same thickness (curve 1) has a lifespan of 10 ⁻⁴ sec at 60 MPa. It can be seen that it has a value of 10 ⁴ sec at 60 Mpa. Thus it can be seen that the film binder according to the invention has a lifespan as long as 10 ⁸ times.

The experiment was performed on PET, the stress application rate is 2.9MPa / s, the test frequency is an average of 10 times. Curve 1 shows the lifetime of multiple layers, curve 2 shows the guaranteed lifetime of multiple layers, and curve 3 shows the guaranteed lifetime of mono films. Therefore, it can be seen that the life extension effect of the film binder according to the present invention is also very excellent.

According to the present invention, it can be used for insulators for electric cables, dielectrics for capacitors, etc. by having extremely high insulation and dielectric properties, and also has an effect that can be manufactured at low cost by simply stacking conventionally developed materials. .

Claims (6)

By using a plurality of mono film having the same characteristics, the same thickness, and the same shape, and laminated by the required thickness, the laminated mono film is configured by applying a predetermined size of power for a predetermined time using an electrode and curing A film assembly having an ultra high strength insulating property and a dielectric property. The method of claim 1, A film assembly having ultra high strength insulating and dielectric properties, wherein the power is applied to the electrode for 5 seconds and gradually increased until the breakdown voltage of the electrode is reached. The method of claim 1, The mono film is any one of all polymer films based on polyimides, polytetrafluoroethylenes, polyethylenes, polystyrenes, and polyethylene terephthalate. An ultra-high strength insulation film and a dielectric film characterized by a dielectric film. A first step of preparing a plurality of mono films having the same thickness and shape to produce the required thickness by stacking mono films having the same characteristics; A second step of laminating the prepared plurality of mono films in close contact with electrodes and gradually applying power for 5 seconds until immediately before the electrode breakdown voltage; And a third step of drying the laminated film through which the power is passed by the second step. The method of claim 4, wherein The mono film is any one of all polymer films based on polyimides, polytetrafluoroethylenes, polyethylenes, polystyrenes, and polyethylene terephthalate. Method of manufacturing a film assembly having an ultra-high strength insulation characteristics and dielectric properties. The method of claim 4, wherein The shape of the electrode is a film assembly having a super high-strength insulating characteristics and dielectric properties, characterized in that the deformation is protruding, flat string, sphere.

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