CN207625858U - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
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- CN207625858U CN207625858U CN201721440060.0U CN201721440060U CN207625858U CN 207625858 U CN207625858 U CN 207625858U CN 201721440060 U CN201721440060 U CN 201721440060U CN 207625858 U CN207625858 U CN 207625858U
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- insulating layer
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- printed circuit
- circuit board
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Abstract
The utility model provides a kind of printed circuit board, including stack layer, second insulating layer, signal conductor layer and the third insulating layer set gradually from bottom to up；Wherein, stack layer includes multiple coats of metal being cascading, and has the first insulating layer between the two neighboring coat of metal；The thickness of second insulating layer is less than the thickness of the first insulating layer, and the thickness of institute's third insulating layer is less than the thicknesses of metal coating of the first insulating layer.The utility model provides a kind of printed circuit board, to realize the thinning of printed circuit board.
Description
Technical field
The utility model embodiment is related to printed circuit technique more particularly to a kind of printed circuit board.
Background technology
Recent, due to the needs of structure design and appearance, printed circuit board (PCB) is widely used in electronic equipment
In, it is however generally that, signal can be used by the PCB layout of certain length to provide load end.
Existing PCB is mostly using even level stack layer, such as two layers, four layers, six layers or eight layers of the coat of metal etc., mesh
Preceding only two-sided substrate, and press in the production process when is all even numbers, and all processing procedures design in equipment
All it is symmetrical.Such as four laminate be always applied in together above and below in processing procedures in etching development etc..However in reality
In use, the situation for needing metal-coated structure to be odd number is frequently encountered, such as three ply board, five laminates, seven laminates etc., at this time
There is the printed circuit board of the even level coat of metal to generate the wasting of resources because there is one layer of coat of metal to be not used by and cause to print
The thickness of circuit board increases.On the other hand, the insulating layer between each coat of metal of printed circuit board is often in the prior art
Thickness is bigger, and the thickness of printed circuit board is caused to increase.
Utility model content
The utility model embodiment provides a kind of printed circuit board, to realize the thinning of printed circuit board.
The utility model embodiment provides a kind of printed circuit board, including set gradually from bottom to up stack layer,
Two insulating layers, signal conductor layer and third insulating layer；
Wherein, the stack layer includes multiple coats of metal being cascading, the two neighboring coat of metal it
Between have the first insulating layer；
The thickness of the second insulating layer is less than the thickness of first insulating layer, and the thickness of institute's third insulating layer is less than institute
State the thickness of the first insulating layer.The coat of metal further includes ground metal layer optionally, and the ground metal layer is located at described second
The 4th insulation is provided between insulating layer and the signal conductor layer, and between the ground metal layer and the signal conductor layer
Layer.
Optionally, the 4th insulating layer is made with the third insulating layer of same material, and the 4th insulation
The thickness of layer is less than the thickness of first insulating layer.
Optionally, further include the 5th insulating layer, be located at the stack layer far from signal conductor layer side, and with it is described
Second insulating layer is made of same material, and the thickness of the 5th insulating layer is less than the thickness of first insulating layer.
Optionally, the stack layer is including first coat of metal, second successively on signal conductor layer direction
The coat of metal, the third coat of metal and the 4th coat of metal.
Optionally, first insulating layer includes glass-epoxy.
Optionally, the second insulating layer includes insulated paint.
Optionally, the third insulating layer includes glassine paper or polyethylene terephthalate.
The printed circuit board that the utility model embodiment provides includes stack layer and signal conductor layer, and stack layer is led with signal
It is electrically insulated by second insulating layer between line layer, printed circuit board further includes being located at signal conductor layer far from stack layer side
Third insulating layer, third insulating layer can be used for protection signal conductor layer and make signal conductor layer not and influence printed circuit board it
Outer circuit, the circuit except printed circuit board for example can be gate driving circuit, source electrode drive circuit or touch-control driving electricity
Road.Stack layer is generally made by board, and the thickness of the first insulating layer in stack layer between the two neighboring coat of metal is bigger,
The utility model embodiment is less than the thickness and third insulating layer of the first insulating layer by the way that the thickness of second insulating layer is arranged
Thickness is less than the thickness of the first insulating layer so that printed circuit board is more frivolous, realizes the thinning of printed circuit board.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram for printed circuit board that the utility model embodiment provides；
Fig. 2 is the structural schematic diagram for another printed circuit board that the utility model embodiment provides；
Fig. 3 is the structural schematic diagram for another printed circuit board that the utility model embodiment provides.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose of utility model is taken,
Below in conjunction with attached drawing and preferred embodiment, to according to the utility model proposes a kind of printed circuit board specific implementation mode,
Structure, feature and its effect are described in detail as after.
Fig. 1 is a kind of structural schematic diagram for printed circuit board that the utility model embodiment provides, as shown in Figure 1, this reality
Include that stack layer 10, second insulating layer 102, signal conductor layer 20 and third are exhausted with a kind of printed circuit board of new embodiment offer
Edge layer 103.Wherein, stack layer 10 includes multiple coats of metal 11 being cascading, between the two neighboring coat of metal 11
With the first insulating layer 101.Second insulating layer 102 is located at the side of stack layer 10.Signal conductor layer 20 is located at second insulating layer
102 far from 10 side of stack layer.Third insulating layer 103 is located at signal conductor layer 20 far from 10 side of stack layer, that is, printed circuit
Plate includes the stack layer 10 set gradually from bottom to up, second insulating layer 102, signal conductor layer 20 and third insulating layer 103.The
The thickness of two insulating layers 102 is less than the thickness of the first insulating layer 101, and the thickness of third insulating layer 103 is less than the first insulating layer 101
Thickness.
The method for forming above-mentioned printed circuit board can be：In the upper formation second insulating layer 102 of stack layer 10；Then lead to
The method for crossing inkjet printing or wet etching forms signal conductor layer 20；Then third insulation is formed on signal conductor layer 20 again
Layer 103；Alternatively, signal conductor layer can also be formed by the method for inkjet printing or wet etching on third insulating layer 103
20, while in the upper formation second insulating layer 102 of stack layer 10；Then include signal conductor layer 20 by third insulating layer 103
It is bonded when with while contraposition of the stack layer 10 comprising second insulating layer 20.
The printed circuit board that the utility model embodiment provides includes stack layer and signal conductor layer, and stack layer is led with signal
It is electrically insulated by second insulating layer between line layer, printed circuit board further includes being located at signal conductor layer far from stack layer side
Third insulating layer, third insulating layer can be used for protection signal conductor layer and make signal conductor layer not and influence printed circuit board it
Outer circuit, the circuit except printed circuit board for example can be gate driving circuit, source electrode drive circuit or touch-control driving electricity
Road.Stack layer is generally made by board, and the thickness of the first insulating layer in stack layer between the two neighboring coat of metal is bigger,
The utility model embodiment is less than the thickness and third insulating layer of the first insulating layer by the way that the thickness of second insulating layer is arranged
Thickness is less than the thickness of the first insulating layer so that printed circuit board is more frivolous, realizes the thinning of printed circuit board.Another party
Face is all even numbers when due to being pressed in the technique of board making stack layer, and all processing procedures design all in equipment
It is symmetrical, so stack layer generally uses even level stack layer, but often exists in practical application and need the coat of metal
Structure is the situation of odd number, and the printed circuit board of the even level coat of metal generates due to having one layer of coat of metal to be not used by this time
The wasting of resources and the thickness of printed circuit board is caused to increase, the coat of metal in the utility model embodiment (signal conductor layer with
The coat of metal all has the function of signal transduction, therefore can be using signal conductor layer as one kind in the coat of metal) quantity
Setting is more flexible, therefore the coat of metal quantity of printed circuit board can be arranged according to specific product.
Optionally, stack layer 10 may include first coat of metal 111, the successively on 11 direction of signal conductor layer
Two coats of metal 112, the third coat of metal 113 and the 4th coat of metal 114.Due to six layers of metal-coated structure in the prior art
Printed circuit board it is relatively common, but for required circuit performance, often only need five layers of coat of metal that can expire
Foot requires, and the utility model embodiment includes four layers of coat of metal and a layer signal conductor layer, disclosure satisfy that the circuit
Can needs, and simple in structure, the thickness of printed circuit board also smaller is more advantageous to printed circuit board making in the electronic device
With reducing the thickness and weight of the electronic equipment using printed circuit board.It should be noted that in other embodiments,
Stack layer can also be the stack layer of other quantity, be not limited thereto.
Optionally, the first insulating layer 101 includes glass-epoxy, and glass-epoxy has higher machine
Tool performance and dielectric properties, preferable heat resistance and moisture resistivity simultaneously have good machining property.
Optionally, second insulating layer 102 includes insulated paint.Insulated paint be based on high molecular polymer, can be certain
Under conditions of be solidified into insulating film or the whole important insulating materials of insulation.Insulated paint is filled out by base-material, fire retardant, curing agent, face
The compositions such as material and solvent, with good electro-chemical properties, hot property, mechanical performance and chemical property.Ensureing electrical insulating property
Under conditions of energy, the thickness of insulated paint could be provided as the thickness less than glass-epoxy, so that printed circuit is thinned
The thickness of plate.
Optionally, third insulating layer 103 includes glassine paper (PT) or polyethylene terephthalate (PET).Glassine paper
There is the property similar to plastic film with polyethylene terephthalate, therefore under conditions of ensureing electrical insulation capability,
The ratio that glassine paper and polyethylene terephthalate can make is relatively thin, the thickness of glassine paper or polyethylene terephthalate
Degree could be provided as the thickness less than glass-epoxy, so that the thickness of printed circuit board is thinned.
Fig. 2 is the structural schematic diagram for another printed circuit board that the utility model embodiment provides, as shown in Fig. 2, print
Printed circuit board can also include ground metal layer 30, ground metal layer 30 be located at second insulating layer 102 and signal conductor layer 20 it
Between, and the 4th insulating layer 104 is provided between ground metal layer 30 and signal conductor layer 20.There is ground metal layer 30 shielding to print
The effect of the signal integrity of printed circuit board internal signal and promotion printed circuit intralamellar part.
Optionally, the 4th insulating layer 104 may be used same material with third insulating layer 103 and be made, therefore the 4th insulation
Layer 104 may be used technique identical with third insulating layer 103 and be formed.The thickness of 4th insulating layer 104 is less than the first insulating layer
101 thickness, so that the thickness of printed circuit board is further thinned.
Fig. 3 is the structural schematic diagram for another printed circuit board that the utility model embodiment provides, as shown in figure 3, print
Printed circuit board can also include the 5th insulating layer 105, and the 5th insulating layer 105 is located at stack layer 10 far from signal conductor layer 20 1
Side for protection signal conductor layer and makes signal conductor layer not and influences circuit except printed circuit board, and the 5th insulating layer
105 are made with second insulating layer 102 of same material, therefore the 5th insulating layer 105 may be used and 102 phase of second insulating layer
Same technique is formed.The thickness of 5th insulating layer 105 is less than the thickness of the first insulating layer 101, so that printing is further thinned
The thickness of circuit board.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation be not limited to the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe
Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when in the technology using the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still
It is within the scope of the technical solutions of the present invention.
Claims (8)
1. a kind of printed circuit board, which is characterized in that including stack layer, second insulating layer, the signal set gradually from bottom to up
Conductor layer and third insulating layer；
Wherein, the stack layer includes multiple coats of metal being cascading, and is had between the two neighboring coat of metal
There is the first insulating layer；
The thickness of the second insulating layer is less than the thickness of first insulating layer, and the thickness of institute's third insulating layer is less than described the
The thickness of one insulating layer.
2. printed circuit board according to claim 1, which is characterized in that further include ground metal layer, the grounded metal
Layer is between the second insulating layer and the signal conductor layer, and between the ground metal layer and the signal conductor layer
It is additionally provided with the 4th insulating layer.
3. printed circuit board according to claim 2, which is characterized in that the 4th insulating layer and the third insulating layer
It is made of same material, and the thickness of the 4th insulating layer is less than the thickness of first insulating layer.
4. printed circuit board according to claim 1, which is characterized in that further include the 5th insulating layer, be located at the stacking
Layer is made with the second insulating layer of same material far from signal conductor layer side, the 5th insulating layer
Thickness is less than the thickness of first insulating layer.
5. printed circuit board according to claim 1, which is characterized in that the stack layer is close to the signal conductor layer
Include first coat of metal, second coat of metal, the third coat of metal and the 4th coat of metal successively on direction.
6. printed circuit board according to claim 1, which is characterized in that first insulating layer includes glass fibre epoxy
Resin.
7. printed circuit board according to claim 1, which is characterized in that the second insulating layer includes insulated paint.
8. printed circuit board according to claim 1, which is characterized in that the third insulating layer includes glassine paper or poly- pair
Ethylene terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721440060.0U CN207625858U (en) | 2017-11-01 | 2017-11-01 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721440060.0U CN207625858U (en) | 2017-11-01 | 2017-11-01 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207625858U true CN207625858U (en) | 2018-07-17 |
Family
ID=62827487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721440060.0U Active CN207625858U (en) | 2017-11-01 | 2017-11-01 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207625858U (en) |
-
2017
- 2017-11-01 CN CN201721440060.0U patent/CN207625858U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215301 No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou Patentee after: Kunshan Longteng Au Optronics Co Address before: 215301 No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou Patentee before: Kunshan Longteng Optronics Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |