KR20060018545A - Flexible printed circuit preventing electromagnetic interference - Google Patents

Flexible printed circuit preventing electromagnetic interference Download PDF

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KR20060018545A
KR20060018545A KR1020040066954A KR20040066954A KR20060018545A KR 20060018545 A KR20060018545 A KR 20060018545A KR 1020040066954 A KR1020040066954 A KR 1020040066954A KR 20040066954 A KR20040066954 A KR 20040066954A KR 20060018545 A KR20060018545 A KR 20060018545A
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South Korea
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printed circuit
flexible printed
circuit pattern
circuit board
insulating layer
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KR1020040066954A
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Korean (ko)
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김종수
남민현
김관식
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유트로닉스 주식회사
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Priority to KR1020040066954A priority Critical patent/KR20060018545A/en
Publication of KR20060018545A publication Critical patent/KR20060018545A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

본 발명은 전자기파 차폐된 연성인쇄회로기판에 관한 것으로, 구체적으로는 인쇄회로기판의 회로 패턴 전면 혹은 후면에 전자기파를 흡수하는 전도성 물질을 형성됨을 특징으로 하는 연성인쇄회로기판에 관한 것이다. 본 발명에서 구현된 연성인쇄회로기판는 종래의 회로기판과 비교하여, 전자기파 방출을 현저히 감소시키며, 본 연성인쇄회로기판이 적용되는 전자 장치내의 전자기파 간섭현상을 현저히 감소시킴으로써 줄여 전자 장치의 안정화 시킬 수 있다.

Figure 112004038008276-PAT00001

전자기파 차폐, 연성인쇄회로, 전도성 물질

The present invention relates to a flexible printed circuit board shielding electromagnetic waves, and more particularly, to a flexible printed circuit board, wherein a conductive material absorbing electromagnetic waves is formed on the front or rear surface of a circuit pattern of a printed circuit board. Compared to the conventional circuit board, the flexible printed circuit board implemented in the present invention significantly reduces electromagnetic wave emission, and can significantly reduce the electromagnetic interference in the electronic device to which the flexible printed circuit board is applied, thereby reducing the stabilization of the electronic device. .

Figure 112004038008276-PAT00001

Electromagnetic shielding, flexible printed circuits, conductive materials

Description

전자기파 차폐된 연성인쇄회로기판 {Flexible Printed Circuit preventing ElectroMagnetic Interference} Flexible Printed Circuit Preventing ElectroMagnetic Interference             

도 1은 종래의 연성인쇄회로기판의 단면도,1 is a cross-sectional view of a conventional flexible printed circuit board,

도 2는 본 발명의 실시예 1에 따른 연성인쇄회로기판의 단면도,2 is a cross-sectional view of a flexible printed circuit board according to Embodiment 1 of the present invention;

도 3는 본 발명의 실시예 2에 따른 연성인쇄회로기판의 단면도,3 is a cross-sectional view of a flexible printed circuit board according to Embodiment 2 of the present invention;

도 4은 본 발명의 실시예 3에 따른 연성인쇄회로기판의 단면도,4 is a cross-sectional view of a flexible printed circuit board according to Embodiment 3 of the present invention;

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

1 : 인쇄회로기판 2 : 절연판1 printed circuit board 2 insulation board

3 : 회로패턴 4 : 단자홀3: circuit pattern 4: terminal hole

5 : 전도성 물질 6 : 접지단자5: conductive material 6: ground terminal

본 발명은 전지기파를 흡수하는 전도성 물질이 코팅된 연성인쇄회로기판에 관한 것으로서, 보다 상세하게는 인쇄회로기판 상에 설치되는 IC칩 등을 포함하는 각종 전자부품으로부터 생성되는 전자기파 간섭이 다른 전자부품 또는 다른 전자장치의 오 동작을 방지하도록 전자기파를 흡수시키고, 인체에 유해한 전자기파를 차단할 수 있는, 회로패턴의 전면 혹은 후면에 단층 혹은 다층으로 전도성 물질이 형성된 인쇄회로기판에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board coated with a conductive material that absorbs electromagnetic waves, and more particularly, to an electronic component having different electromagnetic interference generated from various electronic components including an IC chip installed on a printed circuit board. Another aspect of the present invention relates to a printed circuit board in which a conductive material is formed in a single layer or a multilayer on a front or rear surface of a circuit pattern, which absorbs electromagnetic waves to prevent malfunction of other electronic devices and blocks electromagnetic waves harmful to a human body.

종래의 인쇄회로기판(10)은, 도1에 도시된 바와 같이, 페놀 등의 수지를 이용한 절연판(12)의 일면에 구리 등 금속 재질의 박판이 부착되고, 이 박판을 현상, 에칭(etching) 등의 공정으로 요구되는 회로패턴(14)으로 형성시킨 것으로서, 이 회로패턴(14)의 각 부위에 대응하여 전자부품을 배치하여 상호 접속 연결되도록 함으로써 이들 전자부품 상호간의 구동이 원활하게 이루어질 수 있도록 형성된 것이다. 이러한 인쇄회로기판(10)에 있어서, 각종 전자부품의 각 단자가 위치되는 부위에는, 도2에 도시된 바와 같이, 그 표면으로부터 회로패턴(14)과의 접속 연결이 용이하도록 소정 부위가 노출되거나 그 부위에 대응하여 땜납에 의한 접속이 이루어지도록 단자홀(16)이 형성된다.In the conventional printed circuit board 10, as shown in FIG. 1, a thin plate of a metal material such as copper is attached to one surface of the insulating plate 12 using a resin such as phenol, and the thin plate is developed and etched. It is formed of the circuit pattern 14 required by the process such as, and the like to arrange the electronic components corresponding to each part of the circuit pattern 14 to be connected to each other so that the driving between these electronic components can be smoothly performed. Formed. In such a printed circuit board 10, a portion where each terminal of various electronic components is located, as shown in FIG. 2, is exposed to a predetermined portion so as to facilitate connection and connection with the circuit pattern 14 from its surface. Corresponding to the portion, the terminal hole 16 is formed so that the connection by solder is made.

종래의 인쇄회로기판(10)의 구성에 의해 각종 전자부품이 설치됨에 있어서, 이들 전자부품은 인가되는 전원으로 자체 또는 상호간의 전기적 접속 관계에 의해 전자기파를 주변에 형성하게 되고, 이렇게 형성되는 전자기파는 인근의 전자부품 또는 다른 전기장치에 영향을 끼쳐 문제를 야기한다.In the installation of various electronic components by the configuration of a conventional printed circuit board 10, these electronic components are formed around the electromagnetic wave by the electrical connection relationship between itself or each other by a power source to be applied, and the electromagnetic waves thus formed are It affects nearby electronic components or other electrical devices, causing problems.

또한, 인쇄회로기판(10)에 인가되는 전원으로 인하여, 인쇄회로기판(10)의 회로 패턴에서 전자기파를 방출하고 인근의 전자부품 또는 다른 전기장치에 영향을 끼쳐 오동작시키는 등의 문제가 있었다.In addition, due to the power applied to the printed circuit board 10, there is a problem that emits electromagnetic waves in the circuit pattern of the printed circuit board 10, affects nearby electronic components or other electrical devices and malfunctions.

본 발명은 상기한 바와 같은 문제점을 해결하기 위한 것으로, 인쇄회로기판 상에 접속 설치되는 각종 전자부품 및 회로 패턴으로부터 생성되는 전자기파에 의한 다른 전자부품 및 다른 전자장치에 오동작 및 전기적 손상을 방지시키고, 인체에 유해한 전자파를 차단할 수 있도록 하는 전자기파를 차단하는 전도성 물질이 코팅된 인쇄회로기판을 제공함에 있다.
The present invention is to solve the problems as described above, to prevent malfunction and electrical damage to other electronic components and other electronic devices by electromagnetic waves generated from various electronic components and circuit patterns connected to the printed circuit board, The present invention provides a printed circuit board coated with a conductive material that blocks electromagnetic waves, which can block electromagnetic waves harmful to a human body.

상기 기술적 과제를 달성하기 위한 본 발명에 의한 전자기파를 차폐하는 연성인쇄회로기판은, 연성인쇄회로기판의 하면 혹은 연성인쇄회로기판의 상면 혹은 다층회로기판의 경우에 회로 폐턴 사이에 회로기판으로부터 방출되는 전자기파를 흡수하는 전도성 물질을 삽입하는 것을 특징으로 한다.The flexible printed circuit board for shielding the electromagnetic wave according to the present invention for achieving the above technical problem, is emitted from the circuit board between the circuit closing in the case of the lower surface of the flexible printed circuit board, the upper surface of the flexible printed circuit board or in the case of a multilayer circuit board. Inserting a conductive material that absorbs electromagnetic waves.

이하에서는, 본 발명에 의한 전자기파를 차폐하는 연성인쇄회로기판에 대한 실시예를 첨부도면을 통하여 상세히 설명한다.Hereinafter, an embodiment of a flexible printed circuit board for shielding electromagnetic waves according to the present invention will be described in detail with reference to the accompanying drawings.

<실시예 1><Example 1>

도 2는 본 발명의 일실시예로서의 단층 연성인쇄회로기판의 단면도이다. 상기 단층 연성인쇄회로기판은 전기회로패턴, 전기회로패턴 하면의 절연층, 전기회로패턴 상면의 절연층, 전기회로패턴 하면의 절연층 위에 전도성 물질이 형성된 면, 전도성 물질이 형성된 면 위로 다시 형성된 절연층으로 구성되어 있다.2 is a cross-sectional view of a single layer flexible printed circuit board according to an embodiment of the present invention. The single layer flexible printed circuit board may include an electric circuit pattern, an insulating layer under the electric circuit pattern, an insulating layer on the upper surface of the electric circuit pattern, an insulating layer formed on the surface on which the conductive material is formed, and an insulating layer formed on the surface on which the conductive material is formed. It is composed of layers.

상기 본 발명의 단층 연성인쇄회로기판을 제공하기 위하여, 전도성 물질은 구리 혹은 은과 같은 순수 금속성 물질, In2O3 및 SnO2의 합금형태의 전도성 화합물, 혹은 상기 금속성 물질을 전도성 수지와 혼합한 페이스트 형태로 이루어진다. 또한, 상기 전도성 물질는 실크 스크린 방법, 스퍼터링 방법, 스프레이 분사 방법, 혹은 전도성 물질 테이프의 접착방법 중 어느 한 가지 방법으로 형성될 수 있다.In order to provide the single layer flexible printed circuit board of the present invention, the conductive material is made of a pure metallic material such as copper or silver, a conductive compound in the form of an alloy of In 2 O 3 and SnO 2, or a paste in which the metallic material is mixed with a conductive resin. . In addition, the conductive material may be formed by any one of a silk screen method, a sputtering method, a spray spraying method, or a method of adhering a conductive material tape.

상기 전도성 물질은 전기 회로 패턴 하면의 절연층 아래에 형성되며, 그 두께는 너무 두꺼우면 인쇄회로의 연성이 감소하며, 제조원가가 증가하므로 최소화하는 것이 바람직하다. 또한 상기 전도성 물질은 회로기판의 접지선과 연결하여 흡수되 전자기파를 접지선으로 유인하도록 하는 것이 바람직하다.The conductive material is formed under the insulating layer under the electric circuit pattern, and if the thickness is too thick, the ductility of the printed circuit is reduced, and the manufacturing cost is increased, so it is desirable to minimize it. In addition, the conductive material is preferably connected to the ground line of the circuit board to absorb the electromagnetic wave to the ground line.

상기의 전도성 물질은 폴리이미드와 같은 종래의 절연층 물질로 다른 전자 부품 소자와의 절연을 위하여 봉합하는 것이 바람직하다.The conductive material is a conventional insulating layer material such as polyimide and is preferably sealed for isolation from other electronic component elements.

<실시예 2><Example 2>

도 2는 본 발명의 실시예로서의 단층 연성인쇄회로기판의 단면도이다. 상기 단층 연성인쇄회로기판은 전기회로패턴, 전기회로패턴 하면의 절연층, 전기회로패턴 상면의 절연층, 전기회로패턴 상면의 절연층 위의 전도성 물질층, 전도성 물질층다시 형성된 절연층으로 구성되어 있다.2 is a cross-sectional view of a single layer flexible printed circuit board as an embodiment of the present invention. The single-layer flexible printed circuit board is composed of an electrical circuit pattern, an insulating layer on the lower surface of the electrical circuit pattern, an insulating layer on the upper surface of the electrical circuit pattern, a conductive material layer on the insulating layer on the upper surface of the electrical circuit pattern, and an insulating layer formed on the conductive material layer again. have.

상기 본 발명의 실시예 2에서 단층 연성인쇄회로기판을 제공하기 위하여, 전도성 물질 및 전도성 물질의 형성방법은 실시예 1과 동일하다. 그러나 실시예 2에서는 단층 연성인쇄회로기판의 상면에는 실장되는 전자부품과 회로 패턴과의 연결을 위한 연결단자가 노출되어야함을 고려하여 연결단자를 부분을 마스킹시켜서 전도성 물질을 코팅하는 것이 바람직하다.In order to provide a single layer flexible printed circuit board in Example 2 of the present invention, the conductive material and the method of forming the conductive material are the same as in Example 1. However, in Example 2, it is preferable to coat the conductive material by masking the portion of the connecting terminal in consideration of exposing the connecting terminal for connecting the electronic component and the circuit pattern to be mounted on the upper surface of the single layer flexible printed circuit board.

<실시예 3><Example 3>

도 2는 본 발명의 실시예로서의 양측 연성인쇄회로기판의 단면도이다. 상기 단층 연성인쇄회로기판은 상면전기회로패턴, 하면전기회로패턴, 이중층의 전기회로패턴사이의 전도성 물질층으로 구성되어 있다.2 is a cross-sectional view of both flexible printed circuit boards as an embodiment of the present invention. The single layer flexible printed circuit board is composed of a conductive material layer between a top electrical circuit pattern, a bottom electrical circuit pattern, and a double layer electrical circuit pattern.

상기 본 발명의 실시예 3에서 양측 연성인쇄회로기판을 제공하기 위하여, 전도성 물질 및 전도성 물질의 형성방법은 실시예 1과 동일하다. 그러나 실시예 3에서는 상면전기회로패턴 및 하면전기회로패턴사이의 절연층 사이에 전도성 물질이 형성된다는 것이 특징이다.In order to provide both flexible printed circuit boards in the third embodiment of the present invention, the conductive material and the method of forming the conductive material are the same as in the first embodiment. However, in the third embodiment, a conductive material is formed between the insulating layer between the upper surface electrical circuit pattern and the lower surface electrical circuit pattern.

이상에서 설명한 바와 같이, 본 발명에 의한 전자기파를 차단하기 위하여 전도성 물질이 부착된 연성인쇄회로기판은 연성인쇄회로기판의 하면 혹은 연성인쇄회로기판의 상면 혹은 다층회로기판의 경우에 회로 폐턴 사이에 회로기판으로부터 방출되는 전자기파를 흡수하는 전도성 물질을 삽입함으로써 각종 전자부품의 구동시 전자부품 및 연성인쇄회로기판의 회로패턴에서 생성되는 전자기파가 전도성 물질에 흡수되어 접지선에 의해 유도됨에 따라 각 전자부품 및 다른 전자장치 상호간의 전기장에 의한 오동작이 방지되며, 인체에 유해한 영향을 제거할 수 있는 효과가 있다.As described above, the flexible printed circuit board with a conductive material in order to block the electromagnetic wave according to the present invention has a circuit between the circuit closing turns in the lower surface of the flexible printed circuit board, the upper surface of the flexible printed circuit board, or the multilayer printed circuit board. By inserting a conductive material that absorbs electromagnetic waves emitted from the substrate, the electromagnetic waves generated in the circuit patterns of the electronic component and the flexible printed circuit board are absorbed by the conductive material and guided by a ground wire when driving various electronic components. Malfunctions caused by electric fields between electronic devices are prevented, and there is an effect of eliminating harmful effects on the human body.

이상 설명한 본 발명은 그 기술적 사상 또는 주요한 특징으로부터 벗어남이 없이 다른 여러가지 형태로 실시될 수 있다. 따라서, 상기 실시예는 모든 점에서 단순한 예시에 지나지 않으며 한정적으로 해석되어서는 안된다.
The present invention described above can be embodied in many different forms without departing from the spirit or main features thereof. Therefore, the above embodiments are merely examples in all respects and should not be interpreted limitedly.

Claims (7)

전기회로패턴, 전기회로패턴 하면의 절연층, 전기회로패턴 상면의 절연층을 구비하는 연성인쇄회로기판에 있어서, 상기 전기회로패턴 하면의 절연층 아래에 전도성 물질층이 형성되고, 상기 전도성 물질층 아래 다시 절연층이 형성됨을 특징으로 하는 연성인쇄회로기판.In a flexible printed circuit board having an electrical circuit pattern, an insulating layer on the bottom surface of the electrical circuit pattern, and an insulating layer on the top surface of the electrical circuit pattern, a conductive material layer is formed under the insulating layer on the bottom surface of the electrical circuit pattern, and the conductive material layer Flexible printed circuit board, characterized in that the insulating layer is formed again below. 전기회로패턴, 전기회로패턴 하면의 절연층, 전기회로패턴 상면의 절연층을 구비하는 연성인쇄회로기판에 있어서, 상기 전기회로패턴 상면의 절연층 위에 전기회로패턴 만을 노출시키는 전도성 물질층이 형성되고, 상기 전도성 물질층 위에 다시 전기회로패턴 만을 노출시키는 절연층이 형성됨을 특징으로 하는 연성인쇄회로기판.In a flexible printed circuit board having an electric circuit pattern, an insulating layer on the lower surface of the electric circuit pattern, and an insulating layer on the upper surface of the electric circuit pattern, a conductive material layer exposing only the electric circuit pattern is formed on the insulating layer on the upper surface of the electric circuit pattern. And an insulating layer exposing only the electric circuit pattern again on the conductive material layer. 이중의 전기회로패턴, 이중의 전기회로패턴 사이에 절연층, 전기회로패턴 상면 및 하면에 절연층을 구비하는 연성인쇄회로기판에 있어서,In a flexible printed circuit board having a double electrical circuit pattern, an insulating layer between the double electrical circuit pattern, the insulating layer on the upper and lower surfaces of the electrical circuit pattern, 상기 하면의 절연층 아래에 전도성 물질층이 형성되고, A conductive material layer is formed under the insulating layer on the lower surface, 상기 전도성 물질층 아래 다시 절연층이 형성됨을 특징으로 하는 연성인쇄회로기판.And an insulating layer is formed under the conductive material layer. 이중의 전기회로패턴, 이중의 전기회로패턴 사이에 절연층, 전기회로패턴 상면 및 하면에 절연층을 구비하는 연성인쇄회로기판에 있어서, 상기 상면의 절 연층 위에 전기회로패턴 만을 노출시키는 전도성 물질층이 형성되고, 상기 전도성 물질층 위에 다시 전기회로패턴 만을 노출시키는 절연층이 형성됨을 특징으로 하는 연성인쇄회로기판.In a flexible printed circuit board having a double electric circuit pattern, an insulating layer between the double electric circuit pattern, an insulating layer on the upper and lower surfaces of the electrical circuit pattern, a conductive material layer exposing only the electrical circuit pattern on the insulating layer of the upper surface And a dielectric layer exposing only the electrical circuit pattern again on the conductive material layer. 이중의 전기회로패턴, 이중의 전기회로패턴 사이에 절연층, 전기회로패턴 상면 및 하면에 절연층을 구비하는 연성인쇄회로기판에 있어서, 상기 이중의 전기회로패턴 사이에 절연층 사이에 전도성 물질층이 형성성됨을 특징으로 하는 연성인쇄회로기판.A flexible printed circuit board having a double electric circuit pattern, an insulating layer between the double electric circuit patterns, and an insulating layer on the upper and lower surfaces of the electric circuit pattern, wherein the conductive material layer is provided between the insulating layers between the double electric circuit patterns. A flexible printed circuit board, characterized in that it is formed. 제 1항에서 제 5항까지에 있어서, 상기 전도성 물질은 구리 혹은 은과 같은 순수 금속성 물질, In2O3 및 SnO2의 합금형태의 전도성 화합물, 혹은 상기 금속성 물질을 전도성 수지와 혼합한 페이스트 형태로 이루어진 것을 특징으로 하는 연성인쇄회로기판.The method according to claim 1 to 5, wherein the conductive material is a pure metallic material such as copper or silver, a conductive compound in the form of alloys of In2O3 and SnO2, or a paste in which the metallic material is mixed with a conductive resin, characterized in that Flexible printed circuit boards. 제 1항에서 제 5항까지에 있어서,상기 전도성 물질이 접지선과 연결된 것을 특징으로 하는 연성인쇄회로기판.The flexible printed circuit board of claim 1, wherein the conductive material is connected to a ground line.
KR1020040066954A 2004-08-25 2004-08-25 Flexible printed circuit preventing electromagnetic interference KR20060018545A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7952676B2 (en) 2006-12-15 2011-05-31 Samsung Electronics Co., Ltd. Connection structures capable of reducing distortion of signal
WO2016117720A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding sheet and manufacturing method of the same
WO2016117719A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding film and manufacturing method thereof
KR101866501B1 (en) * 2011-09-28 2018-06-12 삼성전자주식회사 Superhydrophobic electromagnetic field sheilding material and method of preparing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7952676B2 (en) 2006-12-15 2011-05-31 Samsung Electronics Co., Ltd. Connection structures capable of reducing distortion of signal
KR101866501B1 (en) * 2011-09-28 2018-06-12 삼성전자주식회사 Superhydrophobic electromagnetic field sheilding material and method of preparing the same
WO2016117720A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding sheet and manufacturing method of the same
WO2016117719A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding film and manufacturing method thereof

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