KR20060013276A - Semiconductor manufacturing equipment having a shower head improved assembly - Google Patents

Abstract

The semiconductor manufacturing equipment having the shower head with improved assembly performance is installed in the chamber and the chamber having a gas supply line to which the reaction gas is supplied, and a threaded surface formed on the ceiling surface, And a shower head having a locking portion formed to be fixedly installed, and a gas supply hole is formed in the hook portion and the locking portion so as to communicate with the outlet of the shower head so that the reaction gas supplied from the gas supply line flows.

Showerhead, chamber

Description

Semiconductor Manufacturing Equipment Having a Shower Head Improved Assembly}

1 is a schematic cross-sectional view showing a semiconductor manufacturing apparatus equipped with a conventional shower head;

Figure 2 is an exploded perspective view showing a semiconductor manufacturing equipment having a showerhead with improved assembly of the present invention,

3 is a cross-sectional view showing a bonding state along the line A-A 'shown in FIG.

4 is a partially enlarged cross-sectional view of a display B shown in FIG.

FIG. 5 is a partially enlarged cross-sectional view of the symbol C shown in FIG. 3.

** Explanation of symbols for main parts of drawings **

100: chamber 150: hanger

151: first gas supply hole 200: shower head

220: latching portion 221: second gas supply hole

250: elastic member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shower head for semiconductor manufacturing equipment, and more particularly, to fabricating a semiconductor by facilitating assembling and preventing leakage of a reaction gas to the outside of the chamber by attaching and fixing the shower head in a chamber. A showerhead for a facility.

In general, semiconductor manufacturing equipment for processing wafers includes equipment for performing a chemical vapor deposition (CVD) process to form a thin film on the upper surface of the wafer, and equipment for performing an etching process for removing material from a specific portion of the wafer. Each facility is equipped with a shower head for supplying a predetermined reaction gas into the chamber in which the wafer is seated and spraying the wafer onto the wafer in order to perform a predetermined process on the wafer.

Referring to FIG. 1, a semiconductor manufacturing apparatus for processing a conventional wafer forms a chamber 100 that can create a vacuum environment, and a susceptor on which a wafer W to be processed is mounted in the chamber 100. 110 is provided, and the shower head 200 is provided above the chamber 100 to inject the reaction gas supplied by the gas supply device (131, 132) into the chamber 100.

Here, the shower head 120 mounted inside the chamber 100 is fastened in a state in which the upper portion of the shower head 120 is in close contact with the ceiling surface of the chamber 100 through the fastening means 10 such as a bolt.

At this time, the gas supply holes 121 and 122 formed in the shower head 120 are positioned to communicate with the gas supply lines 131a and 132a outside the chamber 100.

When the fastening means 10 is tightened with an excessive force above an allowable value in the above state to fasten the shower head 120, the fastening means 10 may be broken.

In this case, as the fastening means 10 is broken, the shower head 120 mounted inside the chamber 100 is inclined to one side, and the remaining reaction gas injected into the chamber 100 remains in the fastening means 10. There is a problem in that leakage through the fastening hole 11 is opened while being broken.

In addition, when the reactive gas leaked as described above is a flammable gas, there is a big problem of causing human life and physical damage due to fire.

Therefore, the present invention has been made in order to solve the above problems, according to the shower head for semiconductor manufacturing equipment of the present invention, to form a cladding portion is formed in the ceiling portion in the ceiling inside the chamber, the shower head is A locking portion is formed and fixed to the shower head body so as to be fixed. The reaction gas supplied from the outside of the chamber is supplied to match the gas supply hole formed in the locking portion of the chamber with the locking portion of the shower head. It is to provide a shower head of the semiconductor manufacturing equipment to prevent the reaction gas injected from the leakage of the outside of the chamber as well as to easily detach the shower head.

A semiconductor manufacturing apparatus having a showerhead having improved assembly ability of the present invention includes a chamber having a gas supply line to which a predetermined reaction gas is supplied, and a latching portion formed on a ceiling surface thereof; And a shower head installed in the chamber and having a locking portion to be fixedly installed over the latching surface of the latching portion.

Here, the shower head is fixed to be installed across the engaging surface of the hook portion, it is preferable that the elastic member is further interposed so that the latching surface and the engaging portion is in close contact between the shower head upper surface and the ceiling surface of the chamber.

The elastic member may be interposed between the shower head upper surface and the ceiling surface of the chamber, and may be installed on the shower head upper surface or the chamber ceiling surface.

The shower head may include a first gas supply hole formed in the latch portion and communicating with the gas supply line when the shower head is fixed across the latch portion of the chamber, and a second portion formed inside the latch portion of the shower head. It is preferable that the two gas supply holes communicate with each other so that the reaction gas is injected through the injection hole of the shower head.

In addition, the latching portion of the chamber and the locking portion of the shower head may be formed radially.

Hereinafter, with reference to the accompanying drawings will be described a configuration of a semiconductor manufacturing equipment having a showerhead improved assembly performance of the present invention.

Referring to FIG. 2, a semiconductor manufacturing apparatus having a showerhead having improved assembly ability of the present invention includes a wafer W on which a process is to be performed, in order to perform a predetermined process, for example, a thin film forming process, and a reaction gas. The gas supply lines 131a and 132a communicated with each other to be introduced therein, are installed in the chamber 100 and the chamber 100 having a catching part 150 formed with a catching surface 150a on the ceiling surface. It includes a shower head 200 is formed with a locking portion 220 to be fixed across the engaging surface (150a) of the needle 150.

In addition, the shower head 200 is fixedly installed over the latching surface 150a of the hooking portion 150, and the hooking surface 150a and the hooking portion are disposed between the top of the showerhead 200 and the ceiling surface of the chamber 100. An elastic member 250, such as a spring, is further interposed so that the 220 is in close contact with each other.

Here, the elastic member 250 may be interposed between the upper surface of the shower head 200 and the ceiling surface of the chamber 100, may be interposed fixedly installed on the upper surface of the shower head 200, or the ceiling surface of the chamber 100.

In addition, when the shower head 200 is fixed across the hook portion 150 of the chamber 100, the shower head 200 is formed in the hook portion 150 to communicate with the gas supply line 131a. And, the second gas supply hole 221 formed in the engaging portion 220 of the shower head 200 is fixed to communicate with the reaction gas is formed to be injected through the injection hole (200a) of the shower head 200. .

In addition, the hook portion 150 of the chamber 100 and the catching portion 220 of the shower head 200 may be formed radially.

Next, to describe the preferred embodiment according to the present invention through the configuration as described above.

Referring to FIG. 2, the locking portion 220 of the shower head 200 is inserted between the plurality of radially caught portions 150 formed on the ceiling surface inside the chamber 100, and then the caught portion 150a is disposed on the caught surface 150a. The bottom of 220) is fixed by turning it so that it is in close contact.                     

Here, between the upper surface of the shower head 200 and the ceiling surface of the chamber 100, an elastic member 250 such as a spring is interposed, and a pushing force is applied in the up / down direction so that the engaging surface 150a and the engaging portion 220 are actuated. Improve the fixing power by increasing the adhesion of

In addition, the elastic member 250 may be fixed to one of the upper surface of the shower head 200 or the ceiling surface of the chamber 100.

3 and 4, the inlet 151a of the first gas supply hole 151 formed inside the hooking part 150 communicates with the gas supply lines 131a and 132a installed in communication with the upper part of the chamber 100. The first gas supply hole 151 and the outlet 151b are formed in the second gas supply hole 221 formed in the engaging portion 220 of the shower head 200 across the engaging surface 150a of the engaging portion 150. It communicates with the inlet 221a.

Accordingly, the reaction gas supplied from the gas supply lines 131a and 132a flows through the first gas supply hole 151 and passes through the gas hole 230 through the second gas supply hole 221 to the injection hole 200a. Is sprayed on.

Here, the outlet 151b of the first gas supply hole 151 and the inlet 221a of the second gas supply hole 221 are in close contact with each other and communicate with each other, thereby preventing leakage of the supplied reaction gas into the chamber 100. In order to prevent it, it may be desirable to further provide a sealing means such as an O-ring.

Of course, a small amount of reaction gas leaks into the chamber 100, but there is no big problem in the process, but the above-mentioned method is necessary to maintain a uniform injection degree of the reaction gas injected through the injection hole 200a of the shower head 200. It is preferable that the sealing means be installed as well.                     

Thus, the reaction gas is effectively prevented from leaking between the gaps in which the fastening means 10 is fitted by not fastening the shower head 200 using the fastening means 10 such as bolts through the outside of the chamber 100. do.

On the other hand, although not shown in the drawing, when the locking portion 220 of the shower head 200 is inserted and fixed between the hook portions 150 of the chamber 100, the first and second gas supply holes 151 , 221 should be exactly matched, by limiting the rotational position of the locking portion 220 of the shower head 200 is fixed by turning the hook is formed vertically on one side of the hook portion 150, in the direction to be turned It is also possible to prevent the locking unit 220 from being separated from the hooking unit 151 and to accurately match the center positions of the first and second gas supply holes 151 and 221.

Therefore, according to the semiconductor manufacturing equipment having the shower head with improved assembly performance of the present invention, when mounting the shower head in the chamber, the operator by inserting the locking portion of the shower head to the locking portion formed on the ceiling surface of the chamber, the operator It can be easily attached and detached during airborne work.

In addition, it is possible to prevent the reaction gas from leaking to the outside of the chamber by fixing the shower head directly from the outside of the chamber through the fastening means and preventing the leakage of the reaction gas to the outside of the chamber. It can prevent as much as possible due to human and material damage.

Claims (5)

A chamber having a gas supply line to which a predetermined reaction gas is supplied, and having a hook portion formed on a ceiling thereof; And And a shower head installed inside the chamber, the shower head having a locking portion formed to be fixedly installed across the latching surface of the latching portion. The method of claim 1, The shower head is fixedly installed across the hanging surface of the hanging portion, the assembly is characterized in that the elastic member is further interposed between the upper surface of the shower head and the ceiling surface of the chamber so that the engaging surface and the engaging portion is in close contact. A semiconductor manufacturing facility having this improved showerhead. The method of claim 2, The elastic member is interposed between the upper surface of the shower head and the ceiling surface of the chamber, the semiconductor manufacturing equipment having an improved shower head, characterized in that installed on the upper surface of the shower head. The method of claim 1, When the shower head is fixed across the latch portion of the chamber, a first gas supply hole is formed in the latch portion and communicates with the gas supply line, and a second gas formed inside the latch portion of the shower head. Supply hole is in communication with the semiconductor manufacturing equipment having an improved shower head, characterized in that the reaction gas is formed to be injected through the injection port of the shower head. The method of claim 1, And said latching portion of said chamber and said latching portion of said shower head are radially formed.

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