KR20060011011A - Apparatus for matching rf power for semiconductor manufacturing equipment - Google Patents

Abstract

The present invention relates to a high frequency power matching device for semiconductor manufacturing equipment, that is, the present invention is provided at the bottom of the process chamber, the high frequency power matched through the electrode of the mini match by screwing the mini match by the bracket inside the cover In the high frequency power matching device for semiconductor manufacturing equipment to apply the to the process chamber, the bracket 40 is a fastening portion 41 to which the mini match 30 is fastened and a cover 20 of the fastening portion 41. The end portion is bent vertically to form a fixing portion 42 in surface contact with one side of the cover 20, wherein the fixing portion 42 is fastened to the fastening means 50 on one side of the cover 20. In this way, the high frequency power applied to the process chamber 10 through the electrode 31 of the mini match 30 is made stable all the time. A while will be yitorok for the economical maintenance service to be performed by a stable process ever accurate power applied is possible by reducing the power of the high frequency noise, and in particular prevent damage to the cover 20.

Process Chamber, High Frequency Power, RF, Matching

Description

High frequency power matching device for semiconductor manufacturing equipment {Apparatus for matching RF power for semiconductor manufacturing equipment}             

1 is a side cross-sectional view showing a conventional high frequency power matching device;

Figure 2 is a side cross-sectional view showing a deformation state of the bracket in the conventional high frequency power matching device,

Figure 3 is a side cross-sectional view showing a high frequency power matching device according to the present invention.

Explanation of symbols on the main parts of the drawings

1, 10: process chamber 2, 20: cover

3, 30: mini match 4, 31: electrode

5, 40: bracket 41: fastening portion

42: fixed part

50: fastening means

The present invention relates to a high frequency power matching device for semiconductor manufacturing equipment, and more particularly to a cover provided to cover the outside of the mini match with a bracket for fixing the mini match for matching the high frequency power to the process chamber. For semiconductor manufacturing equipment that allows contact with the cover while allowing surface contact, and easy replacement, and replacement of the mini match before the bracket is modified, so that the electrode connection to the process chamber is always accurate and stable. A high frequency power matching device.

In general, the electrical impedance inside the chamber of the process equipment used in the semiconductor manufacturing process has an element that can be changed by the environment formed therein. Especially, in the case of a plasma chamber to which a high frequency power source is applied, a variable factor It works more loudly.

For example, in the case of performing a sputtering process with a target used as a deposition material, the impedance inside the chamber changes as the target is corroded, and in the etching or ashing process, the gas inside the chamber with respect to the size and required etching rate of the substrate to be processed. Impedance will vary depending on requirements such as temperature and temperature.

The most ideal high frequency matching in the plasma chamber is a state in which the internal impedance of the high frequency power source is equal to the internal impedance of the chamber.

In this case, RF power is generally used as RF power, and the RF power is generated by the RF generator and transferred to the process chamber. The RF power delivered to the process chamber is often changed as the frequency range changes during the transmission. Since no power can be delivered, it is a high frequency power matching device that is provided to ensure that proper RF power can be delivered without loss.

Such a high frequency power matching device is already disclosed by Korean Patent Laid-Open Publication No. 1993-003272 and Korean Patent Laid-Open Publication No. 2003-86673, wherein the high frequency power matching apparatus is shown in FIG. 1.

That is, the high frequency power matching device is configured to be provided at the bottom of the process chamber 1, and the outside of the high frequency power matching device is usually surrounded by the cover 2, and the assembly for substantially RF matching is provided therein.

This RF matching assembly is often referred to as a mini match (3), and in addition to the mini match (3), various structures are located inside the cover (2).

On the other hand, the mini match 3 includes a plurality of motors, a plurality of capacitors, a tuning controller, and the like, and an electrode rod for positive and negative poles for RF power and static electricity generation (4) vertically toward the process chamber 1 at the upper end thereof. ) Is provided as a plurality.

Therefore, the RF power generated by the RF generator (not shown) is properly matched while passing through the mini match 3 to be transferred to the process chamber 1 through each electrode 4.

In this working structure, the mini-match 3 is formed with a long screw 6 having a long length in the fixing bracket 5 which is normally provided so that one end is welded to one side of the cover 2 so as to protrude inward to a predetermined length. It is fixed by tightening by.

However, mini-matches (3) are consumables that need to be replaced at regular intervals, so frequent replacement is required. However, when replacing the mini-screws (5) from the fixing brackets (5) frequently, the fixing brackets are replaced. As the inner diameter of the fastening hole (not shown) formed in (5) is severely worn, the diameter gradually expands, and the fastening force is weakened, and the part attached to the cover 2 is damaged by the cover 2 while being intensively loaded. There is a problem that even the cover 2 needs to be replaced.

In addition, since the fixing bracket 5 is attached to only one side of the cover 2 by welding, the inner tip of the fixing bracket 5 is slightly lowered due to frequent replacement of the mini match 3. Accordingly, the plurality of electrodes 4 connected to the process chamber 1 are connected to the process chamber 1 as shown in FIG. 2 while the mini match 3 screwed to the front end side of the fixing bracket 5 is also slightly down. 1) The side may not be assembled correctly and may be inclined, causing serious problems causing RF power loss.

Therefore, the present invention has been invented to solve the above-mentioned problems of the prior art, an object of the present invention is to distribute the load on the cover even more frequently during the frequent replacement of the mini-match high frequency for semiconductor manufacturing equipment to prevent damage to the cover It is to provide a power matching device.

It is another object of the present invention to provide a high frequency power matching device for semiconductor manufacturing equipment which prevents noise from occurring while the application of RF power is accurate by maintaining the state of electrode assembly to the process chamber at all times.

In order to achieve the above object, the present invention is provided at the bottom of the process chamber, and the semiconductor manufacturing to apply a high frequency power matched through the electrode of the mini match to the process chamber by screwing the mini match by the bracket inside the cover; In the high-frequency power matching device for equipment, the bracket is bent vertically by the cover side end of the fastening portion and the fastening portion to which the mini match is fastened to form a fixing portion in surface contact with one side of the cover, the fixing portion It is a configuration to be coupled to one side of the cover by the fastening means to enable the solution.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 shows a high frequency power matching device according to the present invention, the upper part is provided with a process chamber 10, the lower portion of the process chamber 10 to be surrounded by the cover 20, the inside The mini match 30 is provided, but the mini match 30 is fixed to the cover 20 by using a bracket to be pulled out from the RF generator (not shown) through a plurality of electrodes 31 formed to be drawn out to the upper end. The applied high frequency power is matched and applied to the process chamber 10, which is similar to the conventional configuration.

In this case, in addition to the mini match 30, a cooling line or other various components connected to the process chamber 10 may be accommodated in the cover 20, and the mini match 30 may also include various matching components.

The present invention has the most prominent feature to improve the configuration for fixing the mini match 30, in particular the connection configuration with the cover 20 of the bracket.

That is, in the present invention, the bracket 40 for fixing the mini match 30 is formed as the fastening part 41 and the fixing part 42, and the fixing part 42 has the fastening means 50 in the cover 20. It is a configuration that allows the physical solution to be connected.

In other words, the bracket 40 of the present invention has a shape that is bent as "a", one side of the fastening portion 41 formed one or more fastening holes so that the mini match 30 can be fastened by the long screw 32 The fixing part 42 is formed to be in close contact with the inner surface of the cover 20 while allowing one end of the fastening part 41 to be bent upward or downward, thereby forming the fixing part 42 with the cover 20. Using a separate fastening means 50 is to be coupled to the body resolution.

In this case, a screw may be used as the fastening means 50 for coupling the fixing part 42 of the bracket 40 to the cover 20, but it is most preferable to be fastened by the combination of the bolt and the nut for a more secure coupling. .

Looking at the operation by the present invention configured as described above are as follows.

In the present invention, the bracket 40 provided to support the mini match 30 is to be provided so that it can be replaced with the mini match 30, so that the bracket 40 is also a long screw with the mini match 30. And coupled to the cover 20 using a separate fastening means 50 such as a bolt and a nut.

That is, the fastening portion 41 coupled to the mini match 30 of the bracket 40 is provided to protrude inward from one side in the inside of the cover 20, but the cover 20 of the cover of the fastening portion 41 ( The inside of the cover 20 is fastened by the fastening means 50 to enable the detachable portion between the cover 20 and the fixing part 42 while closely fitting the fixing part 42 bent vertically at the side end portion. It is to be bent upward or downward along the plane.

When the screw 40 is coupled to the bracket 40 while the bracket 40 is firmly fixed inside the cover 20, the plurality of electrode rods protrude to the top of the mini match 30. The 31 are correctly connected vertically to the process chamber 10 so that the high frequency power is stably transmitted to the cathode and the electrostatic chuck of the process chamber 10.

When the high frequency power is matched to the process chamber 10 and transmitted to the process chamber 10, the mini match 30 may have a component that is at the end of its service life or failure, and thus the mini-match 30 may be replaced as a whole. In order to replace the must match the mini match 30 from the bracket (40).

When the mini match 30 is separated, the fastening part 41 of the bracket 40 may be slightly deformed by the load of the mini match 30, but if left as it is, the electrode rod 31 may be left unchanged. The assembly state with the process chamber 10 will be poor.

Therefore, the degree of deformation of the fastening portion 41 of the bracket 40 is checked so that the bracket 40 may be replaced at the same time when it is determined that the electrode 31 is formed to the extent that a defect occurs in the application of the high frequency power to the process chamber 10. .

When the bracket 40 is also replaced according to the deformation state of the bracket 40, the mini match 30 fixed to the bracket 40 also remains constantly coupled to the electrode 40 of the mini match 30. In addition, high frequency power can be stably applied to the process chamber 10 while maintaining an accurate connection state.

In addition, according to the present invention by expanding the portion that is in close contact with the cover 20 to prevent damage to the cover 20 due to the load shock applied to the bracket 40, there is no need to replace the cover 20 itself There is convenience.

On the other hand, while many matters have been described in detail in the above description, they should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention.

Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

As described above, according to the present invention, the process through the electrode rod 31 of the mini match 30 is achieved by simply improving the shape of the bracket 40 supporting the mini match 30 and the coupling structure to the cover 20. By applying the high frequency power to the chamber 10 at all times, it is possible to reduce the noise of the high frequency power while improving the efficiency of the process performance so that accurate power can be applied, thereby providing stable process performance. There is an advantage that economical maintenance is easy by preventing damage.

Claims (5)

In the high frequency power matching device for semiconductor manufacturing equipment, which is provided at the bottom of the process chamber, to apply a high frequency power matched through the electrode of the mini match to the process chamber by screwing the mini match by the bracket inside the cover, The bracket is a fastening portion to which the mini match is fastened, and the cover side end portion of the fastening portion is vertically bent to form a fixing portion in surface contact with one side of the cover, and the fixing portion is fastening means on one side of the cover. High frequency power matching device for semiconductor manufacturing equipment to enable the solution solved by. 2. The high frequency power matching device as set forth in claim 1, wherein at least one fastening hole is formed at the fastening part to allow the mini match to be coupled by a long screw. The high frequency power matching device for semiconductor manufacturing equipment according to claim 1, wherein the fixing part has a shape in which one end of the fastening part is bent upward. The high frequency power matching device for semiconductor manufacturing equipment according to claim 1, wherein the fixing part has a shape in which one end of the fastening part is bent downward. The high frequency power matching device for semiconductor manufacturing equipment according to claim 1, wherein the fastening means for coupling the fixing part to the cover comprises a bolt and a nut.

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