KR20060010578A - Led package and assembly for light device - Google Patents

Abstract

The present invention relates to an LED package for an optical device and an assembly thereof manufactured to emit light in various directions using a light emitting diode (LED).

LED package for an optical device according to the present invention, the LED; A first lead frame to which the LED is mounted and to which the first electrode of the LED is connected; A second lead frame facing the first lead frame and spaced apart from each other by a predetermined distance and connected to a second electrode of the LED; A main body part having a molding cup for filling the LED image with a transparent resin, and a base on which the first lead frame and the second lead frame are arranged; The first lead frame and the second lead frame extending from the one side in the longitudinal direction and formed on the outer lower portion of the main body portion; and a side electrode extending from at least one side of the external electrode It is characterized by.

LED, sideview, topview, lead frame

Description

LED Package and Assembly for Optical Device {LED PACKAGE AND ASSEMBLY FOR LIGHT DEVICE}             

1A is a perspective view of a LED package for a conventional optical device.

1B is a cross-sectional view of a LED package for a conventional optical device.

2A is a cross-sectional view of an LED package for an optical device according to an embodiment of the present invention.

2B and 2C are top views of LED packages for optical devices according to embodiments of the present invention.

2D is a top view of an LED package for an optical device according to an embodiment of the present invention.

Figure 3a is an LED assembly for an optical device for irradiating light in two directions perpendicular to each other in accordance with an embodiment of the present invention.

3B is an LED assembly for an optical device for irradiating strong light in the same direction according to an embodiment of the present invention.

Figure 3c is an LED assembly for an optical device for irradiating light in opposite directions in accordance with an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

10: LED Package for Conventional Optical Device 11: Cavity

12: main body 13: molding cup

14: Base 15, 16: Lead frame

17: LED

20, 20-1: LED package for an optical device according to an embodiment of the present invention

21: cavity 22: main body

23: Molding Cup 24: Base

25 and 26 lead frames 27 and 28 lower electrodes

29, 30: side electrode 40: substrate

41 to 43: LED assembly for an optical device according to an embodiment of the present invention

44: pad

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a viewing device using a light emitting diode (LED), and more particularly, to an LED package for an optical device and an assembly thereof manufactured to emit light in various directions.

As the electronics industry develops, various display devices having small size and low energy consumption are being developed, and optical devices such as video devices, computers, mobile communication terminals, and flashes are being developed using the same.

In general, a light emitting diode (LED) is a light emitting device that generates light by using a light emitting phenomenon (also called 'electric field emission') generated when a voltage is applied to a semiconductor. As the material of the LED, materials satisfying the conditions such that the light emission wavelength is present in the visible or near infrared region, the light emission efficiency is high, and the p-n junction can be manufactured are suitable. Such materials include gallium nitride (GaN), gallium arsenide (GaAs), gallium phosphide (GaP), gallium-arsenide-phosphorus (GaAs1-x Px), gallium-aluminum-arsenic (Ga1-xAlxAs), indium phosphide (InP) ), Compound semiconductors such as indium-gallium-phosphorus (In1-xGaxP) are used.

The light emission is largely divided by recombination of free carriers and recombination at an impurity emission center. In this case, the wavelength of the light generated by recombination to the impurity emission center varies depending on the type of the impurity added to the semiconductor. For example, in the case of gallium phosphide, light emission involving zinc and oxygen atoms is red (wavelength 700 nm), and light emission involving nitrogen atoms is green (wavelength 500 nm). That is, depending on the type of impurities and the semiconductor material, the light generated from the LEDs has different colors (wavelengths). Such LEDs have advantages in that they are smaller in size, longer in lifespan, and have higher energy efficiency and lower operating voltage than conventional light sources. Therefore, an LED having such an advantage is used as a light source of the LCD backlight module.

1 is a view showing the structure of a conventional LED package for an optical device. 1A is a perspective view of a LED package for a conventional optical device.

Referring to FIG. 1A, a conventional LED package 10 for an optical device is composed of a body portion 12 having a cavity 11 in the center thereof. In addition, after the LED (not shown) is mounted in the cavity 11, the cavity 11 is filled with a transparent resin such as an epoxy resin.

1B is a cross-sectional view of a LED package for a conventional optical device.

Referring to FIG. 1B, in the conventional LED package 10 for an optical device, the LED package 10 of the conventional LED body 10 is integrally formed with the molding cup 13 and the base 14. On the base 14, two lead frames 15 and 16 are regularly spaced apart from each other. An LED 17 is mounted on one of the lead frames 15 and 16, and the positive electrode and the negative electrode of the LED 17 are selectively wired to the lead frames 15 and 16, respectively. It is wire bonded. Then, the LEDs 17 are driven by connecting the lead frames 15 and 16 to an external circuit (not shown), for example, by vias formed through the bottom surface of the main body 12. Can be.

However, such a conventional LED device for optical device 10 can only irradiate light in one direction viewed by the LED 16, there is a problem that can not irradiate light in a plurality of directions. . In addition, even if a plurality of the conventional LED package for the optical device 10 is arranged to irradiate light in various directions, due to the structural limitations of the conventional LED package for optical device 10 requires a lot of space. It is difficult to manufacture a device capable of irradiating light in various directions with a small size.

An object of the present invention for solving the above problems is to provide an LED package for an optical device that can irradiate light in various directions using the LED.

In addition, another object of the present invention is to provide an LED assembly for an optical device that can be laminated to effectively irradiate in various directions.

LED package for an optical device according to the present invention for achieving the above object, the LED;

A first lead frame to which the LED is mounted and to which the first electrode of the LED is connected; A second lead frame facing the first lead frame and spaced apart from each other by a predetermined distance and connected to a second electrode of the LED; A main body part having a molding cup for filling the LED image with a transparent resin, and a base on which the first lead frame and the second lead frame are arranged; The first lead frame and the second lead frame extending from the one side in the longitudinal direction and formed on the outer lower portion of the main body portion; and a side electrode extending from at least one side of the external electrode It is characterized by.

In addition, the LED assembly for an optical device according to the present invention for achieving the above object is a substrate comprising a predetermined driving circuit; and the LED, the first lead frame is mounted on the LED and the first electrode of the LED, and the first A second lead frame facing the lead frame and spaced a predetermined distance from each other and connected to the second electrode of the LED; a molding cup for filling the LED on the LED with a transparent resin; and the first lead frame and the second lead frame. A main body portion having a base, the first lead frame and the second lead frame extends from one side in the longitudinal direction and formed from a lower electrode formed on the outer lower portion of the main body portion, and from at least one side of the external electrode And a plurality of LED packages for optical devices including side electrodes formed on the substrate and mounted on the substrate. The cage is formed by electrically connecting each of the lower and side electrodes.

DETAILED DESCRIPTION A detailed description of preferred embodiments of the present invention will now be described with reference to the accompanying drawings. It should be noted that reference numerals and like elements among the drawings are denoted by the same reference numerals and symbols as much as possible even though they are shown in different drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

2 is an LED package for an optical device according to an embodiment of the present invention.

First, Figure 2a is a cross-sectional view of the LED package for an optical device according to an embodiment of the present invention.

Referring to FIG. 2A, in the LED package 20 for an optical device according to the embodiment of the present invention, the molding cup 23 and the base 24 are integrally manufactured to form a main body portion 22.

A cavity is formed in the molding cup 23. Two lead frames 25 and 26 are arranged on the top surface of the base 24. Unlike the related art, however, both end portions of the lead frames 25 and 26 extend in the longitudinal direction thereof, and are positioned on the same horizontal plane as the base 24, so that the lower electrodes are exposed to the outside of the main body part 22. (27, 28) is characterized by being formed. In addition, the side surfaces of the exposed lower electrodes 27 and 28 of the lead frames 25 and 26 extend perpendicular to the longitudinal direction of the lead frames 25 and 26 to form side electrodes 29 and 30. It is characterized by

Here, the lower electrodes 27 and 28 are bent in a portion extending from one side of the lead frames 25 and 26 by a method such as lead frame down-set or half etching. After that, it may be formed to be exposed to the bottom of the main body portion 22.

2B and 2C are top views of LED packages for optical devices according to embodiments of the present invention.

2b shows that side electrodes 29 and 30 are formed on both sides of the LED package 20 for an optical device according to the embodiment of the present invention. However, the side electrodes 29 and 30 may be formed only on one side of the LED package 20 for an optical device as shown in FIG. 2C.

2D is a top view of an LED package for an optical device according to an embodiment of the present invention.

Referring to FIG. 2D, the LED package 20 for an optical device according to an embodiment of the present invention has one end of the lead frames 25 and 26 exposed on the bottom surface of the main body 22 of the LED package 20. The lower electrodes 27 and 28 are formed. In this case, the base 14 may be formed in a minimum space to support the lead frames 25 and 26, and to easily form the lower electrodes 27 and 28 and the side electrodes 29 and 30 according to the present invention.

The side electrodes 29 and 30 extend from one side or both sides of the lower electrodes 27 and 28, and may be electrically connected to other LED packages 20 as shown in FIGS. 2A to 2D. It is formed by folding parallel to the outer circumferential surface of the main body portion 22.

As described above, in the LED package 20 for an optical device according to the embodiment of the present invention, one end of the lead frames 27 and 28 is exposed on the bottom of the main body 22 so that the lower electrodes 27 and 28 and the side electrodes 29 and 30 are exposed. ) Is formed, and by stacking a plurality of such LED packages 20 it is possible to irradiate light in various directions. Hereinafter, an LED device for an optical device that can irradiate light in various directions by stacking the LED package 20 in various ways will be described.

3 is a view showing an LED assembly for an optical device according to an embodiment of the present invention.

First, FIG. 3A shows an LED assembly 41 for an optical device for irradiating light in two directions perpendicular to each other. In this case, the side electrodes 29 and 30 of the LED package 20 for an optical device according to the embodiment of the present invention are mounted on a substrate 40 on which a predetermined electric circuit for driving the LED is contacted. The lower electrodes 27 and 28 of the other LED package 20-1 are arranged on the LED package 20 to face the substrate 40. Then, the two LED packages 20 and 20-1 may be easily electrically connected to the side electrodes 29 and 30 and the lower electrodes 27 and 28, respectively, and irradiate light in two directions perpendicular to each other. You can do it.

3b shows an LED assembly 42 for an optical device for irradiating strong light in the same direction. In this case, the side electrodes 29 and 30 of the LED package 20 for an optical device according to the embodiment of the present invention are mounted on the substrate 40 having a predetermined driving circuit. In addition, the LEDs of another LED package 20-1 on the LED package 20 are arranged to face the same direction while the side electrodes 29 and 30 face the substrate 40. Then, the two LED packages 20 and 20-1 are easily electrically connected to each of the side electrodes 29 and 30, and the respective LEDs irradiate light in the same direction to obtain a stronger light source. do.

3C shows an LED assembly 43 for an optical device for irradiating light in opposite directions. In this case, the side electrodes 29 and 30 of the LED package 20 for an optical device according to the embodiment of the present invention are mounted on the pad 44 formed on the substrate 40. The LED package 20 and another LED package 20-1 are arranged to face in opposite directions. Then, since the LED electrodes 20 and the lower electrodes 27 and 28 of each of the LED packages 20-1 are electrically connected to each other, light can be irradiated in opposite directions.

In addition, the LED assembly for an optical device according to an embodiment of the present invention can be formed so as to irradiate light in various directions by stacking a plurality of the LED package for the optical device 20.

Meanwhile, in the detailed description of the present invention, specific embodiments have been described, but various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims below, but also by those equivalent to the claims.

According to the present invention as described above, there is an advantage that can be manufactured in a compact LED package for an optical device that can irradiate light in various directions while using the LED.

In addition, according to the present invention, it is possible to provide an LED assembly for an optical device that can be stacked to effectively irradiate light in various directions such as sideview and topview using one type of LED package. There is an advantage.

Claims (2)

LED; A first lead frame to which the LED is mounted and to which the first electrode of the LED is connected; A second lead frame facing the first lead frame and spaced apart from each other by a predetermined distance and connected to a second electrode of the LED; A body part having a molding cup for filling the LED image with a transparent resin, and a base on which the first lead frame and the second lead frame are arranged; A lower electrode extending from the one side to the first lead frame and the second lead frame in a longitudinal direction and formed at an outer lower portion of the body part; and And a side electrode extending from at least one side of the external electrode. A substrate configured with a predetermined driving circuit; and An LED, a first lead frame in which the LED is mounted and the first electrode of the LED is connected, a second lead frame opposed to the first lead frame and spaced apart by a predetermined distance, and connected to the second electrode of the LED; A main body portion having a molding cup for filling the LED image with a transparent resin, a base on which the first lead frame and the second lead frame are arranged, and the first lead frame and the second lead frame extend in the longitudinal direction from one side thereof. A lower electrode formed on an outer lower side of the main body, and a side electrode extending from at least one side surface of the external electrode, and including a plurality of LED packages for optical devices mounted on the substrate; And the plurality of LED packages are formed by electrically connecting the respective lower or side electrodes to each other.

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