KR20050119278A - Moking process of conductivity cushion sheet - Google Patents

Moking process of conductivity cushion sheet Download PDF

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KR20050119278A
KR20050119278A KR1020040044334A KR20040044334A KR20050119278A KR 20050119278 A KR20050119278 A KR 20050119278A KR 1020040044334 A KR1020040044334 A KR 1020040044334A KR 20040044334 A KR20040044334 A KR 20040044334A KR 20050119278 A KR20050119278 A KR 20050119278A
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plating
nickel
plated
bath
cushion sheet
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KR1020040044334A
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KR100619573B1 (en
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최철수
이영호
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최철수
이영호
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

본 발명은 일정한 간격으로 구멍을 형성한 쿠션시트의 표면과 구멍면에 전도성이 좋은 니켈,동,금,은,주석,코발트등의 전도성 금속을 도금하여 각종 전자 통신기기와 휴대용 이동기기의 외부충격과 내부진동등을 흡수 할수있도록 함과 아울러 기기의 상하부 양측에 전자파의 누설 및 침투를 방지할 수 있도록하고 우수한 탄성회복력을 발휘시킬 수 있도록한 전도성 고분자 쿠션시트의 제조방법을 제공할 수 있도록한 것에 그 목적이 있다.The present invention plated conductive metal such as nickel, copper, gold, silver, tin, and cobalt having good conductivity on the surface and hole surface of the cushion sheet having holes formed at regular intervals, and thus external shocks of various electronic communication devices and portable mobile devices. It is possible to provide a method of manufacturing a conductive polymer cushion sheet that can absorb the internal vibration and the like, and to prevent leakage and penetration of electromagnetic waves on both sides of the device. The purpose is.

Description

전도성 고분자 쿠션시트의 제조방법{MOKING PROCESS OF CONDUCTIVITY CUSHION SHEET}Manufacturing method of conductive polymer cushion sheet {MOKING PROCESS OF CONDUCTIVITY CUSHION SHEET}

본 발명은 전자통신기기와 휴대용 이동기기의 외부충격과 내부진동등을 흡수하여 보호할 수 있도록함과 동시에 기기의 상하부 양쪽에 전자파를 차단할 수 있도록한 전도성 고분자 쿠션시트의 제조방법에 관한 것으로서The present invention relates to a method for manufacturing a conductive polymer cushion sheet that can absorb and protect external shocks and internal vibrations of electronic communication devices and portable mobile devices and at the same time block electromagnetic waves on both upper and lower sides of the device.

더욱 상세하게는 고분자 합성수지 또는 합성고무로된 탄력성의 쿠션시트에 일정한 간격으로 구멍을 형성하여 쿠션시트의 외표면과 구멍면에 전도성이 우수한 니켈,동,은,금,주석,코발트등의 금속을 도금할 수 있도록한 것이다.More specifically, holes are formed in the elastic cushion sheet made of polymer synthetic resin or synthetic rubber at regular intervals so that metals such as nickel, copper, silver, gold, tin, and cobalt having excellent conductivity are formed on the outer surface and the hole surface of the cushion sheet. It is to be plated.

종래에도 우레탄,폴리우레탄폼등의 도전성직물이나 필름을 접착하여 타공한 후 타공된 공간 및 상하양면에 도전성코팅제를 침투시키거나 쿠션재에 칼집 절개부를 형성하여 절개부위에 도전성소재를 함침하여 경화시켜 절개부를 접합하여 상하 통전이 가능토록한 발명이 공지되어 있으나 이는 구멍과 절개부에 도전성의 코팅제를 밀실하게 침투 또는 충진하고 경화제조하여서 된것이므로 구멍과 절개부에 가득 채워진 금속코팅제에 의하여 탄성회복력이 떨어지는 단점이 있고 또한 침투,함침경화된 금속은 시트와의 물성차로 인하여 시트를 움직이거나 형태를 비틀시 시트에서 탈락이 쉽게되는등 많은 문제가 따르게 되었다.Conventionally, after attaching a conductive fabric or film such as urethane or polyurethane foam and perforating it, the conductive coating agent is infiltrated into the perforated space and upper and lower surfaces, or a sheath cutout is formed in the cushioning material to impregnate the cured material by impregnating the conductive material. Invention is known to allow up and down energization by joining parts, but this is because the conductive coating is tightly infiltrated or filled and hardened in the holes and incisions, so that the elastic recovery force is reduced by the metal coating agent filled in the holes and the incisions. In addition, the penetrated and impregnated hardened metal has a number of problems, such as easily falling off the sheet when moving the sheet or twisted form due to the difference in physical properties with the sheet.

본 발명은 상기와 같은 문제점을 해결하기 위하여The present invention to solve the above problems

일정한 간격으로 미세한 구멍(1A)을 촘촘히 배열형성한 쿠션시트(1)를 초음파처리를 거친후 무전해도금이나 전해도금 또는 치환도금등에 의하여 니켈,동,금,은,주석,코발트등의 금속을 쿠션시트(1)표면과 구멍(1A)의 면(구멍이 막히지 않도록)에 도금하여 충격흡수와 전자파 및 탄성회복력이 우수한 전도성 고분자 쿠션시트의 제조방법을 제공할 수 있도록한 것에 그 목적이 있다.After the ultrasonic wave treatment of the cushion sheet 1 in which fine holes 1A are closely arranged at regular intervals, metals such as nickel, copper, gold, silver, tin, and cobalt may be formed by electroless plating, electroplating, or substitution plating. It is an object of the present invention to provide a method for producing a conductive polymer cushion sheet excellent in shock absorption, electromagnetic waves and elastic recovery by plating on the surface of the cushion sheet 1 and the surface of the hole 1A (so that the holes are not blocked).

이하 본 발명을 설명하면 다음과 같다.Hereinafter, the present invention will be described.

쿠션시트(1)는 폴리에틸렌테레트랄레이트(PET),폴리우레탄,폴리올레핀등의 고분자 합성수지 또는 합성고무시트등을 주로 사용하게된다.The cushion sheet 1 mainly uses a polymer synthetic resin or synthetic rubber sheet such as polyethylene terephthalate (PET), polyurethane, and polyolefin.

쿠션시트의 두께는 용도에 따라 0.5㎜∼10.0㎜등 그 두께를 조절하여 사용하게 됨으로 두께를 일정하게 한정지울 수 없다. 쿠션시트의 구멍(1A)역시 제조에 따라 조절하게 됨으로 구멍의 모양이나 간격 또는 크기를 한정하기 어렵고 구멍대신에 선상으로 절개를 하여 절개형구멍을 형성하여도 좋다.The thickness of the cushion seat is 0.5 mm to 10.0 mm, depending on the purpose of use to adjust the thickness, such that the thickness can not be limited. Since the hole 1A of the cushion sheet is also adjusted according to manufacture, it is difficult to limit the shape, spacing, or size of the hole, and instead of the hole, a cut may be made in a line to form a cut-out hole.

단, 그 간격이 좁고 구멍이나 길쭉한 절개형구멍의 크기가 작다면 상하통전에 유리하다.However, if the spacing is narrow and the size of the hole or the elongated incision is small, it is advantageous to conduct up and down.

전기전도성을 부여하기 위한 무전해도금은 쿠션시트를 60∼80℃의 5∼15%의가성소다약품조에서 초음차세척을 실시하여 구션시트(발포시트)에 친수성을 부여하여 도금면적을 충분히 넓힌다. 그리고 온도 75∼100℃의 에칭(Etching)조에서 10∼20%의 가성소다용액을 거치고 수세를 행한후 염화 파라듐과 염화주석의 혼합액으로 된 파라듐촉매조(Catalyst)에 침적후 수세를 거친후 10∼20%의 황산조(Accelatro)에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거하고 황산니켈 20∼30g/ℓ,차아인산소다 15∼22g/ℓ,구연산소다 30∼45g/ℓ을 혼합한 니켈도금(Electroless Nickel)조에 침적하여 니켈금속을 도금한후 수세하여 동 3.0∼4.5g/ℓ,가성소다 8∼10g/ℓ포르마린 4.0∼5.5g/ℓ의 동도금(Electroiess Copper)조에 침적하여 동금속을 도금한다.Electroless plating for imparting electrical conductivity is performed by supersonic washing of a cushion sheet in a caustic soda solution of 5 to 15% at 60 to 80 ° C to give hydrophilicity to the cushion sheet, thereby broadening the plating area. . After washing with 10 ~ 20% caustic soda solution in an etching bath with a temperature of 75 ~ 100 ℃, it was immersed in a paradium catalyst bath made of a mixture of palladium chloride and tin chloride and washed with water. Subsequently, it was immersed in 10-20% of a sulfuric acid bath (Acccelatro) to remove the remaining tin, and 20 to 30 g / l of nickel sulfate, 15 to 22 g / l of sodium hypophosphite and 30 to 45 g / l of citric acid were mixed. Nickel plating is carried out in an electroless nickel bath, and the nickel metal is plated and washed with water, and copper 3.0 to 4.5 g / l and caustic soda 8 to 10 g / l formalin 4.0 to 5.5 g / l are deposited in an electroiess copper bath. Plate it.

금속류는 그 종류와 방식에 따라 동과 니켈외에 금(Gold),은(Silver),주석(Tin),코발트(Cobalt)등 다양하게 그 용도에 맞출수가 있으며, 금속종류에 따라 도금방식은 전해도금과 치환도금 또는 무전해도금을 선택하게된다. 도금에 의한 쿠션시트(1)의 표면과 구멍(1A)이 뚫린상태로 있게끔 구멍(2)면에만 얇게 도금층(2)을 피복하였으므로 전자통신기기나 휴대용 이동기기등의 외부충격이나 내부진동등의 완화효율과 쿠션시트(1)의 상하표면 도금층(2)으로의 전도성 및 전자파 차폐효율이 우수하게 발휘된다.Metals can be used for various purposes such as gold, silver, tin, and cobalt in addition to copper and nickel, depending on the type and method. And substitution plating or electroless plating. Since the plating layer 2 is coated on the surface of the hole 2 so that the surface of the cushion sheet 1 and the hole 1A by the plating are in a perforated state, external shock or internal vibration of an electronic communication device or a portable mobile device, etc. The relaxation efficiency and the electroconductive shielding efficiency of the cushion sheet 1 to the upper and lower surface plating layers 2 are exhibited excellently.

(실시예1)Example 1

일정한 간격으로 구멍(1A)을 촘촘히 뚫어서된 쿠션시트(1)를 60∼80℃의 5∼15%의 가성소다약품조에서 초음차세척을 실시하여 발포시트에 친수성을 부여하여 도금면적을 충분히 넓힌다음 온도 75∼100℃의 에칭조에서 10∼20%의 가성소다용액을 거치고 수세를 행한후 염화 파라듐과 염화주석의 혼합액으로 된 파라듐촉매조(Catalyst)에 침적하고 수세를 거친후 10∼20%의 황산조(Accelatro)에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거하고 황산니켈 20∼30g/ℓ,차아인산소다 15∼22g/ℓ,구연산소다 30∼45g/ℓ를 혼합한 니켈도금조에 침적하여 니켈금속을 도금한다음 동 3.0∼4.5g/ℓ,가성소다 8∼10g/ℓ포르마린 4.0∼5.5g/ℓ의 동도금에 침적하여 동도금하여 시트쿠션(1)과 구멍(1A)면에 도금된 니켈과 동금속의 도금층(2)에 의하여 양호한 전도성을 부여하였다.The cushion sheet 1, which was formed by closely drilling holes 1A at regular intervals, was subjected to supersonic washing in a 5 to 15% caustic soda chemical bath at 60 to 80 ° C to give hydrophilicity to the foam sheet, thereby sufficiently widening the plating area. After washing with 10 ~ 20% caustic soda solution in an etching bath at a temperature of 75 ~ 100 ℃, it was immersed in a palladium catalyst bath composed of a mixture of palladium chloride and tin chloride and washed with water. A nickel plating bath containing 20-30 g / l of nickel sulfate, 15-22 g / l of sodium hypophosphite, and 30-45 g / l of sodium citrate was mixed by dipping and washing in 20% of an accelatrogen bath. It is deposited and plated with nickel metal, followed by copper plating with copper plating of 3.0 to 4.5 g / l and caustic soda 8 to 10 g / l formalin and 4.0 to 5.5 g / l and plating on the surface of seat cushion 1 and hole 1A. Good conductivity was given by the plated layer 2 of nickel and copper metal.

(실시예2)Example 2

일정한 간격으로 미세한 구멍(1A)을 촘촘히 뚫어서된 쿠션시트(1)에 있어서 상기 쿠션시트(1)를 60∼80℃의 5∼15%가성소다약품조에서 초음차세척을 실시하여 발포시트에 친수성을 부여하여 도금면적을 충분히 넓힌다음 온도 75∼100℃의 에칭조에서 10∼20%의 가성소다용액을 거치고 수세를 행한후 염화 파라듐과 염화주석의 혼합액으로 된 파라듐촉매조(Catalyst)에 침적하고 수세를 거친후 10∼20%의 황산조(Accelatro)에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거하고 황산니켈 20∼30g/ℓ,차아인산소다 15∼22g/ℓ,구연산소다 30∼45g/ℓ혼합된 니켈도금조에 침적하여 니켈금속을 도금한다음 시안화칼륨 60g/ℓ,청화은카리움 40g/ℓ의 은도금용액에 침적하여 은도금하여 니켈과 은금속의 도금층(2)에 의하여 양호한 전도성을 부여하였다.In the cushion sheet (1) formed by precisely drilling fine holes (1A) at regular intervals, the cushion sheet (1) is subjected to supersonic washing in a 5 to 15% caustic soda drug bath at 60 to 80 ° C, thereby making the foam sheet hydrophilic. After enlarging the plating area sufficiently, washing with 10 ~ 20% caustic soda solution in an etching bath at a temperature of 75 ~ 100 ℃, and washing with water, and then putting it into a catalysed mixture of palladium chloride and tin chloride. After immersion and washing with water, it is immersed in 10-20% of acetic acid bath to remove remaining tin and clean. 20-20g / l of nickel sulfate, 15-22g / l of sodium hypophosphite, 30-45g of sodium citrate. The nickel metal was plated by dipping in a / l mixed nickel plating bath and then plated in silver plating solution of 60 g of potassium cyanide and 40 g / l of silver cyanide, and then plated with silver to give good conductivity by the plating layer of nickel and silver metal (2). .

(실시예3)Example 3

일정한 간격으로 미세한 구멍(1A)을 촘촘히 뚫어서된 쿠션시트(1)에 있어서 상기의 쿠션시트(1)를 60∼80℃의 5∼15%가성소다약품조에서 초음차세척을 실시하여 발포시트에 친수성을 부여하여 도금면적을 충분히 넓힌다음 온도 75∼100℃의 에칭조에서 10∼20%의 가성소다용액을 거치고 수세를 행한후 염화 파라듐과 염화주석의 혼합액으로 된 파라듐촉매조(Catalyst)에 침적하고 수세를 거친후 10∼20%의 황산조(Accelatro)에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거하고 황산니켈 20∼30g/ℓ,차아인산소다 15∼22g/ℓ,구연산소다 30∼45g/ℓ혼합된 니켈도금조에 침적하여 니켈금속을 도금한다음 0.75∼1.0g/ℓ의 금도금용액에 침적하여 금도금을하여 니켈과 금금속의 도금층(2)에 의하여 양호한 전도성을 부여하였다.In the cushion sheet (1) in which fine holes (1A) are tightly drilled at regular intervals, the above-mentioned cushion sheet (1) is subjected to supersonic washing in a 5 to 15% caustic soda drug bath at 60 to 80 DEG C. Hydrophilicity is given to widen the plating area, and then washed with 10 to 20% caustic soda solution in an etching bath at a temperature of 75 to 100 ° C, followed by washing with water, and then a catalyst solution made of a mixture of palladium chloride and tin chloride. After dipping in water and washing with water, it is immersed in 10 ~ 20% of acetic acid bath to remove remaining tin. Nickel metal is plated by dipping in 45g / l mixed nickel plating bath. Gold was plated by depositing in a gold plating solution of 0.75 to 1.0 g / l to give good conductivity by the plating layer 2 of nickel and gold metal.

이와같은 본 발명은 전도성 쿠션시트의 표면과 구멍의 면에다 매우합리적인 방법으로 도금하여 도금된 구멍을 통하여 상하통전을 이루어지게하여 전자통신기기 및 휴대용 이동기기등의 상하에서 발생하는 전자파를 차폐할 수 있음과 아울러 외부에서의 충격과 내부진동등을 흡수하여 보호할 수 있는 효과가 있다.In the present invention, the surface of the conductive cushion sheet and the surface of the hole are plated in a very rational manner to conduct up and down conduction through the plated hole to shield the electromagnetic waves generated from the upper and lower sides of the electronic communication device and the portable mobile device. In addition, there is an effect that can be absorbed and protected from external shocks and internal vibrations.

도1은 본 발명에 의하여 제조된 쿠션시트의 사시도1 is a perspective view of a cushion seat manufactured according to the present invention

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

1 : 쿠션시트1: cushion seat

1A : 구멍1A: hole

2 : 도금층2: plating layer

Claims (3)

일정한 간격으로 미세한 구멍(1A)을 촘촘히 뚫어서된 쿠션시트(1)를 60∼80℃의 5∼15%의 가성소다약품조에서 초음차세척을 실시하여 발포시트에 친수성을 부여하여 도금면적을 충분히 넓힌다음 온도 75∼100℃의 에칭조에서 10∼20%의 가성소다용액을 거치고 수세를 행한후 염화 파라듐과 염화주석의 혼합액으로 된 파라듐촉매조(Catalyst)에 침적하고 수세를 거친후 10∼20%의 황산조(Accelatro)에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거하고 황산니켈 20∼30g/ℓ,차아인산소다 15∼22g/ℓ,구연산소다 30∼45g/ℓ혼합된 니켈도금조에 침적하여 니켈금속을 도금한다음 동 3.0∼4.5g/ℓ,가성소다 8∼10g/ℓ,포르마린 4.0∼5.5g/ℓ의 동도금에 침적하여 동도금을하여 시트쿠션(1)과 구멍(1A)면에 도금된 니켈 동도금의 도금층(2)에 의하여 양호한 전도성을 부여하여서 된것을 특징으로한 전도성 고분자 쿠션시트의 제조방법.The cushion sheet 1, which is formed by closely drilling fine holes 1A at regular intervals, was subjected to supersonic washing in a 5 to 15% caustic soda chemical bath at 60 to 80 ° C. to give hydrophilicity to the foam sheet, thereby sufficiently plating area. After widening, it was washed with 10 ~ 20% caustic soda solution in an etching bath at a temperature of 75 ~ 100 ℃, immersed in a catalysis solution containing a mixture of palladium chloride and tin chloride, and washed with water. It is immersed in a 20% acetic acid bath to remove remaining tin, and 20 to 30 g / l nickel sulfate, 15 to 22 g / l sodium hypophosphite and 30 to 45 g / l sodium citrate are mixed in a nickel plating bath. It is deposited and plated with nickel metal, followed by copper plating with copper plating of 3.0 to 4.5 g / l, caustic soda 8 to 10 g / l, and formalin 4.0 to 5.5 g / l, and the sheet cushion (1) and hole (1A) surfaces. By providing a good conductivity by the plating layer (2) of nickel copper plating plated on Method for producing a conductive polymer cushion sheet, characterized in that. 제1항에 있어서 니켈도금조에 침적하여 니켈금속을 도금한다음 시안화칼륨 60g/ℓ,청화은카리움 40g/ℓ의 은도금용액에 침적하여 은도금하여 니켈과 은도금의 도금층(2)에 의하여 양호한 전도성을 부여하여서 된것을 특징으로한 전도성 고분자 쿠션시트의 제조방법.The nickel metal is plated by depositing in a nickel plating bath, and then plated on a silver plating solution of 60 g of potassium cyanide and 40 g / l of silver cyanide, and silver plated to give good conductivity by the plating layer of nickel and silver plating (2). Method for producing a conductive polymer cushion sheet characterized in that. 제1항에 있어서 니켈도금조에 침적하여 니켈금속을 도금한다음 0.75∼1.0g/ℓ의 금도금용액에 침적하여 금도금을하여 니켈과 금도금의 도금층(2)에 의하여 양호한 전도성을 부여하여서 된것을 특징으로한 전도성 고분자 쿠션시트의 제조방법.The nickel metal plating is carried out by depositing in a nickel plating bath. A method for producing a conductive polymer cushion sheet, characterized in that it is deposited by gold plating solution of 0.75 to 1.0 g / l and gold plated to impart good conductivity by a plating layer (2) of nickel and gold plating.
KR1020040044334A 2004-06-16 2004-06-16 Moking process of conductivity cushion sheet KR100619573B1 (en)

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KR200447610Y1 (en) * 2009-02-02 2010-02-11 주식회사 나노인터페이스 테크놀로지 Electric contact terminal for surface mount

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