KR20050105045A - A method for fabricating printing roll and method for forming pattern using the same - Google Patents

Abstract

The present invention relates to a manufacturing method of a printing roll used to form a pattern by a printing method and a pattern forming method using the same, preparing a cylindrical roll and a resin having a convex pattern having the same shape as the pattern to be formed. It provides a method for producing a printing roll comprising the step of preparing a plate and attaching a resin plate so that the convex pattern is exposed on the cylindrical roll surface.

Description

A manufacturing method of a printing roll and a pattern forming method using the same {A METHOD FOR FABRICATING PRINTING ROLL AND METHOD FOR FORMING PATTERN USING THE SAME}

The present invention relates to a printing apparatus used for pattern formation by a printing method, and more particularly, to a manufacturing method of a printing roll for transferring a pattern to an etching target layer and a pattern forming method using the same.

In display devices, particularly flat panel displays such as liquid crystal display devices, each pixel includes an active device such as a thin film transistor to drive the display device. The driving method is often called an active matrix driving method. In the active matrix method, the active elements are arranged in each pixel arranged in a matrix to drive the pixel.

1 is a view showing an active matrix liquid crystal display device. The liquid crystal display of the structure shown in the figure is a TFT LCD using a thin film transistor as an active element. As shown in the figure, each pixel of the TFT LCD in which N × M pixels are arranged vertically and horizontally has a gate line 4 to which a scan signal is applied from an external driving circuit and a data line 6 to which an image signal is applied. It includes a TFT formed in the intersection area. The TFT includes a gate electrode 3 connected to the gate line 4, a semiconductor layer 8 formed on the gate electrode 3, and activated when a scan signal is applied to the gate electrode 3, and the semiconductor layer. (8) and a source / drain electrode 5 formed thereon. In the display area of the pixel 1, an image signal is applied through the source / drain electrode 5 as the semiconductor layer 8 is connected to the source / drain electrode 5 to activate the liquid crystal (not shown). Is formed on the pixel electrode 10.

2 is a diagram showing the structure of a TFT disposed in each pixel. As shown in the figure, the TFT includes a substrate 20 made of a transparent insulating material such as glass, a gate electrode 3 formed on the substrate 20, and an entire substrate 20 on which the gate electrode 3 is formed. A gate insulating layer 22 stacked over the semiconductor insulating layer 22, a semiconductor layer 6 formed on the gate insulating layer 22 and activated when a signal is applied to the gate electrode 3, and formed on the semiconductor layer 6. A source / drain electrode 5 and a passivation layer 25 formed on the source / drain electrode 5 to protect the device.

The source / drain electrode 5 of the TFT is electrically connected to a pixel electrode formed in the pixel, so that a signal is applied to the pixel electrode through the source / drain electrode 5 to drive the liquid crystal to display an image. do.

In an active matrix display device such as a liquid crystal display device as described above, each pixel has a size of several tens of micrometers, and therefore, an active device such as a TFT disposed in the pixel must be formed with a fine size of several micrometers. Furthermore, as the desire for high-definition display devices such as high-definition television (HDTV) has increased in recent years, more pixels must be disposed on the screen of the same area, and thus, active element patterns (gate line and data line patterns) included in the pixels are included. ) Should also be more finely formed.

On the other hand, in order to fabricate an active device such as a TFT, a pattern, a line, and the like of the active device are formed by a photolithography method using an exposure apparatus. The photolithography process, however, consists of a continuous process such as photo-resist coating, alignment and exposure, development, and cleaning.

In addition, in order to form a pattern of the liquid crystal display device as described above, a number of photo processes must be repeated, which leads to a problem that productivity is lowered.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to provide a pattern forming method that can simplify the process and improve the productivity by forming a pattern in one step by a printing method.

Another object of the present invention is to provide a method of manufacturing a printing roll that can simplify the printing equipment used to form the pattern.

Another object of the present invention is to provide a pattern forming method which can further simplify the printing process.

The printing roll manufacturing method of the present invention made to achieve the above object comprises the steps of preparing a cylindrical roll, preparing a resin plate formed with a convex pattern of the same shape as the pattern to be formed and the convex pattern on the surface of the cylindrical roll Attaching the resin plate so that it is exposed.

The preparing of the resin plate having the convex pattern is performed by applying an organic film on the resin plate, forming an organic pattern having the same shape as a pattern to be formed by patterning the organic film, and curing the organic pattern. Is made of. In this case, the organic layer may be made of polyimide or benzocyclobutene.

Curing the organic pattern may include irradiating thermal to the organic pattern or irradiating UV to the organic pattern.

In addition, the pattern forming method according to the present invention comprises the steps of preparing a cylindrical roll, preparing a resin plate having a convex pattern of the same shape as the pattern to be formed, and a resin plate so that the convex pattern is exposed on the cylindrical roll surface And forming an ink on the convex pattern surface and transferring the ink formed on the convex pattern onto the etching target layer.

The preparing of the resin plate having the convex pattern is performed by applying an organic film on the resin plate, forming an organic pattern having the same shape as a pattern to be formed by patterning the organic film, and curing the organic pattern. Is made of.

Forming ink on the convex pattern surface may include providing ink on a surface of the anneal roll which rotates in engagement with the printing roll, and depositing ink on the convex pattern of the printing roll in contact with the ink provided on the anneal roll surface. The transfer step is made.

The transferring of the ink onto the etching target layer may include rotating the printing roll while contacting the ink formed on the convex pattern on the etching target layer and transferring the ink formed on the convex pattern of the printing roll onto the etching target layer. The key consists of steps.

And curing the ink transferred onto the etching target layer and etching the etching target layer using the cured ink as a mask.

The etching target layer may be formed of one of a metal layer, SiOx or SiNx, and a semiconductor layer.

In the present invention, a printing method is used to form an active element pattern of a display element such as a liquid crystal display element. In particular, gravure offset printing is a printing method in which ink is applied to a concave plate to scrape off excess ink, and printing is known as a printing method in various fields such as publishing, packaging, cellophane, vinyl, polyethylene, and the like. In the present invention, such an printing method is used to produce an active element or a circuit pattern applied to the display element.

Since gravure offset printing transfers ink onto a substrate using a transfer roll, it is possible to form a pattern by one transfer even in the case of a large display element by using a transfer roll corresponding to the area of a desired display element. do. Such gravure offset printing can be used to pattern various patterns of display devices, for example, TFTs as well as gate patterns and data lines, pixel electrodes, and capacitor metal patterns connected to the TFTs.

Hereinafter, a pattern forming method according to the present invention will be described in detail with reference to the accompanying drawings.

3A to 3C show a method of forming an ink pattern on a substrate using a printing method. As shown in FIG. 3A, in the printing method, a groove 132 is formed at a specific position of the concave plate or the cliché 130, and then the ink 134 is filled in the groove 132. The grooves 132 formed in the cliché 130 are formed by a general photolithography method, and the filling of the ink 134 into the grooves 132 is pattern forming ink 134 on the top of the cliché 130. ) And then push the doctor blade 138 in contact with the surface of the cliché 130. Therefore, the ink 134 is filled in the groove 132 by the progress of the doctor blade 138 and the ink 134 remaining on the surface of the cliché 130 is removed.

As shown in FIG. 3B, the ink 134 filled in the groove 132 of the cliché 130 is transferred to the surface of the printing roll 131 which rotates in contact with the surface of the cliché 130. do. The printing roll 131 is formed to have the same width as the width of the panel of the display device to be manufactured, and has a circumference of the same length as the length of the panel. Therefore, the ink 134 filled in the groove 132 of the cliché 130 is transferred to the circumferential surface of the printing roll 131 by one rotation.

3C, the ink transferred to the printing roll 131 as the printing roll 131 is rotated in contact with the surface of the etch target layer 140 formed on the substrate 130 ′. 134 is transferred to the etching target layer 140, and the ink pattern 133 is formed by applying UV radiation or heat to the transferred ink 134 to dry. In this case, the desired pattern 133 may be formed over the entire substrate 130 ′ of the display device by one rotation of the printing roll 131. Subsequently, by etching the etching target layer 140 using the ink pattern 133 as a mask, a desired pattern can be formed.

As described above, in the printing method, the cliché 130 and the printing roll 131 can be manufactured according to the size of the desired display element, and a pattern can be formed on the substrate 130 'by one transfer. The pattern of the area display element can also be formed by one process.

The etching target layer 140 may be a metal layer for forming an electrode such as a gate electrode, a source / drain electrode, a gate line, a data line, or a pixel electrode of the TFT, or may be a semiconductor layer for forming an active layer, and may be SiOx or SiNx. It may be an insulating layer as shown.

When the actual pattern of the display device is formed, the ink pattern 133 serves as a resist in the conventional photo process. Therefore, after forming the ink pattern 133 as described above on the metal layer or the insulating layer, the metal layer or the insulating layer is etched by a general etching process, so that the metal layer (ie, the electrode structure) or the insulating layer (for example, the contact) of the desired pattern is formed. Holes, etc.) can be formed.

As described above, the printing method has many advantages. In particular, the ink pattern is formed on a large display element by one process or the process is very simple compared to the conventional photolithography process, which is a representative advantage of the printing method.

However, since the printing method is less accurate than the photolithography method, the alignment between the patterns is not precisely performed, which may result in a decrease in productivity due to a poor pattern.

Therefore, this problem can be solved by forming a pattern on the printing roll 134 itself so that the printing roll 131 also serves as the cliché 130 without using a recessed plate such as the cliché 130 separately. . When a pattern is formed on the printing roll 131 itself and is directly transferred to the etching target layer 140, the step of transferring the ink pattern from the cliché 130 to the surface of the printing roll 131 can be omitted. Compared with the case where the sieve 130 is provided separately, the precision can be further improved.

That is, by forming a convex pattern at a specific position on the surface of the printing roll to form the ink pattern, and then forming an ink pattern on the convex pattern and transferring it on the etching target layer, the use of the cliché is omitted in forming the ink pattern. You can do it.

In addition, by directly transferring the ink pattern formed on the convex pattern of the printing roll to the etching target layer, the pattern forming process can be further simplified as compared with the previous (FIGS. 3A to 3C).

4A to 4E illustrate a printing roll manufacturing method according to the present invention. First, as shown in FIG. 4A, a resin plate 232 is prepared, and then an organic film 233 is applied thereon. In this case, the organic layer 233 may use polyimide or benzocyclobutene.

Subsequently, as shown in FIG. 4B, the organic layer 233 is selectively irradiated with light using a mask 220 in which a transmission region and a non-transmission region for light (indicated by an arrow in the drawing) are selectively formed. When the organic film 233 to which light is irradiated is applied to the developer, as shown in FIG. 4C, the region to which light is irradiated is removed, and the organic pattern 233a remains in a region where light is not irradiated. In this case, the organic pattern 233a may be formed in a region to which light is irradiated according to the characteristics of the organic layer 233. That is, when the organic film 233 is a positive type, the organic film of the region irradiated with light is removed through the transmission region, and the organic pattern is formed in the region not irradiated with light. In the case of using (negitive type), the organic pattern of the region irradiated with light remains through the transmission region, and the organic film of the region not irradiated with light is removed by the developer. In the present invention, both a negative type and a positive type organic film can be used. In addition, by irradiating the organic pattern 233a with heat or UV, the organic pattern 233a may be cured.

On the other hand, the organic pattern 233a should be formed to have the same shape as the ink pattern to be formed on the actual etching target layer. Therefore, the mask used for patterning the organic pattern 233a must also match the ink pattern to be actually formed.

Subsequently, as shown in FIG. 4D, the cylindrical roll 231 is prepared, and then the resin plate 232 is attached to the surface of the roll 231 so that the organic pattern 233a is exposed to the outside. As described above, a printing roll on which the convex pattern 233a is formed is produced. In this case, the resin plate 232 should have a curved property to be flexibly attached to the cylindrical roll 231.

The convex pattern corresponds to a region in which an ink pattern is formed on an etching target layer in a process of printing an actual ink pattern. In other words, the convex pattern is an area for printing the actual ink pattern, and the ink material applied on the convex pattern is transferred onto the etching target layer as it is. Therefore, when the ink pattern is formed using a printing roll having a convex pattern formed on the surface, the ink is filled in the groove of the cliché, and the ink filled in the groove of the cliché is transferred to the surface of the printing roll. Can be omitted. That is, by applying the ink on the convex pattern formed on the surface of the printing roll, and then directly transferred to the etching target layer, it is possible to further simplify the printing equipment and shorten the process time.

5A to 5C show a pattern forming method using a printing roll manufactured as described above.

First, as shown in FIG. 5A, a printing roll 331 having a convex pattern 333a having the same shape as the ink pattern to be formed on the surface of the blanket 332 is prepared, and then the convex of the printing roll 331 is prepared. The anneal roll 360 which contacts and rotates with the pattern 333a is prepared. At this time, the ink is supplied from the ink supply 335 while the anneal roll 360 rotates, and the ink 350 is provided on the surface of the anneal roll 360. As such, the ink 350 provided on the surface of the anneal roll 360 is transferred to the surface of the convex pattern 333a of the printing roll 331 which rotates in contact with the anneal roll 360. Therefore, the ink pattern 350a is formed on the convex pattern 333a.

Subsequently, as shown in FIG. 5B, the printing roll 331 is rotated while the ink pattern 350a formed on the convex pattern 333a is brought into contact with the etching target layer 340 of the substrate 330 '. At this time, as the printing roll 331 is rotated, the ink pattern 350a formed on the convex pattern 333a is retransmitted on the etching target layer 340. In this case, the ink pattern 350a should be made of a material that is easily separated from the convex pattern 333a formed of an organic material and adheres well to the etching target layer 340.

Thereafter, as shown in FIG. 5C, the ink pattern 350a may be further cured by irradiating heat or UV to the ink pattern 350a formed on the etching target layer 340.

The etching target layer 340 may be a metal layer for forming an electrode such as a gate electrode, a source / drain electrode, a gate line, a data line, or a pixel electrode of a TFT, or a semiconductor layer for forming an active layer, and may be SiOx or SiNx. It may be an insulating layer as shown. When the actual pattern of the display device is formed, the ink pattern 350a serves as a resist in the conventional photo process. Therefore, after forming the ink pattern 350a as described above on the metal layer or the insulating layer, the metal layer or the insulating layer is etched by a general etching process, thereby forming a metal layer (ie, an electrode structure) or an insulating layer (eg, a contact) of a desired pattern. Holes, etc.) can be formed.

In the pattern forming method of the present invention as described above, the convex pattern 333a having the same shape as the pattern to be formed in advance is formed on the printing roll 331, and the ink pattern 350a is formed on the convex pattern 333a. Then, by transferring it on the etching target layer 340, it is possible to further simplify the printing process. That is, before (Figs. 3A to 3C), the ink is applied to the recessed groove formed cliché, and then the ink inside the groove is filled using a doctor blade, transferred to the surface of the printing roll, and then the etching target layer. An ink pattern is formed by the process of retransferring on a surface. However, the pattern forming method described in FIGS. 5A to 5C forms a convex pattern having the same shape as the pattern to be formed on the surface of the printing roll, thereby forming ink on the convex pattern, and transferring it directly onto the etching target layer. An ink pattern can be formed. Therefore, the cleats are not required separately, and the printing process can be further simplified since the step of transferring ink from the cleats to the printing roll can be omitted.

The method of forming the convex pattern on the printing roll is, as described in Figures 4a to 4e, after applying the organic material on the resin plate, to form an organic pattern of the same shape as the ink pattern to be formed by the photolithography method Then, after curing it, it is made through a process of attaching the resin plate to the cylindrical roll so that the organic pattern is exposed to the outside. At this time, the curing process of the organic pattern may be made after attaching to the cylindrical roll.

In addition, the pattern forming method by the printing method may be used for the element formation on the semiconductor wafer as well as the active element or circuit of the display element such as the liquid crystal display element.

As described above, according to the present invention, by forming the convex pattern on the surface of the printing roll corresponding to the position where the ink pattern is to be formed when forming the display element or the like, the printing equipment can be further simplified. In addition, the present invention can simplify the printing process by forming an ink pattern on the convex pattern using a printing roll on which the convex pattern is formed and transferring it to the etching target layer.

The present invention can increase the production efficiency by simplifying the printing equipment and printing process.

1 is a plan view showing the structure of a general liquid crystal display device.

FIG. 2 is a cross-sectional view illustrating a thin film transistor structure of the liquid crystal display shown in FIG.

3A to 3C are views showing a pattern forming method by a gravure offset printing method.

4A to 4E are views showing a printing roll manufacturing method according to the present invention.

5A to 5C are views showing a pattern forming method according to the present invention.

*** Explanation of symbols for main parts of drawing ***

231,331: roll 232,332: resin plate

233: organic layer 233a, 333a: organic pattern

340: etching target layer 350a: ink pattern

Claims (11)

Preparing a cylindrical roll; Preparing a resin plate having a convex pattern having the same shape as a pattern to be formed; And A printing roll manufacturing method comprising the step of attaching a resin plate so that the convex pattern is exposed on the cylindrical roll surface. The method of claim 1, wherein the preparing of the resin plate on which the convex pattern is formed is performed. Applying an organic film on the resin plate; Forming an organic pattern having the same shape as a pattern to be formed by patterning the organic layer; And Print roll manufacturing method comprising the step of curing the organic pattern. The method of claim 2, wherein the organic film is polyimide. The method of claim 2, wherein the organic film is benzocyclobutene (BenzoCycloButene). The method of claim 2, wherein curing the organic pattern comprises: Printing roll manufacturing method comprising the step of irradiating the thermal (thermal) to the organic pattern. The method of claim 2, wherein curing the organic pattern comprises: Printing roll manufacturing method comprising the step of irradiating UV to the organic pattern. Preparing a cylindrical roll; Preparing a resin plate having a convex pattern having the same shape as a pattern to be formed; Attaching a resin plate to expose the convex pattern on the cylindrical roll surface; Forming ink on the convex pattern surface; And And transferring the ink formed on the convex pattern onto the etching target layer. The method of claim 7, wherein preparing the resin plate on which the convex pattern is formed, Applying an organic film on the resin plate; Forming an organic pattern having the same shape as a pattern to be formed by patterning the organic layer; And Print roll manufacturing method comprising the step of curing the organic pattern. The method of claim 7, wherein forming the ink on the convex pattern surface, Providing ink to a surface of the anneal roll which rotates in engagement with the printing roll; And And transferring the ink onto the convex pattern of the printing roll in contact with the ink provided on the surface of the anneal roll. The method of claim 7, wherein the transferring of the ink onto the etching target layer comprises: Rotating the printing roll in a state where the ink formed on the convex pattern is in contact with the etching target layer; And And transferring the ink formed on the convex pattern of the printing roll onto the etching target layer. The method of claim 7, wherein Curing the ink transferred onto the etching target layer; And And etching the etching target layer using the cured ink as a mask.